K10P81M72SF1
K10 Sub-Family
Supports: MK10DX64VLK7,
MK10DX128VLK7, MK10DX256VLK7,
MK10DX64VMB7, MK10DX128VMB7,
MK10DX256VMB7
Features
Operating Characteristics
Voltage range: 1.71 to 3.6 V
Flash write voltage range: 1.71 to 3.6 V
Temperature range (ambient): -40 to 105°C
Clocks
3 to 32 MHz crystal oscillator
32 kHz crystal oscillator
Multi-purpose clock generator
System peripherals
10 low-power modes to provide power optimization
based on application requirements
16-channel DMA controller, supporting up to 63
request sources
External watchdog monitor
Software watchdog
Low-leakage wakeup unit
Security and integrity modules
Hardware CRC module to support fast cyclic
redundancy checks
128-bit unique identification (ID) number per chip
Human-machine interface
Low-power hardware touch sensor interface (TSI)
General-purpose input/output
Analog modules
Two 16-bit SAR ADCs
Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
12-bit DAC
Three analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
Voltage reference
Timers
Programmable delay block
Eight-channel motor control/general purpose/PWM
timer
Two 2-channel quadrature decoder/general purpose
timers
Periodic interrupt timers
16-bit low-power timer
Carrier modulator transmitter
Real-time clock
Communication interfaces
Controller Area Network (CAN) module
Two SPI modules
Two I2C modules
Four UART modules
I2S module
Freescale Semiconductor Document Number: K10P81M72SF1
Data Sheet: Technical Data Rev. 2, 4/2012
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2012 Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................3
1.1 Determining valid orderable parts......................................3
2 Part identification......................................................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
3Terminology and guidelines......................................................4
3.1 Definition: Operating requirement......................................4
3.2 Definition: Operating behavior...........................................5
3.3 Definition: Attribute............................................................5
3.4 Definition: Rating...............................................................6
3.5 Result of exceeding a rating..............................................6
3.6 Relationship between ratings and operating
requirements......................................................................6
3.7 Guidelines for ratings and operating requirements............7
3.8 Definition: Typical value.....................................................7
3.9 Typical value conditions....................................................8
4Ratings......................................................................................9
4.1 Thermal handling ratings...................................................9
4.2 Moisture handling ratings..................................................9
4.3 ESD handling ratings.........................................................9
4.4 Voltage and current operating ratings...............................9
5General.....................................................................................10
5.1 AC electrical characteristics..............................................10
5.2 Nonswitching electrical specifications...............................10
5.2.1 Voltage and current operating requirements.........10
5.2.2 LVD and POR operating requirements.................12
5.2.3 Voltage and current operating behaviors..............12
5.2.4 Power mode transition operating behaviors..........13
5.2.5 Power consumption operating behaviors..............14
5.2.6 Designing with radiated emissions in mind...........18
5.2.7 Capacitance attributes..........................................18
5.3 Switching specifications.....................................................19
5.3.1 Device clock specifications...................................19
5.3.2 General switching specifications...........................19
5.4 Thermal specifications.......................................................20
5.4.1 Thermal operating requirements...........................20
5.4.2 Thermal attributes.................................................21
6 Peripheral operating requirements and behaviors....................22
6.1 Core modules....................................................................22
6.1.1 Debug trace timing specifications.........................22
6.1.2 JTAG electricals....................................................23
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.3.1 MCG specifications...............................................25
6.3.2 Oscillator electrical specifications.........................28
6.3.3 32kHz Oscillator Electrical Characteristics............30
6.4 Memories and memory interfaces.....................................31
6.4.1 Flash electrical specifications................................31
6.4.2 EzPort Switching Specifications............................35
6.4.3 Flexbus Switching Specifications..........................36
6.5 Security and integrity modules..........................................39
6.6 Analog...............................................................................39
6.6.1 ADC electrical specifications.................................39
6.6.2 CMP and 6-bit DAC electrical specifications.........48
6.6.3 12-bit DAC electrical characteristics.....................50
6.6.4 Voltage reference electrical specifications............53
6.7 Timers................................................................................54
6.8 Communication interfaces.................................................55
6.8.1 CAN switching specifications................................55
6.8.2 DSPI switching specifications (limited voltage
range)....................................................................55
6.8.3 DSPI switching specifications (full voltage range).56
6.8.4 I2C switching specifications..................................58
6.8.5 UART switching specifications..............................58
6.8.6 I2S/SAI Switching Specifications..........................58
6.9 Human-machine interfaces (HMI)......................................63
6.9.1 TSI electrical specifications...................................63
7 Dimensions...............................................................................64
7.1 Obtaining package dimensions.........................................64
8 Pinout........................................................................................64
8.1 K10 Signal Multiplexing and Pin Assignments..................64
8.2 K10 Pinouts.......................................................................69
9 Revision History........................................................................71
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
2 Freescale Semiconductor, Inc.
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to http://www.freescale.com and perform a part number
search for the following device numbers: PK10 and MK10 .
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## A M FFF R T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field Description Values
Q Qualification status M = Fully qualified, general market flow
P = Prequalification
K## Kinetis family K10
A Key attribute D = Cortex-M4 w/ DSP
F = Cortex-M4 w/ DSP and FPU
M Flash memory type N = Program flash only
X = Program flash and FlexMemory
Table continues on the next page...
