TMP75AIDGKRG4 - Texas Instruments

FEATURES

D27 ADDRESSES (TMP175)

8 ADDRESSES (TMP75)

DDIGITAL OUTPUT: Two-Wire Serial Interface

DRESOLUTION: 9- to 12-Bits, User-Selectable

DACCURACY:

±1.5°C (max) from −25°C to +85°C

±2.0°C (max) from −40°C to +125°C

DLOW QUIESCENT CURRENT:

50µA, 0.1µA Standby

DWIDE SUPPLY RANGE: 2.7V to 5.5V

DSMALL SO-8 AND MSOP-8 PACKAGES

APPLICATIONS

DPOWER-SUPPLY TEMPERATURE

MONITORING

DCOMPUTER PERIPHERAL THERMAL

PROTECTION

DNOTEBOOK COMPUTERS

DCELL PHONES

DBATTERY MANAGEMENT

DOFFICE MACHINES

DTHERMOSTAT CONTROLS

DENVIRONMENTAL MONITORING AND HVAC

DELECTROMECHANICAL DEVICE

TEMPERATURE

DESCRIPTION

The TMP175 and TMP75 are two-wire, serial output

temperature sensors available in SO-8 and MSOP-8

packages. Requiring no external components, the

TMP175 and TMP75 are capable of reading temperatures

with a resolution of 0.0625°C.

The TMP175 and TMP75 feature a T wo-Wire interface that

is SMBus-compatible, with the TMP175 allowing up to 27

devices on one bus and the TMP75 allowing up to eight

devices on one bus. The TMP175 and TMP75 both feature

an SMBus Alert function.

The TMP175 and TMP75 are ideal for extended

temperature measurement in a variety of communication,

computer, consumer, environmental, industrial, and

instrumentation applications.

The TMP175 and TMP75 are specified for operation over

a temperature range of −40°C to +125°C.

Diode

Temp.

Sensor

∆Σ

A/D

Converter

OSC

Control

Logic

Serial

Interface

Config.

and Temp.

TMP175, TMP75

Temperature

ALERT

SDA 1

GND

V+

SCL 27

TMP175

TMP75

SBOS288J − JANUARY 2004 − REVISED DECEMBER 2007

Digital Temperature Sensor

with Two-Wire Interface

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments

semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

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ABSOLUTE MAXIMUM RATINGS(1)

Power Supply, V+ 7.0V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input Voltage(2) −0.5V to 7.0V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input Current 10mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Temperature Range −55 °C to +127°C. . . . . . . . . . . . . . .

Storage Temperature Range −60 °C to +130°C. . . . . . . . . . . . . . . . .

Junction Temperature (TJ max) +150°C. . . . . . . . . . . . . . . . . . . . . .

ESD Rating:

Human Body Model (HBM) 4000V. . . . . . . . . . . . . . . . . . . . . . .

Charged Device Model (CDM) 1000V. . . . . . . . . . . . . . . . . . . .

Machine Model (MM) 300V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(1) Stresses above these ratings may cause permanent damage.

Exposure t o absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only , a nd

functional operation of the device at these or any other conditions

beyond those specified is not supported.

(2) Input voltage rating applies to all TMP175 and TMP75 input

voltages.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING

TMP175 SO-8 D TMP175

TMP175 MSOP-8 DGK DABQ

TMP75 SO-8 D TMP75

TMP75 MSOP-8 DGK T127

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website

at www.ti.com.

PIN ASSIGNMENTS

Top View

NOTE: Pin 1 is determined by orienting the package marking as indicated in the diagram.

SDA

SCL

ALERT

GND

V+

TMP175

SO−8

TMP175

SDA

SCL

ALERT

GND

V+

T127

MSOP−8

TMP75

SDA

SCL

ALERT

GND

V+

TMP75

SO−8

TMP75

SDA

SCL

ALERT

GND

V+

DABQ

MSOP−8

TMP175

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ELECTRICAL CHARACTERISTICS

At TA = −40°C to +125°C, and V+ = 2.7V to 5.5V, unless otherwise noted.

