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41
1
BLM21 Series(2012 Size)
2.0±0.2
0.5±0.2 *2
1.25±0.2
*1 BLM21B222S / B272S :1.25±0.2
*2
EIA CODE : 0805
BLM21B272S : 0.3±0.2
in mm
0.85±0.2 *1
Part Number Impedance (at 100MHz)
(ohm) Rated Current
(mA) DC Resistance(max.)
(ohm) Operating Temperature Range
(°C)
BLM21AG121SN1 120 ±25% 200 0.15 -55 to 125
BLM21AG151SN1 150 ±25% 200 0.15 -55 to 125
BLM21AG221SN1 220 ±25% 200 0.20 -55 to 125
BLM21AG331SN1 330 ±25% 200 0.25 -55 to 125
BLM21AG471SN1 470 ±25% 200 0.25 -55 to 125
BLM21AG601SN1 600 ±25% 200 0.30 -55 to 125
BLM21AG102SN1 1000 ±25% 200 0.45 -55 to 125
BLM21AH102SN1 1000 ±25% 200 0.45 -55 to 85
BLM21AJ401SN1 400 ±25% 200 0.85 -55 to 125
BLM21AJ601SN1 600 ±25% 200 1.10 -55 to 125
BLM21BB050SN1 5 ±25% 500 0.07 -55 to 125
BLM21BB600SN1 60 ±25% 200 0.20 -55 to 125
BLM21BB750SN1 75 ±25% 200 0.25 -55 to 125
BLM21BB121SN1 120 ±25% 200 0.25 -55 to 125
BLM21BB151SN1 150 ±25% 200 0.25 -55 to 125
BLM21BB201SN1 200 ±25% 200 0.35 -55 to 125
BLM21BB221SN1 220 ±25% 200 0.35 -55 to 125
BLM21BB331SN1 330 ±25% 200 0.40 -55 to 125
BLM21BB471SN1 470 ±25% 200 0.45 -55 to 125
BLM21BD121SN1 120 ±25% 200 0.25 -55 to 125
BLM21BD151SN1 150 ±25% 200 0.25 -55 to 125
BLM21BD221SN1 220 ±25% 200 0.25 -55 to 125
BLM21BD331SN1 330 ±25% 200 0.30 -55 to 125
BLM21BD421SN1 420 ±25% 200 0.30 -55 to 125
BLM21BD471SN1 470 ±25% 200 0.35 -55 to 125
BLM21BD601SN1 600 ±25% 200 0.35 -55 to 125
BLM21BD751SN1 750 ±25% 200 0.40 -55 to 125
BLM21BD102SN1 1000 ±25% 200 0.40 -55 to 125
BLM21BD152SN1 1500 ±25% 200 0.45 -55 to 125
BLM21BD182SN1 1800 ±25% 200 0.50 -55 to 125
BLM21BD222TN1 2200 ±25% 200 0.60 -55 to 125
BLM21BD222SN1 2250 (Typ.) 200 0.60 -55 to 125
BLM21BD272SN1 2700 ±25% 200 0.80 -55 to 125
BLM21PG220SN1 22 (Typ.) 6000 0.01 -55 to 125
BLM21PG300SN1 30 (Typ.) 3000 0.015 -55 to 125
BLM21PG600SN1 60 (Typ.) 3000 0.025 -55 to 125
BLM21PG221SN1 220 (Typ.) 2000 0.050 -55 to 125
BLM21PG331SN1 330 (Typ.) 1500 0.09 -55 to 125
BLM21RK121SN1 120 ±25% 200 0.15 -55 to 125
BLM21RK221SN1 220 ±25% 200 0.20 -55 to 125
BLM21RK471SN1 470 ±25% 200 0.25 -55 to 125
BLM21RK601SN1 600 ±25% 200 0.30 -55 to 125
Continued on the following page.
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42
1Part Number Impedance (at 100MHz)
(ohm) Rated Current
(mA) DC Resistance(max.)
(ohm) Operating Temperature Range
(°C)
Continued from the preceding page.
