Rev. 1.0 4/12 Copyright © 2012 by Silico n Laboratories Si5315
Si5315
SYNCHRONOUS ETHERNET/TELECOM JITTER ATTENUATING
CLOCK MULTIPLIER
Features
Applications
Description
The Si5315 is a jitter-attenuating clock multiplier for Gb and 10G Synchronous
Ethernet, SONET/SDH, and PDH (T1/E1) applications. The Si5315 supports SyncE
EEC options 1 and 2 when paired with a timing card that implements the required
wander filter. The Si5315 accepts dual clock inputs ranging from 8 kHz to 644.53 MHz
and generates two equal frequency-multiplied clock outputs ranging from 8 kHz to
644.53 MHz. The input clock frequency and clock multiplication ratio are selectable
from a table of popular SyncE and T1/E1 rates. The Si5315 is based on Silicon
Laboratories' third-generation DSPLL® technology, which provides any-frequency
synthesis and jitter attenuation in a highly integrated PLL solution that eliminates the
need for external VCXO and loop filter components. The DSPLL loop bandwidth is
user programmable, providing jitter performance optimization at the application level.
Functional Block Diagram
Provides jitter attenuation and frequency
translation between SONET/PDH and
Ethernet
Supports ITU-T G.8262 Synchronous
Ethernet equipment slave clock (EEC
option 1 and 2) requirements with
optional Stratum 3 compliant timing card
clock source
Two clock inputs/two clock outputs
Input frequency range: 8 kHz–644 MHz
Output frequency range: 8 kHz–644 MHz
Ultra low jitter:
0.23 ps RMS (1.875–20 MHz)
0.47 ps RMS (12 kHz–20 MHz)
Simple pin control interface
Selectable loop bandwidth for jitter
attenuation: 60 to 8.4 kHz
Automatic/Manual hitless switching
and holdover during loss of inputs
clock
Programmable output clock signal
format: LVPECL, LVDS, CML or
CMOS
40 MHz crystal or XO reference
Single supply: 1.8, 2.5, or 3.3 V
On-chip voltage regulator with high
PSRR
Loss of lock and loss of signal alarms
Small size: 6 x 6 mm, 36-QFN
Wide temperature range: –40 to
+85 ºC
Synchronous Ethernet line cards
SONET OC-3/12/48 line cards
PON OLT/ONU
Carrier Ethernet switches routers
MSAN / DSLAM
T1/E1/DS3/E3 line cards
DSPLL®
Clock In 1
Clock In 2
Clock Out 1
Clock Out 2
Clock 2 Disable/PLL Bypass
Output Signal Format[1:0]
XTAL/Clock
VDD (1.8, 2.5, or 3.3 V)
GND
Status/Control
Loss of Lock
Loss of Signal 2
Frequency Select[3:0]
Frequency Table Select
Manual/Auto Clock Selection
Clock Switch/Clock Active Indicator
Loss of Signal 1
Loop Bandwidth Select[1:0] XTAL/Clock
Si5315
Ordering Information:
See page 48.
Pin Assignments
1
2
3
2930313233343536
20
21
22
23
24
25
26
27
10 11 12 13 14 15 16 17
4
5
6
7
8
FRQTBL
AUTOSEL
RST
LOS2
LOS1
GND
VDD
XA
VDD
XTAL/CLOCK
CKIN2+
CKIN2–
DBL2_BY
GND
CKIN1+
CKIN1–
CS_CA
BWSEL0
BWSEL1
FRQSEL1
FRQSEL2
FRQSEL3
CKOUT1–
SFOUT1
GND
VDD
SFOUT0
CKOUT2–
CKOUT2+
NC
GND
Pad
FRQSEL0
GND
9
18
19
28
XB
LOL
GND
CKOUT1+
Si5315
2 Rev. 1.0
Si5315
Rev. 1.0 3
TABLE OF CONTENTS
Section Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
1.1. Three-Level (3L) Input Pins (No External Resistors) . . . . . . . . . . . . . . . . . . . . . . . .11
1.2. Three-Level (3L) Input Pins (With External Resistors) . . . . . . . . . . . . . . . . . . . . . . .12
2. Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
3. System Level Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
4.1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
4.2. PLL Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
5. Frequency Plan Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
5.1. Frequency Multiplication Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
5.2. PLL Self-Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
5.3. Input Clock Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
5.4. Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
5.5. Holdover Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
5.6. PLL Bypass Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
6. High-Speed I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
6.1. Input Clock Buffers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
6.2. Output Clock Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
7. Crystal/Reference Clock Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
7.1. Crystal/Reference Clock Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
8. Power Supply Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
9. Typical Phase Noise Plots . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
9.1. 10G LAN SyncE Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
10. Pin Descriptions: Si5315 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
11. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
12. Package Outline: 36-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
13. PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
14. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
14.1. Si5315 Top Marking (QFN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
14.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Si5315
4 Rev. 1.0
1. Electrical Specifications
Table 1. Recommended Operating Conditions
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA= –40 to 85 ºC)
Parameter Symbol Test Condition Min Typ Max Unit
Temperature Range TA–40 25 85 ºC
Supply Voltage VDD 3.3 V nominal 2.97 3.3 3.63 V
2.5 V nominal 2.25 2.5 2.75 V
1.8 V nominal 1.71 1.8 1.89 V
Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise noted.
Table 2. DC Characteristics
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA= –40 to 85 ºC)
Parameter Symbol Test Co ndition Min Typ Max Units
Supply Current (Supply
current is independent of
VDD)
IDD LVPECL Format
644.53125 MHz Out
All CKOUTs Enabled1
—251279 mA
LVPECL Format
644.53125 MHz Out
Only 1 CKOUT Enabled1
—217243 mA
CMOS Format
25.00 MHz Out
All CKOUTs Enabled2
—204234 mA
CMOS Format
25.00 MHz Out
Only CKOUT1 Enabled2
—194220 mA
CKINn Input Pins
Input Common Mode Voltage
(Input Threshold Voltage)
VICM 1.8 V ± 5% 0.9 — 1.4 V
2.5 V ± 10% 1.0 — 1.7 V
3.3 V ± 10% 1.1 — 1.95 V
Input Resistance CKNRIN Single-ended 20 40 60 k
Input Voltage Level Limits CKNVIN 0—V
DD V
Notes:
1. Refers to Si5315A speed grade.
2. Refers to Si5315B speed grade.
3. This is the amount of leakage that the 3L inputs can tolerate from an external driver. See Figure 3 on page 11.
Si5315
Rev. 1.0 5
Single-ended Input Voltage
Swing
VISE fCKIN <212.5 MHz
See Figure 2.
0.2 — — VPP
fCKIN > 212.5 MHz
See Figure 2.
0.25 — — VPP
Differential Input
Voltage Swing
VID fCKIN <212.5 MHz
See Figure 2.
0.2 — — VPP
fCKIN > 212.5 MHz
See Figure 2.
0.25 — — VPP
CKOUTn Output Clocks
Common Mode VOCM LVPECL 100 load
line-to-line
VDD –
1.42
—V
DD –
1.25
V
Differential Output Swing VOD LVPECL 100 load
line-to-line
1.1 — 1.9 VPP
Single Ended Output Swing VSE LVPECL 100 load
line-to-line
0.5 — 0.93 VPP
Differential Output Voltage CKOVD CML 100 load
line-to-line
350 425 500 mVPP
Common Mode
Output Voltage
CKOVCM CML 100 load
line-to-line
—V
DD –
0.36
—V
Differential
Output Voltage
CKOVD LVDS 100 load
line-to-line
500 700 900 mVPP
Low swing LVDS 100 load
line-to-line
350 425 500 mVPP
Common Mode
Output Voltage
CKOVCM LVDS 100 load
line-to-line
1.125 1.2 1.275 V
Differential Output Resistance CKORD CML, LVPECL, LVDS,
Disable
—200—
Output Voltage Low CKOVOLLH CMOS — — 0.4 V
Output Voltage High CKOVOHLH VDD = 1.71 V
CMOS
0.8 x VDD —— V
Table 2. DC Characteristics (Continued)
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA= –40 to 85 ºC)
Parameter Symbol Test Co ndition Min Typ Max Units
Notes:
1. Refers to Si5315A speed grade.
2. Refers to Si5315B speed grade.
3. This is the amount of leakage that the 3L inputs can tolerate from an external driver. See Figure 3 on page 11.
Si5315
6 Rev. 1.0
Output Drive Current CKOIO CMOS
Driving into CKOVOL for out-
put low or CKOVOH for out-
put high. CKOUT+ and
CKOUT– shorted externally.
VDD = 1.71 V 7.5 — — mA
VDD = 2.97 V 32 — — mA
2-Level LVCMOS Input Pins
Input Voltage Low VIL VDD =1.71V — — 0.5 V
VDD =2.25V — — 0.7 V
VDD =2.97V — — 0.8 V
Input Voltage High VIH VDD =1.89V 1.4 — — V
VDD =2.25V 1.8 — — V
VDD =3.63V 2.5 — — V
Input Low Current IIL ——50 µA
Input High Current IIH ——50 µA
Weak Internal Input Pull-up
Resistor
RPUP —75— k
Weak Internal Input
Pull-down Resistor
RPDN —75— k
3-Level Input Pins
Input Voltage Low VILL ——
0.15 x VDD V
Input Voltage Mid VIMM 0.45 x VDD —0.55 x VDD V
Input Voltage High VIHH 0.85 x VDD —— V
Input Low Current IILL See note 3. –20 — — µA
Input Mid Current IIMM See note 3. –2 — 2 µA
Input High Current IIHH See note 3. — — 20 µA
Table 2. DC Characteristics (Continued)
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA= –40 to 85 ºC)
Parameter Symbol Test Co ndition Min Typ Max Units
Notes:
1. Refers to Si5315A speed grade.
2. Refers to Si5315B speed grade.
3. This is the amount of leakage that the 3L inputs can tolerate from an external driver. See Figure 3 on page 11.
Si5315
Rev. 1.0 7
LVCMOS Output Pins
Output Voltage Low VOL IO=2mA
VDD =1.62V
——0.4 V
IO=2mA
VDD =2.97V
——0.4 V
Output Voltage High VOH IO=–2mA
VDD =1.62V
VDD –0.4 — — V
IO=–2mA
VDD =2.97V
VDD –0.4 — — V
Disabled Leakage Current IOZ RST = 0 –100 — 100 µA
Single-Ended Reference Clock Input Pin XA (XB with Cap to Gnd)
Input Resistance XARIN XTAL/CLOCK = M — 12 — k
Input Voltage Level Limits XAVIN 0—1.2 V
Input Voltage Swing XAVPP 0.5 — 1.2 VPP
Differential Reference Clock Input Pins (XA/XB)
Input Resistance XA/XBRIN XTAL/CLOCK = M — 12 — k
Differential Input Voltage
Level Limits
XA/XBVIN 0—1.2 V
Input Voltage Swing XAVPP/XBVPP 0.5 — 2.4 VPP
Table 2. DC Characteristics (Continued)
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA= –40 to 85 ºC)
Parameter Symbol Test Co ndition Min Typ Max Units
Notes:
