© Semiconductor Components Industries, LLC, 2014
October, 2014 − Rev. 5 1Publication Order Number:
NLU2G04/D
NLU2G04
Dual Inverter
The NLU2G04 MiniGatet is an advanced high−speed CMOS dual
inverter in ultra−small footprint.
The NLU2G04 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
Features
•High Speed: tPD = 3.5 ns (Typ) @ VCC = 5.0 V
•Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
•Power Down Protection Provided on inputs
•Balanced Propagation Delays
•Overvoltage Tolerant (OVT) Input and Output Pins
•Ultra−Small Packages
•These are Pb−Free Devices
OUT Y1
IN A2
IN A1
OUT Y2
GND
1
2
3
5
4
IN A2 OUT Y2
1
Figure 1. Pinout (Top View)
Figure 2. Logic Symbol
6
VCC
IN A1 OUT Y1
1
PIN ASSIGNMENT
1
2
3IN A2
IN A1
GND
4
5V
CC
OUT Y2
FUNCTION TABLE
L
H
AY
H
L
6 OUT Y1
MARKING
DIAGRAMS
H = Device Marking
M = Date Code
www.onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
HM
1
UDFN6
MU SUFFIX
CASE 517AA
1
1
1
ULLGA6
1.0 x 1.0
CASE 613AD
ULLGA6
1.2 x 1.0
CASE 613AE
ULLGA6
1.45 x 1.0
CASE 613AF
HM
HM
HM
UDFN6
1.45 x 1.0
CASE 517AQ
UDFN6
1.0 x 1.0
CASE 517BX
1
M
1
M
D
Y
NLU2G04
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2
MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC DC Supply Voltage −0.5 to +7.0 V
VIN DC Input Voltage −0.5 to +7.0 V
VOUT DC Output Voltage −0.5 to +7.0 V
IIK DC Input Diode Current VIN < GND −20 mA
IOK DC Output Diode Current VOUT < GND ±20 mA
IODC Output Source/Sink Current ±12.5 mA
ICC DC Supply Current Per Supply Pin ±25 mA
IGND DC Ground Current per Ground Pin ±25 mA
TSTG Storage Temperature Range −65 to +150 °C
TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C
TJJunction Temperature Under Bias 150 °C
MSL Moisture Sensitivity Level 1
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
ILATCHUP Latchup Performance Above VCC and Below GND at 125 °C (Note 2) ±500 mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC Positive DC Supply Voltage 1.65 5.5 V
VIN Digital Input Voltage 0 5.5 V
VOUT Output Voltage 0 5.5 V
TAOperating Free−Air Temperature −55 +125 °C
Dt/DVInput Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V 0
0100
20 ns/V
NLU2G04
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3
DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Conditions VCC
(V)
TA = 25 5C TA = +855CTA = −555C to
+1255C
Unit
Min Typ Max Min Max Min Max
VIH Low−Level
Input Voltage 1.65 0.75 x
VCC 0.75 x
VCC V
2.3 to
5.5 0.70 x
VCC 0.70 x
VCC
VIL Low−Level
Input Voltage 1.65 0.25 x
VCC 0.25 x
VCC 0.25 x
VCC V
2.3 to
5.5 0.30 x
VCC 0.30 x
VCC 0.30 x
VCC
VOH High−Level
Output Voltage VIN = VIH or VIL
IOH = −50 mA2.0
3.0
4.5
1.9
2.9
4.4
2.0
3.0
4.5
1.9
2.9
4.4
1.9
2.9
4.4
V
VIN = VIH or VIL
IOH = −4 mA
IOH = −8 mA 3.0
4.5 2.58
3.94 2.48
3.80 2.34
3.66
V
VOL Low−Level
Output Voltage VIN = VIH or VIL
IOL = 50 mA2.0
3.0
4.5
0
0
0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA 3.0
4.5 0.36
0.36 0.44
0.44 0.52
0.52
IIN Input Leakage
Current 0 v VIN v 5.5 V 0 to
5.5 ±0.1 ±1.0 ±1.0 mA
ICC Quiescent
Supply Current 0 v VIN v VCC 5.5 1.0 10 40 mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 nS)
Symbol Parameter VCC
(V) Test
Condition
TA = 25 5C TA = +855CTA = −555C to
+1255C
Unit
Min Typ Max Min Max Min Max
tPLH,
tPHL Propagation Delay,
Input A to Output Y 3.0 to
3.6 CL = 15 pF 4.5 7.1 8.5 10.0 ns
CL = 50 pF 6.4 10.6 12.0 14.5
4.5 to
5.5 CL = 15 pF 3.5 5.5 6.5 8.0
CL = 50 pF 4.5 7.5 8.5 10.0
CIN Input Capacitance 4 10 10 10.0 pF
CPD Power Dissipation
Capacitance
(Note 3)
5.0 8.0 pF
3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
NLU2G04
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4
VCC
GND
50%
50% VCC
A or B
Y
tPHL
tPLH
Figure 3. Switching Waveforms
Figure 4. Test Circuit
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for propagation delay tests.
