©2009 Fairchild Semiconductor Corporation
ISL9V3040D3S / ISL9V3040S3S / IS L9V3040P3 / ISL9V3040S3
ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 /
ISL9V3040S3
EcoSPARK 300mJ , 400V, N-Channel Ignition IGBT
General Description
The ISL9V3040D3S, ISL9V3040S3S, ISL9V3040P3, and
ISL9V3040S3 are the next generation ignition IGBTs that offer
outstanding SCIS capability in the space saving D-Pak (TO-252), as
well as the industry standard D²-Pak (TO-263), and TO-262 and TO-
220 plastic packages. This device is intended for use in automotive
ignition ci rcuits, speci fically a s a coil d river. In ternal d iode s provide
voltage clamping without the need for external components.
devices can be custom made to specific clamp
voltages. Contact your nearest Fairchild sales office for more
information.
F ormerly Developmental Type 49362
Applications
Automotive Ignition Coil Driver Circuits
Coil- On Plug Applications
Features
Space saving D-Pak package availability
SCIS Energy = 300mJ at TJ = 25oC
Logic Level Gate Drive
Device Ma xi mum Rati ngs TA = 25°C unless otherwise noted
Symbol Parameter Ratings Units
BVCER Collect or to Emitter Breakdown Voltage (IC = 1 mA) 430 V
BVECS Emitter to Collector Voltage - Reverse Battery Condition (IC = 10 mA) 24 V
ESCIS25 At Starting TJ = 25°C , ISCIS = 14.2A, L = 3.0 mHy 300 mJ
ESCIS150 At Starting TJ = 150°C, ISCIS = 10.6A, L = 3.0 mHy 170 mJ
IC25 Collector Current Continuous , At TC = 25°C, See Fig 9 21 A
IC110 Collector Current Continuous, At TC = 110°C, See Fig 9 17 A
VGEM Gate to Emitter Voltage Continuous ±10 V
PDPower Dissipation Total TC = 25°C 150 W
Power Dissipation Derating TC > 25°C 1.0 W/°C
TJOperating Junction Temperature Range -40 to 175 °C
TSTG Stor age Junction Temperature Range -40 to 175 °C
TLMax Lead Temp for Soldering (Leads at 1.6mm from Case for 10s) 300 °C
Tpkg Max Lead Temp for Soldering (Package Body for 10s) 260 °C
ESD Electrostatic Discharge Voltage at 100pF, 15004kV
Package
GATE
COLLECTOR
EMITTER
R
2
R
1
Symbol
JEDEC TO-252AA
D-Pak
D²-Pak
JEDEC TO-263AB
COLLECTOR
(FLANGE)
JEDEC TO-220AB
E
G
E
G
JEDEC TO-262AA
EG
C
EG
C
November 2009
®
EcoSPARK®
Qualified to AEC Q101
RoHS Compliant
ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3 Rev. D4, November 2009
ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3
Package Marking and Ordering Information
Electrical Characteristics TA = 25°C unless otherwise noted
Off State Characteristics
On State Charac t eris ti cs
Dynamic Characteristics
Switching Characteristics
Thermal Characteristics
Device Marking Device Package Reel Size Tape Width Quantity
V3040D ISL9V3040D3ST TO-252AA 330mm 16mm 2500
V3040S ISL9V3040S3ST TO-263AB 330mm 24mm 800
V3040P ISL9V3040P3 TO-220AA Tube N/A 50
V3040S ISL9V3040S3 TO-262AA Tube N/A 50
V3040D ISL9V3040D3S TO-252AA Tube N/A 75
V3040S ISL9V3040S3S TO-263AB Tube N/A 50
Symbol Par a m e ter Test Conditions Min Typ Max Units
BVCER Collect or to Emitter Breakdown Voltage IC = 2mA, VGE = 0,
RG = 1KΩ, See Fig. 15
TJ = -40 to 150°C
370 400 430 V
BVCES Collector to Emitter Breakdown Voltage IC = 10mA, VGE = 0,
RG = 0, See Fig. 15
TJ = -40 to 150°C
390 420 450 V
