TQP7M9104 2W High Linearity Amplifier Applications Repeaters BTS Transceivers BTS High Power Amplifiers CDMA / WCDMA / LTE General Purpose Wireless 24-pin QFN 4x4mm SMT Package Product Features Functional Block Diagram 700-4000 MHz +32.8 dBm P1dB +49.5 dBm Output IP3 15.8 dB Gain @ 2140 MHz +5V Single Supply, 435 mA Collector Current Internal RF overdrive protection Internal DC overvoltage protection Internal Active Bias On chip ESD protection Shut-down Capability Capable of handling 10:1 VSWR @ 5Vcc, 2.14 GHz, 32.8 dBm CW Pout or 23.5 dBm WCDMA Pout General Description Pin Configuration The TQP7M9104 is a high linearity driver amplifier in industry standard, RoHS compliant, QFN surface mount package. This InGaP/GaAs HBT delivers high performance across 700-4000 GHz range of frequencies with 15.8 dB Gain, +49.5 dBm OIP3 and +32.5 dBm P1dB at 2.14 GHz while only consuming 435 mA quiescent collector current. All devices are 100% RF and DC tested. Pin # The TQP7M9104 incorporates on-chip features that differentiate it from other products in the market. The amplifier integrates an on-chip DC over-voltage and RF over-drive protection. This protects the amplifier from electrical DC voltage surges and high input RF input power levels that may occur in a system. The TQP7M9104 is targeted for use as a driver amplifier in wireless infrastructure where high linearity, medium power, and high efficiency are required. The device is an excellent candidate for transceiver line cards and high power amplifiers in current and next generation multicarrier 3G / 4G base stations. Symbol 1 2, 3, 6, 7, 8, 9, 10, 11, 12,13, 17, 19, 20, 21, 22, 23, 24 4, 5 14, 15, 16 18 Vbias GND / NC RFin RFout/Vcc Iref Ordering Information Part No. Description TQP7M9104 TQP7M9104-PCB900 TQP7M9104-PCB2140 2 W High Linearity Amplifier TQP7M9104 920-960MHz EVB TQP7M9104 2.11-2.17GHz EVB Standard T/R size =2500 pieces on a 13" reel. Advanced Data Sheet: Rev C 10/17/11 (c) 2011 TriQuint Semiconductor, Inc. - 1 of 11- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network(R) TQP7M9104 2W High Linearity Amplifier Specifications Recommended Operating Conditions Absolute Maximum Ratings Parameter Rating Parameter Storage Temperature Device Voltage, Vcc Maximum Input Power, CW -65 to +150 oC 6.5 V +30 dBm Vcc Tcase Tj (for>106 hours MTTF) Operation of this device outside the parameter ranges given above may cause permanent damage. Min Typ Max Units +5 -40 +5.25 +85 160 V C o C o Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Test Conditions:VCC = +5V, ICQ = 435 mA, T = 25C using a TQP7M9104-PCB2140 application circuit. Parameter Operational Bandwidth Test Frequency Power Gain Input Return Loss Output Return Loss Output IP3 (+17 dBm/tone, f = 1 MHz) WCDMA Channel Power (at -50 dBc ACLR) Conditions Min Typical 700 2140 15.8 12 9.5 +49.5 23.8 +32.8 4.4 435 +5 19 15.7 See Note 1. See Note 2. Output P1dB Noise Figure Quiescent Collector Current, Icq Vcc Iref Thermal Resistance (jnc to case) jc Max Units 4000 MHz MHz dB dB dB dBm dBm dBm dB mA V mA o C/W Notes: 1. OIP3 is measured with 1 MHz tone spacing. 