Datashee
t
○Product structure：Silicon monolithic integrated circuit○This product has no designed protection against radioactive rays
1/21
TSZ22111・14・001
© 2013 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
www.rohm.com
1 Channel Compact High Side Switch ICs
2.0A Current Limit High Side Switch ICs
BD82022FVJ
Description
BD82022FVJ is a Single Channel High Side Switch IC
employing N-channel power MOSFET with low on
resistance and low supply current for the power supply
line of universal serial bus (USB).
This IC has a built-in over current detection circuit,
thermal shutdown circuit, under voltage lockout and
soft start circuits.
Features
Over-Current Protection：2.0A
Control Input Logic：Active-High
Output Discharge Function
Reverse Current Protection when Power S witch Off
Thermal Shutdown
Open-Drain Fault Flag Output
Under-Voltage Lockout
OCP Fast Response
Soft-Start Circuit
ESD Protection
UL：File No. E243261
IEC 60950-1 CB_scheme: File No.US-1 8106-UL
Applications
USB hub in consumer appliances, PC,
PC peripheral equipment, and so forth
Key Specifications
Input Voltage Range: 2.8V to 5.5V
ON Resistance: (VIN=5V) 90mΩ(Typ)
Over Current Threshold: 2.0A
Standby Current: 0.01µA (Typ)
Operating Temperature Ran ge: -40℃ to +85℃
Package W(Typ) D(Typ) H(Max)
TSSOP-B8J 3.00mm x 4.90mm x 1.10mm
Typical Application Circuit
Figure 1. Typical Application Circuit
TSSOP-B8J
( MSOP8 Jedec )
OU
T
OU
T
OU
T
IN
IN
/OC
GN
D
5
V(typ.)
C
L
CI N -
+
EN(/EN)
3.3V
10kΩ~
100kΩ
VOUT
10kΩ to
100kΩ
5V(Typ)
2/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Block Diagram
Pin Configuration
Pin Descriptions
Pin No. Symbol I/O Function
1 GND - Ground
2, 3 IN I Power supply input
Input terminal to the power switch and po wer supply inp ut terminal of the internal circuit
Short these pins externally
4 EN, /EN I
Enable input
Active high power on switch
High level input > 2.0V, Low level input < 0.8V
5 /OC O
Error flag output
Low when over-current or thermal shutdown is activated
Open drain output
6, 7, 8 OUT O Power switch output
Short these pins externally
Figure 2. Block Diagram
UVLO IN
GND
Charge
Pump
Gate
Logic
OCD
TSD
IN
EN(/EN)
OUT
OUT
OUT
/OC
Figure 3. Pin Configuration (TOP VIEW)
1
2
3
4
8
7
6
5
GND
IN
IN
/OC
OUT
OUT
OUT
Top View
EN(/EN)
3/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Absolute Maximum Ratings(Ta=25℃)
Parameter Symbol Rating Unit
IN Supply Voltage VIN -0.3 to +6.0 V
EN Input Voltage VEN -0.3 to +6.0 V
/OC Voltage V/OC -0.3 to +6.0 V
/OC Sink Current I/OC 5 mA
OUT Voltage VOUT -0.3 to +6.0 V
Storage T emperature Tstg -55 to +150 ℃
Power Dissipation Pd 587.5 (1) mW
(1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 4.7mW per 1℃ above 25℃
Recommended Operating Ratings
Parameter Symbol Rating Unit
Min Typ Max
IN Operating Voltage VIN 2.8 - 5.5 V
Operating Temperature Topr -40 - +85 ℃
Electrical Characteristics (V IN= 5V, Ta= 25℃, unless other wise specified.)