1. Refers to Si5315A speed grade.
2. Refers to Si5315B speed grade.
3. This is the amount of leakage that the 3L inputs can tolerate from an external driver. See Figure 3 on page 11.
Si5315
8 Rev. 1.0
Table 3. AC Characteristics
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA= –40 to 85 ºC)
Parameter Symbol Test Condition M in Typ Max Units
Input Frequency CKNF0.008 — 644.53 MHz
CKINn Input Pins
Input Duty Cycle (Minimum
Pulse Width) CKNDC Whichever is smaller140 — 60 %
2——ns
Input Capacitance CKNCIN —— 3pF
Input Rise/Fall Time CKNTRF 20–80%
See Figure 2
—— 11ns
CKOUTn Output Pins
Output Frequency (Output not
configured for CMOS or disable) CKOF
Note 2 0.008 — 644.53 MHz
Note 3 0.008 — 125 MHz
Maximum Output Frequency in
CMOS Format
CKOFMC — — 161.13 MHz
Output Rise/Fall (20–80%) at
644.5313 MHz
CKOTRF Output not configured for CMOS
or disabled, see Figure 2
— 230 350 ps
Single Ended Output Rise/Fall
(20–80%)
CKOTRF
CMOS Output
VDD = 1.62
Cload = 5 pF
—— 8ns
CMOS Output
VDD = 2.97
Cload = 5 pF
—— 2ns
Output Duty Cycle Differential
Uncertainty
CKODC 100 Load
Line to Line
Measured at 50% Point
(not for CMOS)
——±40ps
LVCMOS Pins
Input Capacitance Cin —— 3pF
Notes:
1. Assumes N3 does not equal 1. IF N3 = 1, CKNDC = 50 µs.
2. Refers to Si5315A speed grade.
3. Refers to Si5315B speed grade.
Si5315
Rev. 1.0 9
LVCMOS Output Pins
Rise/Fall Times tRF CLOAD = 20 pf
See Figure 2
—25 —ns
LOSn Trigger Window LOSTRIG
From last CKINn to
internal detection of LOSn
——750µs
Time to Clear LOL after LOS
Cleared
tCLRLOL LOS to LOL
Assume Fold=Fnew,
Stable XA-XB reference
—10 —ms
PLL Performance
Output Clock Skew tSKEW of CKOUTn to CKOUTn — — 100 ps
Phase Change Due to
Temperature Variation
tTEMP Maximum phase change from
–40 to +85 °C
— 300 500 ps
Lock Time tLOCKHW RST with valid CKIN to LOL;
BW = 100 Hz
— 1200 — ms
Closed Loop Jitter Peaking JPK —0.050.1dB
Jitter Tolerance JTOL
See 4.2.3. "Jitter Toler-
ance" on page 18.
ns pk-
pk
Minimum Reset Pulse Width tRSTMIN 1——µs
Output Clock Initial Phase Step tP_STEP
During clock switch CKIN > 19.44
MHz
— 100 200 ps
Holdover Frequency Historical
Averaging Time tHISTAVG
—6.7 —sec
Holdover Frequency Historical
Delay Time tHISTDEL
—26.2 — ms
Spurious Noise SPSPUR
Max spur @ n x f3
(n > 1, n x f3 < 100 MHz)
—–75 —dBc
Table 3. AC Characteristics (Continued)
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA= –40 to 85 ºC)
Parameter Symbol Test Condition M in Typ Max Units
Notes:
1. Assumes N3 does not equal 1. IF N3 = 1, CKNDC = 50 µs.
2. Refers to Si5315A speed grade.
3. Refers to Si5315B speed grade.
Si5315
10 Rev. 1.0
Figure 1. CKIN Voltage Characteristics
Figure 2. Rise/Fall Time Characteristics
Table 4. Jitter Generation
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA= –40 to 85 ºC)
Parameter Symbol Test Condition 1,2,3,4 Min Typ Max GR-253 Spec Unit
Measuremen
t Filter (MHz) DSPLL BW1
Jitter Gen OC-192 JGEN
0.02–80 167 Hz5— 0.483 0.628 N/A psrms
4–80 167 Hz5— 0.302 0.392 N/A psrms
0.05–80 167 Hz5— 0.467 0.607 1.0 psrms
(0.01 UIrms
psrms
Jitter Gen OC-48 JGEN 0.012–20
167 Hz5— 0.470 0.611 4.02 psrms
(0.01 UIrms)
psrms
111 Hz6— 0.565 0.734 4.02 psrms
(0.01 UIrms)
psrms
IEEE 802.3 GbE
RMS Jitter JGEN
1.875–20 83 Hz6— 0.232 0.301 psrms
Notes:
1. BWSEL [1:0] loop bandwidth settings provided in Table 9 on page 20.
2. 40 MHz fundamental mode crystal used as XA/XB input.
3. VDD = 2.5 V
4. TA = 85 °C
5. Si5315A test condition: fIN = 19.44 MHz, fOUT = 156.25 MHz, LVPECL clock input: 1.19 Vppd with 0.5 ns rise/fall time
(20–80%), LVPECL clock output.
6. Si5315B test condition: fIN =19.44 MHz, fOUT = 125 MHz, LVPECL clock input: 1.19 Vppd with 0.5 ns rise/fall time (20-
80%), LVPECL clock output.
V
ISE , VOSE
VID,VOD
Differential I/Os
VICM, VOCM
Single-Ended
Peak-to-Peak Voltage
Differential
Peak-to-Peak Voltage
SIGNAL +
SIGNAL –
(SIGNAL +) – (SIGNAL –)
V
t
SIGNAL +
SIGNAL –
VID = (SIGNAL+) – (SIGNAL–)
V
ICM , VOCM
tFtR
80%
20%
DOUT, CLOUT
Si5315
Rev. 1.0 11
1.1. Three-Level (3L) Input Pins (No External Resistors)
Figure 3. Three-Level Input Pins
Table 5. Three-Level Input Pins (No External Resistors)
Parameter Symbol Min Max
Input Voltage Low Vill — 0.15 x VDD
Input Voltage Mid Vimm 0.45 x VDD 0.55 x VDD
Input Voltage High Vihh 0.85 x VDD —
Input Low Current Iill –6 µA —
Input Mid Current Iimm –2 µA 2 µA
Input High Current Iihh — 6 µA
Note: The above currents are the amount of leakage that the 3L inputs can tolerate from an external driver.
External Driver
Si5315
Iimm 75 k
VDD
75 k
Si5315
12 Rev. 1.0
1.2. Three-Level (3L) Input Pins (With External Resistors)
Figure 4. Three Level Input Pins
Any resistor pack may be used.
The Panasonic EXB-D10C183J is an example.
PCB layout is not critical.
Resistor packs are only needed if the leakage current of the external driver exceeds the listed currents.
If a pin is tied to ground or VDD, no resistors are needed.
If a pin is left open (no connect), no resistors are needed.
Table 6. Three-Level Input Pins (With External Resistors)
Parameter Symbol Min Max
Input Low Current Iill –30 µA —
Input Mid Current Iimm –11 µA –11 µA
Input High Current Iihh — –30 µA
Note: The above currents are the amount of leakage that the 3L inputs can tolerate from an external driver.
External Driver
Si5315
Iimm 18 k
VDD
18 k
75 k
VDD
75 k
One of eight resistors from a Panasonic EXB-D10C183J
(or similar) resistor pack
Si5315
Rev. 1.0 13
Table 7. Thermal Characteristics
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA= –40 to 85 ºC)
Parameter Symbol Test Condition Min Typ Max Unit
Thermal Resistance
Junction to Ambient
JA Still Air — 32 — ºC/W
Thermal Resistance
Junction to Case
JC Still Air — 14 — ºC/W
Table 8. Absolute Maximum Limits
Parameter Symbol Value Unit
DC Supply Voltage VDD –0.5 to 3.8 V
LVCMOS Input Voltage VDIG –0.3 to (VDD + 0.3) V
CKINn Voltage Level Limits CKNVIN 0 to VDD V
XA/XB Voltage Level Limits XAVIN 0 to 1.2 V
Operating Junction Temperature TJCT –55 to 150 C
Storage Temperature Range TSTG –55 to 150 C
ESD HBM Tolerance (100 pF, 1.5 kΩ); All pins except
CKIN+/CKIN–
2kV
ESD MM Tolerance; All pins except CKIN+/CKIN– 150 V
ESD HBM Tolerance (100 pF, 1.5 kΩ); CKIN+/CKIN– 750 V
ESD MM Tolerance; CKIN+/CKIN– 100 V
Latch-Up Tolerance JESD78 Compliant
Note: Permanent device damage may occur if the Absolute Maximum Ratings are exceeded. Functional operation should be
restricted to the conditions as specified in the operation sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods of time may affect device reliability.
Si5315
14 Rev. 1.0
2. Typical Application Circuit
Figure 5. Si5315 Typical Application Circuit
Si5315
LOS1
LOS2
LOL
CKOUT1+
CKOUT1–
CKIN1 Loss of Signal Indicator
CKIN2 Loss of Signal Indicator
PLL Loss of Lock Indicator
CKOUT2+
CKOUT2–
2. Denotes tri-level input pins with states designated as L (ground), M (VDD/2), and H (VDD).
CKIN1+
CKIN1–
Backplane or Line
Recovered Clock
Inputs
CKIN2+
CKIN2–
Notes:
3. Assumes manual input clock selection.
XA
XB
40 MHz Crystal
Option 1:
1. Assumes differential LVPECL termination (3.3 V) on clock inputs.
VDD
GND
Ferrite
Bead
System
Power
Supply
C3
C2
C1
C4
0.1 µF
0.1 µF
0.1 µF
1 µF
130 130
82 82
VDD = 3.3 V
130 130
82 82
VDD = 3.3 V
Clock Outputs to
Ethernet PHYs
100
0.1 µF
0.1 µF
+
–
100
0.1 µF
0.1 µF
+
–
XA
XB
Ext. Refclk+
Option 2: 0.1 µF
Ext. Refclk–
0.1 µF
BWSEL[1:0]2
Bandwidth Select
VDD
15 k
15 k
SFOUT[1:0]2
Signal Format Select
VDD
15 k
15 k
DBL2_BY2
Clock Output 2 Disable/
Bypass Mode Control
VDD
15 k
15 k
FRQSEL[3:0]2
Frequency Select
VDD
15 k
15 k
FRQTBL2
Frequency Table Select
VDD
15 k
15 k
CS3
Input Clock Select
VDD
15 k
15 k
AUTOSEL2
Manual/Automatic Clock
Selection (L)
VDD
15 k
15 k
XTAL/Clock2
Crystal/Ref Clk
VDD
15 k
15 k
RST
Reset
GND Pad
Si5315
Rev. 1.0 15
3. System Level Overview
The Si5315 provides clock translation, jitter attenuation, and clock distribution for high-performance Synchronous
Ethernet* line card timing applications.
