TXB0302 www.ti.com SCES837B - MARCH 2012 - REVISED OCTOBER 2012 2-Bit Bidirectional Voltage-Level Translator with Automatic Direction Sensing Check for Samples: TXB0302 FEATURES 1 * * * * * * * Fully Symmetric Supply Voltages. 0.9 V to 3.6 V on A Port and 0.9 V to 3.6 V VCC Isolation Feature -- If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State OE Input Circuit Referenced to VCCA Low Power Consumption, 5-A Max ICC Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 - 4000-V Human-Body Model (A114-B) - 1000-V Charged-Device Model (C101) DESCRIPTION This 2-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 0.9 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 0.9 V to 3.6 V. This allows for low-voltage bidirectional translation between 1-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V and 3.3-V voltage nodes. For the TXB0302, when the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. The TXB0302 is designed so that the OE input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. DQM PACKAGE (TOP VIEW) VCCA 1 8 VCCB A1 2 7 A2 3 6 B1 B2 GND 4 5 OE A. Pull up resistors are not required on both sides for Logic I/O. B. If pull up or pull down resistors are needed, the resistor value must be over 20 k. C. 20 k is a safe recommended value, if the customer can accept higher Vol or lower Voh, smaller pull up or pull down resistor is allowed, the draft estimation is Vol = Vccout x 1.5k/(1.5k + Rpu) and Voh = Vccout x Rdw/(1.5k + Rdw). D. If pull up resistors are needed, please refer to the TXS0102 or contact TI. E. For detailed information, please refer to application note SCEA043. ORDERING INFORMATION (1) (1) (2) TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING -40C to 85C DQM - MicroQFN TXB0302DQMR 77A For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2012, Texas Instruments Incorporated TXB0302 SCES837B - MARCH 2012 - REVISED OCTOBER 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. PIN DESCRIPTION PIN NO. NAME DQM TXB0302 1 VCCA 2 A1 Input/output 1. Referenced to VCCA. 3 A2 Input/output 2. Referenced to VCCA. 4 GND 5 OE 3-state output-mode enable. Pull OE (TXB0302) low to place all outputs in 3-state mode. 6 B2 Input/output 2. Referenced to VCCB. 7 B1 Input/output 1. Referenced to VCCB. 8 VCCB FUNCTION A-port supply voltage 0.9 V VCCA 3.6 V Ground B-port supply voltage 0.9 V VCCB 3.6 V. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCCA VCCB MIN MAX -0.5 4.6 -0.5 4.6 A port -0.5 4.6 B port -0.5 6.5 A port -0.5 4.6 B port -0.5 6.5 A port -0.5 VCCA + 0.5 B port -0.5 VCCB + 0.5 Supply voltage range VI Input voltage range VO Voltage range applied to any output in the high-impedance or power-off state UNIT V V V V VO Voltage range applied to any output in the high or low state(2) IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current 50 mA 100 mA 150 C Continuous current through VCCA, VCCB, or GND Tstg (1) Storage temperature range -65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL IMPEDANCE RATINGS (1) (2) TXB0302 THERMAL METRIC DQM UNIT 8 PINS JA (1) (2) 2 Package thermal impedance 259 C/W The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Submit Documentation Feedback Copyright (c) 2012, Texas Instruments Incorporated Product Folder Links :TXB0302 TXB0302 www.ti.com SCES837B - MARCH 2012 - REVISED OCTOBER 2012 RECOMMENDED OPERATING CONDITIONS (1) VCCA VCCA Supply voltage VCCB VIH High-level input voltage MIN MAX 0.9 3.6 0.9 3.6 Data inputs 0.9 V to 3.6 V 0.9 V to 3.6 V VCCI (2) x 0.65 VCCI (2) OE 0.9 V to 3.6 V 0.9 V to 3.6 V VCCA x 0.65 3.6 Data inputs 0.9 V to 3.6 V 0.9 V to 3.6 V 0 VCCI OE 0.9 V to 3.6 V 0.9 V to 3.6 V 0 VCCA x 0.35 0.9 V to 3.6 V 0.9 V to 3.6 V 0 3.6 0.9 V to 3.6 V 0.9 V to 3.6 V 0 3.6 A-port inputs 0.9 V to 3.6 V 0.9 V to 3.6 V 40 B-port inputs 0.9 V to 3.6 V 0.9 V to 3.6 V 40 VIL Low-level input voltage VO Voltage range applied to any output in A-port the high-impedance or power-off state B-port t/v Input transition rise or fall rate TA Operating free-air temperature (1) (2) VCCB UNIT V V (2) -40 x 0.35 85 V V ns/V C The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND. VCCI is the supply voltage associated with the input port. ELECTRICAL CHARACTERISTICS PARAMETER TEST CONDITIONS VCCA TA = 25C VCCB MIN -40C to 85C UNIT TYP MAX MIN MAX VOHA IOH = -20 A 0.9 V to 3.6 V VOLA IOL = 20 A 0.9 V to 3.6 V VOHB IOH = -20 A VOLB IOL = 20 A 0.9 V to 3.6 V OE VI = VCCI or GND 0.9 V to 3.6 V 0.9 V to 3.6 V 1 2 A port VI or VO = 0 to 3.6 V 0V 0 V to 3.6 V 1 2 B port VI or VO = 0 to 3.6 V 0.9 V to 3.6 V 0V 1 2 A or B port 1 II Ioff 0.9 x VCCA V 0.2 0.9 V to 3.6 V V 0.9 x VCCB V 0.2 V A A OE = GND 0.9 V to 3.6 V 0.9 V to 3.6 V 2 A ICCA VI = VCCI or GND, IO = 0 0.9 V to 3.6 V 0.9 V to 3.6 V 5 A ICCB VI = VCCI or GND, IO = 0 0.9 V to 3.6 V 0.9 V to 3.6 V 5 A ICCA + ICCB VI = VCCI or GND, IO = 0 0.9 V to 3.6 V 0.9 V to 3.6 V 10 A ICCZA VI = VCCI or GND, IO = 0, OE = GND 0.9 V to 3.6 V 0.9 V to 3.6 V 5 A ICCZB VI = VCCI or GND, IO = 0, OE = GND 0.9 V to 3.6 V 0.9 V to 3.6 V 5 A OE 0.9 V to 3.6 V 0.9 V to 3.6 V 3 A port 0.9 V to 3.6 V 0.9 V to 3.6 V 9 IOZ Ci Cio pF pF B port 12 TIMING REQUIREMENTS Data rate VCCA VCCB MAX UNIT CL = 15 pF 0.9 to 3.6 V 0.9 to 3.6 V MIN 40 Mbps CL = 15 pF 1.2 to 3.6 V 1.2 to 3.6 V 100 Mbps CL = 15 pF 1.8 to 3.6 V 1.8 to 3.6 V 140 Mbps CL = 30 pF 0.9 to 3.6 V 0.9 to 3.6 V 40 Mbps CL = 30 pF 1.2 to 3.6 V 1.2 to 3.6 V 90 Mbps CL = 30 pF 1.8 to 3.6 V 1.8 to 3.6 V 120 Mbps CL = 50 pF 1.2 to 3.6 V 1.2 to 3.6 V 70 Mbps CL = 50 pF 1.8 to 3.6 V 1.8 to 3.6 V 100 Mbps Submit Documentation Feedback Copyright (c) 2012, Texas Instruments Incorporated Product Folder Links :TXB0302 3 TXB0302 SCES837B - MARCH 2012 - REVISED OCTOBER 2012 www.ti.com SWITCHING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) A B A B A A tpd TYP TA = 25C MAX 0.9-3.6 18.9 62.5 1.2-3.6 7.5 15.5 VCCA VCCB MIN UNIT CL = 15 0.9-3.6 CL = 15 1.2-3.6 B CL = 15 1.8-3.6 1.8-3.6 3.7 5.8 B CL = 30 0.9-3.6 0.9-3.6 19.5 64.5 A B CL = 30 1.2-3.6 1.2-3.6 7.8 16.1 A B CL = 30 1.8-3.6 1.8-3.6 3.8 6.1 A B CL = 50 1.2-3.6 1.2-3.6 8 16.8 A B CL = 50 1.8-3.6 1.8-3.6 4 6.5 B A CL = 15 0.9-3.6 0.9-3.6 18.9 62.6 B A CL = 15 1.2-3.6 1.2-3.6 7.5 15.4 B A CL = 15 1.8-3.6 1.8-3.6 3.7 5.8 B A CL = 30 0.9-3.6 0.9-3.6 19.5 64.5 B A CL = 30 1.2-3.6 1.2-3.6 7.8 16.1 B A CL = 30 1.8-3.6 1.8-3.6 3.8 5.2 B A CL = 50 1.2-3.6 1.2-3.6 8 16.9 B A CL = 50 1.8-3.6 1.8-3.6 4 A CL = 15 0.9-3.6 0.9-3.6 504 B CL = 15 0.9-3.6 0.9-3.6 356 A CL = 15 0.9-3.6 0.9-3.6 200 ns B 200 ns ns ns 6.6 ten OE tdis OE CL = 15 0.9-3.6 0.9-3.6 trB, tfB B-port rise and fall times CL = 15 0.9-3.6 0.9-3.6 2.95 ns ts, ts A-port rise and fall times CL = 15 0.9-3.6 0.9-3.6 3.1 ns tSK(O) Channel-to-channel skew CL = 15 0.9-3.6 0.9-3.6 0.5 ns ns OPERATING CHARACTERISTICS TA = 25C PARAMETER CpdA CpdB CpdA CpdB 4 TEST CONDITIONS A-port input, B-port output B-port input, A-port output A-port input, B-port output 40 40 40 A-port input, B-port output A-port input, B-port output TYP 40 CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = VCCA (outputs enabled) B-port input, A-port output B-port input, A-port output VCCA, VCCB 0.9 V to 3.6 V 0.01 CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = GND (outputs disabled) B-port input, A-port output 0.01 0.01 0.01 Submit Documentation Feedback UNIT pF pF pF pF Copyright (c) 2012, Texas Instruments Incorporated Product Folder Links :TXB0302 TXB0302 www.ti.com SCES837B - MARCH 2012 - REVISED OCTOBER 2012 PRINCIPLES OF OPERATION Applications The TXB0302 can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. Architecture The TXB0302 architecture (see Figure 1) does not require a direction-control signal to control the direction of data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0302 can maintain a high or low, but are designed to be weak, so that they can be over driven by an external driver when data on the bus starts flowing the opposite direction. The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns on the PMOS transistors (T1, T3) for a short duration, which speeds up the lowto-high transition. Similarly, during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up the high-to-low transition. The typical output impedance during output transition is 35 at VCCO = 0.9 V to 1.1 V, 25 at VCCO = 1.2 V to 3.3 V. VCCA VCCB One Shot T1 1 k One Shot T2 B A One Shot T3 1 k T4 One Shot Figure 1. Architecture of TXB0302 I/O Cell Input Driver Requirements Typical IIN vs VIN characteristics of the TXB0302 are shown in Figure 2. For proper operation, the device driving the data I/Os of the TXB0302 must have drive strength of at least 3 mA. Submit Documentation Feedback Copyright (c) 2012, Texas Instruments Incorporated Product Folder Links :TXB0302 5 TXB0302 SCES837B - MARCH 2012 - REVISED OCTOBER 2012 www.ti.com IIN VT/1k VT 0 VIN -(VCC - VT)/1k (1) VT is the input threshold voltage of the TXB0302 (typical VCCI/2). (2) VD is the supply voltage of the external driver. Figure 2. Typical IIN vs VIN Curve Power Up There is no requirement for the power sequence. During operation, TXB0302 can work at both VCCA VCCB and VCCA VCCB , During power-up sequencing, any power supply can be ramped up first. The TXB0302 has circuitry that disables all output ports when either VCC is switched off (VCCA/B = 0 V). Enable and Disable The TXB0302 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the outputs actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the one-shot circuitry to become operational after OE is taken high. Pullup or Pulldown Resistor on I/O Lines The TXB0302 is designed to drive capacitive loads of up to 50 pF. The output drivers of the TXB0302 have low dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be kept higher than 20 k to ensure that they do not contend with the output drivers of the TXB0302. but if the receiver is integrated with the smaller pull down or pull up resistor, below formula can be used for estimation to evaluate the Voh and Vol. Vol = VCCout 1.5k 1.5k + Rpu Voh = VCCout (1) Rpd 1.5k + Rpd (2) For the same reason, the TXB0302 should not be used in applications such as I2C or 1-Wire where an opendrain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx series of level translators. 6 Submit Documentation Feedback Copyright (c) 2012, Texas Instruments Incorporated Product Folder Links :TXB0302 TXB0302 www.ti.com SCES837B - MARCH 2012 - REVISED OCTOBER 2012 PARAMETER MEASUREMENT INFORMATION 2 x VCCO From Output Under Test CL 50 k LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT VCCI Input VCCI/2 VCCI/2 0V t PLH Output Open 50 k CL LOAD CIRCUIT FOR MAX DATA RATE, PULSE DURATION PROPAGATION DELAY OUTPUT RISE AND FALL TIME MEASUREMENT S1 50 k From Output Under Test TEST S1 t PZL/t PLZ t PHZ/t PZH 2 x VCCO Open VCCA Output Control (low-level enabling) VCCA/2 VCCA /2 0V t PHL VCCO/2 0.9 VCCO 0.1 VCCO tr VCCO/2 tf VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOL t PLZ t PZL VOH Output Waveform 1 S1 at 2 x VCCO (see Note B) Output Waveform 2 S1 at GND (see Note B) VCCO 0.1 VCCO VCCO/2 VOL t PHZ t PZH 0.9 VOH VCCO VCCO/2 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES A. B. C. D. E. F. G. CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , dv/dt 1 V/ns. The outputs are measured one at a time, with one transition per measurement. tPLH and tPHL are the same as tpd. VCCI is the VCC associated with the input port. VCCO is the VCC associated with the output port. All parameters and waveforms are not applicable to all devices. Figure 3. Load Circuits and Voltage Waveforms Submit Documentation Feedback Copyright (c) 2012, Texas Instruments Incorporated Product Folder Links :TXB0302 7 TXB0302 SCES837B - MARCH 2012 - REVISED OCTOBER 2012 www.ti.com REVISION HISTORY Changes from Original (March 2012) to Revision A * Added package pin out diagram notes. ................................................................................................................................ 1 Changes from Revision A (May 2012) to Revision B * 8 Page Page Added Application Information Section ................................................................................................................................. 5 Submit Documentation Feedback Copyright (c) 2012, Texas Instruments Incorporated Product Folder Links :TXB0302 PACKAGE OPTION ADDENDUM www.ti.com 20-May-2013 PACKAGING INFORMATION Orderable Device Status (1) TXB0302DQMR ACTIVE Package Type Package Pins Package Drawing Qty X2SON DQM 8 3000 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (C) Device Marking (3) CU NIPDAU Level-1-260C-UNLIM (4/5) -40 to 85 77A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device TXB0302DQMR Package Package Pins Type Drawing X2SON DQM 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 180.0 9.5 Pack Materials-Page 1 1.4 B0 (mm) K0 (mm) P1 (mm) 2.0 0.5 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXB0302DQMR X2SON DQM 8 3000 180.0 180.0 30.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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