©2018 Integrated Device Technology, Inc.
JANUARY 2018
DSC-3026/13
1
HIGH SPEED 3.3V
2K X 8 DUAL-PORT
STATIC RAM WITH
INTERRUPTS
IDT71V321S/L
Features
High-speed access
Commercial & Industrial: 25/35/55ns (max.)
Low-power operation
IDT71V321S
Active: 325mW (typ.)
Standby: 5mW (typ.)
IDT71V321L
Active: 325mW (typ.)
Standby: 1mW (typ.)
Two INT flags for port-to-port communications
Functional Block Diagram
NOTES:
1. IDT71V321 (MASTER): BUSY is an output
2. BUSY and INT are totem-pole outputs.
On-chip port arbitration logic (IDT71V321 only)
BUSY output flag
Fully asynchronous operation from either port
Battery backup operation—2V data retention (L only)
TTL-compatible, single 3.3V power supply
Available in 52-pin PLCC, 64-pin TQFP and STQFP
packages
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Green parts available, see ordering information
I/O
Control
Address
Decoder MEMORY
ARRAY
ARBITRATION
and
INTERRUPT
LOGIC
Address
Decoder
I/O
Control
R/W
L
CE
L
OE
L
BUSY
L
A
10L
A
0L
3026 drw 01
I/O
0L
-I/O
7L
CE
L
OE
L
R/W
L
INT
L
BUSY
R
I/O
0R
-I/O
7R
A
10R
A
0R
INT
R
CE
R
OE
R
(2)
(1,2) (1,2)
(2)
R/W
R
CE
R
OE
R
11
11
R/W
R
LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
2
IDT71V321J
J52
(4)
52-Pin PLCC
Top View
(5)
INDEX
I/O
A
A
A
A
A
A
A
A
A
I/O
I/O
I/O
1L
2L
3L
4L
5L
6L
7L
8L
9L
0L
1L
3L
2L
OE
R
A
A
A
A
A
A
A
A
A
A
NC
I/O
0R
1R
2R
3R
4R
5R
6R
7R
8R
9R
7R
4L
5L
6L
7L
NC
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
0R
1R
2R
3R
4R
6R
5R
A
0L
OE
L
A
10L
INT
L
BUSY
L
R/W
L
CE
L
V
CC
CE
R
R/W
R
BUSY
R
INT
R
A
10R
1
234567474849505152
9
8
10
11
12
13
14
15
16
17
18
19
20 27262524232221 333231302928
35
34
36
37
38
39
40
41
42
43
44
45
46
3026 drw 02
Pin Configurations(1,2,3)
Description
The IDT71V321 is a high-speed 2K x 8 Dual-Port Static RAMs with
internal interrupt logic for interprocessor communications. The
IDT71V321 is designed to be used as a stand-alone 8-bit Dual-Port
RAM.
The device provides two independent ports with separate control,
address, and I/O pins that permit independent, asynchronous access
for reads or writes to any location in memory. An automatic power
down feature, controlled by CE, permits the on chip circuitry of each
port to enter a very low standby power mode.
Fabricated using CMOS high-performance technology, these de-
vices typically operate on only 325mW of power. Low-power (L) ver-
sions offer battery backup data retention capability, with each Dual-Port
typically consuming 200µW from a 2V battery.
The IDT71V321 devices are packaged in a 52-pin PLCC, a 64-pin
TQFP (thin quad flatpack), and a 64-pin STQFP (super thin quad
flatpack).
INDEX
IDT71V321PF or TF
PP64
(4)
&
PN64
(4)
64-Pin STQFP
64-Pin TQFP
Top View
(5)
8
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
46
45
44
43
42
41
40
39
38
37
36
35
34
47
48
33
17
18
19
20
32
31
30
29
28
27
26
25
24
23
22
21
49
50
51
52
63
62
61
60
59
58
57
56
55
54
53
64
I/O
6R
N/C
A
0R
A
1R
A
2R
A
3R
A
4R
A
5R
A
6R
A
7R
A
8R
A
9R
I/O
7R
OE
R
N/C
N/C
I/O
2L
A
0L
OE
L
A
1L
A
2L
A
3L
A
4L
A
5L
A
6L
A
7L
A
8L
A
9L
I/O
0L
I/O
1L
N/C
N/C
GND
4L
I/O
5L
I/O
6L
I/O
7L
I/O
I/O
0R
I/O
1R
I/O
2R
I/O
3R
I/O
4R
I/O
5R
I/O
3L
N/C
N/C
GND
N/C
N/C
A
10R
V
CC
BUSY
L
R/W
L
CE
R
R/W
R
BUSY
R
CE
L
N/C
N/C
A
10L
V
CC
N/C
INT
R
INT
L
3026 drw 03
NOTES:
1. All VCC pins must be connected to power supply.
2. All GND pins must be connected to ground supply.
3. J52-1 package body is approximately .75 in x .75 in x .17 in.
PP64-1 package body is approximately 10mm x 10mm x 1.4mm.
PN64-1 package body is approximately 14mm x 14mm x 1.4mm.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part-marking.
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
3
Recommended DC Operating
Conditions
Absolute Maximum Ratings(1) Recommended Operating
Temperature and Supply Voltage(1,2)
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS
may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions
above those indicated in the operational sections of the specification is not
implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
2. VTERM must not exceed VCC + 10% for more than 25% of the cycle time or 10ns
maximum, and is limited to < 20mA for the period of VTERM > VCC + 10%.
NOTES:
1. VIL (min.) = -1.5V for pulse width less than 20ns.
2. VTERM must not exceed Vcc + 0.3V.
NOTES:
1. This is the parameter TA. This is the "instant on" case temperature.
2. Industrial temperature: for specific speeds, packages and powers contact your
sales office.
Symbol Rating Commercial
& Industrial Unit
V
TERM
(2)
Terminal Voltage
with Re sp e ct
to GND
-0. 5 to +4.6 V
T
A
Operating
Temperature 0 to +70 °C
T
BIAS
Temperature
Under Bias -55 to +125
o
C
T
STG
Storage
Temperature -65 to +150
o
C
I
OUT
DC Outp ut
Current 50 mA
3026 tbl 01
Grade Ambient
Temperature GND Vcc
Commercial 0
O
C to +70
O
C0V3.3V
+
0. 3V
Industrial -40
O
C to + 85
O
C0V 3.3V
+
0. 3V
3026 tbl 02
Symbol Parameter Min. Typ. Max. Unit
V
CC
Sup p ly Vo ltag e 3.0 3.3 3.6 V
GND Ground 0 0 0 V
V
IH
Inp ut Hi g h Vo l tage 2. 0
____
V
CC
+0.3
(2)
V
V
IL
Input Lo w Vo ltag e -0.3
(1)
____
0.8 V
3026 tbl 03
Capacitance(1)
(TA = +25°C, f = 1.0MHz) TQFP Only
Symbol Parameter Conditions
(2)
Max. Unit
CIN Inp ut Cap aci tanc e V IN = 3dV 9 pF
COUT Ou tp ut Cap ac itanc e V OUT = 3dV 10 pF
3026 tbl 04
NOTES:
1. This parameter is determined by device characterization but is not production
tested.
2 . 3dv references the interpolated capacitance when the input and output signals
switch from 0V to 3V or from 3V to 0V.
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range (VCC = 3.3V ± 0.3V)
Symbol Parameter Test Conditions
71V321S 71V321L
UnitMin. Max. Min. Max.
|I
LI
|Input Leakage Current
(1)
V
CC
= 3.6V,
V
IN
= 0V to V
CC
___
10
___
A
|I
LO
| Output Leakage Current CE = V
IH
, V
OUT
= 0V to V
CC
V
CC
= 3.6V
___
10
___
A
V
OL
Output Low Voltage I
OL
= 4mA
___
0.4
___
0.4 V
V
OH
Output High Voltage I
OH
= -4mA 2.4
___
2.4
___
V
3026 tbl 05
NOTE:
1. At VCC < 2.0V input leakages are undefined.
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
4
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range(1,2) (VCC = 3.3V ± 0.3V)
NOTES:
1. 'X' in part numbers indicates power rating (S or L).
