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ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. "Typical" parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. FSQ500L Compact, Green Mode, Fairchild Power Switch (FPSTM) Features Description The FSQ500L is specially designed for a replacement of linear power supplies with low cost. This device combines current-mode Pulse Width Modulator (PWM) with a senseFET. The integrated PWM controller features include: a fixed oscillator, Under Voltage Lockout (UVLO) protection, Overload Protection (OLP), Leading-Edge Blanking (LEB), an optimized gate turnon/turn-off driver, Thermal Shutdown (TSD) protection with hysteresis, and temperature-compensated precision-current sources for loop compensation. When compared to a linear power supply, the FSQ500L device reduces total size and weight, while increasing efficiency, productivity, and system reliability. This device provides a basic platform for cost-effective flyback converters. Single Chip 700V SenseFET Power Switch Precision Fixed Operating Frequency: 130kHz No-load consumption 250mW at 265VAC with Burst Mode and Down to 60mW with External Bias Internal Startup Switch Auto-Restart Mode Soft-Start Time Tuned by External Capacitor Under-Voltage Lockout (UVLO) with Hysteresis Pulse-by-Pulse Current Limit Overload Protection (OLP) and Internal Thermal Shutdown Function (TSD) with Hysteresis No Need for Auxiliary Bias Winding Applications Cost-Effective Linear Power Supplies Replacement Charger and Adapter for Mobile Phone, PDA, MP3, and Cordless Phone Maximum Output Power(1) 230VAC 15%(2) Related Resources AN4137 -- Design Guidelines for Off-line Flyback Converters Using Fairchild Power Switch (FPSTM) AN4141 -- Troubleshooting and Design Tips for Fairchild Power Switch (FPSTM) Flyback Applications AN-4147 -- Design Guidelines for RCD Snubber of Flyback Converters AN-6075 -- Compact Green Mode Adapter Using FSQ500L for Low Cost AN-4138 -- Design Considerations for Battery Charger Using Green Mode Fairchild Power Switch (FPSTM) Evaluation Board: FEBFSQ500L 85-265VAC Adapter(3) Open Frame(4) Adapter(3) Open Frame(4) 2.5W 3.0W 2.0W 2.5W Notes: 1. The junction temperature can limit the maximum output power. 2. 230VAC or 100/115VAC with doubler. 3. Typical continuous power in a non-ventilated enclosed adapter measured at 50C ambient. 4. Maximum practical continuous power in an open frame design at 50C ambient. Ordering Information Part Number Operating Temperature Range Package Packing Method FSQ500L -40C to +85C 4-Lead, Small Outline Package (SOT223-4L) Tape & Reel (c) 2008 Fairchild Semiconductor Corporation FSQ500L * Rev. 1.0.3 www.fairchildsemi.com FSQ500L -- Compact, Green Mode, Fairchild Power Switch (FPSTM) April 2012 AC IN DC OUT D PWM VFB V CC GND Figure 1. Typical Application Circuit Internal Block Diagram VCC D 2 1 6.5V Soft-Soft VCC VCC I FB IIDELAY 7.7VZ OSC (BURST MODE:IFB/2) VFB 3 S 8R 250ns LEB R sense V BURL/V BURH (0.3V) S A/R OLP V VOLP SD UVLO Q R R VREF HV/REG HV/REG OFF Q R TSD 4 GND Figure 2. Internal Block Diagram (c) 2008 Fairchild Semiconductor Corporation FSQ500L * Rev. 1.0.3 www.fairchildsemi.com 2 FSQ500L -- Compact, Green Mode, Fairchild Power Switch (FPSTM) Application Circuit Diagram GND FSQ500L D VCC VFB Figure 3. Package / Pin Diagram Pin Definitions Pin # Name Description D High-voltage power senseFET drain connection. In addition, at startup, the internal high-voltage current source supplies internal bias and charges the external capacitor connected to the VCC pin. Once VCC reaches 6.0V, all internal blocks are activated. The internal high-voltage current source is alive until VCC reaches 6.5V. After that, the internal high voltage current source turns on and off irregularly to maintain VCC at 6.5V. VCC This pin is connected to a storage capacitor. A high-voltage regulator connected between pin 1 (D) and this pin provides the supply voltage to the FSQ500L at startup and when switching during normal operation. The FSQ500L eliminates the need for auxiliary bias winding and associated external components. 