INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-XBA170-R04 1
XBA170
Dual Single-Pole, Normally Open
OptoMOS® Relay
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Pb
Part # Description
XBA170 8-Pin DIP (50/Tube)
XBA170P 8-Pin Flatpack (50/Tube)
XBA170PTR 8-Pin Flatpack (1000/Reel)
XBA170S 8-Pin Surface Mount (50/Tube)
XBA170STR 8-Pin Surface Mount (1000/Reel)
Parameter Rating Units
Load Voltage 350 V
Load Current 100 mArms / mADC
On-Resistance (max) 50
Input Control Current 5 mA
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
XBA170 comprises two independent 350V, 100mA,
50 solid state relays: one single-pole, normally
open (1-Form-A) relay and one single-pole, normally
closed (1-Form-B) relay.
Featuring low on-resistance combined with enhanced
peak load current handling capabilities, XBA170
is designed to provide an ideal solution where a
complementary Form-A/Form-B relay pair is required.
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Utility Meters (gas, oil, electric and water)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Compliant
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• VDE Compatible
• FCC Compatible
• No EMI/RFI Generation
• Small 8-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount & Tape & Reel Version Available
Switching Characteristics
of Normally Closed Devices
Form-B
I
F
10%
90%
I
LOAD
t
on
t
off
Switching Characteristics
of Normally Open Devices
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
1
2
3
4
8
7
6
5
+ Control - Normally Closed
– Control - Normally Closed
+ Control - Normally Open
– Control - Normally Open
Normally Closed Pole
Normally Open Pole
AC/DC Configuration
INTEGRATED CIRCUITS DIVISION
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2R04
XBA170
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
AC/DC Configuration, Continuous - IL- - 100 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance, AC/DC Configuration IL=100mA RON -3350
Off-State Leakage Current VL=350VPILEAK --1 A
Switching Speeds
Turn-On IF=5mA, VL=10V ton --5 ms
Turn-Off toff --5
Output Capacitance VL=50V, f=1MHz COUT -25- pF
Input Characteristics
Input Control Current to Activate IL=100mA IF--2 mA
Input Control Current to Deactivate - IF0.4 0.7 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Capacitance, Input to Output - CI/O -3- pF
*NOTE: If both poles operate simultaneously, then the load current must be derated in order not to exceed the package power dissipation value.
Parameter Ratings Units
Blocking Voltage 350 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
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XBA170
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FORM-A / FORM-B PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
FORM-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Typical Leakage vs. Temperature
Measured across Pins 5&6 or 7&8
Temperature (ºC)
Leakage (PA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Energy Rating Curve
Time
Load Current (A)
10Ps
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100Ps 100ms 1s
10ms 10s 100s
FormA
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC)
0.67 0.83 1.06 1.140.75 0.990.91
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
FormA
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC)
0.11 0.17 0.22 0.280.250.190.14
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
FormA
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=100mADC)
25
20
15
10
5
0
29.09 30.63 32.9329.86 32.1631.40 33.70
On-Resistance (:)
Device Count (N)
FormA
Typical IF for Switch Operation
(N=50, IL=100mADC)
0.44 0.56 0.690.50 0.62 0.75 0.81
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
FormA
Typical IF for Switch Dropout
(N=50, IL=100mADC)
25
20
15
10
5
0
0.50 0.62 0.750.44 0.56 0.69 0.81
LED Current (mA)
Device Count (N)
FormA
Typical Blocking Voltage Distribution
(N=50)
25
20
15
10
5
0
424.0 434.5 444.9 455.4429.3 439.7 450.1
Blocking Voltage (VP)
Device Count (N)
INTEGRATED CIRCUITS DIVISION
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4R04
XBA170
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
FORM-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
FormA
Typical Turn-On Time
vs. LED Forward Current
(IL=100mADC)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
FormA
Typical Turn-On Time
vs. Temperature
(IL=100mADC)
Temperature (ºC)
I
F
=5mA
Turn-On Time (ms)
-40
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100 120
IF=10mA
IF=20mA
FormA
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100 120
FormA
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mADC)
LED Forward Current (mA)
Turn-Off Time (ms)
05 101520253035404550