*Note: The Si5315 supports SyncE EEC options 1 and 2 when paired with a timing card that implements the required wander
filtering and Stratum 3 compliant reference clock. For detailed information, refer to “AN420: SyncE and IEEE 1588: Sync
Distribution for a Unified Network”.
The Si5315 provides clock translation, jitter attenuation, and clock distribution for high-performance Synchronous
Ethernet line card timing applications. The device accepts two clock inputs ranging from 8 kHz to 644.53 MHz and
generates two equal frequency, low jitter clock outputs ranging from 8 kHz to 644.53 MHz. For ease of use, the
Si5315 is pin controlled to enable simple device configuration of frequency plans, PLL loop bandwidth, and input
clock selection. The DSPLL locks to one of two input reference clocks and provides over 200 frequency
translations to synchronize output clocks for Ethernet, SONET/SDH, and PDH line cards. The Si5315 implements
internal state machines to control hitless switching between input clocks and holdover. Status alarms, loss of signal
(LOS) and loss of lock (LOL) are provided on output pins to indicate a change in device status.
This device is designed for systems with line cards that are synchronized to a redundant, centralized telecom or
Ethernet backplane. The Si5315 synchronizes to backplane clocks and generates a multiplied, jitter attenuated
Ethernet/SONET/SDH clock or PDH clock. A typical system application is shown in Figure 6. The Si5315
translates a 19.44 MHz clock from the telecom backplane to an Ethernet or SONET/SDH clock frequency to the
PHY and filters the jitter to ensure compliance with related ITU-T and Telcordia standards.
Figure 6. Typical Si5315 Application
Telecom
or
Ethernet
Backplane
Wander Filtering
Hitless Switching
Holdover
Network Sync
PLL
8 kHz
19.44 MHz
25 MHz
Network
Synchronization
A
B
BITS A
Line Recovered Timing
BITS B
10G LA N / WAN
SyncE Line Card
Line
Recovered
Clocks
155.52 MHz
156.25 MHz
161.1328125 MHz
10GbE
PHY
Si5315
Tx Timing Path
Rx Timing Path
8 kHz
19.44 MHz
25 MHz
Jitter Filtering
Hitless Switching
Frequency Translation
10GbE
PHY
A
B
Redundant
Timing C ards
Multi-Port
SONET / SDH / PDH Line Card
Line
Recovered
Clocks
77.76 / 155.52 MHz
1.544 / 2.048 MHz
OC-3 / 12
Si5315
Tx Timing Path
Rx Timing Path
8 kHz
19.44 MHz
25 MHz
Jitter Filtering
Hitless Switching
Frequency Translation
A
B
T1 / E1
Si5315
16 Rev. 1.0
4. Functional Description
Figure 7. Detailed Block Diagram
4.1. Overview
The Si5315 is a jitter-attenuating precision clock multiplier for Synchronous Ethernet, SONET/SDH, and PDH
(T1/E1) applications. The Si5315 accepts dual clock inputs ranging from 8 kHz to 644.53 MHz and generates two
frequency-multiplied clock outputs ranging from 8 kHz to 644.53 MHz. The two input clocks are at the same
frequency and the two output clocks are at the same frequency. The input clock frequency and clock multiplication
ratio are selectable from a look up table of popular SyncE and T1/E1 rates.
The Si5315 is based on Silicon Laboratories' 3rd-generation DSPLL® technology, which provides any-frequency
synthesis and jitter attenuation in a highly integrated PLL solution that eliminates the need for external VCXO and
loop filter components. The Si5315 PLL loop bandwidth is selectable via the BWSEL[1:0] pins and supports a
range from 60 to 8.4 kHz.
The Si5315 supports hitless switching between the two input clocks in compliance with ITU-T G.8262 and Telcordia
GR-253-CORE and GR-1244-CORE. This feature greatly minimizes the propagation of phase transients to the
clock outputs during an input clock transition (<200 ps typ). Manual and automatic revertive and non-revertive input
clock switching options are available via the AUTOSEL input pin. The Si5315 monitors both input clocks for loss-of-
signal and provides a LOS alarm when it detects missing pulses on either input clock. The device monitors the lock
status of the PLL. The lock detect algorithm works by continuously monitoring the phase of the input clock in
relation to the phase of the feedback clock. The Si5315 provides a holdover capability that allows the device to
continue generation of a stable output clock when the selected input reference is lost.
The Si5315 has two differential clock outputs. The signal format of the clock outputs is programmable to support
LVPECL, LVDS, CML, or CMOS loads. The second clock output can be powered down to minimize power
consumption. For system-level debugging, a bypass mode is available which drives the output clock directly from
the input clock, bypassing the internal DSPLL. The device operates from a single 1.8, 2.5, or 3.3 V supply.
Si5315
Rev. 1.0 17
4.2. PLL Performance
The Si5315 provides extremely low jitter generation, a well-controlled jitter transfer function, and high jitter
tolerance due to the high level of integration.
4.2.1. Jitter Generation
Jitter generation is defined as the amount of jitter produced at the output of the device with a jitter free input clock.
Generated jitter arises from sources within the VCO and other PLL components. Jitter generation is a function of
the PLL bandwidth setting. Higher loop bandwidth settings may result in lower jitter generation, but may result in
less attenuation of jitter that might be present on the input clock signal.
4.2.2. Jitter Transfer
Jitter transfer is defined as the ratio of output signal jitter to input signal jitter for a specified jitter frequency. The
jitter transfer characteristic determines the amount of input clock jitter that passes to the outputs. The DSPLL
technology used in the Si5315 provides tightly controlled jitter transfer curves because the PLL gain parameters
are determined largely by digital circuits which do not vary over supply voltage, process, and temperature. In a
system application, a well-controlled transfer curve minimizes the output clock jitter variation from board to board
and provides more consistent system level jitter performance.
The jitter transfer characteristic is a function of the loop bandwidth setting. Lower bandwidth settings result in more
jitter attenuation of the incoming clock, but may result in higher jitter generation. Figure 8 shows the jitter transfer
curve mask.
Figure 8. PLL Jitter Transfer Mask/Template
Jitter
Transfer
0 dB
BW fJitter
Peaking
–20 dB/dec.
Jitter Out
Jitter In
Si5315
18 Rev. 1.0
4.2.3. Jitter Tolerance
Jitter tolerance is defined as the maximum peak-to-peak sinusoidal jitter that can be present on the incoming clock
before the DSPLL loses lock. The tolerance is a function of the jitter frequency, because tolerance improves for
lower input jitter frequency.
The jitter tolerance of the DSPLL is a function of the loop bandwidth setting. Figure 9 shows the general shape of
the jitter tolerance curve versus input jitter frequency. For jitter frequencies above the loop bandwidth, the tolerance
is a constant value Aj0. Beginning at the PLL bandwidth, the tolerance increases at a rate of 20 dB/decade for
lower input jitter frequencies.
Figure 9. Jitter Tolerance Mask/Template
The equation for the high frequency jitter tolerance can be expressed as a function of the PLL loop bandwidth
(i.e., BW):
For example, the jitter tolerance when fin = 19.44 MHz, fout = 161.13 MHz and the loop bandwidth (BW) is 113 Hz:
4.2.4. Jitter Attenuation Performance
The Internal VCO uses the reference clock on the XA/XB pins as its reference for jitter attenuation. The XA/XB pins
support either a crystal input or an input buffer single-ended or differential clock input, such that an external
oscillator can become the reference source. In either case, the device accepts a wide margin in absolute frequency
of the reference input. (See 5.5. "Holdover Mode" on page 32.) In holdover, the Si5315's output clock stability
matches the reference supplied on the XA/XB pins. The external crystal or reference clock must be selected based
on the stability requirements of the application if holdover is a key requirement.
However, care must be exercised in certain areas for optimum performance. For examples of connections to the
XA/XB pins, refer to 7. "Crystal/Reference Clock Input" on page 38.
Input
Jitter
Amplitude
Aj0
–20 dB/dec.
fJitter In
Excessive Input Jitter Range
BW/100 BW/10 BW
Aj0
5000
BW
------------- ns pk-pk=
Aj0
5000
113
-------------44.24 ns pk-pk==
Si5315
Rev. 1.0 19
5. Frequency Plan Tables
For ease of use, the Si5315 is pin controlled to enable simple device configuration of the frequency plan and PLL
loop bandwidth via a predefined look up table. The DSPLL has been optimized for each frequency multiplication
and PLL loop bandwidth provided in Table 9 on page 20.
Many of the control inputs are three levels: High, Low, and Medium. High and Low are standard voltage levels
determined by the supply voltage: VDD and Ground. If the input pin is left floating, it is driven to nominally half of
VDD. Effectively, this creates three logic levels for these controls. See 1.2. "Three-Level (3L) Input Pins (With
External Resistors)" on page 12 and 8. "Power Supply Filtering" on page 41 for additional information.
5.1. Frequency Multiplication Plan
The input to output clock multiplication is set by the 3-level FRQSEL[3:0] pins. The device provides a wide range of
commonly used SyncE, SONET/SDH, and PDH frequency translations. The CKIN1 and CKIN2 inputs must be the
same frequency as specified in Table 9. Both CKOUT1 and CKOUT2 outputs are at the same frequency.
5.1.1. PLL Loop Bandwidth Plan
The Si5315's loop bandwidth ranges from 60 Hz to 8.4 kHz. For each frequency multiplication, its corresponding
loop bandwidth is provided in a simple look up table. (See Table 9 on page 20.) The loop bandwidth (BW) is
digitally programmable using the 3-level BWSEL [1:0] and FRQTBL input pins.