Ordering parts
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 3
Field Description Values
FFF Program flash memory size 32 = 32 KB
64 = 64 KB
128 = 128 KB
256 = 256 KB
512 = 512 KB
1M0 = 1 MB
R Silicon revision Z = Initial
(Blank) = Main
A = Revision after main
T Temperature range (°C) V = –40 to 105
C = –40 to 85
PP Package identifier FM = 32 QFN (5 mm x 5 mm)
FT = 48 QFN (7 mm x 7 mm)
LF = 48 LQFP (7 mm x 7 mm)
LH = 64 LQFP (10 mm x 10 mm)
MP = 64 MAPBGA (5 mm x 5 mm)
LK = 80 LQFP (12 mm x 12 mm)
MB = 81 MAPBGA (8 mm x 8 mm)
LL = 100 LQFP (14 mm x 14 mm)
ML = 104 MAPBGA (8 mm x 8 mm)
MC = 121 MAPBGA (8 mm x 8 mm)
LQ = 144 LQFP (20 mm x 20 mm)
MD = 144 MAPBGA (13 mm x 13 mm)
MJ = 256 MAPBGA (17 mm x 17 mm)
CC Maximum CPU frequency (MHz) 5 = 50 MHz
7 = 72 MHz
10 = 100 MHz
12 = 120 MHz
15 = 150 MHz
N Packaging type R = Tape and reel
(Blank) = Trays
2.4 Example
This is an example part number:
MK10DN512ZVMD10
3 Terminology and guidelines
Terminology and guidelines
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
4 Freescale Semiconductor, Inc.
3.1 Definition: Operating requirement
An operating requirement is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
3.1.1 Example
This is an example of an operating requirement, which you must meet for the
accompanying operating behaviors to be guaranteed:
Symbol Description Min. Max. Unit
VDD 1.0 V core supply
voltage
0.9 1.1 V
3.2 Definition: Operating behavior
An operating behavior is a specified value or range of values for a technical
characteristic that are guaranteed during operation if you meet the operating requirements
and any other specified conditions.
3.2.1 Example
This is an example of an operating behavior, which is guaranteed if you meet the
accompanying operating requirements:
Symbol Description Min. Max. Unit
IWP Digital I/O weak pullup/
pulldown current
10 130 µA
3.3 Definition: Attribute
An attribute is a specified value or range of values for a technical characteristic that are
guaranteed, regardless of whether you meet the operating requirements.
Terminology and guidelines
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 5
3.3.1 Example
This is an example of an attribute:
Symbol Description Min. Max. Unit
CIN_D Input capacitance:
digital pins
7 pF
3.4 Definition: Rating
A rating is a minimum or maximum value of a technical characteristic that, if exceeded,
may cause permanent chip failure:
Operating ratings apply during operation of the chip.
Handling ratings apply when the chip is not powered.
3.4.1 Example
This is an example of an operating rating:
Symbol Description Min. Max. Unit
VDD 1.0 V core supply
voltage
–0.3 1.2 V
3.5 Result of exceeding a rating
40
30
20
10
0
Measured characteristic
Operating rating
Failures in time (ppm)
The likelihood of permanent chip failure increases rapidly as
soon as a characteristic begins to exceed one of its operating ratings.
Terminology and guidelines
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
6 Freescale Semiconductor, Inc.
3.6 Relationship between ratings and operating requirements
- No permanent failure
- Correct operation
Normal operating range
Fatal range
Expected permanent failure
Fatal range
Expected permanent failure
Operating rating (max.)
Operating requirement (max.)
Operating requirement (min.)
Operating rating (min.)
Operating (power on)
Degraded operating range Degraded operating range
No permanent failure
Handling range
Fatal range
Expected permanent failure
Fatal range
Expected permanent failure
Handling rating (max.)
Handling rating (min.)
Handling (power off)
- No permanent failure
- Possible decreased life
- Possible incorrect operation
- No permanent failure
- Possible decreased life
- Possible incorrect operation
3.7 Guidelines for ratings and operating requirements
Follow these guidelines for ratings and operating requirements:
Never exceed any of the chip’s ratings.
During normal operation, don’t exceed any of the chip’s operating requirements.
If you must exceed an operating requirement at times other than during normal
operation (for example, during power sequencing), limit the duration as much as
possible.
3.8 Definition: Typical value
A typical value is a specified value for a technical characteristic that:
Lies within the range of values specified by the operating behavior
Given the typical manufacturing process, is representative of that characteristic
during operation when you meet the typical-value conditions or other specified
conditions
Typical values are provided as design guidelines and are neither tested nor guaranteed.
Terminology and guidelines
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 7
3.8.1 Example 1
This is an example of an operating behavior that includes a typical value:
Symbol Description Min. Typ. Max. Unit
IWP Digital I/O weak
pullup/pulldown
current
10 70 130 µA
3.8.2 Example 2
This is an example of a chart that shows typical values for various voltage and
temperature conditions:
0.90 0.95 1.00 1.05 1.10
0
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
150 °C
105 °C
25 °C
–40 °C
VDD (V)
I(μA)
DD_STOP
TJ
3.9 Typical value conditions
Typical values assume you meet the following conditions (or other conditions as
specified):
Symbol Description Value Unit
TAAmbient temperature 25 °C
VDD 3.3 V supply voltage 3.3 V
Terminology and guidelines
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
8 Freescale Semiconductor, Inc.
4 Ratings
4.1 Thermal handling ratings
Symbol Description Min. Max. Unit Notes
TSTG Storage temperature –55 150 °C 1
TSDR Solder temperature, lead-free 260 °C 2
1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.2 Moisture handling ratings
Symbol Description Min. Max. Unit Notes
MSL Moisture sensitivity level 3 1
1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.3 ESD handling ratings
Symbol Description Min. Max. Unit Notes
VHBM Electrostatic discharge voltage, human body model -2000 +2000 V 1
VCDM Electrostatic discharge voltage, charged-device model -500 +500 V 2
ILAT Latch-up current at ambient temperature of 105°C -100 +100 mA
1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
4.4 Voltage and current operating ratings
Symbol Description Min. Max. Unit
VDD Digital supply voltage –0.3 3.8 V
Table continues on the next page...
