1
FEATURES
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
C2+
C2−
V−
RIN1
RIN2
RIN3
RIN4
RIN5
DOUT1
DOUT2
DOUT3
DIN3
DIN2
DIN1
C1+
V+
VCC
GND
C1−
FORCEON
FORCEOFF
INVALID
ROUT2B
ROUT1
ROUT2
ROUT3
ROUT4
ROUT5
DB, DW, OR PW PACKAGE
(TOP VIEW)
APPLICATIONS
QFN PACKAGE
(TOP VIEW)
GND
C1–
FORCEON
FORCEOFF
INVALID
ROUTB2
ROUT1
ROUT2
RIN1
RIN2
RIN3
RIN4
RIN5
DOUT1
DOUT2
DOUT3
NC
V–
C2–
C2+
C1+
V+
VCC
NC
NC
DIN3
DIN2
DIN1
ROUT5
ROUT4
ROUT3
NC
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
3132 30 29 28 27 26 25
109 11 12 13 14 15 16
MAX3243E
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................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVERWITH ± 15-kV IEC ESD PROTECTION
2
•Single-Chip and Single-Supply Interface forIBM™ PC/AT™ Serial Port•ESD Protection for RS-232 Bus Pins– ± 15-kV Human-Body Model (HBM)– ± 8-kV IEC61000-4-2, Contact Discharge– ± 15-kV IEC61000-4-2, Air-Gap Discharge•Meets or Exceeds Requirements ofTIA/EIA-232-F and ITU v.28 Standards•Operates With 3-V to 5.5-V V
CC
Supply•Always-Active Noninverting Receiver Output(ROUT2B)
•Designed to Transmit at a Data Rate up to500 kbit/s•Low Standby Current . . . 1 µA Typ•External Capacitors . . . 4 × 0.1 µF•Accepts 5-V Logic Input With 3.3-V Supply•Designed to Be Interchangeable With MaximMAX3243E
•Serial-Mouse Driveability•Auto-Powerdown Feature to Disable DriverOutputs When No Valid RS-232 Signal IsSensed
•Package Options Include Plastic Small-Outline(DW), Shrink Small-Outline (DB), and ThinShrink Small-Outline (PW) Packages
•Battery-Powered Systems•PDAs
•Notebooks
•Laptops
•Palmtop PCs•Hand-Held Equipment
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2IBM, PC/AT are trademarks of International Business Machines Corporation.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005 – 2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
DESCRIPTION
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 ...................................................................................................................................................
www.ti.com
The MAX3243E device consists of three line drivers, five line receivers, and a dual charge-pump circuit with± 15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ± 8-kV ESD (IEC61000-4-2, Contact Discharge)protection on serial-port connection pins. The device meets the requirements of TIA/EIA-232-F and provides theelectrical interface between an asynchronous communication controller and the serial-port connector. Thiscombination of drivers and receivers matches that needed for the typical serial port used in an IBM PC/AT, orcompatible. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-Vsupply. In addition, the device includes an always-active noninverting output (ROUT2B), which allowsapplications using the ring indicator to transmit data while the device is powered down. The device operates atdata signaling rates up to 250 kbit/s and a maximum of 30-V/ µs driver output slew rate.
Flexible control options for power management are available when the serial port is inactive. Theauto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode ofoperation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF isset low, both drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 µA.Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high, and should be done when drivinga serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal isapplied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at anyreceiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than – 2.7 Vor has been between – 0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver inputvoltages are between – 0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
The MAX3243EC is characterized for operation from 0 ° C to 70 ° C. The MAX3243EI is characterized for operationfrom – 40 ° C to 85 ° C.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
MAX3243ECDWSOIC – DW Tape and reel MAX3243ECMAX3243ECDWR
MAX3243ECDBSSOP – DB Tape and reel MAX3243EC0 ° C to 70 ° C MAX3243ECDBR
MAX3243ECPWTSSOP – PW Tape and reel MP243ECMAX3243ECPWRQFN – RHB Tape and reel MAX3243ECRHBR MP243EMAX3243EIDBSSOP – DB Tape and reel MAX3243EIMAX3243EIDBR
MAX3243EIDWSOIC – DW Tape and reel MAX3243EI– 40 ° C to 85 ° C MAX3243EIDWR
MAX3243EIPWTSSOP – PW Tape and reel MP243EIMAX3243EIPWRQFN – RHB Tape and reel MAX3243EIRHBR MR243E
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .
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Product Folder Link(s): MAX3243E
MAX3243E
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................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
FUNCTION TABLES
ABC
EACH DRIVER
(1)
INPUTS
OUTPUT
DRIVER STATUSVALID RIN
DOUTDIN FORCEON FORCEOFF
RS-232 LEVEL
X X L X Z Powered offL H H X H
Normal operation withauto-powerdown disabledH H H X LL L H Yes H
Normal operation withauto-powerdown enabledH L H Yes LL L H No Z
Powered off byauto-powerdown featureH L H No Z
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER
(1)
INPUTS OUTPUTS
VALID RIN
RECEIVER STATUSRIN1, ROUT1,RIN2 FORCEOFF RS-232 ROUT2B ROUT2RIN3 – RIN5 ROUT3 – 5LEVEL
L X L X L Z Z
Powered off whileROUT2B is activeH X L X H Z ZL L H YES L H HL H H YES L L L
Normal operation withH L H YES H H H auto-powerdown
disabled/enabledH H H YES H L LOpen Open H YES L H H
(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): MAX3243E
DIN3
DIN2
DIN1
DOUT3
DOUT2
DOUT1
Auto-powerdown INVALID
RIN1
RIN2
RIN3
RIN4
RIN5
FORCEOFF
FORCEON
ROUT1
ROUT2B
ROUT2
ROUT3
ROUT4
ROUT5
14
13
12
22
23
19
20
18
17
16
15
9
10
11
21
4
5
6
7
8
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 ...................................................................................................................................................
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LOGIC DIAGRAM (POSITIVE LOGIC)
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ABSOLUTE MAXIMUM RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
(1)
ELECTRICAL CHARACTERISTICS
(1)
MAX3243E
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................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range
(2)
– 0.3 6 VV+ Positive output supply voltage range
(2)
– 0.3 7 VV – Negative output supply voltage range
(2)
0.3 – 7 VV+ – V – Output supply voltage difference
(2)
13 VDriver ( FORCEOFF, FORCEON) – 0.3 6V
I
Input voltage range VReceiver – 25 25Driver – 13.2 13.2V
O
Output voltage range VReceiver ( INVALID) – 0.3 V
CC
+ 0.3DB package 62θ
JA
Package thermal impedance
(3) (4)
DW package 46 C/WPW package 62Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 CT
stg
Storage temperature range – 65 150 C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operatingconditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltages are with respect to network GND.(3) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) - T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 ° C can affect reliability.(4) The package thermal impedance is calculated in accordance with JESD 51-7.
See Figure 6
MIN NOM MAX UNIT
V
CC
= 3.3 V 3 3.3 3.6Supply voltage VV
CC
= 5 V 4.5 5 5.5V
CC
= 3.3 V 2V
IH
Driver and control high-level input voltage DIN, FORCEOFF, FORCEON VV
CC
= 5 V 2.4V
IL
Driver and control low-level input voltage DIN, FORCEOFF, FORCEON 0.8 VV
I
Driver and control input voltage DIN, FORCEOFF, FORCEON 0 5.5 VV
I
Receiver input voltage – 25 25 VMAX3243EC 0 70T
A
Operating free-air temperature CMAX3243EI – 40 85
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
I
I
Input leakage current FORCEOFF, FORCEON 0.01 1 µANo load,Auto-powerdown disabled 0.3 1 mAFORCEOFF and FORCEON at V
CC
Powered off No load, FORCEOFF at GND 1 10Supply currentI
CC
No load, FORCEOFF at V
CC
,(T
A
= 25 ° C)
µAFORCEON at GND,Auto-powerdown enabled 1 10All RIN are open or grounded,All DIN are grounded
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 ° C.
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): MAX3243E
DRIVER SECTION
Electrical Characteristics
(1)
Switching Characteristics
(1)
ESD Protection
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 ...................................................................................................................................................
www.ti.com
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
V
OH
High-level output voltage All DOUT at R
L
= 3 k Ωto GND 5 5.4 VV
OL
Low-level output voltage All DOUT at R
L
= 3 k Ωto GND – 5 – 5.4 VOutput voltage DIN1 = DIN2 = GND, DIN3 = V
CC
, 3-k Ωto GND at DOUT3,V
O
± 5 V(mouse driveability) DOUT1 = DOUT2 = 2.5 mAI
IH
High-level input current V
I
= V
CC
± 0.01 ± 1 µAI
IL
Low-level input current V
I
at GND ± 0.01 ± 1 µAV
hys
Input hysteresis ± 1 VV
CC
= 3.6 V, V
O
= 0 VI
OS
Short-circuit output current
(3)
± 60 mAV
CC
= 5.5 V, V
O
= 0 Vr
o
Output resistance V
CC
, V+, and V – = 0 V, V
O
= ± 2 V 300 10M Ω
I
off
Output leakage current FORCEOFF = GND, V
O
= ± 12 V, V
CC
= 0 to 5.5 V ± 25 µA
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 ° C.(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than oneoutput should be shorted at a time.
switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwisenoted) (see Figure 6 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
C
L
= 1000 pF, R
L
= 3 k ΩMaximum data rate 250 500 kbit/sOne DOUT switching, See Figure 1t
sk(p)
Pulse skew
(3)
C
L
= 150 pF to 2500 pF, R
L
= 3 k Ωto 7 k Ω, See Figure 2 100 nsV
CC
= 3.3 V, C
L
= 150 pF to 1000 pF 6 30Slew rate, transition regionSR(tr) R
L
= 3 k Ωto 7 k Ω, V/ µs(see Figure 1)
C
L
= 150 pF to 2500 pF 4 30PRR = 250 kbit/s
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V + 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 ° C.(3) Pulse skew is defined as |t
PLH
– t
PHL
| of each channel of the same device.
PARAMETER TEST CONDITIONS TYP UNIT
HBM ± 15 kVDriver outputs (pins 9 – 11) IEC61000-4-2, Air-Gap Discharge ± 15 kVIEC61000-4-2, Contact Discharge ± 8 kV
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Product Folder Link(s): MAX3243E
RECEIVER SECTION
Electrical Characteristics
(1)
Switching Characteristics
(1)
ESD Protection
MAX3243E
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................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
V
OH
High-level output voltage I
OH
= – 1 mA V
CC
– 0.6 V
CC
– 0.1 VV
OL
Low-level output voltage I
OH
= 1.6 mA 0.4 VV
CC
= 3.3 V 1.6 2.4V
IT+
Positive-going input threshold voltage VV
CC
= 5 V 1.9 2.4V
CC
= 3.3 V 0.6 1.1V
IT –
Negative-going input threshold voltage VV
CC
= 5 V 0.8 1.4V
hys
Input hysteresis (V
IT+
– V
IT –
) 0.5 VI
off
Output leakage current (except ROUT2B) FORCEOFF = 0 V ± 0.05 ± 10 µAr
i
Input resistance V
I
= ± 3 V or ± 25 V 3 5 7 k Ω
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 ° C.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP
(2)
UNIT
t
PLH
Propagation delay time, low- to high-level output C
L
= 150 pF, See Figure 3 150 nst
PHL
Propagation delay time, high- to low-level output 150 nst
en
Output enable time C
L
= 150 pF, R
L
= 3 k Ω, See Figure 4 200 nst
dis
Output disable time 200 nst
sk(p)
Puse skew
(3)
See Figure 3 50 ns
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 ° C.(3) Pulse skew is defined as |t
PLH
- t
PHL
| of each channel of the same device.
PARAMETER TEST CONDITIONS TYP UNIT
HBM ± 15 kVDriver outputs (pins 4 – 8) IEC61000-4-2, Air-Gap discharge ± 15 kVIEC61000-4-2, Contact Discharge ± 8 kV
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Product Folder Link(s): MAX3243E
AUTO-POWERDOWN SECTION
Electrical Characteristics
Switching Characteristics
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 ...................................................................................................................................................
www.ti.com
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )
PARAMETER TEST CONDITIONS MIN MAX UNIT
Receiver input threshold FORCEON = GND,V
IT+(valid)
2.7 Vfor INVALID high-level output voltage FORCEOFF = V
CC
Receiver input threshold FORCEON = GND,V
IT – (valid)
– 2.7 Vfor INVALID high-level output voltage FORCEOFF = V
CC
Receiver input threshold FORCEON = GND,V
T(invalid)
– 0.3 0.3 Vfor INVALID low-level output voltage FORCEOFF = V
CC
I
OH
= -1 mA, FORCEON = GND,V
OH
INVALID high-level output voltage V
CC
– 0.6 VFORCEOFF = V
CC
I
OL
= 1.6 mA, FORCEON = GND,V
OL
INVALID low-level output voltage 0.4 VFORCEOFF = V
CC
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )
PARAMETER TEST CONDITIONS TYP
(1)
UNIT
t
valid
Propagation delay time, low- to high-level output V
CC
= 5 V 1 µst
invalid
Propagation delay time, high- to low-level output V
CC
= 5 V 30 µst
en
Supply enable time V
CC
= 5 V 100 µs
(1) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 ° C.
