
BMA145
Data sheet
Bosch Sensortec
CONTENT
1 SPECIFICATION................................................................................................................................... 6
2 ABSOLUTE MAXIMUM RATINGS........................................................................................................8
3 BMA145 FEATURES............................................................................................................................ 9
3.1 GENERAL DESCRIPTION .................................................................................................................. 9
3.1.1 MEMS element ....................................................................................................................... 9
3.1.2 ASIC........................................................................................................................................ 9
3.2 CHANNEL MULTIPLEXER................................................................................................................ 10
4 OPERATION ....................................................................................................................................... 11
4.1 POWER-ON-RESET AND POWER-UP SEQUENCE............................................................................... 11
4.2 OPERATION MODE SELECTION....................................................................................................... 11
4.3 CHANNEL MULTIPLEXER OUTPUT SELECTION .................................................................................. 11
4.4 ANALOG OUTPUT ON AX, AY AND AZ.............................................................................................. 12
4.5 SELF TEST................................................................................................................................... 12
4.6 POLARITY OF THE ACCELERATION OUTPUT ..................................................................................... 14
4.7 PIN CONFIGURATION (TOP VIEW, PADS NOT VISIBLE)........................................................................ 15
4.8 CONNECTING DIAGRAM................................................................................................................. 16
4.8.1 Full feature operation............................................................................................................ 16
4.8.2 Simple 3-channel operation.................................................................................................. 16
4.8.3 Customizing bandwidth and noise........................................................................................ 17
4.9 HANDLING INSTRUCTION ............................................................................................................... 17
5 PACKAGE .......................................................................................................................................... 18
5.1 OUTLINE DIMENSIONS................................................................................................................... 18
5.2 PRINTED CIRCUIT BOARD (PCB) DESIGN ........................................................................................ 19
5.3 MARKING .................................................................................................................................... 20
5.3.1 Mass production samples..................................................................................................... 20
5.3.2 Engineering samples ............................................................................................................ 20
5.4 MOISTURE SENSITIVITY LEVEL AND SOLDERING............................................................................... 21
5.5 TAPE AND REEL SPECIFICATION ..................................................................................................... 22
5.5.1 Orientation ............................................................................................................................ 23
5.6 ROHS COMPLIANCY ..................................................................................................................... 24
5.7 HALOGEN CONTENT ..................................................................................................................... 24
5.8 NOTE ON INTERNAL PACKAGE STRUCTURE ..................................................................................... 24
Rev. 1.3 Page 4 / proprietary information 11 February 2010
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.