PEMH11,115 - NXP - Datasheet.Cloud

1. Product profile

1.1 General description

NPN/NPN Resistor-Equipped Transistors (RET) in Surface-Mounted Device (SMD)

plastic packages.

1.2 Features and benefits

1.3 Applications

Low current peripheral driver

Control of IC inputs

Replaces general-purpose transistors in digital applications

1.4 Quick reference data

PEMH11; PUMH11

NPN/NPN resistor-equipped transistors;

R1 = 10 k, R2 = 10 k

Rev. 6 — 29 November 2011 Product data sheet

Table 1. Product overview

Type number Package NPN/PNP

complement PNP/PNP

complement Package

configuration

NXP JEITA

PEMH11 SOT666 - PEMD3 PEMB11 ultra small and flat lead

PUMH11 SOT363 SC-88 PUMD3 PUMB11 very small

100 mA output current capability Reduces component count

Built-in bias resistors Reduces pick and place costs

Simplifies circuit design AEC-Q101 qualified

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Per transis tor

VCEO collector-emitter voltage open base - - 50 V

IOoutput current - - 100 mA

R1 bias resistor 1 (input) 7 10 13 k

R2/R1 b ias resis tor ratio 0.8 1 1.2

Product data sheet Rev. 6 — 29 November 2011 2 of 14

NXP Semiconductors PEMH11; PUMH11

NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

2. Pinning information

3. Ordering information

4. Marking

[1] * = placeholder for manufacturing site code.

Table 3. Pinning

Pin Description Simplified outline Graphic symbol

1 GND (emitter) TR1

2 input (base) TR1

3 output (collector) TR2

4 GND (emitter) TR2

5 input (base) TR2

6 output (collector) TR1

001aab555

6 45

1 32

65 4

123

TR1 TR2

R2 R1

sym063

Table 4. Orderin g information

Type number Package

Name Description Version

PEMH11 - plastic surface-mounted package; 6 leads SOT666

PUMH11 SC-88 plastic surface-mounted package; 6 leads SOT363

Table 5. Marking codes

Type number Marking code[1]

PEMH11 H1

PUMH11 H*1

Product data sheet Rev. 6 — 29 November 2011 3 of 14

NXP Semiconductors PEMH11; PUMH11

NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

5. Limiting values

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2] Reflow soldering is the only recommended soldering method.

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per transis tor

VCBO collector-base voltage open emitter - 50 V

VCEO collector-emitter voltage open base - 50 V

VEBO emitter-base voltage open collector - 10 V

VIinput voltage

positive - +40 V

negative - 10 V

IOoutput current - 100 mA

ICM peak collector current - 100 mA

Ptot total power dissipation Tamb 25 C[1]

PEMH11 (SOT666) [2] -200mW

PUMH11 (SOT363) - 200 mW

Per device

Ptot total power dissipation Tamb 25 C[1]

PEMH11 (SOT666) [2] -300mW

PUMH11 (SOT363) - 300 mW

Tjjunction temperature - 150 C

Tamb ambient temperature 65 +150 C

Tstg storage temperature 65 +150 C

Product data sheet Rev. 6 — 29 November 2011 4 of 14

NXP Semiconductors PEMH11; PUMH11

NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Reflow soldering is the only recommended soldering method.

FR4 PCB, standard footprint

Fig 1. Per device: Power derating curve for SOT363 (SC-88) and SOT 666

Tamb (°C)

-75 17512525 75-25

006aac749

200

100

300

400

Ptot

(mW)

Table 7. Thermal characteris tics

Symbol Parameter Conditions Min Typ Max Unit

Per transis tor

Rth(j-a) thermal resistance from

junction to ambient in free air [1]

PEMH11 (SOT666) [2] --625K/W

PUMH11 (SOT363) - - 625 K/W

Per device

Rth(j-a) thermal resistance from

junction to ambient in free air [1]