PARAMETER

CONDITION

TMP175 TMP75

UNITS

PARAMETER

CONDITION

MIN TYP MAX MIN TYP MAX

UNITS

TEMPERATURE INPUT

Range −40 +125 −40 +125 °C

Accuracy (Temperature Error) −25°C to +85°C±0.5 ±1.5 ±0.5 ±2.0 °C

−40°C to +125°C±1.0 ±2.0 ±1.0 ±3.0 °C

vs Supply 0.2 ±0.5 0.2 ±0.5 °C/V

Resolution(1) Selectable +0.0625 +0.0625 °C

DIGITAL INPUT/OUTPUT

Input Capacitance 3 3 pF

Input Logic Levels:

VIH 0.7(V+) 6.0 0.7(V+) 6.0 V

VIL −0.5 0.3(V+) −0.5 0.3(V+) V

Leakage Input Current, IIN 0V ≤ VIN ≤ 6V 1 1 µA

Input Voltage Hysteresis SCL and SDA Pins 500 500 mV

Output Logic Levels:

VOL SDA IOL = 3mA 0 0.15 0.4 0 0.15 0.4 V

VOL ALERT IOL = 4mA 0 0.15 0.4 0 0.15 0.4 V

Resolution Selectable 9 to 12 9 to 12 Bits

Conversion Time 9-Bit 27.5 37.5 27.5 37.5 ms

10-Bit 55 75 55 75 ms

11-Bit 110 150 110 150 ms

12-Bit 220 300 220 300 ms

Timeout Time 25 54 74 25 54 74 ms

POWER SUPPLY

Operating Range 2.7 5.5 2.7 5.5 V

Quiescent Current IQSerial Bus Inactive 50 85 50 85 µA

Serial Bus Active, SCL Freq = 400kHz 100 100 µA

Serial Bus Active, SCL Freq = 3.4MHz 410 410 µA

Shutdown Current ISD Serial Bus Inactive 0.1 3 0.1 3 µA

Serial Bus Active, SCL Freq = 400kHz 60 60 µA

Serial Bus Active, SCL Freq = 3.4MHz 380 380 µA

TEMPERATURE RANGE

Specified Range −40 +125 −40 +125 °C

Operating Range −55 +127 −55 +127 °C

Thermal Resistance q

MSOP-8 250 250 °C/W

SO-8 150 150 °C/W

(1) Specified for 12-bit resolution.

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TYPICAL CHARACTERISTICS

At TA = +25°C and V+ = 5.0V, unless otherwise noted.

QUIESCENT CURRENT vs TEMPERATURE

Temperature (_C)

−55 −35 −15 5 25 45 65 85 105 125 130

IQ(µA)

Serial Bus Inactive

V+=5V

V+ = 2.7V

300

250

200

150

100

CONVERSION TIME vs TEMPERATURE

Temperature (_C)

Conversion Time (ms)

12−bit resolution.

−55 −35 −15 5 25 45 65 85 105 125 130

V+=5V

V+ = 2.7V

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

−0.1

SHUTDOWN CURRENT vs TEMPERATURE

Temperature (_C)

ISD (µA)

−55 −35 −15 5 25 45 65 85 105 125 130

2.0

1.5

1.0

0.5

0.0

−0.5

−1.0

−1.5

−2.0

TEMPERATURE ACCURACY vs TEMPERATURE

Temperature Error (_C)

3 typical units 12−bit resolution.

Temperature (_C)

−55 −35 −155 25456585105125130

500

450

400

350

300

250

200

150

100

QUIESCENT CURRENT WITH

BUS ACTIVITY vs TEMPERATURE

Frequency (Hz)

1k 10k 100k 1M 10M

IQ(µA)

125_C

25_C

−55_C

Hs MODE

FAST MODE

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APPLICATIONS INFORMATION

The TMP175 and TMP75 are digital temperature sensors

that are optimal for thermal management and thermal

protection applications. The TMP175 and TMP75 are

Two-Wire and SMBus interface-compatible, and are

specified over a temperature range of −40°C to +125°C.

The TMP175 and TMP75 require no external components

for operation except for pull-up resistors on SCL, SDA, and

ALERT, although a 0.1µF bypass capacitor is

recommended, as shown in Figure 1.

TMP175

TMP75

0.1µF

V+

GND

ALERT

(Output)

6A1

5A2

SCL

SDA

Two−Wire

Controller

NOTE:SCL,SDA,andALERT

pins require pull−up resistors.