DC Characteristics
Parameter Symbol Limit Unit Condition
Min Typ Max
Operating Current IDD - 95 135
µA VEN = 5V, VOUT = open
Standby Current ISTB - 0.01 1 µA VEN = 0V, VOUT = open
EN Input Voltage VENH 2.0 - - V High input
VENL - - 0.8 V Low input
EN Input Leakage IEN -1 0.01 +1 µA VEN = 0V or 5V
On Resistance RON - 90 115 mΩ IOUT = 1.0A
Reverse Leak Current IREV - - 1 µA VOUT = 5.5V, VIN = 0V
Over-Current Threshold ITH 1.5 2.0 2.6 A
Current Load Slew rate
100A/s
Short Circuit Output Current ISC 1.1 1.4 1.9 A
VOUT=0V
CL=100µF
RMS
Output Discharge Resistance RDISC - 75 150 Ω IOUT = 1mA, VEN = 0V
/OC Output Low Voltage V/OC - - 0.4 V I/OC = 1mA
/OC Output Leak Current IL/OC - 0.01 1 µA V/OC = 5V
UVLO Threshold VTUVH 2.0 2.3 2.5 V VIN increasing
VTUVL 1.9 2.2 2.4 V VIN decreasing
AC Characteristics
Parameter Symbol Limit Unit Condition
Min Typ Max
Output Rise Time tON1 - 0.4 10 ms
RL=10Ω
Output Turn-on Time tON2 - 0.6 20 ms
Output Fall Time tOFF1 - 2 20 µs
Output Turn-off Time tOFF2 - 4 40 µs
/OC Delay Time t/OC 5 12 20 ms
4/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Measurement Circuit
GND
IN
IN
EN(/EN)
OUT
OUT
OUT
/OC
VEN(V/EN)
1µF
VIN
A
GND
IN
IN
EN(/EN)
OUT
OUT
OUT
/OC
VEN(V/EN)
1µF
RL
VIN
10kΩ
VIN
A
Operating Current EN, Input Voltage, Output Rise/Fall Time
GND
IN
IN
EN(/EN)
OUT
OUT
OUT
/OC
VEN(V/EN
)
1µF
10kΩ
CL
VIN VIN
IOUT
A
※10µF
GND
IN
IN
EN(/EN)
OUT
OUT
OUT
/OC
VEN(V/EN)
1µF
VIN
A
I/OC
On Resistance, Over-Current Protection
※Use capa citance of more than 10uF at
output short test by using external supply.
/OC Output Low Voltage
Figure 4. Measurement Circuit
Timing Diagram
TON1
VOUT
10%
90% 90%
TOFF1
TON2
VEN 50%
TOFF2
50%
10%
Figure 5. Output Rise/Fall Time
5/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Typical Performance Curves
0.0
0.2
0.4
0.6
0.8
1.0
23456
Figure 8. Standby Current
EN Disable
Standby Current : ISTB [µA]
Ta=25°C
Supply Voltage : VIN [V]
0.0
0.2
0.4
0.6
0.8
1.0
-50050100
Ambient Temperature ; Ta[°C]
Standby Current : ISTB [µA]
Figure 9. Standby Current
EN Disable
VIN=5.0V
0
20
40
60
80
100
120
140
-50050100
Operating Current : IDD [µA]
Ambient Temperature ; Ta[°C]
Figure 7. Operating Current
EN Enable
VIN=5.0V
Figure 6. Operating Current
EN Enable
0
20
40
60
80
100
120
140
23456
Operating Current : IDD [µA]
Supply Voltage : VIN [V]
Ta=25°C
6/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Typical Performance Curves - continued
Figure 10. EN Input Voltage
0.0
0.5
1.0
1.5
2.0
23456
Supply Voltage : VIN [V]
Enable Input Voltage : VEN[V]
Ta=25°C
Low to High
High to Lo
w
Enable Input Voltage : VEN[V]
0.0
0.5
1.0
1.5
2.0
-50 0 50 100
Ambient Temperature ; Ta[°C]
Figure 11. EN Input Voltage
VIN=5.0V Low to High
High to Lo
w
0
50
100
150
200
23456
Supply Voltage : VIN [V]
On Resistance : RON[mΩ]
Figure 12. On Resistance
Ta=25°C
On Resistance : RON[mΩ]
0
50
100
150
200
-50 0 50 100
Ambient Temperature ; Ta[°C]
Figure 13. On Resistance
VIN=5.0V
7/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Typical Performance Curves - continued
Figure 16. /OC Out put Low Voltage
0
20
40
60
80
100
23456
Supply Voltage : VIN [V]
/OC Output Low Voltage : V/OC[mV]
Ta=25°C
0
20
40
60
80
100
-50050100
Ambient Temperature
;
Ta
[
°
C
]
