SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DMeets or Exceeds the Requirements of
ANSI TIA/EIA-422-B, TIA/EIA-423-B, and ITU
Recommendation V.10 and V.11
DLow Power, ICC = 10 mA Typ
D±7-V Common-Mode Range With ±200-mV
Sensitivity
DInput Hysteresis . . . 60 mV Typ
Dtpd = 17 ns Typ
DOperates From a Single 5-V Supply
D3-State Outputs
DInput Fail-Safe Circuitry
DImproved Replacements for AM26LS32
DAvailable in Q-Temp Automotive
− High Reliability Automotive Applications
− Configuration Control/Print Support
− Qualification to Automotive Standards
description/ordering information
The AM26C32 is a quadruple differential line
receiver for balanced or unbalanced digital data
transmission. The enable function is common to
all four receivers and offers a choice of active-high
or active-low input. The 3-state outputs permit
connection directly to a bus-organized system.
Fail-safe design specifies that if the inputs are
open, the outputs always are high.
The AM26C32 devices are manufactured using a BiCMOS process, which is a combination of bipolar and
CMOS transistors. This process provides the high voltage and current of bipolar with the low power of CMOS
to reduce the power consumption to about one-fifth that of the standard AM26LS32, while maintaining ac and
dc performance.
The AM26C32C is characterized for operation from 0°C to 70°C. The AM26C32I is characterized for operation
from −40 °C to 85°C. The AM26C32Q is characterized for operation from −40°C to 125°C. The AM26C32M is
characterized for operation over the full military temperature range of −55°C to 125°C.
Copyright 2004, Texas Instruments Incorporated
!"# $%
$ ! ! & '
$$ ()% $ !* $ #) #$
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1B
1A
1Y
G
2Y
2A
2B
GND
VCC
4B
4A
4Y
G
3Y
3A
3B
AM26C32C ... D, N, OR NS PACKAGE
AM26C32I ... D, N, NS, OR PW PACKAGE
AM26C32Q ...D PACKAGE
AM26C32M ...J OR W PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
4A
4Y
NC
G
3Y
1Y
G
NC
2Y
2A
AM26C32M . . . FK PACKAGE
(TOP VIEW)
1A
1B
NC
3B
3A 4B
2B
GND
NC CC
V
NC − No internal connection
!$ !# ++,--. ## ! $
# &( $% ## & !$. !$
!* $ #) #$ * ## !%
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP (N) Tube of 25 AM26C32CN AM26C32CN
0°C to 70°C
SOIC (D)
Tube of 40 AM26C32CD
AM26C32C
0°C to 70°CSOIC (D) Reel of 2500 AM26C32CDR AM26C32C
SOP (NS) Reel of 2000 AM26C32CNSR 26C32
PDIP (N) Tube of 25 AM26C32IN AM26C32IN
SOIC (D)
Tube of 40 AM26C32ID
AM26C32I
−40°C to 85°CSOIC (D) Reel of 2500 AM26C32IDR AM26C32I
−40 C to 85 C
SOP (NS) Reel of 2000 AM26C32INSR 26C32I
TSSOP (PW) Tube of 90 AM26C32IPW 26C32I
−40°C to 125°CSOIC (D) Tube of 40 AM26C32QD AM26C32QD
CDIP (J) Tube of 25 AM26C32MJ AM26C32MJ
−55°C to 125°CCFP (W) Tube of 150 AM26C32MW AM26C32MW
−55 C to 125 C
LCCC (FK) Tube of 55 AM26C32MFK AM26C32MFK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each receiver)
DIFFERENTIAL
ENABLES
OUTPUT
DIFFERENTIAL
INPUT G G
OUTPUT
Y
VID ≥ VIT+
H X H
VID ≥ VIT+ XLH
VIT− < VID < VIT+
H X ?
VIT− < VID < VIT+ XL?
VID ≤ VIT−
H X L
VID ≤ VIT− XLL
X L H Z
H = high level, L = low level, X = irrelevant
Z = high impedance (off), ? = indeterminate
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram (positive logic)
4Y
3Y
2Y
1Y
4B
4A
3B
3A
2B
2A
1B
1A
G
G
Pin numbers shown are for the D, J, N, NS, PW, and W packages.
