Absolute Maximum Ratings
Parameter Units
ID @ VGS = 10V, TC = 25°C Continuous Drain Current 30
ID @ VGS = 10V, TC = 100°C Continuous Drain Current 19
IDM Pulsed Drain Current ➀120
PD @ TC = 25°C Max. Power Dissipation 150 W
Linear Derating Factor 1.2 W/°C
VGS Gate-to-Source Voltage ±20 V
EAS Single Pulse Avalanche Energy ➁500 mJ
IAR Avalanche Current ➀30 A
EAR Repetitive Avalanche Energy ➀15 mJ
dv/dt Peak Diode Recovery dv/dt ➂5.0 V/ns
TJOperating Junction -55 to 150
TSTG Storage Temperature Range
Lead Temperature 300 (0.063 in. (1.6mm) from case for 10s)
Weight 11.5 (typical) g
PD - 90338E
oC
A
01/22/01
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Product Summary
Part Number BVDSS RDS(on) ID
IRF250 200V 0.085Ω 30A
For footnotes refer to the last page
REPETITIVE A V ALANCHE AND dv/dt RATED JANTX2N6766
HEXFETTRANSISTORS
JANTXV2N6766
THRU-HOLE (TO-204AA/AE)
[REF:MIL-PRF-19500/543]
IRF250
200V, N-CHANNEL
TO-3
Features:
nRepetitive Avalanche Ratings
nDynamic dv/dt Rating
nHermetically Sealed
nSimple Drive Requirements
nEase of Paralleling
The HEXFETtechnology is the key to International
Rectifier’s advanced line of power MOSFET transistors.
The efficient geometry and unique processing of this latest
“State of the Art” design achieves: very low on-state resis-
tance combined with high transconductance; superior re-
verse energy and diode recovery dv/dt capability.
The HEXFET transistors also feature all of the well estab-
lished advantages of MOSFETs such as voltage control,
very fast switching, ease of paralleling and temperature
stability of the electrical parameters.
They are well suited for applications such as switching
power supplies, motor controls, inverters, choppers, audio
amplifiers and high energy pulse circuits.
IRF250
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Thermal Resistance
Parameter Min Typ Max Units Test Conditions
RthJC Junction to Case — — 0.83
RthJA Junction to Ambient — — 30 Typical socket mount
°C/W
Source-Drain Diode Ratings and Characteristics
Parameter Min Typ Max Units Test Conditions
ISContinuous Source Current (Body Diode) — — 3 0
ISM Pulse Source Current (Body Diode) ➀— — 120
VSD Diode Forward Voltage — — 1 .9 V Tj = 25°C, IS =30A, VGS = 0V ➃
trr Reverse Recovery Time — — 950 nS Tj = 25°C, IF = 30A, di/dt ≤100A/µs
QRR Reverse Recovery Charge — — 9.0 µc VDD ≤50V ➃
ton Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
A
For footnotes refer to the last page
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min Typ Max Units Test Conditions
BVDSS Drain-to-Source Breakdown Voltage 200 — — V VGS = 0V, ID = 1.0mA
∆BVDSS/∆TJTemperature Coefficient of Breakdown — 0.29 — V/°C Reference to 25°C, ID = 1.0mA
Voltage
RDS(on) Static Drain-to-Source On-State — — 0.085 VGS = 10V, ID =19A ➃
Resistance — — 0.090 VGS =10V, ID =30A ➃
VGS(th) Gate Threshold Voltage 2.0 — 4.0 V VDS = VGS, ID =250µA
gfs Forward Transconductance 9.0 — — S ( ) V
DS > 15V, IDS =19A➃
IDSS Zero Gate Voltage Drain Current — — 2 5 VDS=160V, VGS=0V
— — 250 VDS =160V
VGS = 0V, TJ = 125°C
IGSS Gate-to-Source Leakage Forward — — 100 VGS =20V
IGSS Gate-to-Source Leakage Reverse — — -100 VGS =-20V
QgTotal Gate Charge 55 — 115 VGS =10V, ID=30A
Qgs Gate-to-Source Charge 8 — 2 2 nC VDS =100V
Qgd Gate-to-Drain (‘Miller’) Charge 30 — 60
td(on) Turn-On Delay Time — — 35 VDD =100V, ID =30A,
trRise Time — — 190 RG =2.35Ω
td(off) Turn-Off Delay Time — — 170
tfFall Time — — 130
LS + LDTotal Inductance — 6.1 —
Ciss Input Capacitance — 3500 VGS = 0V, VDS =25V
Coss Output Capacitance — 700 — pF f = 1.0MHz
Crss Reverse Transfer Capacitance — 110 —
nA
Ω
nH
ns
µA
Ω
Measured from the center of
drain pad to center of source
pad
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IRF250
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
IRF250
4www.irf.com
Fig 8. Maximum Safe Operating Area
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
13 a& b
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IRF250
Fig 10a. Switching Time Test Circuit
V
DS
90%
10%
V
GS t
d(on)
t
r
t
d(off)
t
f
Fig 10b. Switching Time Waveforms
VDS
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
RD
VGS
RGD.U.T.
10V
+
-
VDD
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig 9. Maximum Drain Current Vs.
Case Temperature
IRF250
6www.irf.com
QG
QGS QGD
VG
Charge
D.U.T. V
DS
I
D
I
G
3mA
V
GS
.3µF
50KΩ
.2µF
12V
Current Regulator
Same Type as D.U.T.
Current Sampling Resistors
+
-
10 V
Fig 13b. Gate Charge Test Circuit
Fig 13a. Basic Gate Charge Waveform
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
Fig 12b. Unclamped Inductive Waveforms
Fig 12a. Unclamped Inductive Test Circuit
tp
V
(BR)DSS
I
AS
R
G
I
AS
0.01
Ω
t
p
D.U.T
L
VDS
+
-V
DD
DRIVER
A
15V
20V
10V
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IRF250
Foot Notes:
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111
IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630
IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936
Data and specifications subject to change without notice. 01/01
➂ ISD ≤30A, di/dt ≤190A/µs,
VDD≤ 200V, TJ ≤ 150°C
Suggested RG =2.35 Ω
➀ Repetitive Rating; Pulse width limited by
maximum junction temperature.
➁ VDD =50V, starting TJ = 25°C,
Peak IL = 30A, ➃ Pulse width ≤ 300 µs; Duty Cycle ≤ 2%
Case Outline and Dimensions —TO-204AE (Modified TO-3)