Si5315
20 Rev. 1.0
Table 9. Look Up Tables for Clock Multiplication and Loop Bandwidth Settings
Plan # fIN
(MHz)
fOUT
(MHz)
FRQTBL FRQSEL
[3:0] Loop Bandwidth Selection (Hz), BWSEL[1:0]
LM LH ML MM MH HL HH
1 0.008 0.008 L LLLL 257 60 — — — — —
2 0.008 1.544 L LLLM 257 60 — — — — —
3 0.008 2.048 L LLLH 257 60 — — — — —
4 0.008 8.192 L LLML 257 60 — — — — —
5 0.008 19.44 L LLMM 257 60 — — — — —
6 0.008 25 L LLMH 257 60 — — — — —
7 0.008 32.768 L LLHL 257 60 — — — — —
8 0.008 34.368 M LLLL 257 60 — — — — —
9 0.008 38.88 M LLLM 257 60 — — — — —
10 0.008 44.736 M LLLH 257 60 — — — — —
11 0.008 51.84 M LLML 257 60 — — — — —
120.00865.536MLLMM 257——————
13 0.008 77.76 M LLMH 257 60 — — — — —
14 0.008 125 M LLHL 257 60 — — — — —
15 0.008 155.52 H LLLL 257 60 — — — — —
16 0.008 156.25 H LLLM 257 60 — — — — —
17 0.008 311.04 H LLLH 257 60 — — — — —
18 0.008 312.5 H LLML 257 60 — — — — —
19 0.008 622.08 H LLMM 257 60 — — — — —
20 1.544 0.008 L LLHM 257 60 — — — — —
21 1.544 1.544 L LLHH — — 6047 1451 359 179 89
22 1.544 2.048 L LMLL 257 60 — — — — —
23 1.544 8.192 L LMLM 257 60 — — — — —
24 1.544 19.44 L LMLH 257 60 — — — — —
Notes:
1. FIN and FOUT frequency values may be rounded off. For exact multiplication ratios, please contact Silicon Labs.
2. Si5315A supports all frequency plans.
3. Si5315B supports output frequency plans up to 125 MHz.
Si5315
Rev. 1.0 21
25 1.544 25 L LMML 257 60 — — — — —
26 1.544 32.768 L LMMM 257 60 — — — — —
27 1.544 34.368 M LLHM 257 60 — — — — —
28 1.544 38.88 M LLHH 257 60 — — — — —
29 1.544 44.736 M LMLL 257 60 — — — — —
30 1.544 51.84 M LMLM 257 60 — — — — —
311.54465.536MLMLH 257——————
32 1.544 77.76 M LMML 257 60 — — — — —
33 1.544 125 M LMMM 257 60 — — — — —
34 1.544 155.52 H LLMH 257 60 — — — — —
35 1.544 156.25 H LLHL 257 60 — — — — —
36 1.544 311.04 H LLHM 257 60 — — — — —
37 1.544 312.5 H LLHH 257 60 — — — — —
38 1.544 622.08 H LMLL 257 60 — — — — —
39 2.048 0.008 L LMMH 2089 485 240 59 — — —
40 2.048 1.544 L LMHL 1037 242 119 — — — —
41 2.048 2.048 L LMHM — — 3949 959 238 118 59
42 2.048 8.192 L LMHH — — 3949 959 238 118 59
43 2.048 19.44 L LHLL — — 3946 958 238 118 59
44 2.048 25 L LHLM 2087 485 240 — — — —
45 2.048 32.768 L LHLH — — 3947 959 238 118 59
46 2.048 34.368 M LMMH — 8163 3935 958 238 118 —
47 2.048 38.88 M LMHL — — 3946 958 238 118 59
48 2.048 44.736 M LMHM — 3983 1944 477 118 59 —
49 2.048 51.84 M LMHH — — 3946 958 238 118 59
Table 9. Look Up Tables for Clock Multiplication and Loop Bandwidth Settings (Continued)
Plan # fIN
(MHz)
fOUT
(MHz)
FRQTBL FRQSEL
[3:0] Loop Bandwidth Selection (Hz), BWSEL[1:0]
LM LH ML MM MH HL HH
Notes:
1. FIN and FOUT frequency values may be rounded off. For exact multiplication ratios, please contact Silicon Labs.
2. Si5315A supports all frequency plans.
3. Si5315B supports output frequency plans up to 125 MHz.
Si5315
22 Rev. 1.0
50 2.048 65.536 M LHLL — 8185 3940 958 238 118 —
51 2.048 77.76 M LHLM — — 3946 958 238 118 59
52 2.048 125 M LHLH 1037 242 119 — — — —
53 2.048 155.52 H LMLM — — 3946 958 238 118 59
54 2.048 156.25 H LMLH 1037 242 119 — — — —
55 2.048 311.04 H LMML — — 3946 958 238 118 59
56 2.048 312.5 H LMMM 1037 242 119 — — — —
57 2.048 622.08 H LMMH — — 3946 958 238 118 59
58 8.192 0.008 L LHML 2089 485 240 59 — — —
59 8.192 1.544 L LHMM 1037 242 119 — — — —
60 8.192 2.048 L LHMH — — 6434 1541 381 190 95
61 8.192 8.192 L LHHL — — 6434 1541 381 190 95
62 8.192 19.44 L LHHM — — 3946 958 238 118 59
63 8.192 25 L LHHH 2087 485 240 — — — —
64 8.192 32.768 L MLLL — — 6431 1541 381 190 95
65 8.192 34.368 M LHML — 8163 3935 958 238 118 —
66 8.192 38.88 M LHMM — — 3946 958 238 118 59
67 8.192 44.736 M LHMH — 3983 1944 477 118 59 —
68 8.192 51.84 M LHHL — — 3946 958 238 118 59
69 8.192 65.536 M LHHM — — 6411 1539 381 190 95
70 8.192 77.76 M LHHH — — 3946 958 238 118 59
71 8.192 125 M MLLL 1037 242 119 — — — —
72 19.44 0.008 L MLLM 1759 409 202 — — — —
73 19.44 1.544 L MLLH — 2779 1362 335 83 — —
74 19.44 2.048 L MLML — 3348 1638 402 100 — —
Table 9. Look Up Tables for Clock Multiplication and Loop Bandwidth Settings (Continued)
Plan # fIN
(MHz)
fOUT
(MHz)
FRQTBL FRQSEL
[3:0] Loop Bandwidth Selection (Hz), BWSEL[1:0]
LM LH ML MM MH HL HH
Notes:
1. FIN and FOUT frequency values may be rounded off. For exact multiplication ratios, please contact Silicon Labs.
2. Si5315A supports all frequency plans.
3. Si5315B supports output frequency plans up to 125 MHz.
Si5315
Rev. 1.0 23
75 19.44 8.192 L MLMM — 3348 1638 402 100 — —
76 19.44 19.44 L MLMH — — 7706 1832 452 225 112
77 19.44 25 L MLHL — 2778 1362 335 83 — —
78 19.44 32.768 L MLHM — — 5022 1215 301 150 75
79 19.44 34.368 M MLLM — 5662 2749 672 167 83 —
80 19.44 38.88 M MLLH — — 7703 1832 452 225 112
81 19.44 44.736 M MLML — 5653 2747 672 167 83 —
82 19.44 51.84 M MLMM — — 7696 1832 452 225 112
83 19.44 65.536 M MLMH 2618 607 300 74 — — —
84 19.44 77.76 M MLHL — — 7696 1832 452 225 112
85 19.44 125 M MLHM 3960 913 450 111 — — —
86 19.44 155.52 H LMHL — — 7696 1832 452 225 112
87 19.44 156.25 H LMHM 6003 1373 677 167 — — —
88 19.44 161.1328 H LMHH 484 113 — — — — —
89 19.44 311.04 H LHLL — — 7696 1832 452 225 112
90 19.44 312.5 H LHLM 6003 1373 677 167 — — —
91 19.44 622.08 H LHLH — — 7696 1832 452 225 112
9219.44644.5313HLHML 103——————
93 25 0.008 L MLHH — — 7045 1681 415 207 103
94 25 1.544 L MMLL 6741 1529 753 186 — — —
95 25 2.048 L MMLM 1299 303 150 — — — —
96 25 8.192 L MMLH 6737 1529 753 186 — — —
97 25 19.44 L MMML — — 6551 1568 387 193 96
98 25 25 L MMMM — — 7615 1812 447 223 111
99 25 32.768 L MMMH 6737 1529 753 186 — — —
Table 9. Look Up Tables for Clock Multiplication and Loop Bandwidth Settings (Continued)
Plan # fIN
(MHz)
fOUT
(MHz)
FRQTBL FRQSEL
[3:0] Loop Bandwidth Selection (Hz), BWSEL[1:0]
LM LH ML MM MH HL HH
Notes:
1. FIN and FOUT frequency values may be rounded off. For exact multiplication ratios, please contact Silicon Labs.
2. Si5315A supports all frequency plans.
3. Si5315B supports output frequency plans up to 125 MHz.
Si5315
24 Rev. 1.0
100 25 34.368 M MLHH 6722 1528 753 186 — — —
101 25 38.88 M MMLL 6729 1529 753 186 — — —
102 25 44.736 M MMLM 1298 303 150 — — — —
103 25 50 H HMLH — — 7880 1880 470 230 120
104 25 51.84 M MMLH — 7988 3846 936 232 116 —
105 25 65.536 M MMML 1298 303 150 — — — —
106 25 77.76 M MMMM 6706 1528 753 186 — — —
107 25 125 M MMMH — — 7606 1811 447 223 111
108 25 155.52 H LHMM 1298 303 150 — — — —
109 25 156.25 H LHMH — — 7606 1811 447 223 111
110 25 161.1328 H LHHL — — 6106 1468 363 181 90
111 25 311.04 H LHHM 1298 303 150 — — — —
112 25 312.5 H LHHH — — 7606 1811 447 223 111
113 25 622.08 H MLLL 1298 303 150 — — — —
114 25 644.5313 H MLLM — — 6106 1468 363 181 90
115 32.768 0.008 L MMHL 2089 485 240 59 — — —
116 32.768 1.544 L MMHM 1037 242 119 — — — —
117 32.768 2.048 L MMHH — — 7187 1714 423 211 105
118 32.768 8.192 L MHLL — — 7632 1816 448 223 111
119 32.768 19.44 L MHLM — — 3946 958 238 118 59
120 32.768 25 L MHLH 2087 485 240 — — — —
121 32.768 32.768 L MHML — — 7632 1816 448 223 111
122 32.768 34.368 M MMHL — 8163 3935 958 238 118 —
123 32.768 38.88 M MMHM — — — 958 238 118 59
124 32.768 44.736 M MMHH — 3983 1944 477 118 59 —
Table 9. Look Up Tables for Clock Multiplication and Loop Bandwidth Settings (Continued)
Plan # fIN
(MHz)
fOUT
(MHz)
FRQTBL FRQSEL
[3:0] Loop Bandwidth Selection (Hz), BWSEL[1:0]
LM LH ML MM MH HL HH
Notes:
1. FIN and FOUT frequency values may be rounded off. For exact multiplication ratios, please contact Silicon Labs.
2. Si5315A supports all frequency plans.
3. Si5315B supports output frequency plans up to 125 MHz.
Si5315
Rev. 1.0 25
125 32.768 51.84 M MHLL — — 3946 958 238 118 59
126 32.768 65.536 M MHLM — — 7604 1815 448 223 111
127 32.768 77.76 M MHLH — — 3946 958 238 118 59
128 32.768 125 M MHML 1037 242 119 — — — —
129 50 25 L HHHH — — 7880 1880 470 230 120
130 50 50 M HMLH — — 7770 1850 466 230 110
131 77.76 0.008 L MHMM 2089 485 240 59 — — —
132 77.76 1.544 L MHMH — 2779 1362 335 83 — —
133 77.76 2.048 L MHHL — — 6804 1626 402 200 100
134 77.76 19.44 L MHHM — — 7905 1879 464 231 115
135 77.76 25 L MHHH — 2778 1362 335 83 — —
136 77.76 34.368 M MHMM — — 6798 1626 402 200 100
137 77.76 38.88 M MHMH — — 7905 1879 464 231 115
138 77.76 44.736 M MHHL — — 6756 1623 402 200 100
139 77.76 51.84 M MHHM — — 7905 1879 464 231 115
140 77.76 65.536 M MHHH — 2461 1208 298 74 — —
141 77.76 77.76 M HLLL — — 7905 1879 464 231 115
142 77.76 125 M HLLM 5336 1220 602 148 — — —
143 77.76 155.52 H MLLH — — 7905 1879 464 231 115
144 77.76 156.25 H MLML 6003 1373 677 167 — — —
145 77.76 161.1328 H MLMM 484 113 — — — — —
146 77.76 311.04 H MLMH — — 7905 1879 464 231 115
147 77.76 312.5 H MLHL 6003 1373 677 167 — — —
148 77.76 622.08 H MLHM — — 7905 1879 464 231 115
149 77.76 644.5313 H MLHH 484 113 — — — — —
Table 9. Look Up Tables for Clock Multiplication and Loop Bandwidth Settings (Continued)
Plan # fIN
(MHz)
fOUT
(MHz)
FRQTBL FRQSEL
[3:0] Loop Bandwidth Selection (Hz), BWSEL[1:0]
LM LH ML MM MH HL HH
Notes:
1. FIN and FOUT frequency values may be rounded off. For exact multiplication ratios, please contact Silicon Labs.
2. Si5315A supports all frequency plans.
3. Si5315B supports output frequency plans up to 125 MHz.
Si5315
26 Rev. 1.0
150 125 0.008 L HLLL — — 7045 1681 415 207 103
151 125 1.544 L HLLM 6741 1529 753 186 — — —
152 125 2.048 L HLLH 1299 303 150 — — — —
153 125 19.44 L HLML — — 6551 1568 387 193 96
154 125 25 L HLMM — — 7862 1870 462 230 115
155 125 34.368 M HLLH 6722 1528 753 186 — — —
156 125 38.88 M HLML 6729 1529 753 186 — — —
157 125 44.736 M HLMM 1298 303 150 — — — —
158 125 51.84 M HLMH — 7988 3846 936 232 116 —
159 125 65.536 M HLHL 1298 303 150 — — — —
160 125 77.76 M HLHM 6706 1528 753 186 — — —
161 125 125 M HLHH — — 7862 1870 462 230 115
162 125 155.52 H MMLL 1298 303 150 — — — —
163 125 156.25 H MMLM — — 7862 1870 462 230 115
164 125 161.1328 H MMLH — — 7718 1839 454 226 113
165 125 311.04 H MMML 1298 303 150 — — — —
166 125 312.5 H MMMM — — 7862 1870 462 230 115
167 125 622.08 H MMMH 1298 303 150 — — — —
168 125 644.5313 H MMHL — — 7718 1839 454 226 113
169 155.52 0.008 L HLMH 2089 485 240 59 — — —
170 155.52 1.544 L HLHL — 2779 1362 335 83 — —
171 155.52 2.048 L HLHM — — 7606 1809 447 223 111
172 155.52 19.44 L HLHH — — 7905 1879 464 231 115
173 155.52 25 L HMLL — 2778 1362 335 83 — —
174 155.52 77.76 H MMHM — — 7905 1879 464 231 115
Table 9. Look Up Tables for Clock Multiplication and Loop Bandwidth Settings (Continued)
Plan # fIN
(MHz)
fOUT
(MHz)
FRQTBL FRQSEL
[3:0] Loop Bandwidth Selection (Hz), BWSEL[1:0]
LM LH ML MM MH HL HH
Notes:
1. FIN and FOUT frequency values may be rounded off. For exact multiplication ratios, please contact Silicon Labs.
2. Si5315A supports all frequency plans.
3. Si5315B supports output frequency plans up to 125 MHz.
Si5315
Rev. 1.0 27
175 155.52 125 H MMHH 5336 1220 602 148 — — —
176 155.52 155.52 H MHLL — — 7905 1879 464 231 115
177 155.52 156.25 H MHLM 6003 1373 677 167 — — —
178 155.52 161.1328 H MHLH 484 113 — — — — —
179 155.52 311.04 H MHML — — 7905 1879 464 231 115
180 155.52 312.5 H MHMM 6003 1373 677 167 — — —
181 155.52 622.08 H MHMH — — 7905 1879 464 231 115
182 155.52 644.5313 H MHHL 828 193 95 — — — —
183 156.25 0.008 L HMLM — — 6123 1469 363 181 90
184 156.25 1.544 L HMLH 1627 379 187 — — — —
185 156.25 2.048 L HMML 322 75 — — — — —
186 156.25 19.44 L HMMM — — 4852 1172 290 145 72
187 156.25 25 L HMMH — — 7835 1864 460 229 114
188 156.25 77.76 H MHHM 1625 379 187 — — — —
189 156.25 125 H MHHH — — 7835 1864 460 229 114
190 156.25 155.52 H HLLL 322 75 — — — — —
191 156.25 156.25 H HLLM — — 7835 1864 460 229 114
192 156.25 161.1328 H HLLH — — 7718 1839 454 226 113
193 156.25 311.04 H HLML 322 75 — — — — —
194 156.25 312.5 H HLMM — — 7835 1864 460 229 114
195 156.25 622.08 H HLMH 322 75 — — — — —
196 156.25 644.5313 H HLHL — — 7718 1839 454 226 113
197161.13280.008LHMHL 225——————
198161.13281.544LHMHM 151——————
199161.13282.048LHMHH 225——————
Table 9. Look Up Tables for Clock Multiplication and Loop Bandwidth Settings (Continued)
Plan # fIN
(MHz)
fOUT
(MHz)
FRQTBL FRQSEL
[3:0] Loop Bandwidth Selection (Hz), BWSEL[1:0]
LM LH ML MM MH HL HH
Notes:
1. FIN and FOUT frequency values may be rounded off. For exact multiplication ratios, please contact Silicon Labs.
2. Si5315A supports all frequency plans.
3. Si5315B supports output frequency plans up to 125 MHz.
Si5315
28 Rev. 1.0
200 161.1328 19.44 L HHLL 679 159 78 — — — —
201 161.1328 25 L HHLM 678 159 78 — — — —
202 161.1328 77.76 H HLHM 678 159 78 — — — —
203 161.1328 125 H HLHH — — 7179 1721 426 212 106
204 161.1328 156.25 H HMLL — — 7019 1683 416 207 103
205 161.1328 161.1328 H HMLM 332 78 — — — — —
206 161.1328 312.5 H HMML 3873 892 440 109 — — —
207161.1328644.5313HHMMM 151——————
208 644.5313 0.008 L HHLH 880 206 101 — — — —
209 644.5313 1.544 L HHML 413 96 — — — — —
210 644.5313 2.048 L HHMM — 3373 1650 405 101 — —
211 644.5313 19.44 L HHMH — 3641 1779 437 108 — —
212 644.5313 25 L HHHL — — 7886 1875 463 231 115
213 644.5313 77.76 H HMMH 828 193 95 — — — —
214 644.5313 125 H HMHL — — 7732 1840 454 226 113
215 644.5313 155.52 H HMHM 828 193 95 — — — —
216 644.5313 156.25 H HMHH — — 7732 1840 454 226 113
217 644.5313 161.1328 H HHLL — — 7895 1880 464 231 115
218 644.5313 311.04 H HHLM 828 193 95 — — — —
219644.5313312.5HHHLH 206——————
220644.5313622.08HHHML 120——————
221 644.5313 644.5313 H HHMM — — 7895 1880 464 231 115
Table 9. Look Up Tables for Clock Multiplication and Loop Bandwidth Settings (Continued)
Plan # fIN
(MHz)
fOUT
(MHz)
FRQTBL FRQSEL
[3:0] Loop Bandwidth Selection (Hz), BWSEL[1:0]
LM LH ML MM MH HL HH
Notes:
1. FIN and FOUT frequency values may be rounded off. For exact multiplication ratios, please contact Silicon Labs.
2. Si5315A supports all frequency plans.
3. Si5315B supports output frequency plans up to 125 MHz.
Si5315
Rev. 1.0 29
5.2. PLL Self-Calibration
An internal self-calibration (ICAL) is performed before operation to optimize loop parameters and jitter
performance. While the self-calibration is being performed, the DSPLL is being internally controlled by the self-
calibration state machine. The LOL alarm will be active during ICAL. The self-calibration time tLOCKHW is given in
Table 3, “AC Characteristics”.
Any of the following events will trigger a self-calibration:
Power-on-reset (POR)
Release of the external reset pin RST (transition of RST from 0 to 1)
Change in FRQSEL, FRQTBL, BWSEL, or XTAL/CLOCK pins
Internal DSPLL registers out-of-range, indicating the need to relock the DSPLL
In any of the above cases, an internal self-calibration will be initiated if a valid input clock exists (no input alarm)
and is selected as the active clock at that time. The external crystal or reference clock must also be present for the
self-calibration to begin. If valid clocks are not present, the self-calibration state machine will wait until they appear,
at which time the calibration will start. An output clock will be active while waiting for a valid input clock. The output
clock frequency is based on the VCO range determine by FRQSEL and FRQTBL settings. This output clock will
vary by ±20%. If no output clock is desired prior to an ICAL, then the SFOUT pins should be kept at LM for
1.2 seconds until the output clock is stable.
After a successful self-calibration has been performed with a valid input clock, no subsequent self calibrations are
performed unless one of the above conditions are met. If the input clock is lost following self-calibration, the device
enters holdover mode. When the input clock returns, the device relocks to the input clock without performing a self-
calibration.
5.2.1. Input Clock Stability during Internal Self-Calibration
An exit from reset must occur when the selected CKINn clock is stable in frequency with a frequency value that is
within the device operating range. The other CKINs must also either be stable in frequency or squelched during a
reset.
5.2.2. Self-Calibration ca used by Changes in Input Frequency
If the selected CKINn varies by 500 ppm or more in frequency since the last calibration, the device may initiate a
self-calibration.
5.2.3. Device Reset
Upon powerup, the device internally executes a power-on-reset (POR) which resets the internal device logic. The
pin RST can also be used to initiate a reset. The device stays in this state until a valid CKINn is present, when it
then performs a PLL Self-Calibration (See 5.2. "PLL Self-Calibration”).
5.2.4. Recommended Reset Guidelines
Follow the recommended RESET guidelines in Table 10 when reset should be applied to a device.