PEMH11 (SOT666) [2] --417K/W

PUMH11 (SOT363) - - 417 K/W

Product data sheet Rev. 6 — 29 November 2011 5 of 14

NXP Semiconductors PEMH11; PUMH11

NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

FR4 PCB, standard footprint

Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration for

PEMH11 (SOT666); typical values

FR4 PCB, standard footprint

Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration for

PUMH11 (SOT363); typical values

006aac751

10-5 1010-2

10-4 102

10-1 tp (s)

10-3 103

102

103

Zth(j-a)

(K/W)

duty cycle = 1

0.75 0.5

0.33 0.2

0.1

0.05

0.02 0.01

006aac750

10-5 1010-2

10-4 102

10-1 tp (s)

10-3 103

102

103

Zth(j-a)

(K/W)

duty cycle = 1

0.75 0.5

0.33

0.2

0.1 0.05

0.02 0.01

Product data sheet Rev. 6 — 29 November 2011 6 of 14

NXP Semiconductors PEMH11; PUMH11

NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

7. Characteristics

[1] Characteristics of built-in transistor.

Table 8. Characteristics

Tamb =25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Per transis tor

ICBO collector-base

cut-off current VCB =50V; I

E= 0 A - - 100 nA

ICEO collector-emitter

cut-off current VCE =30V; I

B=0A --1A

VCE =30V; I

B=0A;

Tj= 150 C--5A

IEBO emitter-base

cut-off current VEB =5V; I

C= 0 A - - 400 A

hFE DC current gain VCE =5V; I

C=5mA 30 - -

VCEsat collector-emitter

saturation voltage IC=10mA; I

B= 0.5 mA - - 150 mV

VI(off) off-state input

voltage VCE =5V; I

C=100A-1.10.8V

VI(on) on-state input

voltage VCE = 0.3 V; IC=10mA 2.5 1.8 - V

R1 bias resistor 1 (input) 7 10 13 k

R2/R1 bias resistor ratio 0.8 1 1.2

Cccollector capacitance VCB =10V; I

E=i

e=0A;

f=1MHz --2.5pF

fTtransition frequency VCB =5V; I

C=10mA;

f = 100 MHz [1] - 230 - MHz

Product data sheet Rev. 6 — 29 November 2011 7 of 14

NXP Semiconductors PEMH11; PUMH11

NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

VCE =5V

(1) Tamb = 100 C

(2) Tamb =25C

(3) Tamb =40 C

IC/IB=20

(1) Tamb = 100 C

(2) Tamb =25C

(3) Tamb =40 C

Fig 4. DC current gain as a function of collector

current; typical values Fig 5. Collector-emitter satura tio n volt ag e as a

function of collector current; typical values

VCE =0.3V

(1) Tamb =40 C

(2) Tamb =25C

(3) Tamb = 100 C

VCE =5V

(1) Tamb =40 C

(2) Tamb =25C

(3) Tamb = 100 C

Fig 6. On-state input voltage as a function of

collector current; typical valu es Fig 7. Off-state input voltage as a function of

collector current; typical values

IC (mA)

10-1 102

101

006aac768

102

103

hFE

(1)

(2)

(3)

IC (mA)

110

006aac769

10-1

VCEsat

(V)

10-2

(1)

(2)

(3)

006aac770

IC (mA)

10-1 102

101

VI(on)

(V)

10-1

(1)

(2)

(3)

IC (mA)

10-1 101

006aac771

VI(off)

(V)

10-1

(1)

(2)

(3)

Product data sheet Rev. 6 — 29 November 2011 8 of 14

NXP Semiconductors PEMH11; PUMH11

NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in automotive applications.