BVECS Emitter to Collector Breakdown Vo ltage IC = -75mA, VGE = 0V,
TC = 25°C 30 - - V
BVGES Gate to Emitter Breakdown Voltage IGES = ± 2mA ±12 ±14 - V
ICER Collector to Emitter Leakage Current VCER = 250V,
RG = 1KΩ,
See Fig. 11
TC = 25°C- - 25 µA
TC = 150°C- - 1 mA
IECS Emitter to Collector Leakage Current VEC = 24V , See
Fig. 11 TC = 25°C- - 1 mA
TC = 150°C- - 40 mA
R1Series Ga te Resistance - 70 -
R2Gate to Emitter Resistance 10K - 26K
VCE(SAT) Collector to Emitter Saturation Voltage IC = 6A,
VGE = 4V TC = 25°C,
See Fig. 3 - 1.25 1.60 V
VCE(SAT) Collector to Emitter Saturation Voltage IC = 10A,
VGE = 4.5V TC = 150°C,
See Fig. 4 - 1.58 1.80 V
VCE(SAT) Collector to Emitter Saturation Voltage IC = 15A,
VGE = 4.5V TC = 150°C - 1.90 2.20 V
QG(ON) Gate Charge IC = 10A, VCE = 12V,
VGE = 5V, See Fig. 14 -17-nC
VGE(TH) Ga te to Emitter Thresh ol d Voltage IC = 1.0mA,
VCE = VGE,
See Fig. 10
TC = 25°C1.3 - 2.2 V
TC = 150°C0.75 - 1.8 V
VGEP Gate to Emitter Plateau Voltage IC = 10A, VCE = 12V - 3.0 - V
td(ON)R Current Turn-On Delay Time-Resistive VCE = 14V, RL = 1Ω,
VGE = 5V, RG = 1K
TJ = 25°C, See Fig. 12
-0.7s
trR Current Rise Time-Resistive - 2.1 7 µs
td(OFF)L Current Turn-Off Dela y Time-Inductive VCE = 300V, L = 500µHy,
VGE = 5V, RG = 1K
TJ = 25°C, See Fig. 12
- 4.8 15 µs
tfL Current Fall Time-Inductive - 2.8 15 µs
SCIS Self Clamped Inductive Switching T J = 25°C, L = 3.0 mHy,
RG = 1KΩ, VGE = 5V, See
Fig. 1 & 2
- - 300 mJ
RθJC Ther m al Resistance Junction-Case All packages - - 1.0 °C/W
November 2009©2009 Fairchild Semiconductor Corporation ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3 Rev. D4,
ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3
Typical Performance Curves
Figure 1. Self Clamped Inductive Switching
Current vs Time in Clamp Figure 2. Self Clamped Inductive Switching
Current vs Inductance
Figure 3. Collector to Emitter On-State Voltage vs
Junction Tem peratu r e Figure 4. Collector to Emitter On-State Voltage
vs Junction Temperature
Figure 5. Collector to Emitter On-State Voltage vs
Collector Current Figure 6. Collector to Emitter On-State Voltage
vs Collector Current
tCLP, TIME IN CLAMP (µS)
ISCIS, INDUCTIVE SWITCHING CURRENT (A)
25
15
5
30
20
10
0
RG = 1k, VGE = 5V,Vdd = 14V
20017515001255025 75 100
TJ = 25°C
TJ = 150°C
SCIS Curves valid for Vclamp Voltages of <430V
25
15
5
30
20
10
0
ISCIS, INDUCTIVE SWITCHING CURRENT (A)
0102468
TJ = 25°C
TJ = 150°C
L, INDUCTANCE (mHy)
RG = 1k, VGE = 5V,Vdd = 14V
SCIS Curves valid for Vclamp Voltages of <430V
1.30
1.26
1.22
1.18
1.14-75 25-25 17512575-50 0 50 100 150
TJ, JUNCTION TEMPERATURE (°C)
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
VGE = 4.0V
VGE = 3.7V
VGE = 4.5V
VGE = 5.0V
VGE = 8.0V
ICE = 6A
-75 25-25 17512575-50 0 50 100 150
1.8
1.7
1.6
1.5
1.4
TJ, JUNCTION TEMPERATURE (°C)
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
ICE = 10A
1.3
1.2
VGE = 4.0V
VGE = 3.7V
VGE = 4.5V
VGE = 5.0V
VGE = 8.0V
ICE, COLLECTOR TO EM ITT ER CURRENT (A)
VCE, COLLECTOR TO EMITTER VO LTAGE (V)
20
0
10
02.01.0 3.0 4.0
25
15
5
TJ = - 40°C
VGE = 4.0V
VGE = 3.7V
VGE = 4.5V
VGE = 5.0V
VGE = 8.0V
VGE = 4.0V
VGE = 3.7V
VGE = 4.5V
VGE = 5.0V
VGE = 8.0V