2. VCC = 3.3V, TA = +25°C, and are not production tested. ICCDC = 70mA (Typ.).
3 . At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/tRC and using "AC Test Conditions" of input levels
of GND to 3V.
4. f = 0 means no address or control lines change. Applies only to inputs at CMOS level standby.
5. Port "A" may be either left or right port. Port "B" is opposite from port "A".
Symbol Parameter Test Condition Version
71V321X25
Com'l & Ind 71V321X35
Com'l & Ind 71V321X55
Com'l & Ind
Unit
Typ. Max. Typ. Max. Typ. Max.
I
CC
Dynamic Operating
Current
(Both Ports Active)
CE = V
IL
, Outputs Disabled
SEM = V
IH
f = f
MAX
(3)
COM'L S
L55
55 130
100 55
55 125
95 55
55 115
85 mA
IND L 55 130 55 125 55 115
I
SB1
Standby Current
(Both Ports - TTL
Level Inputs)
CE
R
= CE
L
= V
IH
SEM
R
= SEM
L
= V
IH
f = f
MAX
(3)
COM'L S
L15
15 35
20 15
15 35
20 15
15 35
20 mA
IND L 15 35 15 35 15 35
I
SB2
Standby Current
(One Port - TTL
Level Inputs)
CE
"A"
= V
IL
and CE
"B"
= V
IH
(5)
Active Port Outputs Disabled,
f=f
MAX
(3)
SEM
R
= SEM
L
= V
IH
COM'L S
L25
25 75
55 25
25 70
50 25
25 60
40 mA
IND L 25 75 25 70 25 60
I
SB3
Full Standby Current
(Both Ports - All
CMOS Level Inputs)
Both Ports CE
L
and
CE
R
> V
CC
- 0.2V
V
IN
> V
CC
- 0.2V or
V
IN
< 0.2V, f = 0
(4)
SEM
R
= SEM
L
> V
CC
- 0.2V
COM'L S
L1.0
0.2 5
31.0
0.2 5
31.0
0.2 5
3mA
IND L 0.2 6 1.0 5 1.0 5
I
SB4
Full Standby Current
(One Port - All
CMOS Level Inputs)
CE
"A"
< 0.2V and
CE
"B"
> V
CC
- 0.2V
(5)
SEM
R
= SEM
L
> V
CC
- 0.2V
V
IN
> V
CC
- 0.2V or V
IN
< 0.2V
Active Port Outputs Disabled
f = f
MAX
(3)
COM'L S
L25
25 70
55 25
25 65
50 25
25 55
40 mA
IND L 25 70 25 65 25 55
3026 tbl 06
Data Retention Characteristics (L Version Only)
Symbol Parameter Test Condition Min. Typ.
(1)
Max. Unit
V
DR
V
CC
fo r Data Rete nti o n 2. 0
___
0V
I
CCDR
Data Re te ntio n Cu rre nt V
CC
= 2
V,
CE > V
CC
- 0.2V COM' L.
___
100 500 µA
t
CDR
(3)
Chip De se lec t to Data
Re te ntio n Tim e V
IN
> V
CC
- 0. 2V o r V
IN
< 0. 2V IND.
___
100 1000 µA
0
___ ___
V
t
R
(3)
Op e ratio n Reco ve ry Time t
RC
(2)
___ ___
V
3026 tbl 07
NOTES:
1. VCC = 2V, TA = +25°C, and is not production tested.
2. tRC = Read Cycle Time.
3. This parameter is guaranteed by device characterization but not production tested.
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
5
Data Retention Waveform
V
CC
CE
3.0V 3.0V
DATA RETENTION MODE
t
CDR
t
R
V
IH
V
IH
V
DR
V
DR
2.0V
3026 drw 04
,
AC Test Conditions
590
30pF
435
DATA
OUT
590
4355pF
DATA
OUT
3026 drw 05
3.3V 3.3V
BUSY
INT
Figure 1. AC Output Test Load Figure 2. Output Test Load
(for tHZ, tLZ, tWZ, and tOW)
* Including scope and jig.