Table 10. Si5315 Pins and Reset
Pin # Si5315 Pin Name Must Reset after Changing
2FRQTBL Yes
11 XTAL/CLOCK Yes
22 BWSEL0 Yes
23 BWSEL1 Yes
24 FRQSEL0 Yes
25 FRQSEL1 Yes
26 FRQSEL2 Yes
27 FRQSEL3 Yes
Si5315
30 Rev. 1.0
5.2.5. Hitless Switching with Phase Build-Out
Silicon Laboratories switching technology performs "phase build-out" to minimize the propagation of phase
transients to the clock outputs during input clock switching. All switching between input clocks occurs within the
input multiplexor and phase detector circuitry. The phase detector circuitry continually monitors the phase
difference between each input clock and the DSPLL output clock, fOSC. The phase detector circuitry can lock to a
clock signal at a specified phase offset relative to fOSC so that the phase offset is maintained by the PLL circuitry.
At the time a clock switch occurs, the phase detector circuitry knows both the input-to-output phase relationship for
the original input clock and for the new input clock. The phase detector circuitry locks to the new input clock at the
new clock's phase offset so that the phase of the output clock is not disturbed. The phase difference between the
two input clocks is absorbed in the phase detector's offset value, rather than being propagated to the clock output.
The switching technology virtually eliminates the output clock phase transients traditionally associated with clock
rearrangement (input clock switching). The Maximum Time Interval Error (MTIE) and maximum slope for clock
output phase transients during clock switching are given in (Table 3, “AC Characteristics”). These values fall
significantly below the limits specified in the ITU-T G.8262, Telcordia GR-1244-CORE, and GR-253-CORE
requirements.
5.3. Input Clock Control
This section describes the clock selection capabilities (manual input selection, automatic input selection, hitless
switching, and revertive switching). When switching between two clocks, LOL may temporarily go high if the two
clocks differ in frequency by more than 100 ppm.
5.3.1. Manual Clock Selection
Manual control of input clock selection is chosen via the CS_CA pin according to Table 11 and Table 12.
5.3.2. Automa ti c Clo c k Sel ec ti on
The AUTOSEL input pin sets the input clock selection mode as shown in Table 11. Automatic switching is either
revertive or non-revertive. Setting AUTOSEL to M or H, changes the CS_CA pin to an output pin that indicates the
state of the automatic clock selection.
Table 11. Automatic/Manual Clock Selection
AUTOSEL Clock Selection Mode
L Manual
M Automatic non-revertive
H Automatic revertive
Table 12. Manual Input Clock Selection, AUTOSEL = L
CS_CA Si5315
AUTOSEL = L
0CKIN1
1CKIN2
Table 13. Clock Active Indicators, AUTOSEL = M or H
CS_CA Active Cloc k
0CKIN1
1CKIN2
Si5315
Rev. 1.0 31
The prioritization of clock inputs for automatic switching is shown in Table 14. This priority is hardwired in the
devices.
At power-on or reset, the valid CKINn with the highest priority (1 being the highest priority) is automatically
selected. If no valid CKINn is available, the device suppresses the output clocks and waits for a valid CKINn signal.
If the currently selected CKINn goes into an alarm state, the next valid CKINn in priority order is selected. If no valid
CKINn is available, the device enters holdover.
Operation in revertive and non- revertive is different when a signal becomes valid:
Revertive (AUTOSEL = H): The device constantly monitors all CKINn. If a CKINn with a higher priority than
the current active CKINn becomes valid, the active CKINn is changed to the
CKINn with the highest priority.
Non-revertive (AUTOSEL = M): The active clock does not change until there is an alarm on the active clock. The
device will then select the highest priority CKINn that is valid. Once in holdover,
the device will switch to the first CKINn that becomes valid.
5.4. Alarms
Summary alarms are available to indicate the overall status of the input signals. Alarm outputs stay high until all the
alarm conditions for that alarm output are cleared.
5.4.1. Loss-of-Signal
The device has loss-of-signal circuitry that continuously monitors CKINn for missing pulses. The LOS circuitry
generates an internal LOSn_INT output signal that is processed with other alarms to generate LOS1 and LOS2.
An LOS condition on CKIN1 causes the internal LOS1_INT alarm to become active. Similarly, an LOS condition on
CKINn causes the LOSn_INT alarm to become active. Once a LOSn_INT alarm is asserted on one of the input
clocks, it remains asserted until that input clock is validated over a designated time period. The time to clear
LOSn_INT after a valid input clock appears is listed in Table 3, “AC Characteristics”. If another error condition on
the same input clock is detected during the validation time then the alarm remains asserted and the validation time
starts over.
5.4.1.1. LOS Algorithm
The LOS circuitry divides down each input clock to produce an 8 kHz to 2 MHz signal. The LOS circuitry over
samples this divided down input clock using a 40 MHz clock to search for extended periods of time without input
clock transitions. If the LOS monitor detects twice the normal number of samples without a clock edge, a
LOSn_INT alarm is declared. Table 3, “AC Characteristics” gives the minimum and maximum amount of time for
the LOS monitor to trigger.
5.4.1.2. Lock Detect
The PLL lock detection algorithm indicates the lock status on the LOL output pin. The algorithm works by
continuously monitoring the phase of the input clock in relation to the phase of the feedback clock. If the time
between two consecutive phase cycle slips is greater than the retrigger time, the PLL is in lock. The LOL output
has a guaranteed minimum pulse width as shown in (Table 3, “AC Characteristics”). The LOL pin is also held in the
active state during an internal PLL calibration. The retrigger time is automatically set based on the PLL closed loop
bandwidth (See Table 15).
Table 14. Input Clock Priority for Auto Switching
Priority Input Clocks
1CKIN1
2CKIN2
3 Holdover
Si5315
32 Rev. 1.0
5.5. Holdover Mode
If an LOS condition exists on the selected input clock, the device enters holdover. In this mode, the device provides
a stable output frequency until the input clock returns and is validated. When the device enters holdover, the
internal oscillator is initially held to its last frequency value. Next, the internal oscillator slowly transitions to a
historical average frequency value that was taken over a time window of 6,711 ms in size that ended 26 ms before
the device entered holdover. This frequency value is taken from an internal memory location that keeps a record of
previous DSPLL frequency values. By using a historical average frequency, input clock phase and frequency
transients that may occur immediately preceding loss of clock or any event causing holdover do not affect the
holdover frequency. Also, noise related to input clock jitter or internal PLL jitter is minimized.
If a highly stable reference, such as an oven-controlled crystal oscillator, is supplied at XA/XB, an extremely stable
holdover can be achieved. If a crystal is supplied at the XA/XB port, the holdover stability will be limited by the
stability of the crystal; Table 3, “AC Characteristics” gives the specifications related to the holdover function.
5.5.1. Recovery from Holdover
When the input clock signal returns, the device transitions from holdover to the selected input clock. The device
performs hitless recovery from holdover. The clock transition from holdover to the returned input clock includes
"phase buildout" to absorb the phase difference between the holdover clock phase and the input clock phase. See
Table 3, “AC Characteristics” for specifications.
5.6. PLL Bypass Mode
The Si5315 supports a PLL bypass mode in which the selected input clock is fed directly to both enabled output
buffers, bypassing the DSPLL. Internally, the bypass path is implemented with high-speed differential signaling;
however, this path is not a low jitter path and will see significantly higher jitter on CKOUT. In PLL bypass mode, the
input and output clocks will be at the same frequency. PLL bypass mode is useful in a laboratory environment to
measure system performance with and without the jitter attenuation provided by the DSPLL. The DSBL2_BY pin is
used to select the PLL Bypass Mode according to Table 16. Bypass mode is not supported for CMOS clock outputs
(SFOUT = LH).
Table 15. Lock Detect Retrigger Time
PLL Bandwidth Setting (BW) Retrigger Time (ms)
60–120 Hz 53
120–240 Hz 26.5
240–480 Hz 13.3
480–960 Hz 6.6
960–1920 Hz 3.3
1920–3840 Hz 1.66
3840–7680 Hz 0.833
Table 16. DSBL2/BYPASS Pin Settings
DSBL2/BYPASS Function
L CKOUT2 Enabled
M CKOUT2 Disabled
H PLL Bypass Mode w/ CKOUT2 Enabled
Si5315
Rev. 1.0 33
Figure 10. Bypass Signal
DSPLL®
DBL2_BY
Crystal or
Reference Clock
SFOUT[1:0]
CKOUT2+
CKOUT2–
CKIN1+
CKIN1– CKOUT1+
CKOUT1–
CKIN2+
CKIN2–
VDD (1.8, 2.5, or 3.3 V)
GND
2
2
0
1
Xtal/Clock
XA
XB
fOSC
2
2
0
1
0
1
f3
Frequency
Control
Bandwidth
Control
Signal Detect
Control
LOS1
LOL
CS/CA
BWSEL[1:0]
AUTOSEL
FRQTBL
LOS2
FRQSEL[3:0]
RST
PLL Bypass
Si5315
34 Rev. 1.0
6. High-Speed I/O
6.1. Input Clock Buffers
The Si5315 provides differential inputs for the CKINn clock inputs. These inputs are internally biased to a common
mode voltage [see Table 2, “DC Characteristics”] and can be driven by either a single-ended or differential source.
Figure 11 through Figure 14 show typical interface circuits for LVPECL, CML, LVDS, or CMOS input clocks. Note
that the jitter generation improves for higher levels on CKINn (within the limits in Table 3, “AC Characteristics”).
AC coupling the input clocks is recommended because it removes any issue with common mode input voltages.
However, either ac or dc coupling is acceptable. Figures 11 and 12 show various examples of different input
termination arrangements. Unused inputs can be left unconnected.
Figure 11. Differential LVPECL Termination
Figure 12. Single-ended LVPECL Termination
40 k
C
C
±
CKIN _
CKIN +
VICM
300
130
130
3.3 V
82
82
Si5315
LVPECL
Driver
40 k
40 k
C
C
CKIN _
CKIN +
VICM
300
130
3.3 V
82
Si5315
Driver
40 k±
Si5315
Rev. 1.0 35
Figure 13. CML/LVDS Termination (1.8, 2.5, 3.3 V)
Figure 14. CMOS Termination (1.8, 2.5, 3.3 V)
40 k
C
C
±
CKIN _
CKIN +
VICM
300
100
Si5315
CML/
LVDS
Driver
40 k
VDD VDD VDD
CMOS Driver
R1
33 ohms
50 R2
See Table
R3
150 ohms
C1
100 nF
R4
150 ohms C2
100 nF
VICM
CKIN+
CKIN–
R5 40 kohm
R6 40 kohm
VDD R2 Notes
3.3 V 100 ohm Locate R1 near CMOS driver
2.5 V 49.9 ohm Locate other components near Si5317
1.8 V 14.7 ohm Recalculate resistor values for other drive strengths
Additional Notes:
1. Attenuation circuit limits overshoot and undershoot.
2. Not to be used with non-square wave input clocks.
Si5315
Si5315
36 Rev. 1.0
6.2. Output Clock Drivers
The Si5315 has a flexible output driver structure that can drive a variety of loads, including LVPECL, LVDS, CML,
and CMOS formats. The signal format is selected for both CKOUT1 and CKOUT2 outputs using the SFOUT [1:0]
pins. This modifies the output common mode and differential signal swing. See Table 2, “DC Characteristics” for
output driver specifications. The SFOUT [1:0] pins are three-level input pins, with the states designated as L
(ground), M (VDD/2), and H (VDD). Table 17 shows the signal formats based on the supply voltage and the type of
load being driven.
