General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
LRZ Series Issue July 2008
Zerohm Thick Film
Jumper Chip
LRZ Series
• Current rating to 35 amps
• 0.002 ohm maximum resistance
• Copper on Alumina construction
• Very low inductance
• Available in 1206, 2010 and 2512 chip sizes
Electrical Data
Physical Data
Size 1206 Size 2010 Size 2512
Resistance ohms 0.002 max. 0.002 max. 0.002 max.
Power Rating @ ≤70° C watts .5 1 2
Continuous Current amps 16 22 32
Maximum Surge Current amps 20 30 35
Dielectric Withstanding Voltage volts 200 200 200
Insulation Resistance ohms greater than 10G
Leach Resistance molten solder 250°C - 90 seconds
Operating Temperature Range -55°C to +150°C
1206 2010 2512
in. mm in. mm in. mm.
L0.126 ± 0.012 3.20 ± 0.30 0.206 ± 0.015 5.23 ± 0.38 0.256 ± 0.015 6.50 ± 0.38
W0.064 ± 0.008 1.63 ± 0.20 0.104 ± 0.010 2.64 ± 0.25 0.128 ± 0.010 3.25 ± 0.25
H0.024 ± 0.004 0.61 ± 0.10 0.029 ± 0.004 0.74 ± 0.10 0.029 ± 0.004 0.74 ± 0.10
D0.019 ± 0.010 0.48 ± 0.25 0.019 ± 0.010 0.48 ± 0.25 0.019 ± 0.010 0.48 ± 0.25
E0.019 ± 0.010 0.48 ± 0.25 0.019 ± 0.010 0.48 ± 0.25 0.019 ± 0.010 0.48 ± 0.25
Nickel Barrier Layer
Finish: Matte Tin or Sn/Pb
H
D
L
Protective Overcoat
Copper C o n d u c t o rCopper Wr ap-around
Te rm ination
Alumina Substrate
W
E
LRZ Series Issue July 2008
Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Zerohm Thick Film
Jumper Chip
Ordering Data
Prefix LRC - LRZ 1206LF - R000
Model
LRZ = Zero ohm jumper
Size
1206, 1206LF, 2010, 2010LF, 2512, 2512LF
Note: LF indicates Pb-free terminations
Resistance Code
Standard Marking is ‘R000’
For additional information or to discuss your specific requirements,
please contact our Applications Team using the contact details below.
Recommended Solder Pad Layout
A
B
C
.MID6021RL0102RL2152RL
A
.ni080.0021.0541.0
mm)0.2()50.3()7.3(
B
.ni061.0552.0503.0
mm)0.4()5.6()57.7(
C.ni050.0060.0060.0
mm)52.1()5.1()5.1(
70°-55° 150°
100
50
10
% Of Rated Power
Temperature in °C
Power Derating Curve
