HLMP-DB25, HLMP-KB45 T-13/4 (5 mm), T-1 (3 mm) Blue LED Lamps Data Sheet Description Features These blue LEDs are designed in industry standard T-1 and T-13/4 package with clear and non diffused optics. They are also available in tape and reel, and ammo-pack option for ease of handling and use. x Popular T-13/4 and T-1 diameter packages These blue lamps are ideal for use as indicators and for general purpose lighting. Blue lamps offer color differentiation as blue is attractive and not widely available. x General purpose leads x Reliable and rugged x Available on tape and reel x Binned for color and intensity Applications x Status indicators x Small message panel x Running and decorative lights for commercial use Package Dimensions HLMP-KB45 HLMP-DB25 3.18 (0.125) 2.67 (0.105) 5.08 (0.200) 4.57 (0.180) 3.43 (0.135) 2.92 (0.115) 9.19 (0.352) 8.43 (0.332) 6.35 (0.250) 5.58 (0.220) 4.70 (0.185) 4.19 (0.165) 1.02 (0.040) NOM. 0.89 (0.035) 0.64 (0.025) 23.0 MIN. (0.90) 23.0 MIN. (0.90) 0.45 (0.018) SQUARE NOMINAL CATHODE 1.27 (0.050) NOM. 1.27 (0.050) NOM. 0.45 (0.018) SQUARE NOM. 2.54 (0.100) NOM. 6.10 (0.240) 5.59 (0.220) CATHODE 2.54 (0.100) NOM. NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. CAUTION: Devices are Class I ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Selection Guide Luminous Intensity Iv (mcd) Part Number Package Viewing Angle Min. Max. HLMP-KB45-A00xx T-1 40 30 - HLMP-DB25-B00xx T-13/4 25 40 - Part Numbering System HLMP - x x xx - x x x xx Mechanical Option 00: Bulk 02: Tape & Reel, Straight Leads DD: Ammo Pack Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (no max. limit) Minimum Iv Bin Options Please refer to the Iv Bin Table Viewing Angle 25: 25 degrees 45: 40 degrees Color Options B: Blue Package Options D: T-13/4 (5 mm) K: T-1 (3 mm) Absolute Maximum Ratings at TA = 25C Parameter Blue Units Peak Forward Current 70 mA DC Current[1] 30 mA Reverse Voltage Not recommended for reverse bias Transient Forward Current[2] (10 Psec Pulse) 350 mA LED Junction Temperature 115 C Operating Temperature -20 to +80 C Storage Temperature -30 to +100 C Wave Soldering Temperature [1.59 mm (0.063 in.) from Body]P Solder Dipping Temperature [1.59 mm (0.063 in.) from Body] 250C for 3 seconds 260C for 5 seconds Notes: 1. Derate linearly from 50C as shown in Figure 6. 2. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that this device be operated at peak currents above the Absolute Maximum Peak Forward Current. 2 Optical Characteristics at TA = 25C Part Number Luminous Intensity IV (mcd) @ IF = 20 mA Min. Color, Dominant Wavelength Od[1] (nm) Typ. Peak Wavelength OPEAK (nm) Typ. Viewing Angle 2T1/2[2] Degrees Typ. HLMP-DB25-B00xx 40 470 464 25 HLMP-KB45-A00xx 30 470 464 40 Notes: 1. The dominant wavelength, Od, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 2. T1/2 is the off-axis angle at which the luminous intensity is half of the axial luminous intensity. Electrical Characteristics at TA = 25C Speed Response Ws (ns) Typ. Capacitance C (pF), VF = 0, f = 1 MHz Typ. Thermal Resistance RTJ-PIN (C/W) Junction to Cathode Lead Typ. HLMP-DB25-B00xx 3.2 3.8 500 97 260 HLMP-KB45-A00xx 3.2 3.8 500 97 290 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 30 IF - FORWARD CURRENT - mA RELATIVE INTENSITY Part Number Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 480 530 580 WAVELENGTH - nm 630 10 5 0 1 2 3 VF - FORWARD VOLTAGE - V 4 Figure 2. Forward current vs. forward voltage 10 Hz Hz HR RES REF ATE RATIO OF PEAK CURRENT TO TEMPERATURE DERATED DC CURRENT 100 300 Figure 3. Relative intensity vs. peak forward current (300 Ps pulse width, 10 ms period) Hz 80 1K 40 50 60 70 IP - PEAK FORWARD CURRENT - mA Hz 30 KHz 1.2 3K 1.4 10 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 15 680 1.6 3 20 0 430 Figure 1. Relative intensity vs. wavelength 1.0 20 25 1 1.00E-06 1.00E-05 1.00E-04 1.00E-03 PULSE WIDTH (SECONDS) Figure 4. Maximum Tolerable Peak Current vs Pulse Width 1.00E-02 35 1.2 30 IF - FORWARD CURRENT - mA DC RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 IF - DC FORWARD CURRENT - mA 10 20 15 10 5 0 0 10 20 30 0 1.0 .8 50 .6 60 .4 70 .2 80 90 10 20 30 40 50 60 70 80 90 100 Figure 7. Relative luminous intensity vs. angular displacement for HLMP-DB25 20 10 0 1.0 30 40 .8 50 .6 60 70 80 90 .4 .2 10 20 30 40 50 60 70 80 90 100 Figure 8. Relative luminous intensity vs. angular displacement for HLMP-KB45 4 50 60 70 80 90 Figure 6. Maximum DC forward current vs. ambient temperature. Derating based on TJ max. = 115C 30 40 40 TA - AMBIENT TEMPERATURE - C Figure 5. Relative luminous intensity vs. forward current 20 25 Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts. Intensity Bin Limits Color Bin Limits (nm at 20 mA) Intensity Range (mcd) Min. Max. Blue Bin nm @ 20 mA Bin ID Min. Max. A 30.0 40.0 1 460.0 464.0 B 40.0 50.0 2 464.0 468.0 C 50.0 65.0 3 468.0 472.0 D 65.0 85.0 4 472.0 476.0 E 85.0 110.0 5 476.0 480.0 F 110.0 140.0 Tolerance for each bin limit is 0.5 nm. G 140.0 180.0 H 180.0 240.0 J 240.0 310.0 K 310.0 400.0 L 400.0 520.0 M 520.0 680.0 N 680.0 880.0 Tolerance for each bin limit is 15%. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 02 Tape & Reel, straight leads, minimum increment 1300 pcs/reel DD Ammo Pack, straight leads with minimum increment 2000pcs/pack Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. 5 Precautions: Lead Forming: x The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. x For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. x If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling: x Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. x LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59 mm x ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. x Recommended soldering condition: Wave Soldering[1],[2] Manual Solder Dipping Pre-heat Temperature 105C Max. - Pre-heat Time 60 sec Max. - Peak Temperature 250C Max. 260C Max. Dwell Time 3 sec Max. 5 sec Max. Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. 6 x Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. x Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. x At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. x If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. x Recommended PC board plated through holes (PTH) size for LED component leads. LED Component Lead Size Diagonal Plated Through Hole Diameter 0.45 x 0.45 mm (0.018 x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020 x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) x Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245C 5C (maximum peak temperature = 250C) TEMPERATURE (C) 200 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) 100 Flux: Rosin flux Solder bath temperature: 245C 5C (maximum peak temperature = 250C) 50 PREHEAT Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 0 10 20 30 40 50 60 TIME (MINUTES) 70 80 90 100 Note: Allow for board to be sufficiently cooled to Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: 7 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin room temperature before exerting mechanical force. (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-3263EN AV02-2213EN - October 26, 2009