Ratings
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 9
Symbol Description Min. Max. Unit
IDD Digital supply current 185 mA
VDIO Digital input voltage (except RESET, EXTAL, and XTAL) –0.3 5.5 V
VAIO Analog1, RESET, EXTAL, and XTAL input voltage –0.3 VDD + 0.3 V
IDMaximum current single pin limit (applies to all port pins) –25 25 mA
VDDA Analog supply voltage VDD – 0.3 VDD + 0.3 V
VBAT RTC battery supply voltage –0.3 3.8 V
1. Analog pins are defined as pins that do not have an associated general purpose I/O port function.
5 General
5.1 AC electrical characteristics
Unless otherwise specified, propagation delays are measured from the 50% to the 50%
point, and rise and fall times are measured at the 20% and 80% points, as shown in the
following figure.
Figure 1. Input signal measurement reference
All digital I/O switching characteristics assume:
1. output pins
have CL=30pF loads,
are configured for fast slew rate (PORTx_PCRn[SRE]=0), and
are configured for high drive strength (PORTx_PCRn[DSE]=1)
2. input pins
have their passive filter disabled (PORTx_PCRn[PFE]=0)
5.2 Nonswitching electrical specifications
General
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
10 Freescale Semiconductor, Inc.
5.2.1 Voltage and current operating requirements
Table 1. Voltage and current operating requirements
Symbol Description Min. Max. Unit Notes
VDD Supply voltage 1.71 3.6 V
VDDA Analog supply voltage 1.71 3.6 V
VDD – VDDA VDD-to-VDDA differential voltage –0.1 0.1 V
VSS – VSSA VSS-to-VSSA differential voltage –0.1 0.1 V
VBAT RTC battery supply voltage 1.71 3.6 V
VIH Input high voltage
2.7 V ≤ VDD ≤ 3.6 V
1.7 V ≤ VDD ≤ 2.7 V
0.7 × VDD
0.75 × VDD
V
V
VIL Input low voltage
2.7 V ≤ VDD ≤ 3.6 V
1.7 V ≤ VDD ≤ 2.7 V
0.35 × VDD
0.3 × VDD
V
V
VHYS Input hysteresis 0.06 × VDD V
IICDIO Digital pin negative DC injection current — single pin
VIN < VSS-0.3V -5 mA
1
IICAIO Analog2, EXTAL, and XTAL pin DC injection current
— single pin
VIN < VSS-0.3V (Negative current injection)
VIN > VDD+0.3V (Positive current injection)
-5
+5
mA
3
IICcont Contiguous pin DC injection current —regional limit,
includes sum of negative injection currents or sum of
positive injection currents of 16 contiguous pins
Negative current injection
Positive current injection
-25
+25
mA
VRAM VDD voltage required to retain RAM 1.2 V
VRFVBAT VBAT voltage required to retain the VBAT register file VPOR_VBAT V
1. All 5 V tolerant digital I/O pins are internally clamped to VSS through a ESD protection diode. There is no diode connection
to VDD. If VIN greater than VDIO_MIN (=VSS-0.3V) is observed, then there is no need to provide current limiting resistors at
the pads. If this limit cannot be observed then a current limiting resistor is required. The negative DC injection current
limiting resistor is calculated as R=(VDIO_MIN-VIN)/|IIC|.
2. Analog pins are defined as pins that do not have an associated general purpose I/O port function.
3. All analog pins are internally clamped to VSS and VDD through ESD protection diodes. If VIN is greater than VAIO_MIN
(=VSS-0.3V) and VIN is less than VAIO_MAX(=VDD+0.3V) is observed, then there is no need to provide current limiting
resistors at the pads. If these limits cannot be observed then a current limiting resistor is required. The negative DC
injection current limiting resistor is calculated as R=(VAIO_MIN-VIN)/|IIC|. The positive injection current limiting resistor is
calcualted as R=(VIN-VAIO_MAX)/|IIC|. Select the larger of these two calculated resistances.
General
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 11
5.2.2 LVD and POR operating requirements
Table 2. VDD supply LVD and POR operating requirements
Symbol Description Min. Typ. Max. Unit Notes
VPOR Falling VDD POR detect voltage 0.8 1.1 1.5 V
VLVDH Falling low-voltage detect threshold — high
range (LVDV=01)
2.48 2.56 2.64 V
VLVW1H
VLVW2H
VLVW3H
VLVW4H
Low-voltage warning thresholds — high range
Level 1 falling (LVWV=00)
Level 2 falling (LVWV=01)
Level 3 falling (LVWV=10)
Level 4 falling (LVWV=11)
2.62
2.72
2.82
2.92
2.70
2.80
2.90
3.00
2.78
2.88
2.98
3.08
V
V
V
V
1
VHYSH Low-voltage inhibit reset/recover hysteresis —
high range
±80 mV
VLVDL Falling low-voltage detect threshold — low range
(LVDV=00)
1.54 1.60 1.66 V
VLVW1L
VLVW2L
VLVW3L
VLVW4L
Low-voltage warning thresholds — low range
Level 1 falling (LVWV=00)
Level 2 falling (LVWV=01)
Level 3 falling (LVWV=10)
Level 4 falling (LVWV=11)