BLM21RK102SN1 1000 ±25% 200 0.50 -55 to 125
BLM21P series require derating above 85°C ambient. Please contact us for details.
■ Equivalent Cirucit
(Resistance element becomes dominant
at high frequencies.)
■ Impedance-Frequency (Typical)
BLM21A Series
1200
900
600
300
01 10 100 1000
AH102SN1
AJ601SN1
AG331SN1
AG221SN1
AG601SN1
AG471SN1
AG121SN1
AG102SN1
AJ401SN1
AG151SN1
Frequency (MHz)
Impedance (Ω)
■ Impedance-Frequency Characteristics
BLM21AG121SN1
200
150
100
50
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21AG151SN1
200
150
100
50
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21AG221SN1
400
300
200
100
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21AG331SN1
400
300
200
100
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
Continued on the following page.
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1
Continued from the preceding page.
■ Impedance-Frequency Characteristics
BLM21AG471SN1
800
600
400
200
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21AG601SN1
800
600
400
200
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21AG102SN1
1200
900
600
300
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21AH102SN1
1200
900
600
300
01 10 100 1000
R
X
Z
Frequency (MHz)
Impedance (Ω)
BLM21AJ401SN1
600
450
300
150
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21AJ601SN1
800
600
400
200
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
■ Impedance-Frequency (Typical)
BLM21BB_SN1
2000
1500
1000
500
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
BB151SN1
BB121SN1
BB471SN1
BB201SN1
BB600SN1
BB331SN1
BB221SN1
BB750SN1
BB050SN1
BLM21BD_SN1/TN1
3200
2400
1600
800
01 10 100 1000
BD331SN1
BD471SN1
BD221SN1
BD152SN1
BD151SN1
BD121SN1
BD601SN1
BD222TN1
BD102SN1
BD751SN1
BD272SN1
BD222SN1
BD182SN1
BD421SN1
Frequency (MHz)
Impedance (Ω)
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44
1■ Impedance-Frequency Characteristics
BLM21BB050SN1
40
30
20
10
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
Z
R
X
BLM21BB600SN1
400
300
200
100
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BB750SN1
400
300
200
100
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BB121SN1
600
450
300
150
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BB151SN1
800
600
400
200
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BB201SN1
1200
900
600
300
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BB221SN1
1000
750
500
250
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BB331SN1
1200
900
600
300
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
Continued on the following page.
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1
Continued from the preceding page.
■ Impedance-Frequency Characteristics
BLM21BB471SN1
2000
1500
1000
500
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BD121SN1
400
300
200
100
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BD151SN1
400
300
200
100
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BD221SN1
600
450
300
150
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BD331SN1
800
600
400
200
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BD421SN1
1000
750
500
250
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BD471SN1
1200
900
600
300
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BD601SN1
1200
900
600
300
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
Continued on the following page.
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1
Continued from the preceding page.