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Product Folder Link(s): MAX3243E
PARAMETER MEASUREMENT INFORMATION
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
−3 V
−3 V
3 V
3 V
0 V
3 V
Output
Input
VOL
VOH
tTLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tTHL
CL
(see Note A)
SR(tr) +6 V
tTHL or tTLH
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tPLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tPHL
CL
(see Note A)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
50% 50%
1.5 V 1.5 V
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
−3 V
3 V
Output
Input
VOL
VOH
tPHL
Generator
(see Note B) tPLH
Output
CL
(see Note A)
3 V or 0 V
FORCEON
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
3 V
FORCEOFF
1.5 V 1.5 V
50% 50%
MAX3243E
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................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
Figure 1. Driver Slew Rate
Figure 2. Driver Pulse Skew
Figure 3. Receiver Propagation Delay Times
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PARAMETER MEASUREMENT INFORMATION
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
Generator
(see Note B)
3 V or 0 V Output
VOL
VOH
tPZH
(S1 at GND)
3 V
−3 V
0.3 V
Output
Input
0.3 V
3 V or 0 V
FORCEON
FORCEOFF
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
C. tPLZ and tPHZ are the same as tdis.
D. tPZL and tPZH are the same as ten.
1.5 V 1.5 V
50%
tPHZ
(S1 at GND)
tPLZ
(S1 at VCC)
50%
tPZL
(S1 at VCC)
RL
S1
VCC GND
CL
(see Note A)
Output
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 ...................................................................................................................................................
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Figure 4. Receiver Enable and Disable Times
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PARAMETER MEASUREMENT INFORMATION
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
3 V
2.7 V
−2.7 V
INVALID
Output
Receiver
Input
Generator
(see Note B)
FORCEOFF
tvalid
ROUT
FORCEON
Auto-
powerdown INVALID
DOUT
0 V
0 V
−3 V
DIN
CL = 30 pF
(see Note A)
VCC
0 V
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
2.7 V
−2.7 V
0.3 V
−0.3 V
0 V
Valid RS-232 Level, INVALID High
Indeterminate
Indeterminate
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
Valid RS-232 Level, INVALID High
†Auto-powerdown disables drivers and reduces supply
current to 1 µA.
≈V+
0 V
≈V−
V+
VCC
ten
V−
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
50% VCC 50% VCC
2.7 V
−2.7 V
0.3 V
0.3 V
tinvalid
Supply
Voltages
MAX3243E
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................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
Figure 5. INVALID Propagation Delay Timnes and Supply Enabling Time
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Product Folder Link(s): MAX3243E
APPLICATION INFORMATION
RIN4
DOUT2
DOUT3
ROUT1
FORCEOFF
RIN5 INVALID
ROUT2
DOUT1 ROUT2B
DIN3
DIN2
ROUT3
ROUT4
DIN1 ROUT5
C4 +
−
+
−
C3†
VCC
C2+
C2− C1
C1+
GND
V−
C1−
FORCEON
C2 +
−
CBYPASS
= 0.1 µF
V+
+
−
+
−
RIN1
RIN2
RIN3
RS-232 Inputs
Logic Outputs
Logic Inputs
RS-232 Outputs
VCC C1 C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
†C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or
electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR V ALUES
Auto-
powerdown
1
2
4
5
6
7
8
9
10
11
12
13
14
3
28
27
26
25
24
23
22
21
20
19
18
17
16
15
5 kΩ
5 kΩ
5 kΩ
5 kΩ
5 kΩ
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 ...................................................................................................................................................
www.ti.com
Figure 6. Typical Operating Circuit and Capacitor Values
12 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
APPLICATION INFORMATION
ESD Protection
ESD Test Conditions
Human Body Model (HBM)
−
+DUT
RD
1.5 kΩ
VHBM 100 pF
CS
MAX3243E
www.ti.com
................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
TI MAX3243E devices have standard ESD protection structures incorporated on the pins to protect againstelectrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driveroutputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structureswere designed to successfully protect these bus pins against ESD discharge of ± 15-kV in all states: normaloperation, shutdown, and powered down. The MAX3243E devices are designed to continue functioning properlyafter an ESD occurrence without any latchup.
The MAX3243E devices have three specified ESD limits on the driver outputs and receiver inputs, with respect toGND:
•± 15-kV Human Body Model (HBM)•± 15-kV IEC61000-4-2, Air-Gap Discharge (formerly IEC1000-4-2)•± 8-kV IEC61000-4-2, Contact Discharge
ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for areliability report that documents test setup, methodology, and results.