4
12
2
1
6
7
10
9
14
15
3
5
11
13
schematics
Input
VCC
EQUIVALENT OF A OR B INPUT TYPICAL OF ALL OUTPUTS
Output
VCC
VCC
1.7 kΩ
NOM
GND GND
1.7 kΩ
NOM
17 kΩ
NOM
288 kΩ
NOM
VCC (A inputs)
or
GND (B inputs)
Input
GND
EQUIVALENT OF G OR G INPUT
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI: A or B inputs −11 V to 14 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
G or G inputs −0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage range, VID −14 V to 14 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO −0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, IO ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 2 and 3): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 108°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential output voltage, VOD, are with respect to network GND. Currents into the device are positive
and currents out of the device are negative.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN NOM MAX UNIT
VCC Supply voltage 4.5 5 5.5 V
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
VIC Common-mode input voltage ±7 V
IOH High-level output current −6 mA
IOL Low-level output current 6 mA
AM26C32C 0 70
TA
Operating free-air temperature
AM26C32I −40 85
°C
T
A
Operating free-air temperature
AM26C32Q −40 125 °
C
AM26C32M −55 125
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended ranges of VCC, VIC, and operating free-air
temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VIT+
Differential input high-threshold voltage
VO = VOH(min),
VIC = −7 V to 7 V 0.2
V
VIT+ Differential input high-threshold voltage
VO = VOH(min),
IOH = −440 µAVIC = 0 to 5.5 V 0.1 V
VIT−
Differential input low-threshold voltage
VO = 0.45 V,
VIC = −7 V to 7 V −0.2‡
V
VIT− Differential input low-threshold voltage
VO = 0.45 V,
IOL = 8 mA VIC = 0 to 5.5 V −0.1‡V
Vhys Hysteresis voltage (VIT+ − VIT−) 60 mV
VIK Enable input clamp voltage VCC = 4.5 V, II = −18 mA −1.5 V
VOH High-level output voltage VID = 200 mV, IOH = −6 mA 3.8 V
VOL Low-level output voltage VID = −200 mV, IOL = 6 mA 0.2 0.3 V
IOZ Off-state (high-impedance state) output current VO = VCC or GND ±0.5 ±5µA
II
Line input current
VI = 10 V, Other input at 0 V 1.5
mA
IILine input current VI = −10 V, Other input at 0 V −2.5 mA
IIH High-level enable current VI = 2.7 V 20 µA
IIL Low-level enable current VI = 0.4 V −100 µA
riInput resistance One input to ground 12 17 kΩ
ICC Supply current VCC = 5.5 V 10 15 mA
†All typical values are at VCC = 5 V, VIC = 0, and TA = 25°C.
‡The algebraic convention, in which the less positive (more negative) limit is designated minimum, is used in this data sheet for common-mode
input voltage.
switching characteristics over recommended ranges of operation conditions, CL = 50 pF (unless
otherwise noted)
PARAMETER
TEST
CONDITIONS
AM26C32C
AM26C32I AM26C32Q
AM26C32M
UNIT
PARAMETER
CONDITIONS
MIN TYP†MAX MIN TYP†MAX
UNIT
tPLH Propagation delay time, low- to high-level output
See Figure 1
9 17 27 9 17 27 ns
tPHL Propagation delay time, high- to low-level output See Figure 1 9 17 27 9 17 27 ns
tTLH Output transition time, low- to high-level output
See Figure 1
4 9 4 10 ns
tTHL Output transition time, high- to low-level output See Figure 1 4 9 4 9 ns
tPZH Output enable time to high level
See Figure 2
13 22 13 22 ns
tPZL Output enable time to low level
See Figure 2
13 22 13 22 ns
tPHZ Output disable time from high level
See Figure 2
13 22 13 26 ns
tPLZ Output disable time from low level
See Figure 2
13 22 13 25 ns
†All typical values are at VCC = 5 V, TA = 25°C.
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
Output VOH
VOL
10%
90%90%
10%
tTLH tTHL
tPLH tPHL
2.5 V
−2.5 V
50%
Input
Device
Under
Test
A
B
VCC
CL = 50 pF
(see Note A)
Input
NOTE A: CL includes probe and jig capacitance.
Figure 1. Switching Test Circuit and Voltage Waveforms
TEST CIRCUIT
Device
Under
Test
G Input
G Input
VCC S1
RL = 1 kΩ
CL = 50 pF
(see Note A)
VID = ±2.5 V
VOLTAGE WAVEFORMS
tPZL, tPLZ Measurement: S1 to VCC
tPZH, tPHZ Measurement: S1 to GND
1.3 VG
G
(see Note B)
Output
(with VID = 2.5 V)
Output
(with VID = −2.5 V)
tPZH tPHZ tPZH tPHZ
tPZL tPLZ tPZL tPLZ
VOH −0.5 V
VOL + 0.5 V
VOH −0.5 V
VOL + 0.5 V
3 V
0 V
3 V
0 V
VOH
VOL
VOH
VOL
1.3 V
50%
50%
A Input
B Input
NOTES: A. CL includes probe and jig capacitance.
B. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, duty cycle ≤ 50%, tr = tf = 6 ns.
Figure 2. Enable/Disable Time Test Circuit and Output Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 5-May-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9164001Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9164001QEA ACTIVE CDIP J 16 1 TBD Call TI Call TI
5962-9164001QFA ACTIVE CFP W 16 1 TBD Call TI Call TI
AM26C32CD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32CDBLE OBSOLETE SSOP DB 16 TBD Call TI Call TI
AM26C32CDE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32CDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32CDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32CN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
AM26C32CNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
AM26C32CNSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32CNSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32CNSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32ID ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32IDBLE OBSOLETE SSOP DB 16 TBD Call TI Call TI
AM26C32IDE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32IDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32IDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 5-May-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
AM26C32IDRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32IN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
AM26C32INE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
AM26C32INSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32INSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32INSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32IPW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32IPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32IPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32IPWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32IPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
AM26C32MJB ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
AM26C32MWB ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
AM26C32QD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26C32QDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 5-May-2012
Addendum-Page 3
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF AM26C32, AM26C32M :
•Catalog: AM26C32
•Enhanced Product: AM26C32-EP, AM26C32-EP
•Military: AM26C32M
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
AM26C32CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26C32CNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
AM26C32IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26C32INSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
AM26C32IPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
AM26C32CDR SOIC D 16 2500 333.2 345.9 28.6
AM26C32CNSR SO NS 16 2000 367.0 367.0 38.0
AM26C32IDR SOIC D 16 2500 333.2 345.9 28.6
AM26C32INSR SO NS 16 2000 367.0 367.0 38.0
AM26C32IPWR TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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