3 VFB This pin is internally connected to the non-inverting input of the PWM comparator. The collector of an opto-coupler is typically tied to this pin. For stable operation, a capacitor should be placed between this pin and GND. If the voltage of this pin reaches 4.5V, the overload protection triggers, which shuts down the FPS. 4 GND 1 2 This pin is the control ground and the senseFET source. (c) 2008 Fairchild Semiconductor Corporation FSQ500L * Rev. 1.0.3 www.fairchildsemi.com 3 FSQ500L -- Compact, Green Mode, Fairchild Power Switch (FPSTM) Pin Assignments Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. (5) VDS Drain Pin Voltage VCC Supply Voltage VFB Feedback Voltage Range Max. 700 -0.3 Unit V 10 V VCC V PD Total Power Dissipation 0.78 W IDM Drain Current Pulsed(6) 0.41 A TJ Operating Junction Temperature -40 Internally Limited C Storage Temperature -55 +150 C Value Unit +160 C/W TSTG Notes: 5. LDMOS available drain voltage is -0.3V ~ 700V. 6. Repetitive rating: pulse width is limited by maximum junction temperature. Thermal Impedance Symbol Parameter (7) JA Junction-to-Ambient Thermal Resistance Note: 7. Free-standing with no heat sink; minimum land pattern. (c) 2008 Fairchild Semiconductor Corporation FSQ500L * Rev. 1.0.3 www.fairchildsemi.com 4 FSQ500L -- Compact, Green Mode, Fairchild Power Switch (FPSTM) Absolute Maximum Ratings TJ = 25C unless otherwise specified. Symbol Parameter Condition Min. Typ. Max. Unit SenseFET Section BVDSS Drain-Source Breakdown Voltage VCC = 6.5V, VFB = 0V, ID = 150A IDSS Zero-Gate-Voltage Drain Current VCC = 6.5V, VFB = 0V, VDS = 560V RDS(ON) CISS COSS tr tf Drain-Source On-State Resistance (8) Input Capacitance (8) 700 V 150 A TJ = 25C, ID = 25mA 25 29 TJ = 100C, ID = 25mA 35 41 VGS = 6.5V 42 pF Output Capacitance VDS = 40V, fS = 1MHz 25 pF Rise Time(8) VDS = 350V, ID = 25mA 100 ns VDS = 350V, lD = 25mA 50 ns (8) Fall Time Control Section fS fS IFB(Burst) IFB(Normal) Switching Frequency VCC = 6.5V, VFB = 1.0V (8) Switching Frequency Variation Feedback Source Current -25C < TJ < 125C 7 % A VCC = 6.5V 200 225 250 A 54 60 66 % 0 % VCC = 6.5V, VFB = 4.0V VCC = 6.5V, VFB = 0V Shutdown Delay Current Enable Voltage 5 122 Minimum Duty Ratio VDLY_EN kHz 110 Maximum Duty Ratio VSTOP 140 98 DMIN UVLO Threshold Voltage 130 VCC = 6.5V, VFB = 0V DMAX VSTART 120 VFB = 0V, VCC Sweep 5.5 6.0 6.5 V After Turn-on, VFB = 0V, VCC Sweep 4.5 5.0 5.5 V VFB = VSD, VCC Sweep from 6V 6.0 6.5 7.0 V 0.75 0.80 0.85 V 0.70 0.75 0.80 V 30 50 80 mV Burst-Mode Section VBURH VBURL VCC = 6.5V, VFB Sweep Burst Mode Voltage HYS Protection Section ILIM Peak Current Limit di/dt = 150mA/s 245 280 315 mA VSD Shutdown Feedback Voltage VCC = 6.5V, VFB Sweep 4.1 4.5 4.9 V VCC = 6.5V, VFB = 4.0V 4 5 6 A IDELAY tLEB tCLD TDS HYS Shutdown Delay Current (8) Leading Edge Blanking Time 250 (8) Current Limit Delay Time ns 100 130 Thermal Shutdown Temperature(8) 140 ns 150 C C 80 Total Device Section IOP-BURST Operating Supply Current (Control Part Only) IOP-FB VCC = 6.5V, VFB = 0V 360 430 500 760 880 A A VCC = 6.5V, VFB = 4V 640 Startup Charging Current VCC = VFB = 0V, VDS = 40V 3.3 VCCREG Supply Shunt Regulator VDS = 40V, VFB = 0V 6.0 6.5 7.0 V VCCREG_ Supply Shunt Regulator During TSD(8) 5.2 5.7 6.2 V ICH TSD mA Note: 8. These parameters, although guaranteed, are not 100% tested in production. (c) 2008 Fairchild Semiconductor Corporation FSQ500L * Rev. 1.0.3 www.fairchildsemi.com 5 FSQ500L -- Compact, Green Mode, Fairchild Power Switch (FPSTM) Electrical Characteristics These characteristic graphs are measured at TA = 25C. Operating Supply Current (IOP) vs Temperature Switching Frequency (fS) vs Temperature 490 140 470 135 fS (KHZ) IOP (A) 450 430 410 130 125 390 370 120 -40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 Temperature () 50 65 80 95 110 125 110 125 Figure 5. Switching