The Human Body Model of ESD testing is shown in Figure 7, while Figure 8 shows the current waveform that isgenerated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to theESD voltage of concern, and subsequently discharged into the DUT through a 1.5k- Ωresistor.
Figure 7. HBM ESD Test Circuit
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): MAX3243E
APPLICATION INFORMATION
100 150 20050
0
1.5
1.0
0.5
0.0
DUT = 10-V 1-Ω Zener Diode
VHBM = 2 kV
Time (ns)
IDUT(A)
IEC61000-4-2 (Formerly Known as IEC1000-4-2)
−
+DUT
150 pF
CS
RCRD
50−100 MΩ330 Ω
High-Voltage
DC Source
MAX3243E
SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 ...................................................................................................................................................
www.ti.com
Figure 8. Typical HBM Current Waveform
Unlike the HBM, MM, and CDM ESD tests that apply to component level integrated circuits, the IEC61000-4-2 isa system-level ESD testing and performance standard that pertains to the end equipment. The MAX3243E isdesigned to enable the manufacturer in meeting the highest level (Level 4) of IEC61000-4-2 ESD protection withno further need of external ESD protection circuitry. The more stringent IEC test standard has a higher peakcurrent than the HBM, due to the lower series resistance in the IEC model.
Figure 9 shows the IEC61000-4-2 model, and Figure 10 shows the current waveform for the corresponding± 8-kV Contact-Discharge (Level 4) test. This waveform is applied to a probe that has been connected to theDUT. On the other hand, the corresponding ± 15-kV (Level 4) Air-Gap Discharge test involves approaching theDUT with an already energized probe.
Figure 9. Simplified IEC61000-4-2 ESD Test Circuit
14 Submit Documentation Feedback Copyright © 2005 – 2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
APPLICATION INFORMATION
(30A) 100%
90%
10%
30 ns 60 ns
I
t
tr = 0.7 ns to 1 ns
IPeak
(8A)
(16A)
(Vcontact = 8 kV)
Machine Model
MAX3243E
www.ti.com
................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009
Figure 10. Typical Current Waveform of IEC61000-4-2 ESD Generator
The Machine Model (MM) ESD test applies to all pins using a 200-pF capacitor with no discharge resistance.The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling andassembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins.However, after PC board assembly, the MM test is no longer as pertinent to the RS-232 pins.
Copyright © 2005 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Link(s): MAX3243E
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX3243ECDB ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECDBE4 ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECDBG4 ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECDBR ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECDBRE4 ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECDW ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECDWG4 ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECDWR ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECPW ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECPWE4 ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECPWR ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECPWRE4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243ECRHBR ACTIVE QFN RHB 32 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
MAX3243ECRHBRG4 ACTIVE QFN RHB 32 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
MAX3243EIDB ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243EIDBG4 ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243EIDBR ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243EIDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243EIDW ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243EIDWG4 ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243EIDWR ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Apr-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX3243EIDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243EIPW ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243EIPWE4 ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243EIPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243EIPWR ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243EIPWRE4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243EIPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243EIRHBR ACTIVE QFN RHB 32 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
MAX3243EIRHBRG4 ACTIVE QFN RHB 32 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Apr-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
MAX3243ECDBR SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
MAX3243ECDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
MAX3243ECPWR TSSOP PW 28 2000 330.0 16.4 7.1 10.4 1.6 12.0 16.0 Q1
MAX3243ECPWR TSSOP PW 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1
MAX3243ECRHBR QFN RHB 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2
MAX3243EIDBR SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
MAX3243EIDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
MAX3243EIPWR TSSOP PW 28 2000 330.0 16.4 7.1 10.4 1.6 12.0 16.0 Q1
MAX3243EIPWR TSSOP PW 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1
MAX3243EIRHBR QFN RHB 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Feb-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX3243ECDBR SSOP DB 28 2000 346.0 346.0 33.0
MAX3243ECDWR SOIC DW 28 1000 346.0 346.0 49.0
MAX3243ECPWR TSSOP PW 28 2000 346.0 346.0 33.0
MAX3243ECPWR TSSOP PW 28 2000 346.0 346.0 33.0
MAX3243ECRHBR QFN RHB 32 3000 346.0 346.0 29.0
MAX3243EIDBR SSOP DB 28 2000 346.0 346.0 33.0
MAX3243EIDWR SOIC DW 28 1000 346.0 346.0 49.0
MAX3243EIPWR TSSOP PW 28 2000 346.0 346.0 33.0
MAX3243EIPWR TSSOP PW 28 2000 346.0 346.0 33.0
MAX3243EIRHBR QFN RHB 32 3000 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Feb-2009
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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