■ Impedance-Frequency Characteristics
BLM21BD751SN1
1600
1200
800
400
01 10 100 1000
R
X
Z
Frequency (MHz)
Impedance (Ω)
BLM21BD102SN1
2000
1500
1000
500
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BD152SN1
2400
1800
1200
600
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BD182SN1
2400
1800
1200
600
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BD222TN1
2400
1800
1200
600
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BD222SN1
3200
2400
1600
800
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
BLM21BD272SN1
3200
2400
1600
800
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
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1
■ Impedance-Frequency (Typical)
BLM21P Series
600
450
300
150
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
PG220SN1
PG600SN1
PG300SN1
PG221SN1
PG331SN1
■ Impedance-Frequency Characteristics
BLM21PG220SN1
30
20
10
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
Z
R
X
40 BLM21PG300SN1
45
30
15
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
Z
R
X
60
BLM21PG600SN1
90
60
30
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
Z
R
X
120
BLM21PG221SN1
300
200
100
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
Z
R
X
400
BLM21PG331SN1
600
450
300
150
01 10 100 1000
Frequency (MHz)
Impedance (Ω)
R
X
Z
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48
1■ Impedance-Frequency (Typical)
BLM21R Series
1200
900
600
300
01 10 100 1000
RK601SN1
RK471SN1
RK121SN1
RK102SN1
RK221SN1
Frequency (MHz)
Impedance (Ω)
■ Impedance-Frequency Characteristics
BLM21RK121SN1
200
150
100
50
01 10 100 1000
Z
R
X
Frequency (MHz)
Impedance (Ω)
BLM21RK221SN1
300
225
150
75
01 10 100 1000
Z
R
X
Frequency (MHz)
Impedance (Ω)
BLM21RK471SN1
600
450
300
150
01 10 100 1000
Z
R
X
Frequency (MHz)
Impedance (Ω)
BLM21RK601SN1
1000
750
500
250
01 10 100 1000
Z
R
X
Frequency (MHz)
Impedance (Ω)
BLM21RK102SN1
1200
900
600
300
01 10 100 1000
Z
R
X
Frequency (MHz)
Impedance (Ω)
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!Waveform Distortion Suppressing
Performance of BLM--R Series
Type of Filter
Initial
(No filter)
Resister (47Ω) is used
BLM18RK221SN1
(220Ω at 100MHz)
is used
EMI Suppression Effect / Description
Ringing is caused on the signal waveform
Such ringing contains several hundred MHz harmonic components and generates noise.
[Measuring Circuits]
Signal waveform (100nsec/div, 2V/div) Expand (10nsec/div, 2V/div) Spectrum
Frequency [MHz]
30 30050 100 150 200 250
45
85
50
55
60
65
70
75
80
Level [dBµV]
Comparing initial waveform, ringing is suppresed a little.
However there still remains high level waveform distortion.
Signal waveform (100nsec/div, 2V/div) Expand (10nsec/div, 2V/div) Spectrum
Frequency [MHz]
30 30050 100 150 200 250
45
85
50
55
60
65
70
75
80
Level [dBµV]
BLM18R has excellent performance for noise suppression and waveform distortion suppression.
BLM18R suppresses drastically not only spectrum level in more than 100MHz range but waveform distortion.
Signal waveform (100nsec/div, 2V/div) Expand (10nsec/div, 2V/div) Spectrum
Frequency [MHz]
30 30050 100 150 200 250
45
85
50
55
60
65
70
75
80
Level [dBµV]
AC04
Filter
Measuring Point
AC00
Pattern20cm
1MHz
EMI Suppression Effect
Noise Suppression Effect of BLM_R Series
54
1
17
Chip Ferrite Bead .............P.24–65 ..........P.129–130
BL01 BL02RN1R3J2B BL02RN2R3J2B
BL02RN1 BL02RN2R1M2B BL03RN2R1M1B
BLM18 BLM21BLM15
BLA31
BLM31 BLM41
Ferrite Bead Inductor
[Equivalent Circuit]
[Impedance-Frequency Characteristics(typical)]
oChip Ferrite Bead
oFerrite Bead Inductor
" Inductor type EMI suppression filters are effective for fre-
quencies ranging from a few MHz to a few GHz. Inductor
type filters are widely used as a low noise
countermeasure, as well as a universal noise
suppression component.
"The inductor type EMIFILr produce a micro inductance in
the low frequency range. At high frequencies, however,
the resistive component of the inductor produces the
primary impedance. When inserted in series in the noise
producing circuit, the resistive impedance of the inductor
prevents noise propagation.