1.74
1.84
1.94
2.04
1.80
1.90
2.00
2.10
1.86
1.96
2.06
2.16
V
V
V
V
1
VHYSL Low-voltage inhibit reset/recover hysteresis —
low range
±60 mV
VBG Bandgap voltage reference 0.97 1.00 1.03 V
tLPO Internal low power oscillator period — factory
trimmed
900 1000 1100 μs
1. Rising thresholds are falling threshold + hysteresis voltage
Table 3. VBAT power operating requirements
Symbol Description Min. Typ. Max. Unit Notes
VPOR_VBAT Falling VBAT supply POR detect voltage 0.8 1.1 1.5 V
General
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
12 Freescale Semiconductor, Inc.
5.2.3 Voltage and current operating behaviors
Table 4. Voltage and current operating behaviors
Symbol Description Min. Max. Unit Notes
VOH Output high voltage — high drive strength
2.7 V ≤ VDD ≤ 3.6 V, IOH = -9mA
1.71 V ≤ VDD ≤ 2.7 V, IOH = -3mA
VDD – 0.5
VDD – 0.5
V
V
Output high voltage — low drive strength
2.7 V ≤ VDD ≤ 3.6 V, IOH = -2mA
1.71 V ≤ VDD ≤ 2.7 V, IOH = -0.6mA
VDD – 0.5
VDD – 0.5
V
V
IOHT Output high current total for all ports 100 mA
VOL Output low voltage — high drive strength
2.7 V ≤ VDD ≤ 3.6 V, IOL = 9mA
1.71 V ≤ VDD ≤ 2.7 V, IOL = 3mA
0.5
0.5
V
V
Output low voltage — low drive strength
2.7 V ≤ VDD ≤ 3.6 V, IOL = 2mA
1.71 V ≤ VDD ≤ 2.7 V, IOL = 0.6mA
0.5
0.5
V
V
IOLT Output low current total for all ports 100 mA
IIN Input leakage current (per pin) for full temperature
range
1 μA 1
IIN Input leakage current (per pin) at 25°C 0.025 μA 1
IOZ Hi-Z (off-state) leakage current (per pin) 1 μA
RPU Internal pullup resistors 20 50 2
RPD Internal pulldown resistors 20 50 3
1. Measured at VDD=3.6V
2. Measured at VDD supply voltage = VDD min and Vinput = VSS
3. Measured at VDD supply voltage = VDD min and Vinput = VDD
5.2.4 Power mode transition operating behaviors
All specifications except tPOR, and VLLSxRUN recovery times in the following table
assume this clock configuration:
CPU and system clocks = 72 MHz
Bus clock = 36 MHz
FlexBus clock = 36 MHz
Flash clock = 24 MHz
General
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 13
Table 5. Power mode transition operating behaviors
Symbol Description Min. Max. Unit Notes
tPOR After a POR event, amount of time from the point VDD
reaches 1.71 V to execution of the first instruction
across the operating temperature range of the chip.
300 μs 1
VLLS1 RUN 112 μs
VLLS2 RUN 74 μs
VLLS3 RUN 73 μs
LLS RUN 5.9 μs
VLPS RUN 5.8 μs
STOP RUN 4.2 μs
1. Normal boot (FTFL_OPT[LPBOOT]=1)
5.2.5 Power consumption operating behaviors
Table 6. Power consumption operating behaviors
Symbol Description Min. Typ. Max. Unit Notes
IDDA Analog supply current See note mA 1
IDD_RUN Run mode current — all peripheral clocks
disabled, code executing from flash
@ 1.8V
@ 3.0V
21.5
21.5
25
30
mA
mA
2
IDD_RUN Run mode current — all peripheral clocks
enabled, code executing from flash
@ 1.8V
@ 3.0V
@ 25°C
@ 125°C
31
31
32
34
34
39
mA
mA
mA
3, 4
IDD_WAIT Wait mode high frequency current at 3.0 V — all
peripheral clocks disabled
12.5 mA 2
IDD_WAIT Wait mode reduced frequency current at 3.0 V
— all peripheral clocks disabled
7.2 mA 5
IDD_VLPR Very-low-power run mode current at 3.0 V — all
peripheral clocks disabled
0.996 mA 6
Table continues on the next page...
General
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
14 Freescale Semiconductor, Inc.
Table 6. Power consumption operating behaviors (continued)
Symbol Description Min. Typ. Max. Unit Notes
IDD_VLPR Very-low-power run mode current at 3.0 V — all
peripheral clocks enabled
1.46 mA 7
IDD_VLPW Very-low-power wait mode current at 3.0 V — all
peripheral clocks disabled
0.61 mA 8
IDD_STOP Stop mode current at 3.0 V
@ –40 to 25°C
@ 70°C
@ 105°C
0.35
0.384
0.628
0.567
0.793
1.2
mA
mA
mA
IDD_VLPS Very-low-power stop mode current at 3.0 V
@ –40 to 25°C
@ 70°C
@ 105°C
5.9
26.1
98.1
32.7
59.8
188
μA
μA
μA
IDD_LLS Low leakage stop mode current at 3.0 V
@ –40 to 25°C
@ 70°C
@ 105°C
2.6
10.3
42.5
8.6
29.1
92.5
μA
μA
μA
9
IDD_VLLS3 Very low-leakage stop mode 3 current at 3.0 V
@ –40 to 25°C
@ 70°C
@ 105°C
1.9
6.9
28.1
5.8
12.1
41.9
μA
μA
μA
9
IDD_VLLS2 Very low-leakage stop mode 2 current at 3.0 V
@ –40 to 25°C
@ 70°C
@ 105°C
1.59
4.3
17.5
5.5
9.5
34
μA
μA
μA
IDD_VLLS1 Very low-leakage stop mode 1 current at 3.0 V
@ –40 to 25°C
@ 70°C
@ 105°C
1.47
2.97
12.41
5.4
8.1
32
μA
μA
μA
IDD_VBAT Average current with RTC and 32kHz disabled at
3.0 V
@ –40 to 25°C
@ 70°C
@ 105°C
0.19
0.49
2.2
0.22
0.64
3.2
μA
μA
μA
Table continues on the next page...
General
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 15
Table 6. Power consumption operating behaviors (continued)
Symbol Description Min. Typ. Max. Unit Notes
IDD_VBAT Average current when CPU is not accessing
RTC registers
@ 1.8V
@ –40 to 25°C
@ 70°C
@ 105°C
@ 3.0V
@ –40 to 25°C
@ 70°C
@ 105°C
0.57
0.90
2.4
0.67
1.0
2.7
0.67
1.2
3.5
0.94
1.4
3.9
μA
μA
μA
μA
μA
μA
10
1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See
each module's specification for its supply current.