TJ = 25°C
ICE, COLLECTOR TO EMITTER CURRENT (A)
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
20
10
0
25
15
5
02.01.0 3.0 4.0
©2009 Fairchild Semiconductor Corporation ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3 Rev. D4, November 2009
ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3
Typical Performance Curves (Continued)
Figure 7. Collector to Emitter On-State Voltage vs
Collector Current Figure 8. Transfer Characteristics
Figure 9. DC Collector Current vs Case
Temperature Figure 10. Threshold Voltage vs Junction
Temperature
Figure 11. Leakage Current vs Junction
Temperature Figure 12. Switching Time vs Junction
Temperature
ICE, COLLECTOR TO EMITTER CURRENT (A)
VCE, COLLECTOR TO EMITTER VO LTAGE (V)
25
15
5
0
20
10
02.01.0 3.0 4.0
VGE = 4.0V
VGE = 3.7V
VGE = 4.5V
VGE = 5.0V
VGE = 8.0V
TJ = 175°C
ICE, COLLECTOR TO EMITTER CURRENT (A)
VGE, GATE TO EMITTER VOLTAGE (V)
2.01.0 3.0 4.0
25
15
5
0
20
10
PULSE DURATION = 250µs
DUTY CYCLE < 0.5%, VCE = 5V
TJ = 25°C
TJ = 150°C
2.51.5 3.5 4.5
TJ = -40°C
ICE, DC COLLECTOR CURRENT (A)
TC, CASE TEMPERATURE (°C)
25
25 1751257550 100 150
20
15
10
5
0
VGE = 4.0V
2.2
17550 100
2.0
1.8
1.6
1.4
1.0
VCE = VGE
VTH, THRESHOLD VOLTAGE (V)
TJ JUNCTION TEMPERATURE (°C)
1500-50 1257525-25
1.2
ICE = 1mA
LEAKAGE CURRENT (µA)
TJ, JUNCTION TEMPERATURE (°C)
1000
10
0.1
10000
100
1
25-25 17512575-50 0 50 100 150
VCES = 250V
VECS = 24V
VCES = 300V
25 1751257550 100 150
TJ, JUNCTION TEMPERATURE (°C)
SWITCHING TIME (µS)
12
10
8
6
4
2
ICE = 6.5A, VGE = 5V, RG = 1K
Resistive tOFF
Inductive tOFF
Resistive tON
November 2009©2009 Fairchild Semiconductor Corporation ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3 Rev. D4,
ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3
Typical Performance Curves (Continued)
Figure 13. Capacitance vs Collector to Emitter
Voltage Figur e 14. Gate Charge
Figure 15. Breakdown Voltage vs Series Gate Resistance
Figure 16. IGBT Normalized Transient Thermal Impedance, Junction to Case
C, CAPACITANCE (pF)
VCE, COLLECTOR TO EMITT ER VOLTAGE (V)
1600
800
400
1200
0105152025
0
CIES
COES
CRES
FREQUENCY = 1 MHz
QG, GATE CHARGE (nC)
VGE, GATE TO EMITTER VOLTAGE (V)
0
2
4
8
0 4 8 1216202428
3
5
7
6
1
32
IG(REF) = 1mA, RL = 1.25Ω, TJ = 25°C
VCE = 6V
VCE = 12V
BVCER, BREAKDOWN VOLTAGE (V)
RG, SERIES GATE RESISTANCE (k)
430
410
400
420
10 20001000 3000
390 100
415
405
425
395
TJ = - 40°C
TJ = 25°C
TJ = 175°C
ICER = 10mA
ZthJC, NORMALIZED THERMAL RESPONSE
T1, RECTANGULAR PULSE DURATION (s)
100
10-2
10-1
10-2
10-3
10-4
10-5 10-1
DUTY FACTOR, D = t
1
/ t
2
PEAK T
J
= (P
D
X Z
θ
JC
X R
θ
JC
) + T
C
t
1
t
2
P
D
10-6
0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
10-3
©2009 Fairchild Semiconductor Corporation ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3 Rev. D4, November 2009
ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3
Test Circuit and Waveforms
Figure 17. Inductive Switching Test Circuit Figure 18. tON and tOFF Switching Test Circuit
Figure 19. Energy Test Circuit Figure 20. Energy Waveforms
RGG
C
E
VCE
L
PULSE
GEN DUT RG = 1K+
-
VCE
DUT
5V
C
G
E
LOAD
R
or
L
tP
VGE
0.01
L
IAS
+
-
VCE
VDD
RG
VARY tP TO OBTAIN