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
FormA
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=100mADC)
Temperature (ºC)
Turn-Off Time (ms)
-40
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100 120
FormA
Typical IF for Switch Dropout
vs. Temperature
(IL=100mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100 120
FormA
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=100mADC)
Temperature (ºC)
On-Resistance (:)
-40
70
60
50
40
30
20
10
0
-20 0 20 40 60 80 100 120
FormA
Typical Load Current
vs. Load Voltage
(IF=5mA)
Load Voltage (V)
Load Current (mA)
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120 -3-4 -2 -1 0 1 2 3 4
Form A
Maximum Load Current
vs. Temperature
Temperature (ºC)
Load Current (mA)
160
140
120
100
80
60
40
20
0
-40 -20 0 20 40 60 80 120100
IF=20mA
IF=10mA
IF=5mA
FormA
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
-40
455
450
445
440
435
430
425
420 -20 0 20 40 60 80 100
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XBA170
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R04
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
FORM-B RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
FormB
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC)
0.11 0.17 0.220.14 0.19 0.25 0.28
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
FormB
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC)
0.75 0.91 1.06 1.140.990.830.67
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
FormB
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=100mADC)
25
20
15
10
5
0
30.59 32.13 33.66 35.2031.36 32.90 34.43
On-Resistance (:)
Device Count (N)
FormB
Typical IF for Switch Operation
(N=50, IL=100mADC)
25
20
15
10
5
0
0.44 0.56 0.69 0.810.50 0.62 0.75
LED Current (mA)
Device Count (N)
FormB
Typical IF for Switch Dropout
(N=50, IL=100mADC)
25
20
15
10
5
0
0.50 0.62 0.750.44 0.56 0.69 0.81
LED Current (mA)
Device Count (N)
FormB
Typical Blocking Voltage Distribution
(N=50)
25
20
15
10
5
0
424.0 434.5 444.9 455.4429.3 439.7 450.1
Blocking Voltage (VP)
Device Count (N)
INTEGRATED CIRCUITS DIVISION
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6R04
XBA170
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
FORM-B RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
FormB
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=100mADC)
Temperature (ºC)
On-Resistance (:)
-40
70
60
50
40
30
20
10
0
-20 0 20 40 60 80 100 120
FormB
Typical Load Current
vs. Load Voltage
(IF=5mA)
Load Voltage (V)
Load Current (mA)
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120 -3-4 -2 -1 0 1 2 3 4
Form B
Maximum Load Current
vs. Temperature
(IF=5mA)
Temperature (ºC)
Load Current (mA)
160
140
120
100
80
60
40
20
0
-40 -20 0 20 40 60 80 120100
FormB
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
-40
455
450
450
440
435
430
425
420 -20 0 20 40 60 80 100
FormB
Typical Turn-On Time
vs. LED Forward Current
(IL=100mADC)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
FormB
Typical Turn-On Time
vs. Temperature
(IF=5mA, IL=100mADC)
Temperature (ºC)
Turn-On Time (ms)
-40
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100 120
FormB
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100 120
FormB
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mADC)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
FormB
Typical Turn-Off Time
vs. Temperature
(IL=100mADC)
Temperature (ºC)
I
F
=5mA
I
F
=10mA
IF=20mA
Turn-Off Time (ms)
-40
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100 120
FormB
Typical IF for Switch Dropout
vs. Temperature
(IL=100mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100 120
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XBA170
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Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
XBA170 / XBA170S / XBA170P MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
XBA170 / XBA170S 250ºC for 30 seconds
XBA170P 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e3
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INTEGRATED CIRCUITS DIVISION
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8R04
XBA170
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
XBA170
XBA170S
XBA170P
Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION
Specification: DS-XBA170-R04
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
For additional information please visit our website at: www.ixysic.com
9
XBA170
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
User Direction of Feed
P = 12.00
(0.472)
W = 16.00
(0.63)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1 = 2.00
(0.079)
K0 = 2.70
(0.106)
7.50
(0.295)
2.00
(0.079)
4.00
(0.157)
XBA170STR Tape & Reel
XBA170PTR Tape & Reel
