
SPD 30N03L
Data Sheet 2 05.99
Thermal Characteristics
Parameter ValuesSymbol Unit
typ. max.min.
Characteristics
R
thJC - - 1.25 K/WThermal resistance, junction - case -Thermal resistance, junction - ambient, leded
R
thJA - 100
-
-
-
-
75
50
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area1)
R
thJA
Electrical Characteristics, at
T
= 25 ˚C, unless otherwise specified
Parameter Symbol UnitValues
min. max.typ.
Static Characteristics
Drain- source breakdown voltage
V
GS = 0 V,
I
D = 0.25 mA -
V
(BR)DSS 30 - V
Gate threshold voltage,
V
GS =
V
DS
I
D = 80 µA
V
GS(th) 21.61.2
Zero gate voltage drain current
V
DS = 30 V,
V
GS = 0 V,
T
j = 25 ˚C
V
DS = 30 V,
V
GS = 0 V,
T
j = 150 ˚C
-
I
DSS µA
1
100
0.1
-
Gate-source leakage current
V
GS = 20 V,
V
DS = 0 V
I
GSS - 10 nA100
Drain-Source on-state resistance
V
GS = 4.5 V,
I
D = 30 A
V
GS = 10 V,
I
D = 30 A
R
DS(on) -
-0.013
0.0076 0.018
0.012
Ω
1 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain
connection. PCB is vertical without blown air.