Figure 15. Typical Differential Output Circuit
Figure 16. Typical CMOS Output Circuit (Tie CKOUTn+ and CKOUTn– Together)
For the CMOS setting (SFOUT = LH), both output pins drive single-ended in-phase signals. The CKOUT+/- can be
externally shorted together for greater drive strength specified in Table 2, “DC Characteristics”.
Table 17. Output Signal Format Selection (SFOUT)
SFOUT[1:0] Signal Format
HL CML
HM LVDS
LH CMOS
LM Disabled
MH LVPECL
ML Low-swing LVDS
All Others Reserved
Si5315
Rcvr
100
Z0 = 50
Z0 = 50
CKOUTn
CMOS
Logic
CKOUTn
Optionally Tie CKOUTn
Outputs Together for Greater Strength
Si5315
Si5315
Rev. 1.0 37
Figure 17. Disable CKOUTn Structure
The SFOUT [1:0] pins can also be used to disable both outputs. Disabling the output puts the CKOUTn+ and
CKOUTn– pins in a high-impedance state relative to VDD (common mode tri-state) while the two outputs remain
connected to each other through a 200 on-chip resistance (differential impedance of 200 ). The maximum
amount of internal circuitry is powered down, minimizing power consumption and noise generation. Recovery from
the disable mode requires additional time as specified in Table 3, “AC Characteristics”.
SFOUT[1:0] = LM (Output Disable)
100 100
+
CKOUTn
Output from
DSPLL
Si5315
38 Rev. 1.0
7. Crystal/Reference Clock Input
The device can use an external crystal or external clock as a reference. If an external clock is used, it must be ac
coupled. With appropriate buffers, the same external reference clock can be applied to CKINn. Although the
reference clock input can be driven single ended (See Figure 18), the best performance is with a crystal or low
jitter, differential clock source. No external loading capacitors are required for normal crystal operation.
Figure 18. CMOS External Reference Circuit
Figure 19. Sinewave External Reference Clock Input Example
Figure 20. Differential External Reference Clock Input Example
3.3 V
CMOS buffer,
8 mA output current
3.3 V
130
150
150
XA 10 k
0.1
F
0.6 V
0.1
F
XB
Si5315
For 2.5 V operation, change 130 to 82 .
External Clock Source 50
0.01 F
1.2 V
0.6 V
10 pF
Si5315
10 k
XA
0 dBm into 50
0.01 FXB
0.1 µF
LVPECL, CML, etc.
0.01 F1.2 V
0.6 V
Si5315
XA
XB 10 k
100
0.01 F10 k
Si5315
Rev. 1.0 39
7.1. Crystal/Reference Clock Selection
The Si5315 requires either a low-jitter external oscillator or a low-cost fundamental mode crystal to be connected to
its XA/XB pins. This serves both as a jitter reference for jitter attenuation and as a reference oscillator for stability
during holdover. The frequency the reference is not directly related to either the input or the output clock
frequencies. The range of the reference frequency is from 37 to 41 MHz. For recommendations on the selection of
the reference frequency and a list of approved crystals, see the application note AN591 which can be downloaded
from www.silabs.com/timing/.
In holdover, the DSPLL remains locked to this external reference. Any changes in the frequency of this reference
when the DSPLL is in holdover will be tracked by the output of the device. Note that crystals can have temperature
sensitivities. Table 18 shows how the XTAL/CLOCK pin is used to select between a crystal and an external
oscillator.
Because the crystal is used as a jitter reference, rapid changes of the crystal temperature can temporarily disturb
the output phase and frequency. For example, it is recommended that the crystal not be placed close to a fan that
is being turned off and on. If a situation such as this is unavoidable, the crystal should be thermally isolated with an
insulating cover.
7.1.1. Reference Drift
During holdover, long-term and temperature related drift of the reference input result in a one-to-one drift of the
output frequency. That is, the stability of the any-frequency output is identical to the drift of the reference frequency.
This means that for the most demanding applications where the drift of a crystal is not acceptable, an external
temperature compensated or ovenized oscillator will be required. Drift is not an issue unless the part is in holdover.
Also, the initial accuracy of the reference oscillator (or crystal) is not relevant.
Table 18. XA/XB Reference Sources
XTAL/CLOCK Type
M 37–41 MHz external clock
L 40 MHz crystal
Si5315
40 Rev. 1.0
7.1.2. Reference Jitter
Jitter on the reference input has a roughly one-to-one transfer function to the output jitter over the bandwidth
ranging from 100 Hz up to 30 kHz. If a crystal is used on the XA/XB pins, the reference will have low jitter if a
suitable crystal is in use. If the XA/XB pins are connected to an external reference oscillator, the jitter of the
external reference oscillator may contribute significantly to the output jitter.
A typical reference input-to-output jitter transfer function is shown in Figure 21.
Figure 21. Typical XA/XB Reference Jitter Transfer Function
-30
-25
-20
-15
-10
-5
0
5
1 10 100 1000 10000 100000 1000000
Jitter Frequency (Hz)
Ji tte r T r an sfer XA/ X B Refer en ce to CKOUT
38.88 MHz XO, 38.88 MHz CKIN, 38.88 MHz CKOUT
Jitter Transfer (dB)
Si5315
Rev. 1.0 41
8. Power Supply Filtering
This device incorporates an on-chip voltage regulator with excellent PSRR to power the device from a supply
voltage of 1.8, 2.5, or 3.3 V. The device requires minimal supply decoupling and no stringent layout or ground plane
islands. Internal core circuitry is driven from the output of this regulator while I/O circuitry uses the external supply
voltage directly. Table 3, “AC Characteristics” gives the sensitivity of the on-chip oscillator to changes in the supply
voltage. Refer to the Si5315 evaluation board for an example.
The center groun d pad und er t he dev ic e mus t be ele ctr ic ally an d therma lly conn ect ed to the grou nd p la ne.
See Figure 26, “Ground Pad Recommended Layout,” on page 50.
Figure 22. Typical Power Supply Bypass Network
Figure 23. Fout = 155 MHz with 112 Hz Loop Bandwidth, 100 mVp-p Supply Noise
Si5315
VDD GND &
GND Pad
C1 – C3
C4
Ferrite
Bead
0.1 uF
1.0 uF
System
Power
Supply
(1.8, 2.5, or
3.3 V)
-105
-100
-95
-90
-85
-80
-75
-70
-65
-60
1 10 100 1000
Frequency of Power S upply Noise (kHz )
Power Supply Noise to Output Transfer Function
Power Supply Noise Rejection Ratio (dB)
Si5315
42 Rev. 1.0
9. Typical Phase Noise Plots
The following is a typical phase noise plot. The clock input source was a Rohde and Schwarz model SML03 RF
Generator. The spectrum analyzer was either an Agilent model E5052B, model E4400A or model JS-500. The
Si5315 operates at 3.3 V with an ac coupled differential PECL output and an ac coupled differential sine wave input
from the RF generator at 0 dBm. Note that, as with any PLL, the output jitter that is below the loop BW is caused by
the jitter at the input clock, not the Si5315. Except as noted, loop BWs of 60 to 240 Hz were in use.
9.1. 10G LAN SyncE Example
Frequency Plan
Fin=19.44 MHz
Fout=156.25 MHz
BW=167 Hz
Fin=19.44 MHz
Fout=125 MHz
BW=111 Hz
Fin=25 MHz
Fout=156.25 MHz
BW=111 Hz
Fin=25 MHz
Fout=125 MHz
BW=111 Hz
Jitter Integration Filter Band RMS Jitter (fs)
IEEE802.3 (1.875 to 20 MHz) 232 240 251 240
SONET OC-192 (20 kHz to 80 MHz) 483 575 525 550
SONET OC-192 (4 to 80 MHz) 302 303 300 294
SONET OC-192 (50 kHz to 80 MHz) 467 564 510 537
SONET OC-48 (12 kHz to 20 MHz) 470 565 517 541
SONET OC-3 (12 kHz to 5 MHz) 422 524 471 503
BroadBand (800 Hz to 80 MHz) 511 584 533 557
‐180
‐160
‐140
‐120
‐100
‐80
‐60
‐40
‐20
0
100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000
Si5315TypicalPhaseNoise
Fin=19.44MHz;
Fout=125MHz;
BW=111Hz
Fin=19.44MHz
Fout=156.25MHz
BW=167Hz
Fin=25MHz
Fout=125MHz
BW=111Hz
Fin=25MHz
Fout=156.25MHz
BW=111Hz
Si5315
Rev. 1.0 43
10. Pin Descriptions: Si5315
Pin assignments are preliminary and subject to change.
Table 19. Si5315 Pin Descriptions
Pin # Pin Name I/O Signal Level Description
1RST ILVCMOSExternal Reset.
Active low input that performs external hardware reset of
device. Resets all internal logic to a known state. Clock out-
puts are tristated during reset. After rising edge of RST sig-
nal, the Si5315 will perform an internal self-calibration when
a valid input signal is present.
This pin has a weak pull-up.
2 FRQTBL I 3-Level Frequency Table Select.
Selects frequency table. (Table 9 on page 20.)
This pin has a weak pull-up and weak pull-down and defaults
to M.
Some designs may require an external resistor voltage
divider when driven by an active device that will tri-state.
3LOS1OLVCMOSCKIN1 Loss of Signal.
Active high loss-of-signal indicator for CKIN1. Once trig-
gered, the alarm will remain active until CKIN1 is validated.
0 = CKIN1 present
1 = LOS on CKIN1
4LOS2OLVCMOSCKIN2 Loss of Signal.
Active high loss-of-signal indicator for CKIN2. Once trig-
gered, the alarm will remain active until CKIN2 is validated.
0 = CKIN2 present
1 = LOS on CKIN2
1
2
3
2930313233343536
20
21
22
23
24
25
26
27
10 11 12 13 14 15 16 17
4
5
6
7
8
FRQTBL
AUTOSEL
RST
LOS2
LOS1
GND
VDD
XA
VDD
XTAL/CLOCK
CKIN2+
CKIN2–
DBL2_BY
GND
CKIN1+
CKIN1–
CS_CA
BWSEL0
BWSEL1
FRQSEL1
FRQSEL2
FRQSEL3
CKOUT1–
SFOUT1
GND
VDD
SFOUT0
CKOUT2–
CKOUT2+
NC
GND
Pad
FRQSEL0
GND
9
18
19
28
XB
LOL
GND
CKOUT1+
Si5315
44 Rev. 1.0
5, 10,
32
VDD VDD Supply Supply.
