01
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01
SMC (Surface Mount Compatible) types, 2.00 mm pitch Page
connector system – general information . . . . . . . . . . . . . . . . . . . . . . 01.02
Solder requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 01.03
SMC connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 01.04
Angled female connectors*
Type A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 01.05
Type B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 01.06
Type AB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 01.07
Type C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 01.08
Directory chapter 01
* Technical characteristics see chapter 00
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connector system General information
Fig. 1:
SMT board with connector for
"Pin in Hole Intrusive Reflow" assembly
Fig. 2:
Pick-and-place machine for
odd form components
(Courtesy of JOT Automation GmbH)
The continuing trend towards miniaturisation
has revolutionised the assembly of electronic
components. For the past 15 years, most
components have been secured directly to
the pcb surface by means of Surface Mount
Technology (SMT). By dispensing with drilled
holes on the pcb, a space saving of up to 70
percent is achieved.
Today, typical components such as ICs, resistors,
capacitors, inductors, and connectors with straight
terminal pins are almost exclusively fitted using
SMD (Surface Mount Device) technology in mass
production. In contrast, angled SMD connectors
at the edge of the board have not been successful
because of tolerance problems (co-planarity) and
stresses during mating.
“Pin in Hole Intrusive Reflow*”
In this process, the connector is inserted into plated
through holes in a comparable way to conventional
component mounting. All other components can be
assembled on the pcb surface.
The components are positioned using pick-and-place
machines. These automatic assembly machines
differ according to whether the components are
small, lightweight or bulky. Connectors, compared to
ICs, are considered bulky (odd form). They are more
difficult to grip, due to their comparatively heavy
weight and larger size. But machines for odd form
components, provide the higher insertion power,
necessary to fit the components into pcb holes,
which are filled with solder paste. Generally modern
SMC production lines are equipped with both types
of machine. Therefore the "Pin in Hole Intrusive
Reflow" process entails no extra investment costs for
the user.
Conventional assembly process:
1. Application of solder paste
2. Positioning the components
3. Positioning odd form components
4. Reflow soldering
5. Pressing in or partially dip soldering the
connector at the board edge
6. Quality inspection
“Pin in Hole Intrusive Reflow” assembly:
1. Application of solder paste
2. Positioning the components
3. Positioning odd form components
4. Reflow soldering
5. Pressing in or partially dip soldering the
connector at the board edge
6. Quality inspection
* Also known as Pin-in-Paste or Through Hole Reflow (THR)
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Volume of solder paste
Connector
termination
Fig. 4: Plated through hole with connector termination
pcb
Solder requirements
Application of solder paste
Before the components are assembled, solder
paste is applied to all the solder pads and the plated
through holes. Usually a screen printing process is
used for this purpose. A squeegee moves across
the pcb, which is masked with screens and presses
the solder paste into all unmasked areas. A good
solder joint is basically determined by the amount
of the applied solder paste. Only a few parameters
(illustrated on the right) will lead to the right quantity.
As an alternative to screen printing, the solder paste
can be applied by means of a dispenser. A high-
precision robot moves the dispenser to all required
positions on the pcb. The dispensing method is
particularly suitable for small pcb’s or applications
which demand high precision and flexibility in
dispensing volumes.
connector was designed for Pin in Hole
Intrusive Reflow with features like an inspection
friendly black colour, tape and reel packaging for
automated handling and it is self retaining on pcb.
The design – moulded from high temperature
resistant material – ensures good heat distribution,
so that current solder temperature profiles can be
used. The special material of the insulation body
withstands also the higher temperatures of lead free
soldering.
Advantages for using connectors are:
● Partial dip soldering or press fitting
is no longer required
● High mechanical stability
● Complete compatibility
with Surface Mount Technology
● Savings through integration
into the automated assembly process
● Reduced floor space in the production plant
Fig. 3: Dispenser in operation
Solder paste volume
There are numerous scientific studies dealing with
calculation of the required quantity of solder paste.
These studies use various parameters, e.g. the
shrinking factor of the paste during soldering or the
thickness of the screens used for masking the pcb.
Since such calculation methods are complicated
to apply, the following rule of thumb has proved
valuable in practice:
VPaste = 2(VH – VP)
in which:
VPaste = Required volume of solder paste
VH = Volume of the plated through hole
VP = Volume of the connector termination
in the hole
Comment: the multiplier “2” compensates for
solder paste shrinkage during soldering. For
this purpose, it was assumed that 50 % of the
paste consists of the actual solder, the other
50 % being soldering aids.
Requirements for the solder connection
At the beginning of a new production batch, the
process parameters, such as quantity of solder paste
and soldering temperature, can be set by interpreting
simple cross-sections of the soldered connection. A
reliable measure for achieving optimum parameters
is the quantity of solder required to fill the hole. In
soldered connections of high quality, the holes are
filled to between 75 % and 100 %.
