TLP721(D4)SERIES TOSHIBA Photocoupler TLP721(D4)SERIES Attachment: Specifications for VDE0884 option: (D4) Types: TLP721, TLP721F Type designations for ` option: (D4) ', which are tested under VDE0884 requirements. Ex.: TLP721 (D4-GR-LF4) D4: VDE0884 option GR: CTR rank LF4: lead bend Note: Use TOSHIBA standard type number for safety standard application. Ex. TLP721 (D4-GR-LF4) TLP721 VDE0884 Isolation Characteristics Description Symbol Application classification (DIN VDE0110 teil 1 / 01.89, table 1) for rated mains voltage 300 Vrms for rated mains voltage 600 Vrms Rating Unit I-IV I-III Climatic classification (DIN IEC68 teil 1 / 09.80) Pollution degree (DIN VDE0110 teil 1 / 01.89) TLP721 Maximum operating insulation voltage TLP721F Input to output test voltage, method A Vpr = 1.5xVIORM, type and sample test tp = 60s, partial discharge < 5pC TLP721 Input to output test voltage, method B Vpr = 1.875xVIORM, 100% production test tp = 1s, partial discharge < 5pC TLP721 VIORM Vpr TLP721F Safety limiting values (max. permissible ratings in case of fault, also refer to thermal derating curve) current (input current IF, Psi = 0) power (output or total power dissipation) temperature Insulation resistance, VIO = 500V, Ta = 25C VIO = 500V, Ta = Tsi 2 630 890 945 Vpk Vpk 1335 Vpr TLP721F Highest permissible overvoltage (transient overvoltage, tpr = 10s) 40 / 100 / 21 1180 Vpk 1670 VTR 6000 Vpk Isi Psi Tsi 300 500 150 mA mW C Rsi 1012 109 * This data sheet refers to TLP721 (D4, M), TLP721F (D4, M) that previously has a white-resin mold and have been changed. When designing new products please use black mold-resin devices. 1 2002-09-25 TLP721(D4)SERIES Insulation Related Specifications 7.62 mm pitch TLP721 10.16 mm pitch TLP721F Minimum creepage distance (*) Cr 7.0 mm 8.0 mm Minimum clearance (*) Cl 7.0 mm 8.0 mm Minimum insulation thickness Comperative tracking index (DIN IEC112 / VDE0303, part 1) ti 0.5 mm CTI 175 (VDE0110 teil 1 / 01.89 group III a) ((*) in accordance with DIN VDE0110 teil 1 / 01.89, table 2, & 4) (*1) If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value (e. g. at a standard distance between soldering eye centres of 7.5 mm). If this is not permissible, the user shall take suitable measures. (*2) This photocoupler is suitable for `safe electrical isolation' only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. 4 VDE Test sign: Marking on product for VDE0884 V DE Marking on packing for VDE0884 Marking example: 0884 or Lot no. P Type name CTR or IFT rank marking Mark for option (D4) 1pin indication 2 2002-09-25 TLP721(D4)SERIES Figure 1 Partial discharge measurement procedure according to VDE0884 destructive test for qualification and sampling tests. Method A VINITIAL (6kV) V (for type and sampling tests,destructive tests) t1,t2 t3,t4 tP(measuring time for partial discharge) tb tini Figure 2 Vpr (945V for TLPxxx) (1335V for TLPxxxF) VIORM =1 to 10s =1s =50s =62s =10s 0 t1 tini t3 tP t2 tb t t4 Partial discharge measurement procedure according to VDE0884 non-destructive test for 100% inspection. Method B Vpr V (for sample test,non-destructive test) (1180V for TLPxxx) (1670V for TLPxxxF) VIORM t3,t4 tP(measuring time for partial discharge) tb =0.1s (630V for TLPxxx) (890V for TLPxxxF) =1s =1.2s t tP t3 Figure 3 (630V for TLPxxx) (890V for TLPxxxF) t4 tb Dependency of maximum safety ratings on ambient temperature Isi 500 1000 Psi (mA) 400 800 (mW) 300 600 200 400 Isi 100 200 Psi 0 0 25 50 75 100 125 150 0 175 Ta (C) 3 2002-09-25 TLP721(D4)SERIES RESTRICTIONS ON PRODUCT USE 000707EBC * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 4 2002-09-25