Inp ut Puls e Le v e ls
Inp ut Ri se / Fa ll Tim e s
Inp ut Timing Re fe re nc e Le v e ls
Outp ut Reference Leve ls
Outp ut Lo ad
GND to 3.0V
5ns
1.5V
1.5V
Fig ures 1 and 2
3026 tbl 08
AC Electrical Characteristics Over the
Operating Temperature Supply Voltage Range(2)
71V321X25
Com'l & Ind 71V321X35
Com'l & Ind 71V321X55
Com'l & Ind
UnitSymbol Parameter Min. Max. Min. Max. Min. Max.
READ CYCLE
tRC Read Cycle Time 25
____
35
____
55
____
ns
tAA Address Access Time
____
25
____
35
____
55 ns
tACE Chip Enable Access Time
____
25
____
35
____
55 ns
tAOE Output Enable Access Time
____
12
____
20
____
25 ns
tOH Output Hold from Address Change 3
____
3
____
3
____
ns
tLZ Output Low-Z Time
(1,2)
0
____
0
____
0
____
ns
tHZ Output High-Z Time
(1,2)
____
12
____
15
____
30 ns
tPU Chip Enable to Power Up Time
(2)
0
____
0
____
0
____
ns
tPD Chip Disable to Power Down Time
(2)
____
50
____
50
____
50 ns
3026 tbl 09
NOTES:
1. Transition is measured 0mV from Low or High-impedance voltage with Output Test Load (Figure 2).
2. This parameter is guaranteed by device characterization, but is not production tested.
3. 'X' in part numbers indicates power rating (S or L).
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
6
CE
t
ACE
t
HZ
t
LZ
t
PD
VALID DATA
50%
OE
DATA
OUT
CURRENT
I
CC
I
SS
50%
3026 drw 07
(4)
(1)
(1) (2)
(2)
(4)
t
LZ
t
HZ
t
AOE
t
PU
Timing Wa vef orm of Read Cy cle No . 2, Either Side (3)
NOTES:
1. Timing depends on which signal is asserted last, OE or CE.
2. Timing depends on which signal is de-asserted first, OE or CE.
3. R/W = VIH and the address is valid prior to or coincidental with CE transition LOW.
4 . Start of valid data depends on which timing becomes effective last tAOE, tACE, tAA, and tBDD.
Timing Wa veform of Read Cy cle No . 1, Either Side(1)
NOTES:
1. R/W = VIH, CE = VIL, and is OE = VIL. Address is valid prior to the coincidental with CE transition LOW.
2. tBDD delay is required only in the case where the opposite port is completing a write operation to the same address location. For simultaneous read operations
BUSY has no relationship to valid output data.
3. Start of valid data depends on which timing becomes effective last tAOE, tACE, tAA, and tBDD.
ADDRESS
DATA
OUT
t
RC
t
OH
PREVIOUS DATA VALID
t
AA
t
OH
DATA VALID
3026 drw 06
t
BDD
(2,3)
BUSY
OUT
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
7
AC Electrical Characteristics Over the
Operating Temperature and Supply Voltage Range(4)
NOTES:
1. Transition is measured 0mV from Low or High-impedance voltage with Output Test Load (Figure 2).
2. This parameter is guaranteed by device characterization but is not production tested.
3. The specification for tDH must be met by the device supplying write data to the RAM under all operating conditions. Although tDH and tOW values will vary over
voltage and temperature, the actual tDH will always be smaller than the actual tOW.
4. 'X' in part numbers indicates power rating (S or L).
Symbol Parameter
71V321X25
Com'l & Ind 71V321X35
Com'l & Ind 71V321X55
Com'l & Ind
UnitMin. Max. Min. Max. Min. Max.
