MHPA19010N
1
RF Device Data
Freescale Semiconductor
PCS Band
RF Linear LDMOS Amplifier
Designed for Class AB amplifier applications in 50 ohm systems operating in
the PCS frequency band. A silicon FET design provides outstanding linearity
and gain. In addition, the excellent group delay and phase linearity characteris-
tics are ideal for digital modulation systems, such as TDMA and CDMA.
Typical CDMA Performance: 1960 MHz, 28 Volts
IS-95 CDMA Pilot, Sync, Paging, Traffic Codes 8 Through 13
Adjacent Channel Power: -51 dBc @ 30 dBm, 885 kHz Channel Spacing
Power Gain: 24.5 dB Min (@ f = 1960 MHz)
0.2 dB Typical Gain Flatness
Features
Excellent Phase Linearity and Group Delay Characteristics
Ideal for Feedforward Base Station Applications
N Suffix Indicates Lead-Free Terminations
Table 1. Maximum Ratings (TC = 25°C unless otherwise noted)
Rating Symbol Value Unit
DC Supply Voltage VDD 30 Vdc
RF Input Power (Single Carrier CW) Pin +20 dBm
Storage Temperature Range Tstg - 40 to +100 °C
Operating Case Temperature Range TC- 20 to +100 °C
Quiescent Bias Current IDQ 750 mA
Table 2. Electrical Characteristics (VDD = 28 Vdc, VBIAS 8 V Set for Supply Current of 600 mA, TC = 25°C, 50 System)
Characteristic Symbol Min Typ Max Unit
Supply Current IDD 600 mA
Power Gain (f = 1960 MHz) Gp24.5 25 dB
Gain Flatness (f = 1930 - 1990 MHz) GF 0.2 0.5 dB
Power Output @ 1 dB Comp. (f = 1960 MHz) P1dB 41.5 dBm
Input VSWR (f = 1930 - 1990 MHz) VSWRin 1.5:1 2:1
Noise Figure (f = 1960 MHz) NF 8 10 dB
Adjacent Channel Power Rejection @ 30 dBm, 1.23 MHz BW,
885 kHz Channel Spacing
ACPR -58 -51 dBc
Document Number: MHPA19010N
Rev. 6, 5/2006
Freescale Semiconductor
Technical Data
MHPA19010N
1930-1990 MHz
10 W, 24.5 dB
RF HIGH POWER LDMOS AMPLIFIER
CASE 301AP-02, STYLE 3
Freescale Semiconductor, Inc., 2006. All rights reserved.
2
RF Device Data
Freescale Semiconductor
MHPA19010N
TYPICAL CHARACTERISTICS
1990
−30
10
1930
20
28
IRL
Gps
ORL
f, FREQUENCY (MHz)
Figure 1. Two-Tone Power Gain, Input Return
Loss and Output Return Loss versus Frequency
IRL/ORL, INPUT/OUTPUT RETURN LOSS (dB)
VDD = 28 Vdc
Pout = 5 W
IDQ = 600 mA
100 kHz Tone Spacing
527
026
−5 25
−10 24
−15 23
−20 22
−25 21
1940 1950 1960 1970 1980
Gps, POWER GAIN (dB)
η
2000
20
28
1920
4
20
Gps
f, FREQUENCY (MHz)
Figure 2. 2-Carrier CDMA Power Gain and Efficiency
versus Frequency
Gps, POWER GAIN (dB)
, DRAIN EFFICIENCY (%)η
2−Carrier CDMA
Carrier Spacing = 2.5 MHz
Carrier Bandwidth = 1.2288 MHz
1930 1940 1950 1960 1970 1980 1990
27 18
26 16
25 14
24 12
23 10
22 8
21 6
VDD = 28 Vdc
Pout = 1 W (Avg.)