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SMC connectors
Requirements for SMC connectors
Conventional SMC (Surface Mount Compatible)
connectors have to withstand temperatures of up
to 225°C in the reflow oven for 10 to 15 seconds.
Industry is moving towards lead free soldering with
temperatures in the range of 235°C up to 260°C.
Peak values might be above this level. Therefore, the
moulding must be made from a dimensionally stable
plastic which expands at the same rate as the pcb
material when subjected to heat.
For the reflow soldering homogeneous heat
distribution and unimpeded access for convection
heat is important to reach all the solder joints. This is
particularly necessary when dealing with the higher
reflow temperatures of lead free soldering.
The HARTING design of the connector
meets this requirement. It guarantees good heat
distribution to all soldered joints. Even contact row
“a”, which is most hidden by the nature of design, is
heating up during the known soldering process.
With this new concept, hard metric 2 mm
connectors can now be fully integrated into the
economic reflow soldering process.
connectors are ideally suited for fully
automated assembly.
The benefits are:
● Compatible to conventional press-in
connectors
● High mechanical stability
● Compatible to existing board layout
● Cost reduction by process step elimination
● Lead free soldering process
Fig. 5: The HARTING connector can be mounted in a tape
ready for automatic placement. Fig. 6: connector
HARTING SMC technology
HARTING offers its customers a complete system
concept for integrating SMC technology into existing
production lines. In addition to connectors
we manufacture a wide range of SMC connectors,
e. g. 3- and 5-row connectors, in compliance with
IEC 60 603-2, D-Sub connectors in compliance with
IEC 60 807 and connectors from the har-mik® series
with contact spacing of 1.27 millimetres. In addition,
HARTING supports the market with packaging and
processing concepts, which have been developed in
collaboration with renowned manufacturers of SMC
soldering and assembly plants.
You will find more detailed information in our
SMC catalogue, as well as in our DIN 41 612
connectors catalogue.
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Type A
Contact length [mm]
No. of termination
Identification contacts side Part number
Female connectors, angled
Dimensions [mm]
Type A
Type A with upper shield
Position
Row
Position
Row
All holes
Board drillings
Diameter of drillings: Ø 0.7 ± 0.025 mm
Diameter of plated through holes: Ø 0.6 ± 0.050 mm
Row
Position
All part numbers: performance level 1
110 2.5 17 21 110 1801
110 2.5 17 21 110 1802
without shielding with shielding
Position
Row
All holes
01
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06 Dimensions [mm]
without shielding with shielding
Position
Row
Position
Row
All holes
Position
All part numbers: performance level 1
Type B
Contact length [mm]
No. of termination
Identification contacts side Part number
Female connectors, angled
Type B19
Type B22
Type B25
Type B19 with upper shield
Type B22 with upper shield
Type B25 with upper shield
Board drillings
Diameter of drillings: Ø 0.7 ± 0.025 mm
Diameter of plated through holes: Ø 0.6 ± 0.050 mm
Contact positions x1 x2
19 38 18 x 2 (= 36)
22 44 21 x 2 (= 42)
25 50 24 x 2 (= 48)
95 2.5 17 25 095 1801
110 2.5 17 24 110 1801
125 2.5 17 22 125 1801
95 2.5 17 25 095 1802
110 2.5 17 24 110 1802
125 2.5 17 22 125 1802
Row
Position All holes
Row
01
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07
Dimensions [mm]
without shielding with shielding
Position
Row
Position
Row
All holes
Position
All part numbers: performance level 1
Type AB
Contact length [mm]
No. of termination
Identification contacts side Part number
Female connectors, angled
Type AB19
Type AB22
Type AB25
Type AB19 with upper shield
Type AB22 with upper shield
Type AB25 with upper shield
Board drillings
Diameter of drillings: Ø 0.7 ± 0.025 mm
Diameter of plated through holes: Ø 0.6 ± 0.050 mm
Position All holes
Contact positions x1 x2
19 38 18 x 2 (= 36)
22 44 21 x 2 (= 42)
25 50 24 x 2 (= 48)
Row
95 2.5 17 33 095 1801
110 2.5 17 34 110 1801
125 2.5 17 35 125 1801
95 2.5 17 33 095 1802
110 2.5 17 34 110 1802
125 2.5 17 35 125 1802
Row
01
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08 Dimensions [mm]
without shielding with shielding
Position
Row
Position
Row
All holes
All part numbers: performance level 1
Type C
Contact length [mm]
No. of termination
Identification contacts side Part number
55 2.5 17 23 055 1801
Female connectors, angled
Type C
55 2.5 17 23 055 1802
Type C with upper shield
All holes
Board drillings
Diameter of drillings: Ø 0.7 ± 0.025 mm
Diameter of plated through holes: Ø 0.6 ± 0.050 mm
Position
Row
Position
Row