Outlines of EMI Suppression Filter (EMIFILr) for DC Line
0
200
400
600
800
1000
1 10 100 1000
Impedance [Ω]
Frequency [MHz]
R : Real Part (Resistive Portion) X : Imaginary Part (Inductive Portion)
X
R
Z
R(f)
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ty
102
q
BL
u
S
r
AG
e
18 1
o
D
w
M
i
N
(Global Part Number)
Chip EMIFILr Inductor Type
eDimension (LgW)
Code
1.00g0.50mm
1.60g0.80mm
2.00g1.25mm
3.20g1.60mm
3.20g2.50mm
4.50g1.60mm
Dimension (LgW)
0402
0603
0805
1206
1210
1806
EIA
15
18
21
31
32
41
qProduct ID
BL Chip Ferrite Beads
Product ID
wType
A
M
D
Array Type
Monolithic Type
Monoblock Type
Code Type
rCharacteristics
Code
for General Use
for High-speed Signal Lines
for Power Supplies
for Digital Interface
for GHz Band General Use
for GHz Band High-speed Signal Line
Characteristics
Ap *1
Bp *2
Pp *3
RK
HG
HD
tImpedance
Expressed by three figures. The unit is in ohm (Ω). The first and
second figures are significant digits, and the third figure
expresses the number of zeros which follow the two figures.
yPerformance
Expressed by an alphabet.
uCategory
N
H
Standard Type
for Automotive Electoronics
Code Category
SSn Plating
Code Performance
iNumbers of Circuit
1
4
6
8
1Circuit
4Circuit
6Circuit
8Circuit
Code Numbers of Circuit
oPackaging
K
L
B
J
D
C
Plastic Taping (ø330mm Reel)
Plastic Taping (ø180mm Reel)
Bulk
Paper Taping (ø330mm Reel)
Paper Taping (ø180mm Reel)
Bulk Case
Code Packaging
*1 For standard type, p is expressed by "G".
*2 p is expressed by "A", "B" or "D".
*3 p is expressed by "G", "M", "B", "F".
Ex.)
2
o Part Numbering The structure of the "Global Part Numbers" that have been adopted since June 2001 and the meaning of each code are described herein.
If you have any questions about details, inquire at your usual Murata sales office or distributor.
()
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1
Continued on the following page.
1. Standard Land Pattern Dimensions
Do not apply narrower pattern than listed above to
BLM_P.
Narrow pattern can cause excessive heat or open circuit.
BLM15 (Reflow)
BLM18 (Flow)
BLM18 (Reflow)
BLM21
BLM31
BLM41
∗
∗BLM15 is specially adapted for refiow soldering.
1.0
1.6
1.6
2.0
3.2
4.5
0.5
0.8
0.8
1.25
1.6
1.6
Type Size (mm)
L
0.4
0.7
0.7
1.2
2.0
3.0
a
1.2-1.4
2.2-2.6
1.8-2.0
3.0-4.0
4.2-5.2
5.5-6.5
bW
0.5
0.7
0.7
1.0
1.2
1.2
c
c
a
b
BLM Series
(Except BLM21P/31P/41P) BLM21P/31P/41P
BLM21PG331SN1
BLM21PG221SN1
BLM21PG300SN1
BLM21PG600SN1
BLM21PG220SN1
BLM31PG330SN1
BLM31PG500SN1
BLM31PG121SN1
BLM31PG391SN1
BLM31PG601SN1
BLM41PF800SN1
BLM41PG102SN1
BLM41PG471SN1
BLM41PG750SN1
BLM41PG181SN1
BLM41PG600SN1
1.5
2
3
6
6
3
2
1.5
1
1.5
2
3
6
1.0
1.2
1.2
Type
Size (mm)
Land pad thickness
and Dimension d
Rated
Current
(A)
1.2
2.0
3.0
a
3.0-4.0
4.5-5.2
5.5-6.5
b c
1.0
1.2
2.4
6.4
2.4
1.2
2.4
6.4
1.0
1.0
1.2
3.3
1.2
1.2
1.2
3.3
1.00
1.00
1.00
1.65
1.20
1.20
1.20
1.65
18µm 35µm 70µm
2. Solder Paste Printing and Adhesive Application
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions. If too much
solder is applied, the chip will prone to be damaged by
mechanical and thermal stress from the PCB and may
crack. In contrast, if too little solder is applied, there is the
potential that the termination strength will be insufficient,
creating the potential for detachment. Standard land
dimensions should be used for resist and copper foil
patterns.