WRITE CYCLE
t
WC
Write Cycle Time 25 ____ 35 ____ 55 ____ ns
t
EW
Chip Enable to End-of-Write 20 ____ 30 ____ 40 ____ ns
t
AW
Addr ess Valid to End-of-Write 20 ____ 30 ____ 40 ____ ns
t
AS
Address Set-up Time 0 ____ 0____ 0____ ns
t
WP
Write Pulse Width 20 ____ 30 ____ 40 ____ ns
t
WR
Write Recovery Time 0 ____ 0____ 0____ ns
t
DW
Data Valid to End-of-Write 12 ____ 20 ____ 20 ____ ns
t
HZ
Output High-Z Time(1,2) ____ 12 ____ 15 ____ 30 ns
t
DH
Data Hold Time(3) 0____ 0____ 0____ ns
t
WZ
Write Enable to Output in High-Z(1,2) ____ 15 ____ 15 ____ 30 ns
t
OW
Output Active from End -of-Write(1,2) 0____ 0____ 0____ ns
3026 tbl 10
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
8
Timing Wa vef orm of Write Cyc le No. 2, (CE Controlled Timing)(1,5)
Timing Wa vef orm of Write Cy cle No . 1, (R/W Controlled Timing)(1,5,8)
NOTES:
1. R/W or CE must be HIGH during all address transitions.
2 . A write occurs during the overlap (tEW or tWP) of CE = VIL and R/W= VIL.
3. tWR is measured from the earlier of CE or R/W going HIGH to the end of the write cycle.
4. During this period, the l/O pins are in the output state and input signals must not be applied.
5. If the CE LOW transition occurs simultaneously with or after the R/W LOW transition, the outputs remain in the High-impedance state.
6. Timing depends on which enable signal (CE or R/W) is asserted last.
7. This parameter is determined to be device characterization, but is not production tested. Transition is measured 0mV from steady state with the Output Test
Load (Figure 2).
8. If OE is LOW during a R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers toturn off data to be
placed on the bus for the required tDW. If OE is HIGH during a R/W controlled write cycle, this requirement does not apply and the write pulse can be as short
as the specified tWP.
t
WC
ADDRESS
OE
CE
R/W
DATA
OUT
DATA
IN
t
AS
t
WR
t
OW
t
DW
t
DH
t
AW
t
WP
(2)
t
HZ
(4) (4)
t
WZ
t
HZ
3026 drw 08
(6)
(7)
(7)
(3) (7)
t
WC
ADDRESS
CE
R/W
DATA
IN
t
AS
t
EW
t
WR
t
DW
t
DH
t
AW
3026 drw 09
(6) (2) (3)
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
9
AC Electrical Characteristics Over the
Operating Temperature and Supply Voltage Range(6)
NOTES:
1. Port-to-port delay through RAM cells from the writing port to the reading port, refer to “Timing Waveform of Write with Port-to-Port Read and BUSY."
2. To ensure that the earlier of the two ports wins.
3. tBDD is a calculated parameter and is the greater of 0, tWDD – tWP (actual) or tDDD – tDW (actual).
4. To ensure that a write cycle is inhibited on port "B" during contention on port "A".
5. To ensure that a write cycle is completed on port "B" after contention on port "A".
6. 'X' in part numbers indicates power rating (S or L).
71V321X25
Com'l & Ind 71V321X35
Com'l & Ind 71V321X55
Com'l & Ind
Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
BUSY Timing
tBAA BUSY Access Time from Address ____ 20 ____ 20 ____ 30 ns
tBDA BUSY Disable Time from Address ____ 20 ____ 20 ____ 30 ns
tBAC BUSY Access Time from Chip Enable ____ 20 ____ 20 ____ 30 ns
tBDC BUSY Disable Time from Chip Enable ____ 20 ____ 20 ____ 30 ns
tWH Write Hold After BUSY(5) 12 ____ 15 ____ 20 ____ ns
tWDD Write Pulse to Data Delay(1) ____ 50 ____ 60 ____ 80 ns
tDDD Write Data Valid to Read Data Delay(1) ____ 35 ____ 45 ____ 65 ns
tAPS Arbitration Priority Set-up Time(2) 5____ 5____ 5____ ns
tBDD BUSY Disable to Valid Data(3) ____ 30 ____ 30 ____ 45 ns
3026 tbl 11
Timing Waveform of Write with Port-to-Port Read and BUSY(2,3,4)
NOTES:
1. To ensure that the earlier of the two ports wins.
2. CEL = CER = VIL
3. OE = VIL for the reading port.
4. All timing is the same for the left and right ports. Port “A” may be either the left or right port. Port “B” is opposite from port “A”.