Figure 1. Typical Connections of the TMP175 and

TMP75

The sensing device of the TMP175 and TMP75 is the chip

itself. Thermal paths run through the package leads as well

as the plastic package. The lower thermal resistance of

metal causes the leads to provide the primary thermal

path.

To maintain accuracy in applications requiring air or

surface temperature measurement, care should be taken

to isolate the package and leads from ambient air

temperature. A thermally-conductive adhesive will assist

in achieving accurate surface temperature measurement.

POINTER REGISTER

Figure 2 shows the internal register structure of the

TMP175 and TMP75. The 8-bit Pointer Register of the

devices is used to address a given data register. The

Pointer Register uses the two LSBs to identify which of the

data registers should respond to a read or write command.

Table 1 identifies the bits of the Pointer Register byte.

Table 2 describes the pointer address of the registers

available in the TMP175 and TMP75. Power-up reset

value of P1/P0 is 00.

I/O

Control

Interface

SCL

SDA

Temperature

Configuration

TLOW

THIGH

Pointer

Figure 2. Internal Register Structure of the

TMP175 and TMP75

P7 P6 P5 P4 P3 P2 P1 P0

000000Register Bits

Table 1. Pointer Register Byte

P1 P0 REGISTER

0 0 Temperature Register (READ Only)

0 1 Configuration Register (READ/WRITE)

1 0 TLOW Register (READ/WRITE)

1 1 THIGH Register (READ/WRITE)

Table 2. Pointer Addresses of the TMP175 and

TMP75

TEMPERATURE REGISTER

The Temperature Register of the TMP175 or TMP75 is a

12-bit, read-only register that stores the output of the most

recent conversion. Two bytes must be read to obtain data,

and are described in Table 3 and Table 4. Note that byte 1

is the most significant byte, followed by byte 2, the least

significant byte. The first 12 bits are used to indicate

temperature, with all remaining bits equal to zero. The

least significant byte does not have to be read if that

information is not needed. Data format for temperature is

summarized in Table 5. Following power-up or reset, the

Temperature Register will read 0°C until the first

conversion is complete.

D7 D6 D5 D4 D3 D2 D1 D0

T11 T10 T9 T8 T7 T6 T5 T4

Table 3. Byte 1 of Temperature Register

D7 D6 D5 D4 D3 D2 D1 D0

T3 T2 T1 T0 0 0 0 0

Table 4. Byte 2 of Temperature Register

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TEMPERATURE

(°C) DIGITAL OUTPUT

(BINARY) HEX

128 0111 1111 1111 7FF

127.9375 0111 1111 1111 7FF

100 0110 0100 0000 640

80 0101 0000 0000 500

75 0100 1011 0000 4B0

50 0011 0010 0000 320

25 0001 1001 0000 190

0.25 0000 0000 0100 004

00000 0000 0000 000

−0.25 1111 1111 1100 FFC

−25 1110 0111 0000 E70

−55 1100 1001 0000 C90

Table 5. Temperature Data Format

The user can obtain 9, 10, 11, or 12 bits of resolution by

addressing the Configuration Register and setting the

resolution bits accordingly. For 9-, 10-, or 11-bit resolution,

the most significant bits in the Temperature Register are

used with the unused LSBs set to zero.

CONFIGURATION REGISTER

The Configuration Register is an 8-bit read/write register

used to store bits that control the operational modes of the

temperature sensor. Read/write operations are performed

MSB first. The format of the Configuration Register for the

TMP175 and TMP75 is shown in Table 6, followed by a

breakdown of the register bits. The power-up/reset value

of the Configuration Register is all bits equal to 0.

BYTE D7 D6 D5 D4 D3 D2 D1 D0

1 OS R1 R0 F1 F0 POL TM SD

Table 6. Configuration Register Format

SHUTDOWN MODE (SD)

The Shutdown Mode of the TMP175 and TMP75 allows

the user to save maximum power by shutting down all

device circuitry other than the serial interface, which

reduces current consumption to typically less than 0.1µA.

Shutdown Mode is enabled when the SD bit is 1; the device

will shut down once the current conversion is completed.

When SD is equal to 0, the device will maintain a

continuous conversion state.

THERMOSTAT MODE (TM)

The Thermostat Mode bit of the TMP175 and TMP75

indicates to the device whether to operate in Comparator

Mode (TM = 0) or Interrupt Mode (TM = 1). For more

information on comparator and interrupt modes, see the

High and Low Limit Registers section.