The device operates from a 1.8, 2.5, or 3.3 V supply. Bypass
capacitors should be associated with the following VDD pins:
5 0.1 µF
10 0.1 µF
32 0.1 µF
A 1.0 µF should also be placed as close to device as is prac-
tical.
7
6
XB
XA
IAnalogExternal Crystal or Reference Clock.
External crystal should be connected to these pins to use
internal oscillator based reference. Crystal or reference clock
selection is set by the XTAL/CLOCK pin.
8,
15,19,
20,31
GND GND Supply Ground.
Must be connected to system ground. Minimize the ground
path impedance for optimal performance of this device.
9 AUTOSEL I 3-Level Manual/Automatic Clock Selection.
Three level input that selects the method of input clock selec-
tion to be used.
L = Manual
M = Automatic non-revertive
H = Automatic revertive
This pin has a weak pull-up and weak pull-down and defaults
to M.
Some designs may require an external resistor voltage
divider when driven by an active device that will tri-state.
11 XTAL/CLOCK I 3-Level External Crystal or Reference Clock Rate.
Three level input that selects the type and rate of external
crystal or reference clock to be applied to the XA/XB port.
This pin has both a weak pull-up and a weak pull-down and
defaults to M.
L = Crystal
M = Clock (Default)
H = Reserved
Some designs may require an external resistor voltage
divider when driven by an active device that will tri-state.
12
13
CKIN2+
CKIN2–
IClock Input 2.
Differential input clock. This input can also be driven with a
single-ended signal. Input frequency selected from a table of
values. The same frequency must be applied to CKIN1 and
CKIN2.
Table 19. Si5315 Pin Descriptions (Continued)
Pin # Pin Name I/O Signal Level Description
Si5315
Rev. 1.0 45
14 DBL2_BY I 3-Level Output 2 Disable/Bypass Mode Control.
Controls enable of CKOUT2 divider/output buffer path and
PLL bypass mode.
L = CKOUT2 enabled
M = CKOUT2 disabled
H = Bypass mode with CKOUT2 enabled. Bypass mode is
not supported with CMOS clock outputs (SFOUT = LH).
This pin has a weak pull-up and weak pull-down and defaults
to M.
Some designs may require an external resistor voltage
divider when driven by an active device that will tri-state.
16
17
CKIN1+
CKIN1–
IMultiClock Input 1.
Differential input clock. This input can also be driven with a
single-ended signal. Input frequency selected from a table of
values. The same frequency must be applied to CKIN1 and
CKIN2.
18 LOL O LVCMOS PLL Loss of Lock Indicator.
This pin functions as the active high PLL loss of lock indica-
tor.
0 = PLL locked
1 = PLL unlocked
21 CS_CA I/O LVCMOS Input Clock Select/Active Clock Indicator.
Input: If manual clock selection mode is chosen
(AUTOSEL = L), this pin functions as the manual
input clock selector. This input is internally deglitched
to prevent inadvertent clock switching during
changes in the CS input state.
0 = Select CKIN1
1 = Select CKIN2
If configured as input, must be set high or low.
Output: If automatic clock selection mode is chosen
(AUTOSEL = M or H), this pin indicates which of the
two input clocks is currently the active clock. If
alarms exist on both CKIN1 and CKIN2, indicating
that the holdover state has been entered, CA will
indicate the last active clock that was used before
entering the hold state.
0 = CKIN1 active input clock
1 = CKIN2 active input clock
23
22
BWSEL1
BWSEL0
I3-LevelLoop Bandwidth Select.
Three level inputs that select the DSPLL closed loop band-
width. See Table 9 on page 20 for available settings.
These pins have both weak pull-ups and weak pull-downs
and default to M.
Some designs may require an external resistor voltage
divider when driven by an active device that will tri-state.
Table 19. Si5315 Pin Descriptions (Continued)
Pin # Pin Name I/O Signal Level Description
Si5315
46 Rev. 1.0
27
26
25
24
FRQSEL3
FRQSEL2
FRQSEL1
FRQSEL0
I3-LevelFrequency Select.
Three level inputs that select the input clock and clock multi-
plication ratio, depending on the FRQTBL setting.
These pins have both weak pull-ups and weak pull-downs
and default to M.
Some designs may require an external resistor voltage
divider when driven by an active device that will tri-state.
29
28
CKOUT1–
CKOUT1+
OMultiClock Output 1.
Differential output clock with a frequency selected from a
table of values. Output signal format is selected by SFOUT
pins. Output is differential for LVPECL, LVDS, and CML com-
patible modes. For CMOS format, both output pins drive
identical single-ended clock outputs.
33
30
SFOUT0
SFOUT1
I3-LevelSignal Format Select.
Three level inputs that select the output signal format (com-
mon mode voltage and differential swing) for both CKOUT1
and CKOUT2.
These pins have both weak pull-ups and weak pull-downs
and default to M.
Some designs may require an external resistor voltage
divider when driven by an active device that will tri-state.
34
35
CKOUT2–
CKOUT2+
OMultiClock Output 2.
Differential output clock with a frequency selected from a
table of values. Output signal format is selected by SFOUT
pins. Output is differential for LVPECL, LVDS, and CML com-
patible modes. For CMOS format, both output pins drive
identical single-ended clock outputs.
36 NC — — No Connect.
Leave floating. Make no external connections to this pin for
normal operation.
GND
PAD
GND GND Supply Ground Pad.
The ground pad must provide a low thermal and electrical
impedance to a ground plane.
Table 19. Si5315 Pin Descriptions (Continued)
Pin # Pin Name I/O Signal Level Description
SFOUT[1:0] Signal Format
HH Reserved
HM LVDS
HL CML
MH LVPECL
MM Reserved
ML LVDS—Low Swing
LH CMOS
LM Disable
LL Reserved
Si5315
Rev. 1.0 47
Table 20. Si5315 Pull-Up/Pull-Down
Pin # Si5315 Pull
1RSTU
2FRQTBLU, D
9 AUTOSEL U, D
11 XTAL/
CLOCK
U, D
14 DBL2_BY U, D
21 CS_CA U, D
22 BWSEL0 U, D
23 BWSEL1 U, D
24 FRQSEL0 U, D
25 FRQSEL1 U, D
26 FRQSEL2 U, D
27 FRQSEL3 U, D
30 SFOUT1 U, D
33 SFOUT0 U, D
Si5315
48 Rev. 1.0
11. Ordering Guide
Ordering Part Number Output Clock Freq Range Pkg ROHS6, Pb-Free Te mp Range
Si5315A-C-GM 8 kHz–644.53 MHz 36-Lead 6x6 mm QFN Yes –40 to 85 °C
Si5315B-C-GM 8 kHz–125 MHz 36-Lead 6x6 mm QFN Yes –40 to 85 °C
Si5315-EVB 8 kHz–644.53 MHz Evaluation Board
Note: Add an “R” at the end of the device to denote tape and reel options (i.e., Si5315A-C-GMR).
Si5315
Rev. 1.0 49
12. Package Outline: 36-Pin QFN
Figure 24 illustrates the package details for the Si5315. Table 21 lists the values for the dimensions shown in the
illustration.
Figure 24. 36-Pin Quad Flat No-Lead (QFN)
Table 21. Package Dimensions
Symbol Millimeters Symbol Millimeters
Min Nom Max Min Nom Max
A 0.80 0.85 0.90 L 0.50 0.60 0.70
A1 0.00 0.02 0.05 ——12º
b 0.18 0.25 0.30 aaa — — 0.10
D 6.00 BSC bbb — — 0.10
D2 3.95 4.10 4.25 ccc — — 0.08
e 0.50 BSC ddd — — 0.10
E 6.00 BSC eee — — 0.05
E2 3.95 4.10 4.25
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to JEDEC outline MO-220, variation VJJD.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
Si5315
50 Rev. 1.0
13. PCB Land Pattern
Figure 25 illustrates the PCB land pattern for the Si5315. Figure 26 illustrates the recommended ground pad
layout. Table 22 lists the land pattern dimensions.
Figure 25. PCB Land Pattern
Figure 26. Ground Pad Recommended Layout
Si5315
Rev. 1.0 51
Table 22. PCB Land Pattern Dimensions
Dimension Min Max
e 0.50 BSC.
E5.42 REF.
D5.42 REF.
E2 4.00 4.20
D2 4.00 4.20
GE 4.53 —
GD 4.53 —
X — 0.28
Y0.89 REF.
ZE — 6.31
ZD — 6.31
Notes (General):
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Notes (Solder Mask Design):
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
Notes (Stencil Design):
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be
used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
4. A 4 x 4 array of 0.80 mm square openings on 1.05 mm pitch should be used for the
center ground pad.
Notes (Card As se m bly):
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for
Small Body Components.
Si5315
52 Rev. 1.0
14. Top Marking
14.1. Si5315 Top Marking (QFN)
14.2. Top Marking Explanation
Mark Method: Laser
Font Size: 0.80 mm
Right-Justified
Line 1 Marking: Si5315Q Customer Part Number
Q = Speed Code: A, B
See Ordering Guide for options.
Line 2 Marking: C-GM C = Product Revision
G = Temperature Range –40 to 85 °C (RoHS6)
M = QFN Package
Line 3 Marking: YYWWRF YY = Year
WW = Work Week
R = Die Revision
F = Internal code
Assigned by the Assembly House. Corresponds to the year
and work week of the mold date.
Line 4 Marking: Pin 1 Identifier Circle = 0.75 mm Diameter
Lower-Left Justified
XXXX Internal Code
Si5315
Rev. 1.0 53
DOCUMENT CHANGE LIST
Revision 0.1 to Revision 0.2
Expanded/added numerous operating sections to
initial data sheet
Revision 0.2 to Revision 0.25
Updated features and application list
Updated Section 1. "Electrical Specifications”
Added voltage regulator block to Figure 7
Revised footnotes in Table 9
Removed plan #203 from Table 9
Removed Figure 17. Crystal Oscillator with
Feedback Resistor diagram from Section 7.
"Crystal/Reference Clock Input”
Added XA/XB jitter transfer plot to Section 7.
"Crystal/Reference Clock Input”
Added PSRR transfer function plot to Section 8.
"Power Supply Filtering”
Updated Typical phase noise plot and RMS jitter
table in Section 9. "Typical Phase Noise Plots”
Revision 0.25 to Revision 0.26
Corrected Section 11. "Ordering Guide” Output
Clock Frequency Range for Si5315B-C-GM to
8 kHz–125 MHz.
Revision 0.26 to Revision 1.0
Updated Table 2 on page 4.
Updated Table 3 on page 8.
Updated Table 7 on page 13.
Moved “Typical Application Circuit” to page 14.
Added reference to AN591.
Bypass mode not supported with CMOS outputs.
Changed G.8262 compliance language.
Added frequency plans 103, 129, and 130.
Disclaimer
Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers
using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific
device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories
reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy
or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply
or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific
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circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.
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