IDQ = 600 mA
−10_C
85_C
−10_C
25_C
85_C
TC = 25_C
ACPR
2000
−60
−35
1920
−70
−20
f, FREQUENCY (MHz)
Figure 3. 2-Carrier CDMA IM3 and ACPR
versus Frequency
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
ACPR @ 885 kHz, Bandwidth = 30 kHz
IM3 @ 2.5 MHz, Bandwidth = 1.2288 MHz
VDD = 28 Vdc, POUT = 1 W (Avg.), IDQ = 600 mA
85_C
−10_C
25_C
85_C
IM3
25_C
2−Carrier CDMA, Carrier Spacing = 2.5 MHz
Carrier Bandwidth = 1.2288 MHz
TC = −10_C
−40 −30
−45 −40
−50 −50
−55 −60
1930 1940 1950 1960 1970 1980 1990 40
−60
−25
15
100 kHz
Pout, OUTPUT POWER (dBm) PEP
Figure 4. Two-Tone CDMA IMD versus Output
Power
INTERMODULATION DISTORTION (dBc)IMD,
VDD = 28 Vdc, IDQ = 600 mA
100 kHz: f1 = 1959.95 MHz
f2 = 1960.05 MHz
10 MHz: f1 = 1955 MHz
f2 = 1965 MHz
35302520
−30
−35
−40
−45
−50
−55
10 MHz
40
−60
−25
15
IDQ = 800 mA
500 mA
Pout, OUTPUT POWER (dBm) PEP
Figure 5. Third Order Intermodulation Distortion
versus Output Power
IM3, THIRD ORDER INTERMODULATION DISTORTION (dBc)
VDD = 28 Vdc
f1 = 1959.95 MHz
f2 = 1960.05 MHz
700 mA
600 mA
−30
−35
−40
−45
−50
−55
35302520
η
25
0
48
−5
23.5
27.5
Gps
PIN, (dBm)
Figure 6. CW Output Power, Efficiency and Gain
versus Input Power
, DRAIN EFFICIENCY (%), ηPout OUTPUT POWER (dBm)
VDD = 28 Vdc
IDQ = 600 mA
f = 1960 MHz
Pout
Gps, POWER GAIN (dB)
0 5 10 15 20
42 27
36 26.5
30 26
24 25.5
18 25
12 24.5
624
IM3, THIRD ORDER INTERMODULATION DISTORTION (dBc)
MHPA19010N
3
RF Device Data
Freescale Semiconductor
TYPICAL CHARACTERISTICS
η
35
−80
−30
5
0
10
IM3
ACPR
Pout, OUTPUT POWER (dBm)
Figure 7. 2-Carrier CDMA ACPR, IM3 and Efficiency
versus Output Power
IM3 (dBc), ACPR (dBc)
, DRAIN EFFICIENCY (%)η
VDD = 28 Vdc
IDQ = 600 mA
f1 = 1960 MHz
f2 = 1962.5 MHz
−35 9
−40 8
−45 7
−50 6
−55 5
−60 4
−65 3
−70 2
−75 1
3025201510
4
RF Device Data
Freescale Semiconductor
MHPA19010N
NOTES
MHPA19010N
5
RF Device Data
Freescale Semiconductor
NOTES
6
RF Device Data
Freescale Semiconductor
MHPA19010N
NOTES
MHPA19010N
7
RF Device Data
Freescale Semiconductor
PACKAGE DIMENSIONS
NOTES:
1. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION "F" TO CENTER OF LEADS.
G
W
N
L
H
R
K
J
A
M
0.020 (0.51) TM
M
0.020 (0.51) T
12 34
F
E
C
SEATING
PLANE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A1.760 1.780 44.70
B1.370 1.390 34.80 35.31
C0.245 0.265 6.22 6.73
D0.017 0.023 0.43 0.58
E0.080 0.100 2.03 2.54
F0.086 BSC 2.18 BSC
G1.650 BSC 41.91 BSC
H1.290 BSC 32.77 BSC
J0.266 0.280 6.76 7.11
K0.125 0.165 3.18 4.19
L0.990 BSC 25.15 BSC
0.390 BSC 9.91 BSCN
P
0.118 0.132 3.00 3.35Q
R0.535 0.555 13.59 14.10
S0.445 0.465 11.30 11.81
W
45.21
CASE 301AP- 02
ISSUE E
B
M
0.020 (0.51) TM
M
S
M
0.008 (0.20) A M
T
0.090 BSC 2.29 BSC
0.008 0.013 0.20 0.33
STYLE 3:
PIN 1. RF INPUT
2. VBIAS
3. VDD
4. RF OUTPUT
CASE: GROUND
D4X
Q2X
B
A
S
S
A
T
P
4X
Note: VDD (Pin 3) should always be applied before VBIAS (Pin 2).
8
RF Device Data
Freescale Semiconductor
MHPA19010N
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Document Number: MHPA19010N
Rev. 6, 5/2006
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