POLARITY (POL)

The Polarity Bit of the TMP175 and TMP75 allows the user

to adjust the polarity of the ALERT pin output. If POL = 0,

the ALERT pin will be active LOW, as shown in Figure 3.

For POL = 1, the ALERT pin will be active HIGH, and the

state of the ALERT pin is inverted.

Measured

Temperature

THIGH

TLOW

TMP75/TMP175 ALERT PIN

(Comparator Mode)

POL = 0

TMP75/TMP175 ALERT PIN

(Interrupt Mode)

POL = 0

TMP75/TMP175 ALERT PIN

(Comparator Mode)

POL = 1

TMP75/TMP175 ALERT PIN

(Interrupt Mode)

POL = 1

Read Read

Time Read

Figure 3. Output Transfer Function Diagrams

FAULT QUEUE (F1/F0)

A fault condition is defined as when the measured

temperature exceeds the user-defined limits set in the

THIGH and TLOW Registers. Additionally, the number of

fault conditions required to generate an alert may be

programmed using the fault queue. The fault queue is

provided to prevent a false alert as a result of

environmental noise. The fault queue requires

consecutive fault measurements in order to trigger the

alert function. Table 7 defines the number of measured

faults that may be programmed to trigger an alert condition

in the device. For THIGH and TLOW register format and byte

order, see the section High and Low Limit Registers.

F1 F0 CONSECUTIVE FAULTS

0 0 1

0 1 2

1 0 4

1 1 6

Table 7. Fault Settings of the TMP175 and TMP75

CONVERTER RESOLUTION (R1/R0)

The Converter Resolution Bits control the resolution of th e

internal Analog-to-Digital (A/D) converter. This allows the

user to maximize efficiency by programming for higher

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resolution or faster conversion time. Table 8 identifies the

Resolution Bits and the relationship between resolution

and conversion time.

R1 R0 RESOLUTION CONVERSION TIME

(typical)

0 0 9 Bits (0.5°C) 27.5ms

0 1 10 Bits (0.25°C) 55ms

1 0 11 Bits (0.125°C) 110ms

1 1 12 Bits (0.0625°C) 220ms

Table 8. Resolution of the TMP175 and TMP75

ONE-SHOT (OS)

The TMP175 and TMP75 feature a One-Shot Temperature

Measurement Mode. When the device is in Shutdown

Mode, writing a ‘1’ to the OS bit will start a single

temperature conversion. The device will return to the

shutdown state at the completion of the single conversion.

This is useful to reduce power consumption in the TMP175

and TMP75 when continuous temperature monitoring is

not required. When the configuration register is read, the

OS will always read zero.

HIGH AND LOW LIMIT REGISTERS

In Comparator Mode (TM = 0), the ALERT pin of the

TMP175 and TMP75 becomes active when the

temperature equals or exceeds the value in THIGH and

generates a consecutive number of faults according to

fault bits F1 and F0. The ALERT pin will remain active until

the temperature falls below the indicated TLOW value for

the same number of faults.

In Interrupt Mode (TM = 1), the ALERT pin becomes active

when the temperature equals or exceeds THIGH for a

consecutive number of fault conditions. The ALERT pin

remains active until a read operation of any register

occurs, or the device successfully responds to the SMBus

Alert Response Address. The ALERT pin will also be

cleared if the device is placed in Shutdown Mode. Once

the ALERT pin is cleared, it will only become active again

by the temperature falling below TLOW. When the

temperature falls below TLOW, the ALERT pin will become

active and remain active until cleared by a read operation

of any register or a successful response to the SMBus

Alert Response Address. Once the ALERT pin is cleared,

the above cycle will repeat, with the ALERT pin becoming

active when the temperature equals or exceeds THIGH.

The ALERT pin can also be cleared by resetting the device

with the General Call Reset command. This will also clear

the state of the internal registers in the device returning the

device to Comparator Mode (TM = 0).

Both operational modes are represented in Figure 3.

Table 9 and Table 10 describe the format for the THIGH and

TLOW registers. Note that the most significant byte is sent

first, followed by the least significant byte. Power-up reset

values for THIGH and TLOW are:

THIGH = 80°C and TLOW = 75°C

The format of the data for THIGH and TLOW is the same as

for the Temperature Register.