2. Using W-CDMA 3GPP Test Model 1+64 DPCH, PAR = 9.7 dB @ 0.01% Probability, 3.84 MHz BW Advanced Data Sheet: Rev C 10/17/11 (c) 2011 TriQuint Semiconductor, Inc. - 2 of 11- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network(R) TQP7M9104 2W High Linearity Amplifier Application Circuit 920-960 MHz (TQP7M9104-PCB900) Notes: 1. See PC Board Layout under Application Information section for more information. 2. Components shown on the silkscreen but not on the schematic are not used. 3. 0 resistor may be replaced with copper trace in the target application layout. 4. Iref can be used as device power down current by placing R7 at location R8. 5. The recommended component values are dependent upon the frequency of operation. 6. All components are of 0603 size unless stated on the schematic. 7. R1 is critical for device linearity performance. 8. Critical component placement locations: Distance between center of C8 and TQP7M9104 (U1) device package is 190 mil. Distance between center of L5 and TQP7M9104 (U1) device package is 452 mil. Distance between center of C2 and TQP7M9104 (U1) device package is 305 mil. Distance between center of C9 and TQP7M9104 (U1) device package is 275 mil. Bill of Material Ref Des Value Description Manuf. Part Number U1 n/a 2W High Linearity Amplifier TriQuint TQP7M9104 n/a C8 C9 B1, L3, L4, R3 L5 C3 C2 C10 C1, C14, C15, C11 L1 C17 C13 C7 R2 R6 R7 R1 R8, R4, C12, C4,D3 n/a 6.8 pF 2.7 pF 0 6.8 nH 4.7 pF 8.2 pF 22 pF 100 pF 18 nH 1000 pF 0.1 uF 10 uF 51 220 110 33 nH n/a Printed Circuit Board Capacitor, Chip, 0603, 0.05pF, 50 V, Accu-P Capacitor, Chip, 0603, 0.05pF, 50 V, Accu-P Resistor, Chip, 0603, 5%, 1/16W Inductor, 0603, 5% Capacitor, Chip, 0603, 0.05pF, 50 V, Accu-P Capacitor, Chip, 0603, 0.05pF, 50 V, Accu-P Capacitor, Chip, 0603, 5%, 50 V, NPO/COG Capacitor, Chip, 0603, 5%, 50V, NPO/COG Inductor, 0805, 5%, Coilcraft CS Series Capacitor, Chip, 0603, 10%, 50V, NPO/COG Capacitor, Chip, 0603, 50V, X5R, 10% Capacitor , Tantalum, 6032, 35V, 10% Resistor, Chip, 0603, 5%, 1/16W Resistor, Chip, 0603, 1%, 1/16W Resistor, Chip, 0603, 1%, 1/16W Inductor, 0603, 5% Do Not Place TriQuint AVX AVX various Toko AVX AVX various various Coilcraft various various various various various various Toko 1078282 06035J6R8ABSTR 06035J2R7ABSTR Advanced Data Sheet: Rev C 10/17/11 (c) 2011 TriQuint Semiconductor, Inc. - 3 of 11- LL1608-FSL6N8 06035J4R7ABSTR 06035J8R2ABSTR 0805CS-330XJLB LL1608-FSL33N Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network(R) TQP7M9104 2W High Linearity Amplifier Typical Performance 920-960 MHz Frequency MHz 920 940 960 Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (+23 dBm/tone, f = 1 MHz) WCDMA Channel power (at -50 dBc ACLR) [1] Supply Voltage, Vcc Quiescent Collector Current, Icq Reference Current , Iref dB dB dB dBm dBm dBm V mA mA 20.8 -13 -9 +33.9 +45 +24 21 -12 -11.8 +33.8 +45 +23.5 +5 435 19 21 -11 -15 +33.4 +45 +23 Notes: 1. ACLR Test set-up: 3GPP WCDMA, TM1+64 DPCH, +5 MHz offset, PAR = 9.7 dB at 0.01% Prob. RF Performance Plots 920-960 MHz Gain vs. Frequency 23 0 Return Loss (dB) Gain (dB) 22 21 20 - 40 C +25C +85 C 19 18 0.90 0.92 0.94 0.96 0.98 - 40 C +25C +85 C -5 -10 -15 -20 0.90 1.00 Input Return Loss vs. Frequency 0.92 0.94 Frequency (GHz) Output Return Loss vs. Frequency 37 - 40 C +25C +85 C -5 -10 -15 -20 0.90 0.98 1.00 P1dB vs. Temperature +85C +25C -40C 36 P1dB (dBm) Return Loss (dB) 0 0.96 Frequency (GHz) 35 34 33 0.92 0.94 0.96 0.98 1.00 32 0.92 Frequency (GHz) Advanced Data Sheet: Rev C 10/17/11 (c) 2011 TriQuint Semiconductor, Inc. 0.93 0.94 0.95 0.96 Frequency (GHz) - 4 of 11- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network(R) TQP7M9104 2W High Linearity Amplifier OIP3 vs. Output Power vs. Temperature 55 OIP3 vs. Output Power vs. Frequency 55 1MHz Tone Spacing 1MHz Tone Spacing Temp.