Frequency (fS) vs. Temperature UVLO Threshold Voltage (VSTOP) vs Temperature UVLO Threshold Voltage (VSTART) vs Temperature 6.5 5.5 6.3 5.3 6.1 5.1 VSTOP (V) VSTART (V) 35 Temperature () Figure 4. Operating Supply Current (IOP_Burst) vs. Temperature 5.9 5.7 4.9 4.7 5.5 4.5 -40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 Temperature () 20 35 50 65 80 95 Temperature () Figure 6. UVLO Threshold Voltage (VSTART) vs. Temperature Figure 7. UVLO Threshold Voltage (VSTOP) vs. Temperature Burst Mode Voltage (VBURL) vs Temperature Burst Mode Voltage (VBURH) vs Temperature 850 800 830 780 VBURL (mV) VBURH (mV) 20 810 790 760 740 720 770 700 750 -40 -25 -10 5 20 35 50 65 80 95 110 -40 125 Figure 8. Burst-Mode Voltage (VBURH) vs. Temperature (c) 2008 Fairchild Semiconductor Corporation FSQ500L * Rev. 1.0.3 -25 -10 5 20 35 50 65 80 95 110 125 Temperature () Temperature () Figure 9. Burst-Mode Voltage (VBURL) vs. Temperature www.fairchildsemi.com 6 FSQ500L -- Compact, Green Mode, Fairchild Power Switch (FPSTM) Typical Performance Characteristics These characteristic graphs are measured at TA = 25C. Maximum Duty Ratio (DMAX) vs Temperature Shutdown Feedback Voltage (VSD) vs Temperature 5.0 64.0 63.0 4.8 61.0 VSD (V) DMAx (%) 62.0 60.0 59.0 58.0 4.6 4.4 4.2 57.0 4.0 56.0 -40 -25 -10 5 20 35 50 65 80 95 110 -40 125 -25 -10 5 Temperature () 20 35 50 65 80 95 110 125 Temperature () Figure 11. Shutdown Feedback Voltage (VSD) vs. Temperature Figure 10. Maximum Duty Ratio (DMAX) vs. Temperature Peak Current Limit (ILIM) vs Temperature Shutdown Delay Current (IDELAY) vs Temperature 5.5 310.0 300.0 5.3 IDELAY (A) ILIM (mA) 290.0 280.0 270.0 5.1 4.9 260.0 4.7 250.0 240.0 4.5 -40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature () Temperature () Figure 13. Shutdown Delay Current (IDELAY) vs. Temperature Figure 12. Peak Current Limit (ILIM) vs. Temperature Supply Shunt Regulator (VCCREG) vs Temperature 7.0 VCCRGE (V) 6.8 6.6 6.4 6.2 6.0 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature () Figure 14. Supply Shunt Regulator (VCCREG) vs. Temperature (c) 2008 Fairchild Semiconductor Corporation FSQ500L * Rev. 1.0.3 www.fairchildsemi.com 7 FSQ500L -- Compact, Green Mode, Fairchild Power Switch (FPSTM) Typical Performance Characteristics (Continued) 1. Startup and VCC Regulation: At startup, an internal high-voltage current source supplies the internal bias and charges the external capacitor (CA) connected to the VCC pin, as illustrated in Figure 15. An internal highvoltage regulator (HV/REG) located between the D and VCC pins regulates the VCC to be 6.5V and supplies operating current. Therefore, FSQ500L needs no auxiliary bias winding. VCC VCC IDELAY VFB VO 2 FOD817A IFB SenseFET OSC D1 CB D2 + VFB* KA431 8R Gate driver R - Transformer OLP VSD Rsense D VCC 3 6.5V Figure 16. Pulse Width Modulation (PWM) Circuit 2 ICH HV/REG 3. Protection Circuits: The FSQ500L has two selfprotective functions: overload protection (OLP) and thermal shutdown (TSD). While OLP is implemented as auto-restart mode, there is no switching when TSD triggers. Once the overload condition is detected, switching is terminated, the senseFET remains off, and HV/REG turns off. This causes VCC to fall. When VCC falls below the under voltage lockout (UVLO) stop voltage of 5.0V, the protection is reset and the startup circuit charges the VCC capacitor. When VCC reaches the start voltage of 6.0V, the FSQ500L resumes its normal operation. If the fault condition is still not removed, the senseFET and HV/REG remain off and VCC drops to VSTOP again. In this manner, the auto-restart can alternately enable and disable the switching of the power senseFET until the fault condition is eliminated, as shown in Figure 17. ISTART CA VREF UVLO Figure 15. Startup Block 2. Feedback Control: FSQ500L employs current mode control, as shown in Figure 16. An opto-coupler (such as the FOD817A) and shunt regulator (such as the KA431) are typically used to implement the feedback