BYTE D7 D6 D5 D4 D3 D2 D1 D0

1 H11 H10 H9 H8 H7 H6 H5 H4

BYTE D7 D6 D5 D4 D3 D2 D1 D0

2 H3 H2 H1 H0 0 0 0 0

Table 9. Bytes 1 and 2 of THIGH Register

BYTE D7 D6 D5 D4 D3 D2 D1 D0

1 L11 L10 L9 L8 L7 L6 L5 L4

BYTE D7 D6 D5 D4 D3 D2 D1 D0

2 L3 L2 L1 L0 0 0 0 0

Table 10. Bytes 1 and 2 of TLOW Register

All 12 bits for the Temperature, THIGH, and TLOW registers

are used in the comparisons for the ALERT function for all

converter resolutions. The three LSBs in THIGH and TLOW

can affect the ALERT output even if the converter is

configured for 9-bit resolution.

SERIAL INTERFACE

The TMP175 and TMP75 operate only as slave devices on

the Two-Wire bus and SMBus. Connections to the bus are

made via the open-drain I/O lines SDA and SCL. The SDA

and SCL pins feature integrated spike suppression filters

and Schmitt triggers to minimize the effects of input spikes

and bus noise. The TMP175 and TMP75 both support the

transmission protocol for fast (1kHz to 400kHz) and

high-speed (1kHz to 3.4MHz) modes. All data bytes are

transmitted MSB first.

SERIAL BUS ADDRESS

To communicate with the TMP175 and TMP75, the master

must first address slave devices via a slave address byte.

The slave address byte consists of seven address bits,

and a direction bit indicating the intent of executing a read

or write operation.

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The TMP175 features three address pins to allow up to 27

devices to be addressed on a single bus interface.

Table 11 describes the pin logic levels used to properly

connect up t o 2 7 devices. ‘1’ indicates the pin is connected

to the supply (VCC); ‘0’ indicates the pin is connected to

GND; Float indicates the pin is left unconnected. The state

of pins A0, A1, and A2 is sampled on every bus

communication and should be set prior to any activity on

the interface.

The TMP75 features three address pins allowing up to

eight devices to be connected per bus. Pin logic levels are

described in Table 12. The address pins of the TMP175

and TMP75 are read after reset, at start of communication,

or in response to a Two-Wire address acquire request.

Following reading the state of the pins the address is

latched to minimize power dissipation associated with

detection.

A2 A1 A0 SLAVE ADDRESS

0 0 0 1001000

0 0 1 1001001

0 1 0 1001010

0 1 1 1001011

1 0 0 1001100

1 0 1 1001101

1 1 0 1001110

1 1 1 1001111

Float 0 0 1110000

Float 0 Float 1110001

Float 0 1 1110010

Float 1 0 1110011

Float 1 Float 1110100

Float 1 1 1110101

Float Float 0 1110110

Float Float 1 1110111

0 Float 0 0101000

0 Float 1 0101001

1 Float 0 0101010

1 Float 1 0101011

0 0 Float 0101100

0 1 Float 0101101

1 0 Float 0101110

1 1 Float 0101111

0 Float Float 0110101

1 Float Float 0110110

Float Float Float 0110111

Table 11. Address Pins and Slave Addresses for

the TMP175

A2 A1 A0 SLAVE ADDRESS

0 0 0 1001000

0 0 1 1001001

0 1 0 1001010

0 1 1 1001011

1 0 0 1001100

1 0 1 1001101

1 1 0 1001110

1 1 1 1001111

Table 12. Address Pins and Slave Addresses for

the TMP75

BUS OVERVIEW

The device that initiates the transfer is called a master, and

the devices controlled by the master are slaves. The bus

must be controlled by a master device that generates the

serial clock (SCL), controls the bus access, and generates

the START and STOP conditions.

To address a specific device, a START condition is

initiated, indicated by pulling the data-line (SDA) from a

HIGH to LOW logic level while SCL is HIGH. All slaves on

the bus shift in the slave address byte, with the last bit

indicating whether a read or write operation is intended.

During the ninth clock pulse, the slave being addressed

responds to the master by generating an Acknowledge

and pulling SDA LOW.

Data transfer is then initiated and sent over eight clock

pulses followed by an Acknowledge Bit. During data

transfer SDA must remain stable while SCL is HIGH, as

any change in SDA while SCL is HIGH will be interpreted

as a control signal.