REQUIRED PEAK IAS
0V
DUT
G
C
E
VDD
VCE
BVCES
tP
IAS
tAV
0
©2009 Fairchild Semiconductor Corporation ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3 Rev. D4, November 2009
ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3
SPICE Thermal Model
REV 7 March 2002
ISL9V3040D3S / ISL9V30 40S3S / ISL9V3040P 3 /
ISL9V3040S3
CTHERM1 th 6 2.1e -3
CTHERM2 6 5 1.4e -1
CTHERM3 5 4 7.3e -3
CTHERM4 4 3 2.1e -1
CTHERM5 3 2 1.1e -1
CTHERM6 2 tl 6.2e +6
RTHERM1 th 6 1.2e -1
RTHERM2 6 5 1.9e -1
RTHERM3 5 4 2.2e -1
RTHERM4 4 3 6.0e -2
RTHERM5 3 2 5.8e -2
RTHERM6 2 tl 1.6e -3
SABER Thermal Model
SABER thermal model
ISL9V3040D3S / ISL9V30 40S3S / ISL9V3040P 3 /
ISL9V3040S3
template thermal_model th tl
therma l _c th, tl
{
ctherm.ctherm1 th 6 = 2.1e -3
ctherm.ctherm2 6 5 = 1.4e -1
ctherm.ctherm3 5 4 = 7.3e -3
ctherm.ctherm4 4 3 = 2.2e -1
ctherm.ctherm5 3 2 =1.1e -1
ctherm.cthe rm6 2 tl = 6.2e +6
rtherm. rtherm1 th 6 = 1.2e -1
rtherm. rtherm2 6 5 = 1.9e -1
rtherm. rtherm3 5 4 = 2.2e -1
rtherm. rtherm4 4 3 = 6.0e -2
rtherm. rtherm5 3 2 = 5.8e -2
rtherm. rtherm6 2 tl = 1.6e -3
}
RTHERM4
RTHERM6
RTHERM5
RTHERM3
RTHERM2
RTHERM1
CTHERM4
CTHERM6
CTHERM5
CTHERM3
CTHERM2
CTHERM1
tl
2
3
4
5
6
th JUNCTION
CASE
/ ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3 Rev. D4, November 2009©2009 Fairchild Semiconductor Corporation ISL9V3040D3S
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPower
Auto-SPM
Build it Now
CorePLUS
CorePOWER
CROSSVOLT
CTL™
Current Transfer Logic™
EcoSPARK®
EfficientMax™
EZSW ITCH™*
™*
DEUXPEED™
®
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
FAST®
FastvCore
FETBench
FlashWriter®*
FPS
F-PFS
FRFET®
Global Power ResourceSM
Green FPS
Green FPS e-Series
Gmax
GTO
IntelliMAX
ISOPLANAR
MegaBuck™
MICROCOUPLER
MicroFET
MicroPak
MillerDrive™
MotionM ax
Motion-SPM™
OPTOLOGIC®
OPTOPLANAR®
®
PDP SPM™
Power-SPM
PowerTrench®
PowerXS™
Programmable Active Droop
QFET®
QS
Quiet Series
RapidConfigure
Saving our world, 1mW/W/kW at a time™
SignalWise™
SmartMax™
SMART START
SPM®
STEALTH™
SuperFET
SuperSOT-3
SuperSOT-6
SuperSOT-8
SupreMOS™
SyncFET™
Sync-Lock™
®*
The Power Franchise®
TinyBoost
TinyBuck
TinyCalc
TinyLogic®
TINYOPTO
TinyPower
TinyPWM
TinyWire
TriFault Detect
TRUECURRENT*
μSerDes
UHC®
Ultra FRFET
UniFET
VCX
VisualMax
XS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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FAIRCHI LD SEM ICONDUCTOR RESERVES THE RIG HT TO MAKE CHANGES WITHOUT FURTHER NOTI CE TO ANY PRODUCTS HEREIN TO I MPRO VE
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WHICH COVERS THESE PRODUCTS.
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FAIRCHI LD’S PRODUCTS ARE NOT AUTHORIZED F OR USE AS CRITI CAL COM PONENTS IN LI FE SUPPORT DEVICES OR SY STEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAI RCHI LD SEM ICONDUCTOR CORPORATIO N.
As used herein:
1. Life support devices or systems are devices or system s which, (a) are
intended for surgical im plant i nto the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Preliminary First Production
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only. Rev. I43
ISL9V3040D3S / ISL9V3040S3S / ISL9V3040P3 / ISL9V3040S3