2. 72MHz core and system clock, 36MHz bus and FlexBus clock, and 24MHz flash clock. MCG configured for FEE mode. All
peripheral clocks disabled.
3. 72MHz core and system clock, 36MHz bus and FlexBus clock, and 24MHz flash clock. MCG configured for FEE mode. All
peripheral clocks enabled.
4. Max values are measured with CPU executing DSP instructions.
5. 25MHz core, system, bus, FlexBus and flash clock. MCG configured for FEI mode.
6. 4 MHz core and system clock, 4 MHz FlexBus and bus clock, and 1 MHz flash clock. MCG configured for BLPE mode. All
peripheral clocks disabled. Code executing from flash.
7. 4 MHz core and system clock, 4 MHz FlexBus and bus clock, and 1 MHz flash clock. MCG configured for BLPE mode. All
peripheral clocks enabled but peripherals are not in active operation. Code executing from flash.
8. 4 MHz core and system clock, 4 MHz FlexBus and bus clock, and 1 MHz flash clock. MCG configured for BLPE mode. All
peripheral clocks disabled.
9. Data reflects devices with 128 KB of RAM.
10. Includes 32kHz oscillator current and RTC operation.
5.2.5.1 Diagram: Typical IDD_RUN operating behavior
The following data was measured under these conditions:
MCG in FBE mode for 50 MHz and lower frequencies. MCG in FEE mode at greater
than 50 MHz frequencies.
No GPIOs toggled
Code execution from flash with cache enabled
For the ALLOFF curve, all peripheral clocks are disabled except FTFL
General
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
16 Freescale Semiconductor, Inc.
Figure 2. Run mode supply current vs. core frequency
General
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 17
Figure 3. VLPR mode supply current vs. core frequency
5.2.6 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
1. Go to http://www.freescale.com.
2. Perform a keyword search for “EMC design.”
5.2.7 Capacitance attributes
Table 7. Capacitance attributes
Symbol Description Min. Max. Unit
CIN_A Input capacitance: analog pins 7 pF
Table continues on the next page...
General
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
18 Freescale Semiconductor, Inc.
Table 7. Capacitance attributes (continued)
Symbol Description Min. Max. Unit
CIN_D Input capacitance: digital pins 7 pF
5.3 Switching specifications
5.3.1 Device clock specifications
Table 8. Device clock specifications
Symbol Description Min. Max. Unit Notes
Normal run mode
fSYS System and core clock 72 MHz
fBUS Bus clock 50 MHz
FB_CLK FlexBus clock 50 MHz
fFLASH Flash clock 25 MHz
fLPTMR LPTMR clock 25 MHz
VLPR mode1
fSYS System and core clock 4 MHz
fBUS Bus clock 4 MHz
FB_CLK FlexBus clock 4 MHz
fFLASH Flash clock 1 MHz
fERCLK External reference clock 16 MHz
fLPTMR_pin LPTMR clock 25 MHz
fLPTMR_ERCLK LPTMR external reference clock 16 MHz
fFlexCAN_ERCLK FlexCAN external reference clock 8 MHz
fI2S_MCLK I2S master clock 12.5 MHz
fI2S_BCLK I2S bit clock 4 MHz
1. The frequency limitations in VLPR mode here override any frequency specification listed in the timing specification for any
other module.
5.3.2 General switching specifications
These general purpose specifications apply to all signals configured for GPIO, UART,
CAN, CMT, and I2C signals.
General
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 19
Table 9. General switching specifications
Symbol Description Min. Max. Unit Notes
GPIO pin interrupt pulse width (digital glitch filter
disabled) — Synchronous path
1.5 Bus clock
cycles
1, 2
GPIO pin interrupt pulse width (digital glitch filter
disabled, analog filter enabled) — Asynchronous path
100 ns 3
GPIO pin interrupt pulse width (digital glitch filter
disabled, analog filter disabled) — Asynchronous path
16 ns 3
External reset pulse width (digital glitch filter disabled) 100 ns 3
Mode select (EZP_CS) hold time after reset
deassertion
2 Bus clock
cycles
Port rise and fall time (high drive strength)
Slew disabled
1.71 ≤ VDD ≤ 2.7V
2.7 ≤ VDD ≤ 3.6V
Slew enabled
1.71 ≤ VDD ≤ 2.7V
2.7 ≤ VDD ≤ 3.6V
12
6
36
24
ns
ns
ns
ns
4
Port rise and fall time (low drive strength)
Slew disabled
1.71 ≤ VDD ≤ 2.7V
2.7 ≤ VDD ≤ 3.6V
Slew enabled
1.71 ≤ VDD ≤ 2.7V
2.7 ≤ VDD ≤ 3.6V
12
6
36
24
ns
ns
ns
ns
5
1. This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In Stop, VLPS, LLS, and VLLSx modes, the synchronizer is bypassed so shorter pulses can be
recognized in that case.
2. The greater synchronous and asynchronous timing must be met.
3. This is the minimum pulse width that is guaranteed to be recognized as a pin interrupt request in Stop, VLPS, LLS, and
VLLSx modes.
4. 75pF load
5. 15pF load
5.4 Thermal specifications
General
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
20 Freescale Semiconductor, Inc.
5.4.1 Thermal operating requirements
Table 10. Thermal operating requirements
Symbol Description Min. Max. Unit
TJDie junction temperature –40 125 °C
TAAmbient temperature –40 105 °C
5.4.2 Thermal attributes
Board type Symbol Description 81 MAPBGA 80 LQFP Unit Notes
Single-layer
(1s)
RθJA Thermal
resistance,
junction to
ambient (natural
convection)
74 51 °C/W 1, 2
Four-layer
(2s2p)
RθJA Thermal
resistance,
junction to
ambient (natural
convection)
42 36 °C/W 1, 3
Single-layer
(1s)
RθJMA Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
62 41 °C/W 1,3
Four-layer
(2s2p)
RθJMA Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
38 30 °C/W 1,3
RθJB Thermal
resistance,
junction to
board
23 20 °C/W 4
RθJC Thermal
resistance,
junction to case
19 10 °C/W 5
ΨJT Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
4 2 °C/W 6
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
General
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 21
2. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the
JESD51-3 specification. For the MAPBGA, the board meets the JESD51-9 specification.
3. Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental
Conditions—Forced Convection (Moving Air) with the board horizontal. For the LQFP, the board meets the JESD51-7
specification.
4. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.
5. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
6. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
6 Peripheral operating requirements and behaviors
6.1 Core modules
6.1.1 Debug trace timing specifications
Table 11. Debug trace operating behaviors
Symbol Description Min. Max. Unit
Tcyc Clock period Frequency dependent MHz
Twl Low pulse width 2 ns
Twh High pulse width 2 ns
TrClock and data rise time 3 ns
TfClock and data fall time 3 ns
TsData setup 3 ns
ThData hold 2 ns
Figure 4. TRACE_CLKOUT specifications
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
22 Freescale Semiconductor, Inc.
Th
Ts Ts Th
TRACE_CLKOUT
TRACE_D[3:0]
Figure 5. Trace data specifications
6.1.2 JTAG electricals
Table 12. JTAG voltage range electricals
Symbol Description Min. Max. Unit
Operating voltage 2.7 5.5 V
J1 TCLK frequency of operation
JTAG
CJTAG
10
5
MHz
J2 TCLK cycle period 1/J1 ns
J3 TCLK clock pulse width
JTAG
CJTAG
100
200
ns
ns
ns
J4 TCLK rise and fall times 1 ns
J5 TMS input data setup time to TCLK rise
JTAG
CJTAG
53
112
ns
J6 TDI input data setup time to TCLK rise 8 ns
J7 TMS input data hold time after TCLK rise
JTAG
CJTAG
3.4
3.4
ns
J8 TDI input data hold time after TCLK rise 3.4 ns
J9 TCLK low to TMS data valid
JTAG
CJTAG
48
85
ns
J10 TCLK low to TDO data valid 48 ns
J11 Output data hold/invalid time after clock edge1 3 ns
1. They are common for JTAG and CJTAG. Input transition = 1 ns and Output load = 50pf
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 23
J2
J3 J3
J4 J4
TCLK (input)
Figure 6. Test clock input timing
J7
J8
J7
J5 J6
Input data valid
Output data valid
Output data valid
TCLK
Data inputs
Data outputs
Data outputs
Data outputs
Figure 7. Boundary scan (JTAG) timing
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
24 Freescale Semiconductor, Inc.
J11
J12
J11
J9 J10
Input data valid
Output data valid
Output data valid
TCLK
TDI/TMS
TDO
TDO
TDO
Figure 8. Test Access Port timing
J14
J13
TCLK
TRST
Figure 9. TRST timing
6.2 System modules
There are no specifications necessary for the device's system modules.
6.3 Clock modules
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 25
6.3.1 MCG specifications
Table 13. MCG specifications
Symbol Description Min. Typ. Max. Unit Notes
fints_ft Internal reference frequency (slow clock) —
factory trimmed at nominal VDD and 25 °C
32.768 kHz
fints_t Internal reference frequency (slow clock) — user
trimmed
31.25 39.0625 kHz
Δfdco_res_t Resolution of trimmed average DCO output
frequency at fixed voltage and temperature —
using SCTRIM and SCFTRIM
± 0.3 ± 0.6 %fdco 1
Δfdco_res_t Resolution of trimmed average DCO output
frequency at fixed voltage and temperature —
using SCTRIM only
± 0.2 ± 0.5 %fdco 1
Δfdco_t Total deviation of trimmed average DCO output
frequency over voltage and temperature
+0.5/-0.7 %fdco 1
Δfdco_t Total deviation of trimmed average DCO output
frequency over fixed voltage and temperature
range of 0–70°C
%fdco 1
fintf_ft Internal reference frequency (fast clock) —
factory trimmed at nominal VDD and 25°C
4 MHz
fintf_t Internal reference frequency (fast clock) — user
trimmed at nominal VDD and 25 °C
3 5 MHz
floc_low Loss of external clock minimum frequency —
RANGE = 00
(3/5) x
fints_t
kHz
floc_high Loss of external clock minimum frequency —
RANGE = 01, 10, or 11
(16/5) x
fints_t
kHz
FLL
ffll_ref FLL reference frequency range 31.25 39.0625 kHz
fdco DCO output
frequency range
Low range (DRS=00)
640 × ffll_ref
20 20.97 25 MHz 2, 3
Mid range (DRS=01)
1280 × ffll_ref
40 41.94 50 MHz
Mid-high range (DRS=10)
1920 × ffll_ref
60 62.91 75 MHz
High range (DRS=11)
2560 × ffll_ref
80 83.89 100 MHz
Table continues on the next page...