network. Comparing the feedback voltage with the voltage across the Rsense resistor makes it possible to control the switching duty cycle. When the reference pin voltage of the regulator exceeds the internal reference voltage of 2.5V, the opto-coupler LED current increases, pulling down the feedback voltage and reducing the duty cycle. This typically happens when the line input voltage increases or the output load current decreases. Because these protection circuits are fully integrated into the IC without external components, reliability is improved without increasing cost. VDS 2.1 Pulse-by-Pulse Current Limit: Because current mode control is employed, the peak current through the senseFET is limited by the non-inverting input of PWM comparator (VFB*), as shown in Figure 16. Assuming that 225A current source flows only through the internal resistor (8R + R = 12k), the cathode voltage of diode D2 is about 2.7V. Since D1 is blocked when the feedback voltage (VFB) exceeds 2.7V, the maximum voltage of the cathode of D2 is clamped at this voltage, clamping VFB*. Therefore, the peak value of the current through the senseFET is limited. OLP removed VCC 6.5V 6.0V 5.0V 2.2 Leading-Edge Blanking (LEB): At the instant the internal senseFET is turned on, a high-current spike occurs through the senseFET, caused by primary-side capacitance and secondary-side rectifier reverse recovery. Excessive voltage across the Rsense resistor would lead to incorrect feedback operation in the current mode PWM control. To counter this effect, the FPS employs a leading-edge blanking (LEB) circuit. This circuit inhibits the PWM comparator for a short time (tLEB = 250ns) after the senseFET turns on. (c) 2008 Fairchild Semiconductor Corporation FSQ500L * Rev. 1.0.3 OLP occurs Power on t Normal operation Fault situation Normal operation Figure 17. Auto Restart Protection Waveforms www.fairchildsemi.com 8 FSQ500L -- Compact, Green Mode, Fairchild Power Switch (FPSTM) Functional Description VFB Power on VDS TSD occurs TSD removed VCC 6.5V 6.0V 5.7V t Normal operation Normal operation Fault situation Figure 19. Over-Temperature Protection (OTP) 4. Soft-Start: The soft-start time is tuned by an external VCC capacitor (CA), which increases PWM comparator non-inverting input voltage together with the senseFET current slowly after it starts up. Before VCC reaches VSTART, CA is charged by the current ICH-ISTART, where ICH and ISTART are described in Figure 15. After VCC reaches VSTART, all internal blocks are activated, so that the current consuming inside IC becomes IOP. Therefore, CA is charged by the current ICH-IOP, which makes the increasing slope of VCC become sluggish. VCC is shifted by 6.0V negatively (it is performed in soft-start block in Figure 2), and then VCC -6.0V is an input of one of the input terminals of the PWM comparator. The drain current follows VCC -6.0V instead of the VFB* because of the low-dominant feature of the PWM comparator. The soft-start time can be made long or short by selecting CA, as described in Figure 20. During tS/S, IDELAY is disabled to avoid unwanted OLP. Typically, tS/S is around 4.6ms with 27F of CA. Overload protection 4.5V 2.7V VCC tS/S T12= CB*(4.5-2.7)/IDELAY T1 Figure 18. Overload Protection T2 t 3.2 Thermal Shutdown (TSD): The senseFET and the control IC in one package makes it easy for the control IC to detect an abnormal over temperature of the senseFET. When the temperature exceeds approximately 140C, the thermal shutdown triggers. When TSD triggers, delay current is disabled, switching operation stops, and VCC through the internal highvoltage current source is set to 5.7V from 6.5V, as shown in Figure 19. Since TSD signal prohibits the senseFET from switching, there is no switching until the junction temperature decreases sufficiently. If the junction temperature is lower than 60C typically, TSD signal is removed and VCC is set to 6.5V again. While VCC increases from 5.7V to 6.5V, the soft-start