/OC Output Low Voltage : V/OC[mV]
Figure 17. /OC Out put Low Voltage
VIN=5.0V
1.0
1.5
2.0
2.5
3.0
23456
Supply Voltage : VIN [V]
Over Current Threshold : ITH[A}
Figure 14. Over-Current Threshold
Ta=25°C
1.0
1.5
2.0
2.5
3.0
-50 0 50 100
Over Current Threshold : ITH[A}
VIN=5.0V
Figure 15. Over-Current Threshold
Ambient Temperature ; Ta[°C]
8/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Typical Performance Curves - continued
2.0
2.1
2.2
2.3
2.4
2.5
-50050100
Ambient Temperature ; Ta[°C]
Figure 18. UVLO T hreshold
UVLO Threshold : VTUVL[V]
VTUVH
VTUVL
Ta=25°C
0.0
0.2
0.4
0.6
0.8
1.0
-50050100
Ambient Temperature ; Ta[°C]
Figure 19. UVLO Hysteresis Voltage
VIN=5.0V
UVLO Hysteresis Voltage : VHYS[V]
0.0
1.0
2.0
3.0
4.0
5.0
23456
Supply Voltage : VIN [V]
Rise T ime : TON1[ms]
Figure 20. Output Rise Time
Ta=25°C
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
Ambient Temperature ; Ta[°C]
Rise T ime : TON1[ms]
Figure 21. Output Rise Time
VIN=5.0V
9/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Typical Performance Curves - continued
0.0
1.0
2.0
3.0
4.0
5.0
23456
Supply Voltage : VIN [V]
Turn On Time : TON2[ms]
Figure 22. Output Turn-on Time
Ta=25°C
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
Ambient Temperature ; Ta[°C]
Turn On Time : TON2[ms]
Figure 23. Output Turn-on Time
VIN=5.0V
Supply Voltage : VIN [V]
Fall T ime : TOFF1[µs]
0.0
1.0
2.0
3.0
4.0
5.0
23456
Figure 24. Output F all Time
Ta=25°C
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
Ambient Temperature ; Ta[°C]
Fall T ime : TOFF1[µs]
Figure 25. Output F all Time
VIN=5.0V
10/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Typical Performance Curves - continued
0.0
2.0
4.0
6.0
8.0
10.0
23456
Supply Voltage : VIN [V]
T urn-of f Time : TOFF2[µs]
Figure 26. Output Turn-off Time
Ta=25°C
Figure 27. Output Turn-off Time
0.0
2.0
4.0
6.0
8.0
10.0
-50050100
Ambient Temperature ; Ta[°C]
T urn-of f Time : TOFF2[µs]
VIN=5.0V
5
10
15
20
-50 0 50 100
Ambient Temperature ; Ta[°C]
/OC Delay Time : T/OC[ms]
Figure 29. /OC Delay Time
VIN=5.0V
10
12
14
16
18
20
23456
Figure 28. /OC Delay Time
Supply Voltage : VIN [V]
/OC Delay Time : T/OC[ms]
Ta=25°C
11/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Typical Performance Curves - continued
0
50
100
150
200
23456
Supply Voltage : VIN [V]
Disc On Resistance: RDISC[Ω]
Figure 30. Discharge On Resi stance
Ta=25°C
0
50
100
150
200
-50050100
Ambient Temperature ; Ta[°C]
Disc On Resistance: RDISC[Ω]
Figure 31. Discharge On Resi stance
VIN=5.0V
12/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Typical Wave Forms（BD82022FVJ）
TIME(1ms/div.)
Figure 32. Output Rise Characteristic
VEN
(5V/div.)
VIN=5V
RL=10Ω
V/OC
(5V/div.)
VOUT
(5V/div.)
IIN
(1.0A/div.)
TIME(1µs/div.)
Figure 33. Output Fall Characteristic
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IIN
(1.0A /div.) VIN=5V
RL=10Ω
TIME(5ms/div.)
Figure 35. Over-Current Resp onse
Ramped Load
V/OC
(5V/div.)
VOUT
(5V/div.)
IIN
(1.0A/div.)
VIN=5V
CL=100µF
VIN=5V
RL=10Ω
TIME(1ms/div.)
Figure 34. Inrush Current Response
VEN
(5V/div.)
V/OC
(5V/div.)
IIN
(0.5A/div.)
CL=47µF
CL=100µF
CL=220µF
13/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Typical Wave Forms（BD82022FVJ）
TIME(10ms/div.)
