2N5639RLRAG - ON Semiconductor

March, 2006 − Rev. 4 1Publication Order Number:

2N5638/D

2N5638, 2N5639

2N5638 is a Preferred Device

JFET Chopper Transistors

N−Channel − Depletion

N−Channel Junction Field Effect Transistors, depletion mode

(Type A) designed for chopper and high−speed switching applications.

Features

•Low Drain−Source “ON” Resistance: RDS(on) = 30W for 2N5638

RDS(on) = 60W for 2N5639

•Low Reverse Transfer Capacitance −

Crss = 4.0 pF (Max) @ f = 1.0 MHz

•Fast Switching Characteristics − tr = 5.0 ns (Max) (2N5638)

•Pb−Free Packages are Available*

MAXIMUM RATINGS

Rating Symbol Value Unit

Drain−Source Voltage VDS 30 Vdc

Drain−Gate Voltage VDG 30 Vdc

Reverse Gate−Source Voltage VGSR 30 Vdc

Forward Gate Current IGF 10 mAdc

Total Device Dissipation

@ TA = 25°C

Derate above 25°C

PD310

2.82 mW

mW/°C

Storage Temperature Range Tstg −65 to +150 °C

Operating Junction Temp Range TJ−65 to +135 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

INPUT

(SCOPE A)

OUTPUT

(SCOPE B)

PULSE

GENERATOR

VDD = 10 Vdc

0.1 mF

0.001 mF

50 W

+−

50 W

SCOPE A

50 W

SCOPE B

RL+VDD

ID*(RDS(on) )50)

1.0 k

SCOPE

TEKTRONIX 567A

OR EQUIVALENT

Figure 1. Switching Times Test Circuit

VGS(on)

VGS(off)

10%

90%

td(off) tr

td(on)

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Device Package Shipping†

ORDERING INFORMATION

2N5638RLRA TO−92

TO−92

CASE 29

STYLE 5

2000/Tape & Reel

Preferred devices are recommended choices for future use

and best overall value.

2N5639 TO−92 1000 Units/Box

2N5369RLRA TO−92 2000/Tape & Reel

MARKING

DIAGRAM

1 DRAIN

2 SOURCE

GATE

http://onsemi.com

2N5369RLRAG TO−92

(Pb−Free) 2000/Tape & Reel

2N5639G TO−92

(Pb−Free) 1000 Units/Box

2N5638RLRAG TO−92

(Pb−Free) 2000/Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

563x

AYWW G

x = 8 or 9

A = Assembly Location

Y = Year

WW = Work Week

G= Pb−Free Package

(Note: Microdot may be in either location)

123

2N5638, 2N5639

http://onsemi.com

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristic Symbol Min Max Unit

OFF CHARACTERISTICS

Gate−Source Breakdown Voltage

(IG = −1.0 mAdc, VDS = 0) V(BR)GSS 35 − Vdc

Gate Reverse Current

(VGS = −15 Vdc, VDS = 0)

(VGS = −15 Vdc, VDS = 0, TA = 100°C)

IGSS −1.0

1.0 nAdc

mAdc

Drain−Cutoff Current

(VDS = 15 Vdc, VGS = −12 Vdc) 2N5638

(VDS = 15 Vdc, VGS = −12 Vdc, TA = 100°C) 2N5638

(VDS = 15 Vdc, VGS = −8.0 Vdc) 2N5639

(VDS = 15 Vdc, VGS = −8.0 Vdc, TA = 100°C) 2N5639

ID(off) −1.0

1.0

mAdc

ON CHARACTERISTICS

Zero−Gate−Voltage Drain Current (Note 1) 2N5638

(VDS = 20 Vdc, VGS = 0) 2N5639 IDSS 50

25 −

−mAdc

Drain−Source “ON” Voltage

(ID = 12 mAdc, VGS = 0) 2N5638

(ID = 6.0 mAdc, VGS = 0) 2N5639

VDS(on) −

−0.5

0.5

Vdc

Static Drain−Source “ON” Resistance

(ID = 1.0 mAdc, VGS = 0) 2N5638

2N5639

RDS(on) −

−30

SMALL−SIGNAL CHARACTERISTICS

Static Drain−Source “ON” Resistance

(VGS = 0, ID = 0, f = 1.0 kHz) 2N5638

2N5639

RDS(on) −

−30

Input Capacitance

(VDS = 0, VGS = −12 Vdc, f = 1.0 MHz) Ciss − 10 pF

Reverse Transfer Capacitance

(VDS = 0, VGS = −12 Vdc, f = 1.0 MHz) Crss − 4.0 pF

SWITCHING CHARACTERISTICS (VDD = 10 Vdc, VGS(on) = 0, VGS(off) = −10 Vdc, RG’ = 50 W. See Figure 1 on page 1)

T urn−On Delay Time ID(on) = 12 mAdc, 2N5638

ID(on) = 6.0 mAdc, 2N5639 td(on) −

−4.0

6.0 ns

Rise Time ID(on) = 12 mAdc, 2N5638

ID(on) = 6.0 mAdc, 2N5639 tr−

−5.0

8.0 ns

Turn−Off Delay Time ID(on) = 12 mAdc, 2N5638

ID(on) = 6.0 mAdc, 2N5639 td(off) −

−5.0

10 ns

Fall Time ID(on) = 12 mAdc, 2N5638

ID(on) = 6.0 mAdc, 2N5639 tf−

−10

20 ns

1. Pulse Width ≤ 300 ms, Duty Cycle ≤ 3.0%.

2N5638, 2N5639

http://onsemi.com

PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. CONTOUR OF PACKAGE BEYOND DIMENSION R

IS UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN P AND

BEYOND DIMENSION K MINIMUM.

SECTION X−X

SEATING

PLANE DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.175 0.205 4.45 5.20

B0.170 0.210 4.32 5.33

C0.125 0.165 3.18 4.19

D0.016 0.021 0.407 0.533

G0.045 0.055 1.15 1.39

H0.095 0.105 2.42 2.66

J0.015 0.020 0.39 0.50

K0.500 −−− 12.70 −−−

L0.250 −−− 6.35 −−−

N0.080 0.105 2.04 2.66

P−−− 0.100 −−− 2.54

R0.115 −−− 2.93 −−−

V0.135 −−− 3.43 −−−

TO−92 (TO−226)

CASE 29−11

ISSUE AL

STYLE 5:

PIN 1. DRAIN

2. SOURCE

3. GATE

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, af filiates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Japan: ON Semiconductor, Japan Customer Focus Center

2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051

Phone: 81−3−5773−3850

2N5638/D

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 61312, Phoenix, Arizona 85082−1312 USA

Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada

Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: http://onsemi.com

Order Literature: http://www.onsemi.com/litorder

For additional information, please contact your

local Sales Representative.