Once all data has been transferred, the master generates

a STOP condition indicated by pulling SDA from LOW to

HIGH, while SCL is HIGH.

WRITING/READING TO THE TMP175 AND

TMP75

Accessing a particular register on the TMP175 and TMP75

is accomplished by writing the appropriate value to the

Pointer Register. The value for the Pointer Register is the

first byte transferred after the slave address byte with the

R/W bit LOW. Every write operation to the TMP175 and

TMP75 requires a value for the Pointer Register. (Ref er t o

Figure 5.)

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When reading from the TMP175 and TMP75, the last value

stored in the Pointer Register by a write operation is used

to determine which register is read by a read operation. To

change the register pointer for a read operation, a new

value must be written to the Pointer Register. This is

accomplished by issuing a slave address byte with the

R/W bit LOW, followed by the Pointer Register Byte. No

additional data is required. The master can then generate

a START condition and send the slave address byte with

the R/W bit HIGH to initiate the read command. See

Figure 7 for details of this sequence. If repeated reads

from the same register are desired, it is not necessary to

continually send the Pointer Register bytes, as the

TMP175 and TMP75 will remember the Pointer Register

value until it is changed by the next write operation.

Note that register bytes are sent most-significant byte first,

followed by the least significant byte.

SLAVE MODE OPERATIONS

The TMP175 and TMP75 can operate as slave receivers

or slave transmitters.

Slave Receiver Mode:

The first byte transmitted by the master is the slave

address, with the R/W bit LOW. The TMP175 or TMP75

then acknowledges reception of a valid address. The next

byte transmitted by the master is the Pointer Register. T h e

TMP175 or TMP75 then acknowledges reception of the

Pointer Register byte. The next byte or bytes are written to

the register addressed by the Pointer Register. The

TMP175 and TMP75 will acknowledge reception of each

data byte. The master may terminate data transfer by

generating a START or STOP condition.

Slave Transmitter Mode:

The first byte is transmitted by the master and is the slave

address, with the R/W bit HIGH. The slave acknowledges

reception of a valid slave address. The next byte is

transmitted by the slave and is the most significant byte of

the register indicated by the Pointer Register. The master

acknowledges reception of the data byte. The next byte

transmitted by the slave is the least significant byte. The

master acknowledges reception of the data byte. The

master may terminate data transfer by generating a

Not-Acknowledge on reception of any data byte, or

generating a START or STOP condition.

SMBus ALERT FUNCTION

The TMP175 and TMP75 support the SMBus Alert

function. When the TMP75 and TMP175 are operating in

Interrupt Mode (TM = 1), the ALERT pin of the TMP75 or

TMP175 may be connected as an SMBus Alert signal.

When a master senses that an ALER T condition is present

on the ALERT line, the master sends an SMBus Alert

command (00011001) on the bus. If the ALERT pin of the

TMP75 or TMP175 is active, the devices will acknowledge

the SMBus Alert command and respond by returning its

slave address on the SDA line. The eighth bit (LSB) of the

slave address byte will indicate if the temperature

exceeding T HIGH or falling below TLOW caused the ALERT

condition. This bit will be HIGH if the temperature is greater

than or equal to THIGH. This bit will be LOW if the

temperature i s less than TLOW. Refer to Figure 8 for details

of this sequence.

If multiple devices on the bus respond to the SMBus Alert

command, arbitration during the slave address portion of

the SMBus Alert command will determine which device

will clear its ALER T status. If the TMP75 or TMP175 wins

the arbitration, its ALERT pin will become inactive at the

completion of the SMBus Alert command. If the TMP75 or

TMP175 loses the arbitration, its ALERT pin will remain

active.

GENERAL CALL

The TMP175 and TMP75 respond to a Two-Wire General

Call address (0000000) if the eighth bit is 0. The device will

acknowledge the General Call address and respond to

commands in the second byte. If the second byte is

00000100, the TMP175 and TMP75 will latch the status of

their address pins, but will not reset. If the second byte is

00000110, the TMP175 and TMP75 will latch the status of

their address pins and reset their internal registers to their

power-up values.