=+25oC 50 OIP3 (dBm) OIP3 (dBm) 50 45 40 - 40 C +25C +85 C 35 45 40 0.92 GHz 35 0.94 GHz 0.96 GHz 30 30 21 22 23 24 25 26 27 21 22 Output Power / Tone(dBm) ACLR vs. Output Power vs. Temperature -40 25 26 27 -50 -55 - 40 C +25C +85 C -60 Temp.=+25oC W-CDMA 3GPP Test Model 1+64 DPCH PAR = 9.7dB @ 0.01% Probability 3.84 MHz BW -45 Frequency : 0.94 GHz ACLR (dBm) ACLR (dBm) 24 ACLR vs. Output Power vs. Frequency -40 W-CDMA 3GPP Test Model 1+64 DPCH PAR = 9.7dB @ 0.01% Probability 3.84 MHz BW -45 23 Output Power / Tone(dBm) -50 -55 0.92 GHz -60 0.94 GHz 0.96 GHz -65 -65 12 14 16 18 20 22 24 26 12 14 16 Output Power (dBm) 20 22 24 26 Collector Current vs. Output Power 1100 1000 18 Output Power (dBm) Frequency : 0.94 GHz CW Signal Temp.=+25oC Icc (mA) 900 800 700 600 500 400 16 18 20 22 24 26 28 30 32 34 Output Power (dBm) Advanced Data Sheet: Rev C 10/17/11 (c) 2011 TriQuint Semiconductor, Inc. - 5 of 11- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network(R) TQP7M9104 2W High Linearity Amplifier 19 20 GND/NC 12 GND/NC 21 GND/NC GND/NC 11 23 22 GND/NC GND/NC 10 GND/NC GND/NC 9 GND/NC 8 GND/NC GND/NC 7 GND/NC 24 Application Circuit 2110-2170 MHz (TQP7M9104-PCB2140) Notes: 1. See PC Board Layout under Application Information section for more information. 2. Components shown on the silkscreen but not on the schematic are not used. 3. 0 resistor may be replaced with copper trace in the target application layout. 4. Iref can be used as device power down current by placing R7 at location R8. 5. The recommended component values are dependent upon the frequency of operation. 6. All components are of 0603 size unless stated on the schematic. 7. R1 is critical for device linearity performance. 8. Critical component placement locations: Distance between center of C8 and TQP7M9104 (U1) device package is 50 mil. Distance between center of C2 and TQP7M9104 (U1) device package is113 mil. Distance between center of C9 and TQP7M9104 (U1) device package is 275 mil. Bill of Material Ref Des U1 n/a C8 C9 C2 B1, L3, L4, R3, C11 C10, C15 C1, C14, C3 L1 C17 C13 C7 R2 R6 R7 R1 R8, R4, C12, C4, D3 Value Description Manuf. Part Number n/a n/a 1.5 pF 2.4 pF 2.7 pF 0 22 pF 100 pF 18 nH 1000 pF 0.1 uF 10 uF 51 220 110 120 nH n/a 2W High Linearity Amplifier Printed Circuit Board Capacitor, Chip, 0603, 0.05pF, 50V, Accu-P Capacitor, Chip, 0603, 0.05pF, 50V, Accu-P Capacitor, Chip, 0603, 0.05pF, 50V, Accu-P Resistor, Chip, 0603, 5%, 1/16W Capacitor, Chip, 0603, 5%, 50V, NPO/COG Capacitor, Chip, 0603, 5%, 50V, NPO/COG Inductor, 1008, 5%, Ceramic Capacitor, Chip, 0603, 10%, 50V, NPO/COG Capacitor, Chip, 0603, 10%, 50V, X5R Capacitor , Tantalum, 6032, 20 %, 50V Resistor, Chip, 0603, 5%, 1/16W Resistor, Chip, 0603, 1%, 1/16W Resistor, Chip, 0603, 1%, 1/16W Inductor, 0603, 5% Do Not Place TriQuint TriQuint AVX AVX AVX various various various Coilcraft various various various various various various Toko TQP7M9104 1078282 06035J1R5ABSTR 