CL*
INPUT OUTPUT
ORDERING INFORMATION
Device Package Shipping†
NLU2G04MUTCG UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free) 3000 / Tape & Reel
NLU2G04AMX1TCG ULLGA6, 1.45 x 1.0, 0.5P
(Pb−Free) 3000 / Tape & Reel
NLU2G04BMX1TCG ULLGA6, 1.2 x 1.0, 0.4P
(Pb−Free) 3000 / Tape & Reel
NLU2G04CMX1TCG ULLGA6, 1.0 x 1.0, 0.35P
(Pb−Free) 3000 / Tape & Reel
NLU2G04AMUTCG UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free) 3000 / Tape & Reel
NLU2G04CMUTCG UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free) 3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NLU2G04
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5
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
ÉÉÉ
ÉÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L6X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
13
46
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
b0.20 0.30
D1.45 BSC
E1.00 BSC
e0.50 BSC
L0.30 0.40
L1 −−− 0.15
DIMENSIONS: MILLIMETERS
0.30
6X
1.24
0.53 PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PACKAGE
OUTLINE
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
ÉÉ
ÉÉ
ÉÉ
DETAIL B
MOLD CMPDEXPOSED Cu
OPTIONAL
CONSTRUCTIONS
A2 0.07 REF
6X
A2
DETAIL B
DET AIL A
NLU2G04
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6
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
ÉÉÉ
ÉÉÉ
ÉÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b0.12 0.22
D1.00 BSC
E1.00 BSC
e0.35 BSC
L0.25 0.35
L1 0.30 0.40
A B
E
D
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
A
A1
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
2X
2X
A3
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
L1
13
46
M
MDIMENSIONS: MILLIMETERS
0.22
5X
0.48 6X
1.18
0.53 PITCH
0.35
1
PKG
OUTLINE
NLU2G04
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7
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÉÉ
ÉÉ
ÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
10X
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L2
13
46
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b0.15 0.25
D1.20 BSC
E1.00 BSC
e0.40 BSC
L0.30 0.40
L1 0.00 0.15
L1
DETAIL A
Bottom View
(Optional)
ÉÉÉ
ÉÉÉ
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L2 0.40 0.50
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.22
6X
0.42 6X
1.07
0.40
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NLU2G04
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8
PACKAGE DIMENSIONS
ULLGA6 1.0x1.0, 0.35P
CASE 613AD
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
ÉÉ
ÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
13
46
DIM MIN MAX
MILLIMETERS
A−−− 0.40
A1 0.00 0.05
b0.12 0.22
D1.00 BSC
E1.00 BSC
e0.35 BSC
L0.25 0.35
L1 0.30 0.40
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.22
5X
0.48 6X
1.18
0.53 PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.35
1
MOUNTING FOOTPRINT
PKG
OUTLINE
NLU2G04
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9
PACKAGE DIMENSIONS
ULLGA6 1.2x1.0, 0.4P
CASE 613AE
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
ÉÉ
ÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
13
46
DIM MIN MAX
MILLIMETERS
A−−− 0.40
A1 0.00 0.05
b0.15 0.25
D1.20 BSC
E1.00 BSC
e0.40 BSC
L0.25 0.35
L1 0.35 0.45
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.26
5X
0.49 6X
1.24
0.53 PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.40
1
MOUNTING FOOTPRINT
PKG
OUTLINE
NLU2G04
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10
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
ÉÉÉ
ÉÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
13
46
DIM MIN MAX
MILLIMETERS
A−−− 0.40
A1 0.00 0.05
b0.15 0.25
D1.45 BSC
E1.00 BSC
e0.50 BSC
L0.25 0.35
L1 0.30 0.40
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.30
5X
0.49 6X
1.24
0.53 PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PKG
OUTLINE
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UBLICATION ORDERING INFORMATION
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Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
NLU2G04/D
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