Figure 38. UVLO Response
Increasing VIN
VIN
(5V/div.)
IIN
(0.5A/div.)
VOUT
(5V/div.)
RL=10Ω
TIME(10ms/div.)
Figure 39. UVLO Response
Decreasing VIN
VIN
(5V/div.)
IIN
(0.5A/div.)
VOUT
(5V/div.)
RL=10Ω
TIME(20ms/div.)
Figure 36. Over-Current Resp onse
Enable to Shortcircuit
VIN=5V
IIN
(1.0A/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
TIME(5ms/div.)
Figure 37. Over-Current Resp onse
1ΩLoad Connected at Enable
VIN=5V
IIN
(1.0A/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
14/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Typical Application Circuit
IN
OU
T
Regulator
OU
T
OU
T
OU
T
IN
IN
/
O
C
GN
D
VBU
S
D-
D+
GN
D
US
B
Controlle
r
5V(Typ.)
10
k
Ωto
100k
Ω
C
L
CIN
-
+
EN
(
/
EN
)
Figure 40. Typical Application Circuit
Application Information
When excessive current flows due to output short- circuit or overload ringing occurs because of inductance bet wee n power
source line and IC. This may cause bad effects on IC operations. In order to avoid this case, connect a bypass capacitor
CIN across IN terminal and GND terminal of I C. 1µF or higher is recomme nded. In order to decreas e voltage fluctuations of
power source line to IC, connect a low ESR capacitor in parallel with CIN. 10µF to 100µF or higher is recommended.
Pull up /OC output via resistanc e value of 10kΩ to 100kΩ.
Set up a value for CL which sat isfies the application.
This system connection diagram does not guarantee o peration as the intended application.
When using the circuit with changes to the external circuit values, make sure to leave an adequate margin for external
components including static and transiti onal characteristics as well as the desig n tolerances of the IC.
Functional Description
1. Switch Operation
IN terminal and OUT terminal are connected to the drain and t he source of switch MOSFET respectively. The IN terminal
is also used as po wer source input to internal control circuit.
When the switch is turned on from EN control input, the IN terminal and OUT terminal are connected by a 90mΩ(Typ)
switch. In ON status, the switch is bidirectional. T herefore, when the potent ial of OUT terminal is higher than that of the IN
terminal, current flows from OUT terminal to IN terminal.
Since the parasitic diode bet ween the drain and the so urce of s witch MOSFET is canceled current flo w from OUT to IN is
prevented during off state.
2. Thermal Shutdown Circuit (TSD)
If over current would continue, the temperature of the IC would increase drastically. If the junction temperature reaches
beyond 130℃(Typ) during the condition of over current detection, thermal shutdown circuit operates and turns power
switch off and outputs an error flag (/OC). Then, when the junction temperature decreases below 120℃(Typ), power
switch is turned on and error flag (/OC) is cancelled. Unless the cause of the increase of the chip’s temperature is
removed or the output of power switch is turned off, this operation repeats.
The thermal shutdown circuit operat es when the switch is on (EN signal is active).
3. Over-Current Detection (OCD)
The over-current detection circuit (OCD) limits current (ISC) and outputs error flag (/OC) when current flowing in each
switch MOSFET exceeds a specified val ue. There are three cases when the OCD circuit is activated. T he OCD operates
when the switch is on (EN signal is act ive).
15/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
(1) When the switch is turned on while the output is in short-circuit status, the switch gets in current limit status
immediately.
(2) When the output short-circ uits or when high current load is connected whil e the switch is on, very large current
will flow until the over-current limit circuit reacts. When this happens, the over-current limit circuit is activated
and the current limitation is carried out .
(3) When the output current increases gradually, current limitation does not work until the output current exceeds
the over-current det ection value. When it exceeds the detection value, current limitation is carried out.
4. Under-Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until VIN exceeds 2.3V(Typ). If VIN drops below 2.2V(Typ) while the
switch is still on, then the UVLO will shut off the power switch. UVLO has a hysteresis of 100mV(Typ).
Under-voltage lockout circuit works when the switch is on (EN signal is active).
5. Error Flag (/OC) Output
Error flag output is an N-MOS open drain output. Upon detection of over current or thermal shutdown, the output level
becomes low.
Over-current detection has a delay filter. This delay filter prevents current detection flags from being sent during
instantaneous events such as surge current due to switching or hot plug.