06035J2R4ABSTR 06035J2R7ABSTR Advanced Data Sheet: Rev C 10/17/11 (c) 2011 TriQuint Semiconductor, Inc. - 6 of 11- 1008HQ-18NXJL LL1608-FSLR12J Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network(R) TQP7M9104 2W High Linearity Amplifier Typical Performance 2110-2170 MHz Frequency MHz 2110 2140 2170 Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (+17 dBm/tone, f = 1 MHz) WCDMA Channel power (at -50 dBc ACLR) [1] Noise Figure Supply Voltage, Vcc Quiescent Collector Current, Icq Reference Current , Iref dB dB dB dBm dBm dBm dB V mA mA 15.8 -12.4 -8.7 +32.9 +49 +23.5 4.4 15.8 -12.0 -9.5 +32.8 +49.5 +23.8 4.4 +5 435 19 15.8 -11.8 -10.5 +32.8 +50 +24.0 4.6 Notes: 1. ACLR Test set-up: 3GPP WCDMA, TM1+64 DPCH, +5 MHz offset, PAR = 9.7 dB at 0.01% Prob. RF Performance Plots 2110-2170 MHz Gain vs. Frequency 18 0 Return Loss (dB) Gain (dB) 17 16 15 - 40C +25C +85C 14 13 2.10 2.12 2.14 2.16 2.18 - 40C +25C +85C -5 -10 -15 -20 2.10 2.20 Input Return Loss vs. Frequency 2.12 Frequency (GHz) Output Return Loss vs. Frequency - 40C +25C +85C -5 2.18 2.20 +85C +25C -40C 34 -10 -15 -20 2.10 2.16 P1dB vs. Temperature 35 P1dB (dBm) Return Loss (dB) 0 2.14 Frequency (GHz) 33 32 31 2.12 2.14 2.16 2.18 2.20 30 2.11 Advanced Data Sheet: Rev C 10/17/11 (c) 2011 TriQuint Semiconductor, Inc. 2.12 2.13 2.14 2.15 2.16 2.17 Frequency (GHz) Frequency (GHz) - 7 of 11- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network(R) TQP7M9104 2W High Linearity Amplifier OIP3 vs. Output Power vs. Temperature 55 OIP3 vs. Output Power vs. Frequency 55 1MHz Tone Spacing 1MHz Tone Spacing Temp.=+25oC 50 OIP3 (dBm) OIP3 (dBm) 50 45 40 - 40 C +25C +85 C 35 45 40 35 2.11 GHz 30 13 15 17 19 21 23 25 13 15 17 Output Power / Tone(dBm) 2.17 GHz 21 23 25 ACLR vs. Output Power vs. Frequency -40 W-CDMA 3GPP Test Model 1+64 DPCH PAR = 9.7dB @ 0.01% Probability 3.84 MHz BW -45 19 Output Power / Tone(dBm) ACLR vs. Output Power vs. Temperature -40 -50 -55 - 40 C +25C +85 C -60 Temp.=+25oC W-CDMA 3GPP Test Model 1+64 DPCH PAR = 9.7dB @ 0.01% Probability 3.84 MHz BW -45 Frequency : 2.14 GHz ACLR (dBm) ACLR (dBm) 2.14 GHz 30 -50 -55 2.11 GHz -60 2.14 GHz 2.17 GHz -65 -65 17 19 21 23 25 27 17 19 Output Power (dBm) Icc vs. Output Power 6.0 Frequency : 2.14 GHz CW Signal 900 23 25 27 Noise Figure vs. Frequency Temp.=+25oC 5.0 800 NF (dB) Collector Current (mA) 1000 21 Output Power (dBm) 700 4.0 600 3.0 500 400 16 18 20 22 24 26 28 30 32 34 2.0 2.11 Output Power (dBm) Advanced Data Sheet: Rev C 10/17/11 (c) 2011 TriQuint Semiconductor, Inc. 2.12 2.13 2.14 2.15 2.16 2.17 Frequency (GHz) - 8 of 11- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network(R) TQP7M9104 2W High Linearity Amplifier GND/NC GND/NC 19 GND/NC 12 GND/NC 20 GND/NC 11 GND/NC 21 GND/NC 22 10 GND/NC 9 GND/NC 23 GND/NC 24 8 GND/NC 7 GND/NC Pin Configuration and Description Pin Symbol Description 1 2, 3, 6,7, 8, 9, 10, 11, 12, 13,17, 19, 20, 21, 22, 23, 24 Vbias Voltage supply for active bias for the amp. Connect to same supply voltage as Vcc. GND/NC No internal connection. This pin can be grounded or N/C on PCB. Land pads should be provided for PCB mounting integrity. 4, 5 RFin 14, 15, 16 RFout / Vcc 18 Iref Backside paddle RF/DC GND RF Input. DC voltage present, blocking capacitor required. Requires external match for optimal performance. RF Output. DC Voltage present, blocking cap required. Requires external match for optimal performance. Reference current into internal active bias current mirror. Current into Iref sets device quiescent current. Also, can be used as on/off control. Multiple Vias should be employed to minimize inductance and thermal resistance. Use recommended via pattern shown under mounting configuration and ensure good solder attach for optimum thermal and electrical performance Applications Information PC Board Layout PCB Material (stackup): 1 oz. Cu top layer 0.014 inch Nelco N4000-13, r=3.7 1 oz. Cu middle layer 1 Core Nelco N4000-13 1 oz. Cu middle layer 2 0.014 inch Nelco N-4000-13 1 oz. Cu bottom layer Finished board thickness is 0.062.006 50 ohm line dimensions: width = .028" The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from supplier to supplier, careful process development is recommended. Advanced Data Sheet: Rev C 10/17/11 (c) 2011 TriQuint Semiconductor, Inc. - 9 of 11- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network(R) TQP7M9104 2W High Linearity Amplifier Mechanical Information Package Information and Dimensions This package is lead-free, RoHS-compliant, and green. The plating material on the pins is annealed matte tin over copper. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes. The component will be laser marked with "7M9104" product label with an alphanumeric lot code on the top surface of the package. 7M9104 Mounting Configuration All dimensions are in millimeters (inches). Angles are in degrees. 16X .38 .64 TYP .50 PITCH, TYP 24X .70 Notes: 1. Ground vias are critical for the proper RF performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. FULL R.19 .64 TYP 2.70 2.70 COMPONENT SIDE 2.70 2.70 BACK SIDE Advanced Data Sheet: Rev C 10/17/11 (c) 2011 TriQuint Semiconductor, Inc. - 10 of 11- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network(R) TQP7M9104 2W High Linearity Amplifier Product Compliance Information Solderability ESD Information ESD Rating: Value: Test: Standard: Class 1C 1000 V and < 2000 V Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV 1000 V min Charged Device Model (CDM) JEDEC Standard JESD22-C101 The plating material on the pins is annealed matte tin over copper. Compatible with both lead-free (maximum 260 C reflow temperature) and tin/lead (maximum 245 C reflow temperature) soldering processes. This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C15H12Br402) Free PFOS Free SVHC Free MSL Rating The part is rated Moisture Sensitivity Level 3 at 260C per JEDEC standard IPC/JEDEC J-STD-020. Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: info-sales@tqs.com Tel: Fax: +1.503.615.9000 +1.503.615.8902 For technical questions and application information: Email: sjcapplications.engineering@tqs.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Advanced Data Sheet: Rev C 10/17/11 (c) 2011 TriQuint Semiconductor, Inc. - 11 of 11- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network(R) Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Qorvo: TQP3M9018-PCB-RF TQP3M9019-PCB-RF TQP4M9071-PCB-IF TQP4M9071-PCB-RF TQP8M9013-PCB2140 TQP3M9008-PCB-IF TQP3M9008-PCB-RF TQP4M0011-PCB TQP3M9038-PCB TriQuint: TQP7M9104 TQP7M9104-PCB2140 TQP7M9104-PCB900