JM38510/30902BEA - NATIONAL SEMICONDUCTOR

SDLS055A – DECEMBER 1972 – REVISED MAY 2007

(1) SN54S153, SN74153, and SN74S153 are obsolete.

(1)

PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

76011012A ACTIVE LCCC FK 20 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 76011012A

SNJ54LS

153FK

7601101EA ACTIVE CDIP J 16 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 7601101EA

SNJ54LS153J

7601101FA ACTIVE CFP W 16 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 7601101FA

SNJ54LS153W

JM38510/30902BEA ACTIVE CDIP J 16 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 JM38510/

30902BEA

M38510/30902BEA ACTIVE CDIP J 16 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 JM38510/

30902BEA

SN54153J ACTIVE CDIP J 16 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 SN54153J

SN54LS153J ACTIVE CDIP J 16 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 SN54LS153J

SN74LS153D ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS153

SN74LS153DG4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS153

SN74LS153DR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LS153

SN74LS153N ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 SN74LS153N

SN74LS153NSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 74LS153

SNJ54153J ACTIVE CDIP J 16 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 SNJ54153J

SNJ54LS153FK ACTIVE LCCC FK 20 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 76011012A

SNJ54LS

153FK

SNJ54LS153J ACTIVE CDIP J 16 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 7601101EA

SNJ54LS153J

SNJ54LS153W ACTIVE CFP W 16 1 Non-RoHS

& Green SNPB N / A for Pkg Type -55 to 125 7601101FA

SNJ54LS153W

(1) The marketing status values are defined as follows:

PACKAGE OPTION ADDENDUM

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Addendum-Page 2

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54LS153, SN74LS153 :

•Catalog: SN74LS153

•Military: SN54LS153

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

PACKAGE OPTION ADDENDUM

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Addendum-Page 3

•Military - QML certified for Military and Defense Applications

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

SN74LS153DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1

SN74LS153NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 30-Dec-2020

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74LS153DR SOIC D 16 2500 333.2 345.9 28.6

SN74LS153NSR SO NS 16 2000 853.0 449.0 35.0

PACKAGE MATERIALS INFORMATION

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Pack Materials-Page 2

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