t
WC
t
WP
t
DW
t
DH
t
BDD
t
DDD
t
BDA
t
WDD
ADDR
"B"
DATA
OUT"B"
DATA
IN"A"
ADDR
"A"
MATCH
VALID
MATCH
VALID
R/W
"A"
BUSY
"B"
t
APS
3026 drw 10
(1)
t
BAA
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
10
Timing Waveform of BUSY Arbitration Controlled by CE Timing(1)
Timing Waveform of BUSY Arbitration Controlled
by Address Match Timing(1)
NOTES:
1. All timing is the same for left and right ports. Port “A” may be either left or right port. Port “B” is the opposite from port “A”.
2. If tAPS is not satisfied, the BUSY will be asserted on one side or the other, but there is no guarantee on which side BUSY will be asserted.
NOTES:
1. tWH must be met for BUSY output 71V321.
2. BUSY is asserted on port 'B' blocking R/W'B', until BUSY'B' goes HIGH.
3. All timing is the same for the left and right ports. Port "A" may be either the left or right port. Port "B" is opposite from port "A".
Timing Waveform of Write with BUSY(3)
BUSY
"B"
3026 drw 11
R/W
"A"
t
WP
t
WH
R/W
"B" (2)
(1)
,
t
APS
(2)
ADDR
"A" AND "B" ADDRESSES MATCH
t
BAC
t
BDC
CE
"B"
CE
"A"
BUSY
"A"
3026 drw 12
BUSY
"B"
ADDRESSES DO NOT MATCH
ADDRESSES MATCH
t
APS
ADDR
"A"
ADDR
"B"
t
RC OR
t
WC
3026 drw 13
(2)
t
BAA
t
BDA
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
11
AC Electrical Characteristics Over the
Operating Temperature and Supply Voltage Range(1)
NOTES:
1. 'X' in part numbers indicates power rating (S or L).
71V321X25
Com'l & Ind 71V321X35
Com'l & Ind 71V321X55
Com'l & Ind
Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
INTERRUPT TIMING
t
AS
Address Set-up Time 0
____
0
____
0
____
ns
t
WR
Write Recovery Time 0
____
0
____
0
____
ns
t
INS
Interrupt Set Time
____
25
____
25
____
45 ns
t
INR
Interrupt Reset Time
____
25
____
25
____
45 ns
3026 tbl 12
Timing Waveform of Interrupt Mode(1)
SET INT
CLEAR INT
NOTES:.
1. All timing is the same for left and right ports. Port “A” may be either left or right port. Port “B” is the opposite from port “A”.
2. See Interrupt Truth Table.
3. Timing depends on which enable signal (CE or R/W) is asserted last.
4. Timing depends on which enable signal (CE or R/W) is de-asserted first.
t
INS
ADDR
"A"
INT
"B"
INTERRUPT ADDRESS
t
WC
t
AS
R/W
"A"
t
WR
3026 drw 14
(3)
(3)
(2)
(4)
t
RC
INTERRUPT CLEAR ADDRESS
ADDR
"B"
OE
"B"
t
INR
INT
"B"
3026 drw 15
t
AS
(3)
(3)
(2)
,
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
12
Table III — Address BUSY Arbitration
Table I
Non-Contention
Read/Write Control(4)
NOTES:
1 . Pins BUSYL and BUSYR are both outputs. BUSYX outputs on the IDT71V321 are totem-
pole.
2. 'L' if the inputs to the opposite port were stable prior to the address and enable inputs of this
port. 'H' if the inputs to the opposite port became stable after the address and enable inputs
of this port. If tAPS is not met, either BUSYL or BUSYR = LOW will result. BUSYL and BUSYR
outputs can not be LOW simultaneously.
3. Writes to the left port are internally ignored when BUSYL outputs are driving LOW
regardless of actual logic level on the pin. Writes to the right port are internally
ignored when BUSYR outputs are driving LOW regardless of actual logic level
on the pin.
Truth Tables
T able II
Interrupt Flag(1,4)
NOTES:
1. A0L – A10L A0R – A10R.
2. If BUSY = L, data is not written.
3. If BUSY = L, data may not be valid, see tWDD and tDDD timing.
4. 'H' = VIH, 'L' = VIL, 'X' = DON’T CARE, 'Z' = High-impedance.