9. Package outline

f=1MHz; T

amb =25CV

CE =5V; T

amb =25C

Fig 8. Collector capacitance as a function of

collector-base voltage; typical values Fig 9. Transition frequency as a function of collector

current; typical values of built-in transistor

VCB (V)

0504020 3010

006aac772

(pF)

006aac757

IC (mA)

10-1 102

101

102

103

(MHz)

Fig 10. Package outline PEMH11 (SOT666) Fig 11. Package outline PUMH11 (SOT363/SC-88)

Dimensions in mm 04-11-08

1.7

1.5

1.7

1.5

1.3

1.1

0.18

0.08

0.27

0.17

0.5

pin 1 index

123

456

0.6

0.5

0.3

0.1

06-03-16Dimensions in mm

0.25

0.10

0.3

0.2

pin 1

index

1.3

0.65

2.2

2.0 1.35

1.15

2.2

1.8 1.1

0.8

0.45

0.15

132

465

Product data sheet Rev. 6 — 29 November 2011 9 of 14

NXP Semiconductors PEMH11; PUMH11

NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

10. Packing information

[1] For further information and the availability of packing methods, see Section 14.

[2] T1: normal taping

[3] T2: reverse taping

11. Soldering

Table 9. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number Package Description Packing quantity

3000 4000 8000 10000

PEMH11 SOT666 2 mm pitch, 8 mm tape and reel - - -315 -

4 mm pitch, 8 mm tape and reel - -115 - -

PUMH11 SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135

4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165

Reflow soldering is the only recommended soldering method.

Fig 12. Reflow soldering footprint PEMH11 (SOT666)

solder lands

placement area

occupied area

solder paste

sot666_fr

2.75

2.45

2.1

1.6

0.4

(6×)

0.55

(2×)

0.25

(2×)

0.6

(2×)

0.65

(2×)

0.3

(2×)

0.325

(4×)

0.45

(4×)

0.5

(4×)

0.375

(4×)

1.72

1.7

1.0750.538

Dimensions in mm

Product data sheet Rev. 6 — 29 November 2011 10 of 14

NXP Semiconductors PEMH11; PUMH11

NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

Fig 13. Reflow soldering footprint PUMH11 (SOT363/SC-88)

Fig 14. W ave soldering footprint PUMH1 1 (SOT363/SC-88)

solder lands

solder resist

occupied area

solder paste

sot363_fr

2.65

2.35 0.4 (2×)

0.6

(2×)

0.5

(4×)

0.5

(4×)

0.6

(4×)

0.6

(4×)

1.5

1.8

Dimensions in mm

sot363_fw

solder lands

solder resist

occupied area

preferred transport

direction during soldering

5.3

1.3 1.3

1.5

0.3

1.5

4.5

2.45

2.5

Dimensions in mm

Product data sheet Rev. 6 — 29 November 2011 11 of 14

NXP Semiconductors PEMH11; PUMH11

NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

12. Revision history

Table 10. Revision history

Document ID Release date Data sheet statu s Change notice Supersedes

PEMH11_PUMH11 v.6 20111129 Product data sheet - PEMH11_PUMH11 v.5

Modifications: •The format of this document has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Section 1 “Product profile”: updated

•Section 4 “Marking”: updated

•Table 7 “Thermal characteristics”: updated according to the latest measu r ements

•Table 8 “Characteristics”: ICEO updated according to the latest measurements, Vi(on) and

Vi(off) changed respectively to VI(on) and VI(off), fT added

•Figure 1 to 9: added

•Section 8 “Test information”: added

•Figure 10 and 11: replaced by minimized package outline drawings

•Section 10 “Packing information”: added

•Section 11 “Soldering”: added

•Section 13 “Legal information”: updated

PEMH11_PUMH11 v.5 20031020 Product data sheet - PUMH11 v.4

PEMH11 v.1

PUMH11 v.4 19990413 Product specification - -

PEMH11 v.1 20011022 Preliminary specification - -

Product data sheet Rev. 6 — 29 November 2011 12 of 14

NXP Semiconductors PEMH11; PUMH11

NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

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with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

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data sheet shall define the specification of the product as agreed between

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Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

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Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 6 — 29 November 2011 13 of 14

NXP Semiconductors PEMH11; PUMH11

NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All refe renced brands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PEMH11; PUMH11

NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 29 November 2011

Document identifier: PEMH11_PUMH11

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

10 Packing information . . . . . . . . . . . . . . . . . . . . . 9

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

14 Contact information. . . . . . . . . . . . . . . . . . . . . 13

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14