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
26 Freescale Semiconductor, Inc.
Table 13. MCG specifications (continued)
Symbol Description Min. Typ. Max. Unit Notes
fdco_t_DMX3
2
DCO output
frequency
Low range (DRS=00)
732 × ffll_ref
23.99 MHz 4, 5
Mid range (DRS=01)
1464 × ffll_ref
47.97 MHz
Mid-high range (DRS=10)
2197 × ffll_ref
71.99 MHz
High range (DRS=11)
2929 × ffll_ref
95.98 MHz
Jcyc_fll FLL period jitter
fVCO = 48 MHz
fVCO = 98 MHz
180
150
ps
tfll_acquire FLL target frequency acquisition time 1 ms 6
PLL
fvco VCO operating frequency 48.0 100 MHz
Ipll PLL operating current
PLL @ 96 MHz (fosc_hi_1 = 8 MHz, fpll_ref =
2 MHz, VDIV multiplier = 48)
1060 µA 7
Ipll PLL operating current
PLL @ 48 MHz (fosc_hi_1 = 8 MHz, fpll_ref =
2 MHz, VDIV multiplier = 24)
600 µA 7
fpll_ref PLL reference frequency range 2.0 4.0 MHz
Jcyc_pll PLL period jitter (RMS)
fvco = 48 MHz
fvco = 100 MHz
120
50
ps
ps
8
Jacc_pll PLL accumulated jitter over 1µs (RMS)
fvco = 48 MHz
fvco = 100 MHz
1350
600
ps
ps
8
Dlock Lock entry frequency tolerance ± 1.49 ± 2.98 %
Dunl Lock exit frequency tolerance ± 4.47 ± 5.97 %
tpll_lock Lock detector detection time 150 × 10-6
+ 1075(1/
fpll_ref)
s9
1. This parameter is measured with the internal reference (slow clock) being used as a reference to the FLL (FEI clock
mode).
2. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=0.
3. The resulting system clock frequencies should not exceed their maximum specified values. The DCO frequency deviation
(Δfdco_t) over voltage and temperature should be considered.
4. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=1.
5. The resulting clock frequency must not exceed the maximum specified clock frequency of the device.
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 27
6. This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed,
DMX32 bit is changed, DRS bits are changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE,
FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running.
7. Excludes any oscillator currents that are also consuming power while PLL is in operation.
8. This specification was obtained using a Freescale developed PCB. PLL jitter is dependent on the noise characteristics of
each PCB and results will vary.
9. This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled
(BLPE, BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes
it is already running.
6.3.2 Oscillator electrical specifications
This section provides the electrical characteristics of the module.
6.3.2.1 Oscillator DC electrical specifications
Table 14. Oscillator DC electrical specifications
Symbol Description Min. Typ. Max. Unit Notes
VDD Supply voltage 1.71 3.6 V
IDDOSC Supply current — low-power mode (HGO=0)
32 kHz
4 MHz
8 MHz (RANGE=01)
16 MHz
24 MHz
32 MHz
500
200
300
950
1.2
1.5
nA
μA
μA
μA
mA
mA
1
IDDOSC Supply current — high gain mode (HGO=1)
32 kHz
4 MHz
8 MHz (RANGE=01)
16 MHz
24 MHz
32 MHz
25
400
500
2.5
3
4
μA
μA
μA
mA
mA
mA
1
CxEXTAL load capacitance 2, 3
CyXTAL load capacitance 2, 3
Table continues on the next page...
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
28 Freescale Semiconductor, Inc.
Table 14. Oscillator DC electrical specifications (continued)
Symbol Description Min. Typ. Max. Unit Notes
RFFeedback resistor — low-frequency, low-power
mode (HGO=0)
2, 4
Feedback resistor — low-frequency, high-gain
mode (HGO=1)
10
Feedback resistor — high-frequency, low-power
mode (HGO=0)
Feedback resistor — high-frequency, high-gain
mode (HGO=1)
1
RSSeries resistor — low-frequency, low-power
mode (HGO=0)
Series resistor — low-frequency, high-gain mode
(HGO=1)
200
Series resistor — high-frequency, low-power
mode (HGO=0)
Series resistor — high-frequency, high-gain
mode (HGO=1)
0
Vpp5Peak-to-peak amplitude of oscillation (oscillator
mode) — low-frequency, low-power mode
(HGO=0)
0.6 V
Peak-to-peak amplitude of oscillation (oscillator
mode) — low-frequency, high-gain mode
(HGO=1)
VDD V
Peak-to-peak amplitude of oscillation (oscillator
mode) — high-frequency, low-power mode
(HGO=0)
0.6 V
Peak-to-peak amplitude of oscillation (oscillator
mode) — high-frequency, high-gain mode
(HGO=1)
VDD V
1. VDD=3.3 V, Temperature =25 °C
2. See crystal or resonator manufacturer's recommendation
3. Cx,Cy can be provided by using either the integrated capacitors or by using external components.
4. When low power mode is selected, RF is integrated and must not be attached externally.
5. The EXTAL and XTAL pins should only be connected to required oscillator components and must not be connected to any
other devices.
6.3.2.2 Oscillator frequency specifications
Table 15. Oscillator frequency specifications
Symbol Description Min. Typ. Max. Unit Notes
fosc_lo Oscillator crystal or resonator frequency — low
frequency mode (MCG_C2[RANGE]=00)
32 40 kHz
Table continues on the next page...
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 29
Table 15. Oscillator frequency specifications (continued)
Symbol Description Min. Typ. Max. Unit Notes
fosc_hi_1 Oscillator crystal or resonator frequency — high
frequency mode (low range)
(MCG_C2[RANGE]=01)
3 8 MHz
fosc_hi_2 Oscillator crystal or resonator frequency — high
frequency mode (high range)
(MCG_C2[RANGE]=1x)
8 32 MHz
fec_extal Input clock frequency (external clock mode) 50 MHz 1, 2
tdc_extal Input clock duty cycle (external clock mode) 40 50 60 %
tcst Crystal startup time — 32 kHz low-frequency,
low-power mode (HGO=0)
750 ms 3, 4
Crystal startup time — 32 kHz low-frequency,
high-gain mode (HGO=1)
250 ms
Crystal startup time — 8 MHz high-frequency
(MCG_C2[RANGE]=01), low-power mode
(HGO=0)
0.6 ms
Crystal startup time — 8 MHz high-frequency
(MCG_C2[RANGE]=01), high-gain mode
(HGO=1)
1 ms
1. Other frequency limits may apply when external clock is being used as a reference for the FLL or PLL.
2. When transitioning from FBE to FEI mode, restrict the frequency of the input clock so that, when it is divided by FRDIV, it
remains within the limits of the DCO input clock frequency.
