Technical Data 10433 Effective September 2015
HCM1307
High current power inductors
Description
• High current carrying capacity
• Low core losses
• Magnetically shielded, low EMI
• Frequency range up to 1MHz
• Inductance range from 0.47μH to 3.3μH
• Current range from 15 to 63 amps
• 14.2 x 13.0mm footprint surface mount
package in a 6.5mm height
• Iron powder core material
• Halogen free, lead free, RoHS compliant
Applications
• Multi-phase regulators
• Voltage Regulator Modules (VRMs)
• Distributed power systems DC-DC converters
• Desktop and server VRMs and EVRDs
• Point-of-Load (POL) modules
• Field Programmable Gate Array
(FPGA) DC-DC converters
• Battery power systems
• High current power supplies
• Data networking and storage systems
Environmental Data
• Storage temperature range (Component):
-55°C to +125°C
• Operating temperature range: -55°C to +125°C
(ambient + self-temperature rise)
• Solder reflow temperature: J-STD-020D
compliant
Pb
HALOGEN
HF
FREE
2
Technical Data 10433
Effective September 2015
HCM1307
High current power inductors
www.eaton.com/elx
Product Specifications
Part Number6
OCL1
(μH) ±20%
FLL2 (μH)
minimum
Irms
3
(amps)
Isat
4
(amps)
DCR (mΩ)
typical @ +20°C
DCR (mΩ)
maximum @ +20°C K-factor5
HCM1307-R47-R 0.47 0.26 38 63 1.0 1.2 192
HCM1307-1R0-R 1.0 0.56 29 49 1.7 2.0 111
HCM1307-3R3-R 3.3 1.85 15 40 4.3 4.5 88
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 1.0Vrms, @ Isat, @ +25ºC
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating
conditions verified in the end application.
4. Isat: Peak current for approximately 30% rolloff @ +25°C
5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p: (Gauss), K: (K-factor from table), L:
(Inductance in μH), ΔI (Peak to peak ripple current in Amps).
6. Part Number Definition: HCM1307-xxx-R
HCM1307 = Product code and size
xxx= inductance value in μH, R= decimal point ,
If no R is present then last character equals number of zeros
-R suffix = RoHS compliant
Dimensions (mm)
Part marking: XXX=Inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros.
wlyy=date code, R=revision level
All soldering surfaces to be coplanar within 0.10 millimeters
Tolerances are ±0.3 millimeters unless stated otherwise
Color: Grey
Do not route traces or vias underneath the inductor
Recommended Pad Layout Schematic
12.5
±0.5
1
2
XXX
wlyy R
1
2
1
2
13.2
±1.0
6.3
±0.2
3.8
±0.5
2.5
±0.3
8.0
ref
14.20
4.9
7.7
3.25
ab
3
Technical Data 10433
Effective September 2015
HCM1307
High current power inductors
www.eaton.com/elx
Packaging information (mm)
Supplied in tape and reel packaging, 400 parts per 13” diameter reel
Temperature rise vs. total loss
1.5 dia
4.0
2.0
20.0 1.5 dia
1.75
13.3
7.0
4.5
13.1
XXX
wlyy R
11.5
24.0
±0.3
User direction of feed
0
10
20
30
40
50
60
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.41.6 1.82.0 2.2
Temperature Rise (°C)
Total Loss (W)
HCM1307-R47-R
HCM1307-1R0-R
HCM1307-3R3-R
4
Technical Data 10433
Effective September 2015
HCM1307
High current power inductors
www.eaton.com/elx
Core loss vs. Bp-p
Inductance characteristics
0.001
0.010
0.100
1.000
10.000
100 1000 1000
0
Core Loss (mw)
Bp-p (Gauss)
50kHz
25kHz
200kHz
100kHz
300kHz
500kHz
1MHz
40%
50%
60%
70%
80%
90%
100%
110%
0102030405060708090
% of OCL
HCM1307-R47-R
40%
50%
60%
70%
80%
90%
100%
110%
0510 15 20 25 30 35 40 45 50 55 60 65
% of OCL
IDC(Amps)
HCM1307-1R0-R
IDC(Amps)
40%
50%
60%
70%
80%
90%
100%
110%
0510 15 20 25 30 35 40 45
% of OCL
HCM1307-3R3-R
IDC(Amps)
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2015 Eaton
All Rights Reserved
Printed in USA
Publication No. 10433 BU-MC15009
September 2015
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Technical Data 10433
Effective September 2015
HCM1307
High current power inductors
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm) 235°C 220°C
≥2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