HIGH-SPEED MODE

In order for the Two-Wire bus to operate at frequencies

above 400kHz, the master device must issue an Hs-mode

master code (00001XXX) as the first byte after a START

condition to switch the bus to high-speed operation. The

TMP175 and TMP75 will not acknowledge this byte, but

will switch their input filters on SDA and SCL and their

output filters on SDA to operate in Hs-mode, allowing

transfers at u p t o 3.4MHz. After the Hs-mode master code

has been issued, the master will transmit a Two-Wire slave

address to initiate a data transfer operation. The bus will

continue to operate in Hs-mode until a STOP condition

occurs on the bus. Upon receiving the STOP condition, the

TMP175 and TMP75 will switch the input and output filter

back to fast-mode operation.

TIMEOUT FUNCTION

The TMP175 and TMP75 will reset the serial interface if

either SCL or SDA are held LOW for 54ms (typ) between

a START and STOP condition. The TMP175 and TMP75

will release the bus if it is pulled LOW and will wait for a

START condition. To avoid activating the timeout function,

it is necessary to maintain a communication speed of at

least 1kHz for SCL operating frequency.

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SBOS288J − JANUARY 2004 − REVISED DECEMBER 2007

www.ti.com

TIMING DIAGRAMS

The TMP175 and TMP75 are Two-Wire and SMBus

compatible. Figure 4 to Figure 8 describe the various

operations on the TMP175 and TMP75. Bus definitions are

given below. Parameters for Figure 4 are defined in

Table 13.

Bus Idle: Both SDA and SCL lines remain HIGH.

Start Data Transfer: A change in the state of the SDA line,

from HIGH to LOW, while the SCL line is HIGH, defines a

START condition. Each data transfer is initiated with a

START condition.

Stop Da t a Transfer: A change in the state of the SDA line

from LOW to HIGH while the SCL line is HIGH defines a

STOP condition. Each data transfer is terminated with a

repeated START or STOP condition.

Data Transfer: The number of data bytes transferred

between a START and a STOP condition is not limited and

is determined by the master device. The receiver

acknowledges the transfer of data.

Acknowledge: Each receiving device, when addressed,

is obliged to generate an Acknowledge bit. A device that

acknowledges must pull down the SDA line during the

Acknowledge clock pulse in such a way that the SDA line

is stable LOW during the HIGH period of the Acknowledge

clock pulse. Setup and hold times must be taken into

account. On a master receive, the termination of the data

transfer can be signaled by the master generating a

Not-Acknowledge on the last byte that has been

transmitted by the slave.

PARAMETER

FAST MODE HIGH-SPEED MODE

UNITS

PARAMETER

MIN MAX MIN MAX

UNITS

SCL Operating Frequency f(SCL) 0.001 0.4 0.001 3.4 MHz

Bus Free Time Between STOP and START Condition t(BUF) 600 160 ns

Hold time after repeated START condition.

After this period, the first clock is generated. t(HDSTA) 100 100 ns

Repeated STAR T Condition Setup Time t(SUSTA) 100 100 ns

STOP Condition Setup Time t(SUSTO) 100 100 ns

Data Hold Time t(HDDAT) 0 0 ns

Data Setup Time t(SUDAT) 100 10 ns

SCL Clock LOW Period t(LOW) 1300 160 ns

SCL Clock HIGH Period t(HIGH) 600 60 ns

Clock/Data Fall Time tF300 160 ns

Clock/Data Rise Time tR300 160 ns

for SCLK ≤ 100kHz tR1000 ns

Table 13. Timing Diagram Definitions for the TMP175 and TMP75

TWO-WIRE TIMING DIAGRAMS

SCL

SDA

t(LOW) tRtFt(HDSTA)

t(HDSTA) t(HDDAT)

t(BUF)

t(SUDAT)

t(HIGH) t(SUSTA) t(SUSTO)

PS SP

Figure 4. Two-Wire Timing Diagram

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SBOS288J − JANUARY 2004 − REVISED DECEMBER 2007

www.ti.com

Frame 1 Two−Wire Slave Address Byte Frame 2 Pointer Register Byte

Frame 4 Data Byte 2

Start By

Master ACK By

TMP75 ACK By

TMP75

ACK By

TMP75 Stop By

Master

191

D7 D6 D5 D4 D3 D2 D1 D0

Frame 3 Data Byte 1

ACK By

TMP75

SDA

(Continued)

SCL

(Continued)