NOTES:
1. Assumes BUSYL = BUSYR = VIH
2. If BUSYL = VIL, then No Change.
3. If BUSYR = VIL, then No Change.
4. 'H' = HIGH, 'L' = LOW, 'X' = DON’T CARE
Left Port Right Port
FunctionR/W
L
CE
L
OE
L
A
10L
-A
0L
INT
L
R/W
R
CE
R
OE
R
A
10R
-A
0R
INT
R
LLX7FFXXXX X L
(2)
S e t Rig h t INT
R
Flag
XXXXXXLL7FFH
(3)
Re s et R ight INT
R
Flag
XXX X L
(3)
LLX7FEXSet Left INT
L
Flag
XLL7FEH
(2)
XXX X XReset Left INT
L
Flag
3 026 tbl 14
Inputs Outputs
Function
CE
L
CE
R
A
OL
-A
10L
A
OR
-A
10R
BUSY
L
(1)
BUSY
R
(1)
XX NO MATCH H H Normal
HX MATCH H H Normal
XH MATCH H H Normal
L L MATCH (2) (2) Write Inhib it
(3)
3026 tbl 15
Left or Right Port(1)
R/WCE OE D
0-7
Function
XHX Z Port Deselecte d and in Powe r-
Do wn Mo d e. I
SB2
or I
SB4
XHX Z CE
R
= CE
L
= V
IH,
Powe r-Down Mo d e I
SB1
or I
SB3
LLXDATA
IN
Data o n P o rt Wr itte n Into M e mory (2)
HLLDATA
OUT
Data in Me mo ry O utp ut o n P o rt(3)
H L H Z High-impedance Outputs
3026 tbl 13
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
13
Busy Logic
Busy Logic provides a hardware indication that both ports of the RAM
have accessed the same location at the same time. It also allows one of the
two accesses to proceed and signals the other side that the RAM is “Busy”.
The BUSY pin can then be used to stall the access until the operation on
the other side is completed. If a write operation has been attempted from
the side that receives a busy indication, the write signal is gated internally
to prevent the write from proceeding.
The use of BUSY Logic is not required or desirable for all applications.
In some cases it may be useful to logically OR the BUSY outputs together
and use any BUSY indication as an interrupt source to flag the event of
an illegal or illogical operation.
Depth Expansion
The BUSY arbitration, is based on the chip enable and address
signals only. It ignores whether an access is a read or write.
The BUSY outputs on the IDT71V321 are totem-pole type outputs and
do not require pull-up resistors to operate. If these RAMs are being
expanded in depth, then the BUSY indication for the resulting array
requires the use of an external AND gate
Functional Description
The IDT7V1321 provides two ports with separate control, address
and I/O pins that permit independent access for reads or writes to any
location in memory. The IDT71V321 has an automatic power down
feature controlled by CE. The CE controls on-chip power down circuitry
that permits the respective port to go into a standby mode when not
selected (CE = VIH). When a port is enabled, access to the entire memory
array is permitted.
Interrupts
If the user chooses the interrupt function, a memory location (mail box
or message center) is assigned to each port. The left port interrupt flag
(INTL) is asserted when the right port writes to memory location 7FE
(HEX), where a write is defined as the CER = R/WR = VIL per Truth Table
II. The left port clears the interrupt by accessing address location 7FE when
CEL = OEL = VIL, R/W is a "don't care". Likewise, the right port interrupt
flag (INTR) is asserted when the left port writes to memory location 7FF
(HEX) and to clear the interrupt flag (INTR), the right port must access the
memory location 7FF. The message (8 bits) at 7FE or 7FF is user-defined,
since it is an addressable SRAM location. If the interrupt function is not used,
address locations 7FE and 7FF are not used as mail boxes, but as part
of the random access memory. Refer to Truth Table II for the interrupt
operation.
