VCCA
A1
A2
GND
VCCB
B1
OE
B2
1
2
3
4
8
7
6
5
TXB0302
www.ti.com
SCES837B –MARCH 2012–REVISED OCTOBER 2012
2-Bit Bidirectional Voltage-Level Translator with Automatic Direction Sensing
Check for Samples: TXB0302
1FEATURES DESCRIPTION
• Fully Symmetric Supply Voltages. This 2-bit noninverting translator uses two separate
0.9 V to 3.6 V on A Port and 0.9 V to 3.6 V configurable power-supply rails. The A port is
• VCC Isolation Feature — If Either VCC Input Is at designed to track VCCA. VCCA accepts any supply
GND, All Outputs Are in the High-Impedance voltage from 0.9 V to 3.6 V. The B port is designed to
State track VCCB. VCCB accepts any supply voltage from
0.9 V to 3.6 V. This allows for low-voltage
• OE Input Circuit Referenced to VCCA bidirectional translation between 1-V, 1.2-V, 1.5-V,
• Low Power Consumption, 5-µA Max ICC 1.8-V, 2.5-V and 3.3-V voltage nodes. For the
• Ioff Supports Partial-Power-Down Mode TXB0302, when the output-enable (OE) input is low,
Operation all outputs are placed in the high-impedance state. To
ensure the high-impedance state during power up or
• Latch-Up Performance Exceeds 100 mA Per power down, OE should be tied to GND through a
JESD 78, Class II pulldown resistor; the minimum value of the resistor is
• ESD Protection Exceeds JESD 22 determined by the current-sourcing capability of the
– 4000-V Human-Body Model (A114-B) driver. The TXB0302 is designed so that the OE input
circuit is supplied by VCCA. This device is fully
– 1000-V Charged-Device Model (C101) specified for partial-power-down applications using
Ioff. The Ioff circuitry disables the outputs, preventing
damaging current backflow through the device when
it is powered down.
DQM PACKAGE
(TOP VIEW)
A. Pull up resistors are not required on both sides for Logic I/O.
B. If pull up or pull down resistors are needed, the resistor value must be over 20 kΩ.
C. 20 kΩis a safe recommended value, if the customer can accept higher Vol or lower Voh, smaller pull up or pull down
resistor is allowed, the draft estimation is Vol = Vccout × 1.5k/(1.5k + Rpu) and Voh = Vccout × Rdw/(1.5k + Rdw).
D. If pull up resistors are needed, please refer to the TXS0102 or contact TI.
E. For detailed information, please refer to application note SCEA043.
ORDERING INFORMATION(1)
TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING
–40°C to 85°C DQM – MicroQFN TXB0302DQMR 77A
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TXB0302
SCES837B –MARCH 2012–REVISED OCTOBER 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PIN DESCRIPTION
PIN NO. NAME FUNCTION
DQM TXB0302
1 VCCA A-port supply voltage 0.9 V ≤VCCA ≤3.6 V
2 A1 Input/output 1. Referenced to VCCA.
3 A2 Input/output 2. Referenced to VCCA.
4 GND Ground
5 OE 3-state output-mode enable. Pull OE (TXB0302) low to place all outputs in 3-state mode.
6 B2 Input/output 2. Referenced to VCCB.
7 B1 Input/output 1. Referenced to VCCB.
8 VCCB B-port supply voltage 0.9 V ≤VCCB ≤3.6 V.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCCA –0.5 4.6 V
Supply voltage range
VCCB –0.5 4.6
A port –0.5 4.6 V
VIInput voltage range B port –0.5 6.5
A port –0.5 4.6 V
Voltage range applied to any output in the high-impedance or
VOpower-off state B port -0.5 6.5
A port –0.5 VCCA + 0.5 V
VOVoltage range applied to any output in the high or low state(2) B port –0.5 VCCB + 0.5
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IOContinuous output current ±50 mA
Continuous current through VCCA, VCCB, or GND ±100 mA
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL IMPEDANCE RATINGS(1)(2)
TXB0302
THERMAL METRIC DQM UNIT
8 PINS
θJA Package thermal impedance 259 °C/W
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
(2) The package thermal impedance is calculated in accordance with JESD 51-5.
2Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
Product Folder Links :TXB0302
TXB0302
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SCES837B –MARCH 2012–REVISED OCTOBER 2012
RECOMMENDED OPERATING CONDITIONS(1)
VCCA VCCB MIN MAX UNIT
VCCA 0.9 3.6
Supply voltage V
VCCB 0.9 3.6
VCCI(2) ×
Data inputs 0.9 V to 3.6 V 0.9 V to 3.6 V VCCI(2)
0.65
VIH High-level input voltage V
OE 0.9 V to 3.6 V 0.9 V to 3.6 V VCCA × 0.65 3.6
Data inputs 0.9 V to 3.6 V 0.9 V to 3.6 V 0 VCCI (2)× 0.35
VIL Low-level input voltage V
OE 0.9 V to 3.6 V 0.9 V to 3.6 V 0 VCCA × 0.35
A-port 0.9 V to 3.6 V 0.9 V to 3.6 V 0 3.6
Voltage range applied to any output in
VOV
the high-impedance or power-off state B-port 0.9 V to 3.6 V 0.9 V to 3.6 V 0 3.6
A-port inputs 0.9 V to 3.6 V 0.9 V to 3.6 V 40
Δt/Δv Input transition rise or fall rate ns/V
B-port inputs 0.9 V to 3.6 V 0.9 V to 3.6 V 40
TAOperating free-air temperature –40 85 °C
(1) The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND.
(2) VCCI is the supply voltage associated with the input port.
ELECTRICAL CHARACTERISTICS TA= 25°C –40°C to 85°C
PARAMETER TEST CONDITIONS VCCA VCCB UNIT
MIN TYP MAX MIN MAX
VOHA IOH = –20 μA 0.9 V to 3.6 V 0.9 x VCCA V
VOLA IOL = 20 μA 0.9 V to 3.6 V 0.2 V
VOHB IOH = –20 μA 0.9 V to 3.6 V 0.9 x VCCB V
VOLB IOL = 20 μA 0.9 V to 3.6 V 0.2 V
IIOE VI= VCCI or GND 0.9 V to 3.6 V 0.9 V to 3.6 V ±1 ±2 μA
A port VIor VO= 0 to 3.6 V 0 V 0 V to 3.6 V ±1 ±2
Ioff μA
B port VIor VO= 0 to 3.6 V 0.9 V to 3.6 V 0 V ±1 ±2
IOZ A or B port OE = GND 0.9 V to 3.6 V 0.9 V to 3.6 V ±1 ±2 μA
ICCA VI= VCCI or GND, IO= 0 0.9 V to 3.6 V 0.9 V to 3.6 V 5 μA
ICCB VI= VCCI or GND, IO= 0 0.9 V to 3.6 V 0.9 V to 3.6 V 5 μA
ICCA + ICCB VI= VCCI or GND, IO= 0 0.9 V to 3.6 V 0.9 V to 3.6 V 10 μA
ICCZA VI = VCCI or GND, IO= 0, OE = GND 0.9 V to 3.6 V 0.9 V to 3.6 V 5 μA
ICCZB VI = VCCI or GND, IO= 0, OE = GND 0.9 V to 3.6 V 0.9 V to 3.6 V 5 μA
CiOE 0.9 V to 3.6 V 0.9 V to 3.6 V 3 pF
A port 0.9 V to 3.6 V 0.9 V to 3.6 V 9
Cio pF
B port 12
TIMING REQUIREMENTS VCCA VCCB MIN MAX UNIT
CL= 15 pF 0.9 to 3.6 V 0.9 to 3.6 V 40 Mbps
CL= 15 pF 1.2 to 3.6 V 1.2 to 3.6 V 100 Mbps
CL= 15 pF 1.8 to 3.6 V 1.8 to 3.6 V 140 Mbps
CL= 30 pF 0.9 to 3.6 V 0.9 to 3.6 V 40 Mbps
Data rate CL= 30 pF 1.2 to 3.6 V 1.2 to 3.6 V 90 Mbps
CL= 30 pF 1.8 to 3.6 V 1.8 to 3.6 V 120 Mbps
CL= 50 pF 1.2 to 3.6 V 1.2 to 3.6 V 70 Mbps
CL= 50 pF 1.8 to 3.6 V 1.8 to 3.6 V 100 Mbps
Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links :TXB0302
TXB0302
SCES837B –MARCH 2012–REVISED OCTOBER 2012
www.ti.com
SWITCHING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
FROM TO TYP
PARAMETER VCCA VCCB MIN MAX UNIT
(INPUT) (OUTPUT) TA= 25°C
A B CL= 15 0.9-3.6 0.9-3.6 18.9 62.5
A B CL= 15 1.2-3.6 1.2-3.6 7.5 15.5
A B CL= 15 1.8-3.6 1.8-3.6 3.7 5.8
A B CL= 30 0.9-3.6 0.9-3.6 19.5 64.5 ns
A B CL= 30 1.2-3.6 1.2-3.6 7.8 16.1
A B CL= 30 1.8-3.6 1.8-3.6 3.8 6.1
A B CL= 50 1.2-3.6 1.2-3.6 8 16.8
A B CL= 50 1.8-3.6 1.8-3.6 4 6.5
tpd B A CL= 15 0.9-3.6 0.9-3.6 18.9 62.6
B A CL= 15 1.2-3.6 1.2-3.6 7.5 15.4
B A CL= 15 1.8-3.6 1.8-3.6 3.7 5.8
B A CL= 30 0.9-3.6 0.9-3.6 19.5 64.5 ns
B A CL= 30 1.2-3.6 1.2-3.6 7.8 16.1
B A CL= 30 1.8-3.6 1.8-3.6 3.8 5.2
B A CL= 50 1.2-3.6 1.2-3.6 8 16.9
B A CL= 50 1.8-3.6 1.8-3.6 4 6.6
A CL= 15 0.9-3.6 0.9-3.6 504
ten OE ns
B CL= 15 0.9-3.6 0.9-3.6 356
A CL= 15 0.9-3.6 0.9-3.6 200 ns
tdis OE B CL= 15 0.9-3.6 0.9-3.6 200 ns
trB, tfB B-port rise and fall times CL= 15 0.9-3.6 0.9-3.6 2.95 ns
ts, tsA-port rise and fall times CL= 15 0.9-3.6 0.9-3.6 3.1 ns
Channel-to-channel
tSK(O) CL= 15 0.9-3.6 0.9-3.6 0.5 ns
skew
OPERATING CHARACTERISTICS
TA= 25°C VCCA, VCCB 0.9 V to 3.6 V
PARAMETER TEST CONDITIONS UNIT
TYP
A-port input, B-port output 40
CpdA pF
B-port input, A-port output 40
CL= 0, f = 10 MHz, tr= tf= 1 ns,
OE = VCCA (outputs enabled)
A-port input, B-port output 40
CpdB pF
B-port input, A-port output 40
A-port input, B-port output 0.01
CpdA pF
B-port input, A-port output 0.01
CL= 0, f = 10 MHz, tr= tf= 1 ns,
OE = GND (outputs disabled)
A-port input, B-port output 0.01
CpdB pF
B-port input, A-port output 0.01
4Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
Product Folder Links :TXB0302
T1
T2
T4
T3
VCCA VCCB
AB
One
Shot
One
Shot
One
Shot
One
Shot
1 kΩ
1 kΩ
TXB0302
www.ti.com
SCES837B –MARCH 2012–REVISED OCTOBER 2012
PRINCIPLES OF OPERATION
Applications
The TXB0302 can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another.
Architecture
The TXB0302 architecture (see Figure 1) does not require a direction-control signal to control the direction of
data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0302 can maintain a high or low,
but are designed to be weak, so that they can be over driven by an external driver when data on the bus starts
flowing the opposite direction. The output one shots detect rising or falling edges on the A or B ports. During a
rising edge, the one shot turns on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-
to-high transition. Similarly, during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short
duration, which speeds up the high-to-low transition. The typical output impedance during output transition is 35
Ωat VCCO = 0.9 V to 1.1 V, 25 Ωat VCCO = 1.2 V to 3.3 V.
Figure 1. Architecture of TXB0302 I/O Cell
Input Driver Requirements
Typical IIN vs VIN characteristics of the TXB0302 are shown in Figure 2. For proper operation, the device driving
the data I/Os of the TXB0302 must have drive strength of at least ±3 mA.
Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links :TXB0302
pd
oh CCout
pd
R
V V 1.5kΩ R
= ´
+
ol CCout
pu
1.5kΩ
V V 1.5kΩ R
= ´
+
IIN
VT/1k
-(VCC – V )/1k
T
0VTVIN
TXB0302
SCES837B –MARCH 2012–REVISED OCTOBER 2012
www.ti.com
(1) VTis the input threshold voltage of the TXB0302 (typical VCCI/2).
(2) VD is the supply voltage of the external driver.
Figure 2. Typical IIN vs VIN Curve
Power Up
There is no requirement for the power sequence. During operation, TXB0302 can work at both VCCA ≤VCCB and
VCCA ≥VCCB , During power-up sequencing, any power supply can be ramped up first. The TXB0302 has circuitry
that disables all output ports when either VCC is switched off (VCCA/B = 0 V).
Enable and Disable
The TXB0302 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the
high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the
outputs actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the
one-shot circuitry to become operational after OE is taken high.
Pullup or Pulldown Resistor on I/O Lines
The TXB0302 is designed to drive capacitive loads of up to 50 pF. The output drivers of the TXB0302 have low
dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be
kept higher than 20 kΩto ensure that they do not contend with the output drivers of the TXB0302. but if the
receiver is integrated with the smaller pull down or pull up resistor, below formula can be used for estimation to
evaluate the Voh and Vol.
(1)
(2)
For the same reason, the TXB0302 should not be used in applications such as I2C or 1-Wire where an open-
drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx
series of level translators.
6Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
Product Folder Links :TXB0302
From Output
Under Test
LOAD CIRCUIT FOR
ENABLE/DISABLE
TIME MEASUREMENT
S1
2 × VCCO
Open
50 k
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
TEST S1
A. CLincludes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO= 50 Ω, dv/dt ≥1 V/ns.
C. The outputs are measured one at a time, with one transition per measurement.
D. tPLH and tPHL are the same as t
pd.
E. VCCI is the VCC associated with the input port.
F. VCCO is the VCC associated with the output port.
G. All parameters and waveforms are not applicable to all devices.
50 k
From Output
Under Test
50 k
CLCL
LOAD CIRCUIT FOR MAX DATA RATE,
PULSE DURATION PROPAGATION
DELAY OUTPUT RISE AND FALL TIME
MEASUREMENT
tPLH tPHL
0 V
VCCO/2
VCCI/2 VCCI/2
0.9 VCCO
VCCO/2
tr
0.1 VCCO
tf
VCCI
Input
Output
VOH
VOL
VOH
VOL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
VCCA/2VCCA/2
0 V
0.1 VCCO
VCCO/2
0.9 VCCO
VCCO/2
0 V
VCCA
VCCO
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
TXB0302
www.ti.com
SCES837B –MARCH 2012–REVISED OCTOBER 2012
PARAMETER MEASUREMENT INFORMATION
Figure 3. Load Circuits and Voltage Waveforms
Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links :TXB0302
TXB0302
SCES837B –MARCH 2012–REVISED OCTOBER 2012
www.ti.com
REVISION HISTORY
Changes from Original (March 2012) to Revision A Page
• Added package pin out diagram notes. ................................................................................................................................ 1
Changes from Revision A (May 2012) to Revision B Page
• Added Application Information Section ................................................................................................................................. 5
8Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated
Product Folder Links :TXB0302
PACKAGE OPTION ADDENDUM
www.ti.com 20-May-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TXB0302DQMR ACTIVE X2SON DQM 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 77A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TXB0302DQMR X2SON DQM 8 3000 180.0 9.5 1.4 2.0 0.5 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Jan-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TXB0302DQMR X2SON DQM 8 3000 180.0 180.0 30.0
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Jan-2013
Pack Materials-Page 2
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