Figure 41. Over-Current Detection, Thermal Shutdown Timing
VEN
VOUT
IOUT
V/OC
Out
p
ut shortcircuit
Thermal shut down
dela
y
16/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Power Dissipation
The power dissipation depends on output load, ambient t emperature and PCB layout. The devices have current capacity of
1.5A respectively. Power dissipation can b e calculated using the output current and the RON of the power switch as below.
Pd = RON x IOUT2
The derating curve is shown below
TSSOP-B8J
(MSOP-8 JEDEC standard)
0
200
400
600
800
1000
1200
0 25 50 75 100 125 150
Ambient Temperature ; Ta[°C]
Power Dissi
p
ation : P
d
[
mW
]
962m
w
758m
w
587.5m
w
4 layer board mounting
2 layer board mounting
1 layer board mounting
Note: IC is Mounted on 70mmx70mmx1.6mm glass-epoxy PCB. Derating is 4.7mW/℃ above Ta=25℃.
Figure 42. Power Dissipation Curve (Pd-Ta Curve)
17/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
I/O Equivalent Circuit
Symbol Pin No. Equivalent Circ uit
EN(/EN) 4 EN
(/EN)
/OC 5
/OC
OUT 6,7,8 OUT
Operational Notes
1. Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all
destructive situations suc h as short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit
protection measures, like ad di ng a f use, in ca se the I C is operat ed in a s pec ial mode e xceedin g the abs ol ut e maximu m
ratings.
2. Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical c haracteristics are guaranteed under the con ditions of each parameter.
3. Reverse Connection of Power Supply Connector
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the po wer supply, such as mounti ng an external diode bet ween the po wer supply and the I C’s power supply
terminals.
4. Power Supply Line
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and su pply lines
of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature
and aging on the capacitance value when using electrolytic capacitors.
5. GND Voltage
The voltage of the ground pin must be the lowest voltage of all pins of t he IC at all operati ng condit ions. Ensure th at no
pins are at a voltage below the ground pin at an y time, even during transie nt condition.
6. Short Circuit between Terminals and Erroneous Mounting
Ensure that when mount ing the IC on the PCB the d irection and position ar e correct. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each o ther especially to ground. Int er-pin shorts could be due to
many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge
deposited in between pins during assembly to name a few.
7. Operation in Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
18/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
8. Inspection with Set PCB
When testing the I C on an application board, connecting a capacitor directl y to a low-impedance out put pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connectin g or removing it from the test setup during the inspec tion process. To
prevent damage from electro static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9. Input Terminals
In the construc tion of this IC, P-N junct ions are inevitably formed creat ing parasitic diodes or transistors. T he operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elem ents to operate, such as applyi ng a voltage to an input pin lo wer
than the GND voltage should be avoided. Furthermore, do not apply a voltage to the input terminals when no power
supply voltage is applied t o the IC. Even if the po wer supply voltage is applied, make sur e that t he input terminals have
voltages within the values specified in the electrical characteristics of this IC..
10. Ground Wiring Pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on
the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
11. External Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and o thers.
12. Thermal Shutdown Circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal
temperature of the IC reaches a specif ied value. Do not continue t o operate the IC after this function is activat ed. Do not
use the IC in conditions where this function will always be activated.
13. Thermal Design
Use a thermal design t hat allo ws for a sufficient margin b y taking into account the permis sible power dis sipation (Pd) in
actual operatin g conditions.
19/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Ordering Information
B D 8 2 0 2 2 F V J - E 2
Part No.
Part No.
Package
FVJ : TSSOP-B8J
(MSOP-8 JEDEC)
Packaging and forming spec ification
E2: Embossed tape and reel
Lineup Over-Current Threshold Control Logic Part Number
2.0A Active- High BD82022FVJ
Marking Diagram
Part Number Marking
BD82022FVJ 022
TSSOP-B8J(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
D82
20/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Physical Dimension, Tape and Reel Information
Package Name TSSOP-B8J
Direction of feed
Reel
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
1pin
21/21
Datasheet
Datasheet
BD82022FVJ
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001 TSZ02201-0E3E0H300470-1-2
18.SEP.2013 Rev.002
Revision History
Date Revision Changes
2.APR.2013 001 New Release
18.SEP.2013 002 Revised derating of Power Dissipation
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