3026 drw 16
DECODER
BUSY
R
MASTER
Dual Port
RAM
BUSY
L
BUSY
R
CE
MASTER
Dual Port
RAM
BUSY
L
BUSY
R
CE
BUSY
L
Figure 3. Busy and chip enable routing for depth
expansion with IDT71V321.
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
14
Ordering Information
NOTES:
1. Contact your sales office Industrial temperature range is available for selected speeds, packages and powers.
2. Green parts available. For specific speeds, packages and powers contact your local sales office.
LEAD FINISH (SnPb) parts are in EOL process. Product Discontinuation Notice - PDN# SP-17-02
A
Power 999
Speed A
Package A
Process/
Temperature
Range
Blank
I(1) Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
J
PF
TF
52-pin PLCC
64-pin TQFP
64-pin STQFP
25
35
55
XXXXX
Device
Type
Speed in nanoseconds
3026 drw 17
L
SLow Power
Standard Power
71V321 16K (2K x 8-Bit) MASTER 3.3V Dual-Port RAM w/Interrupt
Commercial & Industrial
Commercial & Industrial
Commercial & Industrial
Blank
8 Tube of Tray
Tape and Reel
A
G(2) Green
A
(J52)
(PN64)
(PP64)
Datasheet Document History
03/24/99: Initiated datasheet document history
Converted to new format
Cosmetic and typographical corrections
Page 2 Added additional notes to pin configurations
06/15/99: Changed drawing format
10/15/99: Page 12 Changed open drain to totem-pole in Table III, note 1
10/21/99: Page 13 Deleted 'does not' in copy from Busy Logic
11/12/99: Replaced IDT logo
01/12/01: Pages 1 & 2 Moved full "Description" to page 2 and adjusted page layouts
Page 3 Increased storage temperature parameters
Clarified TA parameter
Page 4 DC Electrical parameters–changed wording from "open" to "disabled"
Changed ±200mV to 0mV in notes
08/22/01: Pages 4, 5, 7, Industrial temp range offering removed from DC & AC Electrical Characteristics for 35 and 55ns
9 & 11
01/17/06: Page 1 Added green availability to features
Page 14 Added green indicator to ordering information
Page 1 & 14 Replaced old IDTTM with new IDTTM logo
Datasheet document history continued on page 15
6.42
IDT71V321S/L
High Speed 3.3V 2K x 8 Dual-Port Static RAM with Interrupts Industrial and Commercial Temperature Ranges
15
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
CORPORATE HEADQUARTERS for SALES: for Tech Support:
6024 Silver Creek Valley Road 800-345-7015 or 408-284-8200 408-284-2794
San Jose, CA 95138 fax: 408-284-2775 DualPortHelp@idt.com
www.idt.com
Datasheet Document History (con't)
08/25/06: Page 11 Changed INT"A" to INT"B" in the CLEAR INT drawing in the Timing Waveform of Interrupt Mode
10/23/08: Page 14 Removed "IDT" from orderable part number
01/25/10: Page 4 In order to correct the DC Chars table for the 71V321/71V421L35 speed grade and the Data Retention Chars
table, I Temp values have been added to each table respectively. In addition, all of the AC Chars tables and the
ordering information also now reflect this I temp correction
Page 2 Removed IDT in reference to fabrication
Page 2 & 14 The package codes J52-1, PN64-1 & PP64-1 changed to J52, PN64 & PP64 respectively to match standard
package codes
Page 14 Added Tape and Reel indicator to Ordering Information
Page 1 -15 Removed 71V421S/L from the part number, in the pin configurations and throughout the datasheet
Page 1 - 15 Removed all references to Master/Slave throughout the datasheet
Page 1 -15 Updated the Com'l and Ind speeds for the 25/35/55ns offerings in Features , in the DC & AC Chars tables, in the
Ordering Information and throughout the datasheet
Page 13 Removed Width Expansion with Busy Logic Master/Slave Arrays diagram for part numbers 71V321/71V421S/ L
and updated with a Depth Expansion diagram for the single part number 71V321S/L
Updated the corresponding Depth Expansion descriptive text in the Depth Expansion section of the datasheet
Product Discontinuation Notice - PDN# SP-17-02
Last time buy expires June 15, 2018
01/12/18:
10/14/15:
06/25/15: