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Formosa MS
1N5221B THRU 1N5267B
Document ID Issued Date Revised Date Revision Page.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Zener Diode
Item Test Conditions Reference
High reliability test capabilities
1. Solder Resistance
2. Solderability
3. Pull Test
4. Bend Lead
5. High Temperature Reverse Bias
6. Pressure Cooker
7. Temperature Cycling
8. Thermal Shock
9. Humidity
10. High Temperature Storage Life
at 260±5 for 10±2sec.
immerse body into solder 1/16"±1/32"
o
at 245±5 C for 5 sec.
0.25kg in axial lead direction for 10 sec.
0.25kg weight applied to each lead bending
o o
arc 90 ±5 for 3 times.
o
V =80% rate at T =150 C for 168 hrs.
R J
o
15P at T =121 C for 4 hrs.
SIG A
o o
-55 C to +125 C dwelled for 30 min.
and transferred for 5min. total 10 cycles.
o o
0 C for 5 min. rise to 100 C for 5 min. total 10 cycles.
o
at T =85 C, RH=85% for 1000hrs.
A
o
at 175 C for 1000 hrs.
oCMIL-STD-750D
METHOD-2031
MIL-STD-202F
METHOD-208
MIL-STD-750D
METHOD-2036
MIL-STD-750D
METHOD-2036
MIL-STD-750D
METHOD-1038
JESD22-A102
MIL-STD-750D
METHOD-1051
MIL-STD-750D
METHOD-1056
MIL-STD-750D
METHOD-1021
MIL-STD-750D
METHOD-1031
Item Test Conditions Reference
DS-222712 2008/02/10 2010/03/10 B 8