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions. If
too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
a
b
d (Pattern)
c
Land Pattern
Solder Resist
Flow Mounting in High Density for BLM31/41
c
b d
a
2.5 Pitch
e
BLM31
BLM41
2.0
3.0
1.2
1.2
Type Size (mm)
a
1.3
1.8
d
4.2-5.2
5.5-6.5
b c
1.35
1.5
e
BLM Series Notice (Soldering and Mounting)
60
2
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2
Continued from the preceding page.
Continued on the following page.
(1) Solder Paste Printing
BLM Series
o Ensure that solder is applied smoothly to a minimum
height of 0.2mm to 0.3mm at the end surface of the
part.
o Coat the solder paste a thickness of 100µm to 200µm.
(2) Adhesive Application
BLM Series
o Coating amount is illustrated in the following diagram.
(1) SOLDERING METHODS
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
o Ensure that solder is applied smoothly to a minimum
height of 0.2mm to 0.3mm at the end surface of the
part.
o Coat the solder paste a thickness of 100µm to 200µm.
(2) SOLDERING TEMPERATURE AND TIME
To prevent external electrode solder leaching and
performance deterioration, solder within the temperature
and time combinations illustrated by the slanted lines in
the following graphs. If soldering is repeated, please note
that the allowed time is the accumulated time.
Solder : H60A H63A solder(JIS Z 3238)
Flux :
o Use Rosin-based fulx(when using RA type solder, clean
products sufficiently to avoid residual fulx.
o Do not use strong acidic fulx(with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble fulx.
3. Standard Soldering Conditions
0.2−0.3mm min
a:20µm−70µm
b:30µm−35µm
c:50µm−105µm
c
a
b
Chip Solid Inductor
Bonding agent
LandPCB
270
280
260
250
240
230
0 5 10 15 20 25 30
Time [s]
Time [s]
Temperature [°C]
270
280
260
250
240
230
0 20 30 40 50 60 70 80 90
Temperature [°C]
BLM
Allowable Flow Soldering Temperature and Time
Allowable Reflow Soldering Temperature and Time
BLM
(Except for BLM15)
BLM Series Notice (Soldering and Mounting)
61
2
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3
Continued from the preceding page.
(3) SOLDERING CONDITIONS
(4) REWORKING WITH SOLDER IRON
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating : 150°C 60 second Min.
Soldering iron power output : 30W Max.
Temperature of soldering iron tip : 280°C Max.
Soldering time : 10 second Max.
Do not allow the tip of the soldering iron directly to
contact the chip.
For additional methods of reworking with soldering iron,
please contact Murata engineering.
4. Cleaning
Flow Solder
Reflow Solder
Temperature [°C]
300
250
200
150
100
50
0
Pre-heating
Gradual cooling
(in air)
Soldering
60s Min. 10s Max.
Temperature [°C]
300
250
200
150
100
50
0
Pre-heating
Gradual cooling
(in air)
Soldering
60s Min. 60s Max. 20s Max.
230°C
183°C
Max. Temp. 230°C
Max. Temp. 250°C
Following conditions should be observed when cleaning
chip EMI filter.
(1) Cleaning Temperature : 60degree C max. (40degree C
max. for CFC alternatives and alcohol cleaning agents)
(2) Ultrasonic
Output : 20W/liter max.
Duration : 5 minutes max.
Frequency : 28kHz to 40kHz
(3) Cleaning agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
a) CFC alternatives and alcohol cleaning agents
Isopropyl alcohol (IPA)
HCFC-225
b) Aqueous cleaning agent
Surface active agent (Clean Thru 750H)
Hydrocarbon (Techno Cleaner 335)
High grade alcohol (Pine Alpha ST-100S)
Alkaline saponifier ( Aqua Cleaner 240 -cleaner should
be diluted within 20% using deionized water.)
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
(5) Some products may become slightly whitened.
However, product performance or usage is not affected.
For additional cleaning methods, please contact Murata
engineering.
4. Cleaning
BLM Series Notice (Soldering and Mounting)
62
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