D6 D5 D4 D3 D2 D1 D0

SDA

SCL

0 0 1 A2A1A0R/W 0 0 0 0 0 0 P1 P0 …

…

Figure 5. Two-Wire Timing Diagram for TMP75 Write Word Format

Frame 1 Two−Wire Slave Address Byte Frame 2 Pointer Register Byte

Frame 4 Data Byte 2

Start By

Master ACK By

TMP175 ACK By

TMP175

ACK By

TMP175 Stop By

Master

191

D7 D6 D5 D4 D3 D2 D1 D0

Frame 3 Data Byte 1

ACK By

TMP175

SDA

(Continued)

SCL

(Continued)

D6 D5 D4 D3 D2 D1 D0

SDA

SCL

A6 A5 A4 A3 A2 A1A0R/W 000000P1P0 …

…

Figure 6. Two-Wire Timing Diagram for TMP175 Write Word Format

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SBOS288J − JANUARY 2004 − REVISED DECEMBER 2007

www.ti.com

Frame 1 Two−Wire Slave Address Byte Frame 2 Pointer Register Byte

Start By

Master ACK By

TMP175 or TMP75 ACK By

TMP175 or TMP75

Frame3Two−WireSlaveAddressByte Frame4DataByte1ReadRegister

Start By

Master ACK By

TMP175 or TMP75 ACK By

Master

From

TMP175 or TMP75

1919

SDA

SCL

001 R/W 000000P1P0 …

…

SDA

(Continued)

SCL

(Continued)

SDA

(Continued)

SCL

(Continued)

1001

000

R/W D7 D6 D5 D4 D3 D2 D1 D0

Frame 5 Data Byte 2 Read Register NOTE: Address Pins A0, A1, A2 = 0

Stop By

Master

ACK By

Master

From

TMP175 or TMP75

D7 D6 D5 D4 D3 D2 D1 D0

Figure 7. Two-Wire Timing Diagram for Read Word Format

Frame 1 SMBus ALERT Response Address Byte Frame 2 Slave Address Byte

Start By

Master ACK By

TMP175 or TMP75 From

TMP175 or TMP75 NACK By

Master Stop By

Master

1919

SDA

SCL

ALERT

0001100R/W 1001000

Status

NOTE: Address Pins A0, A1, A2 = 0

Figure 8. Timing Diagram for SMBus ALERT

PACKAGING INFORMATION

Orderable Device Status (1) Package

Type Package

Drawing Pins Package

Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

TMP175AID ACTIVE SOIC D 8 75 Green (RoHS &

no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

TMP175AIDG4 ACTIVE SOIC D 8 75 Green (RoHS &

no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

TMP175AIDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

TMP175AIDGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

TMP175AIDGKT ACTIVE MSOP DGK 8 250 Green (RoHS &

no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

TMP175AIDGKTG4 ACTIVE MSOP DGK 8 250 Green (RoHS &

no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

TMP175AIDR ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

TMP175AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

TMP75AID ACTIVE SOIC D 8 75 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TMP75AIDG4 ACTIVE SOIC D 8 75 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TMP75AIDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

TMP75AIDGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

TMP75AIDGKT ACTIVE MSOP DGK 8 250 Green (RoHS &

no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

TMP75AIDGKTG4 ACTIVE MSOP DGK 8 250 Green (RoHS &

no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

TMP75AIDR ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TMP75AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

PACKAGE OPTION ADDENDUM

www.ti.com 28-May-2009

Addendum-Page 1

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com 28-May-2009

Addendum-Page 2

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

TMP175AIDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1

TMP175AIDGKT MSOP DGK 8 250 180.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1

TMP175AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

TMP75AIDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1

TMP75AIDGKT MSOP DGK 8 250 180.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1

TMP75AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 6-Oct-2009

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TMP175AIDGKR MSOP DGK 8 2500 370.0 355.0 55.0

TMP175AIDGKT MSOP DGK 8 250 195.0 200.0 45.0

TMP175AIDR SOIC D 8 2500 346.0 346.0 29.0

TMP75AIDGKR MSOP DGK 8 2500 370.0 355.0 55.0

TMP75AIDGKT MSOP DGK 8 250 195.0 200.0 45.0

TMP75AIDR SOIC D 8 2500 346.0 346.0 29.0

PACKAGE MATERIALS INFORMATION

www.ti.com 6-Oct-2009

Pack Materials-Page 2

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