function makes the senseFET turn on and off with no voltage and/or current stress. (c) 2008 Fairchild Semiconductor Corporation FSQ500L * Rev. 1.0.3 6.5V VCCREG 6V VSTART 5V VSTOP t1 t1=CAx6V/(ICH-ISTART) t2 t tS/S=CAx0.5V/(ICH-IOP) Figure 20. Soft-Start Function The peak value of the drain current of the power switching device is progressively increased to establish the correct working conditions for transformers, inductors, and capacitors. The voltage on the output capacitors is progressively increased with the intention of smoothly establishing the required output voltage. It also helps to prevent transformer saturation and reduce stress on the secondary diode during startup. www.fairchildsemi.com 9 FSQ500L -- Compact, Green Mode, Fairchild Power Switch (FPSTM) 3.1 Overload Protection (OLP): Overload is defined as the load current exceeding its normal level due to an unexpected abnormal event. In this situation, the protection circuit should trigger to protect the SMPS. However, even when the SMPS is in the normal operation, the overload protection circuit can be triggered during the load transition. To avoid this undesired operation, the overload protection circuit is designed to trigger after a specified time to determine whether the situation is transient or a true overload. Because of the pulse-by-pulse current limit capability, the maximum peak current through the senseFET is limited and, therefore, the maximum input power is restricted with a given input voltage. If the output consumes more than this maximum power, the output voltage (VO) decreases below the set voltage. This reduces the current through the opto-coupler LED, which also reduces the opto-coupler transistor current, thus increasing the feedback voltage (VFB). If VFB exceeds 2.7V, D1 is blocked and the 5A current source starts to charge CB slowly up to VCC. In this condition, VFB continues increasing until it reaches 4.5V, when the switching operation is terminated, as shown in Figure 18. The delay time for shutdown is the time required to charge CB from 2.7V to 4.5V with 5A. In general, a 10 ~ 50ms delay time is typical for most applications. This protection is implemented in auto restart mode. Voset VFB 0.80V 0.75V IDS VDS time t1 Switching disabled t2 t3 Switching disabled t4 Figure 21. Burst-Mode Operation (c) 2008 Fairchild Semiconductor Corporation FSQ500L * Rev. 1.0.3 www.fairchildsemi.com 10 FSQ500L -- Compact, Green Mode, Fairchild Power Switch (FPSTM) Vo 5. Burst Operation: To minimize power dissipation in standby mode, the FPS enters burst-mode operation. During the burst mode operation, IFB(Burst) decreases half of IFB(Normal). As the load decreases, the feedback voltage decreases. As shown in Figure 21, the device automatically enters burst mode when the feedback voltage drops below VBURL (750mV). At this point, switching stops and the output voltages start to drop at a rate dependent on standby current load. This causes the feedback voltage to rise. Once it passes VBURH (800mV), switching resumes. The feedback voltage then falls and the process repeats. Burst mode alternately enables and disables switching of the power senseFET, reducing switching loss in standby mode. 6.70 6.20 0.10 B C B 3.10 2.90 3.25 4 1.90 A 3.70 3.30 1 6.10 1.90 3 0.84 0.60 2.30 2.30 0.95 4.60 0.10 C B LAND PATTERN RECOMMENDATION SEE DETAIL A 1.80 MAX C 0.08 C 0.10 0.00 10 5 GAGE PLANE R0.150.05 R0.150.05 10 TYP 0 0.25 SEATING PLANE 10 5 0.60 MIN 1.70 DETAIL A SCALE: 2:1 0.35 0.20 7.30 6.70 NOTES: UNLESS OTHERWISE SPECIFIED A) DRAWING BASED ON JEDEC REGISTRATION TO-261C, VARIATION AA. B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS DO NOT INCLUDE BURRS OR MOLD FLASH. MOLD FLASH OR BURRS DOES NOT EXCEED 0.10MM. D) DIMENSIONING AND TOLERANCING PER ASME Y14.5M-2009. E) LANDPATTERN NAME: SOT230P700X180-4BN F) DRAWING FILENAME: MKT-MA04AREV3 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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