3. Proper PC board layout procedures must be followed to achieve specifications.
4. Crystal startup time is defined as the time between the oscillator being enabled and the OSCINIT bit in the MCG_S register
being set.
6.3.3 32kHz Oscillator Electrical Characteristics
This section describes the module electrical characteristics.
6.3.3.1 32kHz oscillator DC electrical specifications
Table 16. 32kHz oscillator DC electrical specifications
Symbol Description Min. Typ. Max. Unit
VBAT Supply voltage 1.71 3.6 V
RFInternal feedback resistor 100
Cpara Parasitical capacitance of EXTAL32 and XTAL32 5 7 pF
Vpp1Peak-to-peak amplitude of oscillation 0.6 V
1. The EXTAL32 and XTAL32 pins should only be connected to required oscillator components and must not be connected to
any other devices.
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
30 Freescale Semiconductor, Inc.
6.3.3.2 32kHz oscillator frequency specifications
Table 17. 32kHz oscillator frequency specifications
Symbol Description Min. Typ. Max. Unit Notes
fosc_lo Oscillator crystal 32.768 kHz
tstart Crystal start-up time 1000 ms 1
1. Proper PC board layout procedures must be followed to achieve specifications.
6.4 Memories and memory interfaces
6.4.1 Flash electrical specifications
This section describes the electrical characteristics of the flash memory module.
6.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 18. NVM program/erase timing specifications
Symbol Description Min. Typ. Max. Unit Notes
thvpgm4 Longword Program high-voltage time 7.5 18 μs
thversscr Sector Erase high-voltage time 13 113 ms 1
thversblk32k Erase Block high-voltage time for 32 KB 52 452 ms 1
thversblk256k Erase Block high-voltage time for 256 KB 104 904 ms 1
1. Maximum time based on expectations at cycling end-of-life.
6.4.1.2 Flash timing specifications — commands
Table 19. Flash command timing specifications
Symbol Description Min. Typ. Max. Unit Notes
trd1blk32k
trd1blk256k
Read 1s Block execution time
32 KB data flash
256 KB program flash
0.5
1.7
ms
ms
trd1sec1k Read 1s Section execution time (data flash
sector)
60 μs 1
trd1sec2k Read 1s Section execution time (program flash
sector)
60 μs 1
Table continues on the next page...
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 31
Table 19. Flash command timing specifications (continued)
Symbol Description Min. Typ. Max. Unit Notes
tpgmchk Program Check execution time 45 μs 1
trdrsrc Read Resource execution time 30 μs 1
tpgm4 Program Longword execution time 65 145 μs
tersblk32k
tersblk256k
Erase Flash Block execution time
32 KB data flash
256 KB program flash
55
122
465
985
ms
ms
2
tersscr Erase Flash Sector execution time 14 114 ms 2
tpgmsec512p
tpgmsec512d
tpgmsec1kp
tpgmsec1kd
Program Section execution time
512 B program flash
512 B data flash
1 KB program flash
1 KB data flash
2.4
4.7
4.7
9.3
ms
ms
ms
ms
trd1all Read 1s All Blocks execution time 1.8 ms
trdonce Read Once execution time 25 μs 1
tpgmonce Program Once execution time 65 μs
tersall Erase All Blocks execution time 175 1500 ms 2
tvfykey Verify Backdoor Access Key execution time 30 μs 1
tswapx01
tswapx02
tswapx04
tswapx08
Swap Control execution time
control code 0x01
control code 0x02
control code 0x04
control code 0x08
200
70
70
150
150
30
μs
μs
μs
μs
tpgmpart32k
Program Partition for EEPROM execution time
32 KB FlexNVM
70
ms
tsetramff
tsetram8k
tsetram32k
Set FlexRAM Function execution time:
Control Code 0xFF
8 KB EEPROM backup
32 KB EEPROM backup
50
0.3
0.7
0.5
1.0
μs
ms
ms
Byte-write to FlexRAM for EEPROM operation
teewr8bers Byte-write to erased FlexRAM location execution
time
175 260 μs 3
Table continues on the next page...
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
32 Freescale Semiconductor, Inc.
Table 19. Flash command timing specifications (continued)
Symbol Description Min. Typ. Max. Unit Notes
teewr8b8k
teewr8b16k
teewr8b32k
Byte-write to FlexRAM execution time:
8 KB EEPROM backup
16 KB EEPROM backup
32 KB EEPROM backup
340
385
475
1700
1800
2000
μs
μs
μs
Word-write to FlexRAM for EEPROM operation
teewr16bers Word-write to erased FlexRAM location
execution time
175 260 μs
teewr16b8k
teewr16b16k
teewr16b32k
Word-write to FlexRAM execution time:
8 KB EEPROM backup
16 KB EEPROM backup
32 KB EEPROM backup
340
385
475
1700
1800
2000
μs
μs
μs
Longword-write to FlexRAM for EEPROM operation
teewr32bers Longword-write to erased FlexRAM location
execution time
360 540 μs
teewr32b8k
teewr32b16k
teewr32b32k
Longword-write to FlexRAM execution time:
8 KB EEPROM backup
16 KB EEPROM backup
32 KB EEPROM backup
545
630
810
1950
2050
2250
μs
μs
μs
1. Assumes 25MHz flash clock frequency.
2. Maximum times for erase parameters based on expectations at cycling end-of-life.
3. For byte-writes to an erased FlexRAM location, the aligned word containing the byte must be erased.
6.4.1.3 Flash current and power specfications
Table 20. Flash current and power specfications
Symbol Description Typ. Unit
IDD_PGM Worst case programming current in program flash 10 mA
6.4.1.4 Reliability specifications
Table 21. NVM reliability specifications
Symbol Description Min. Typ.1Max. Unit Notes
Program Flash
tnvmretp10k Data retention after up to 10 K cycles 5 50 years
tnvmretp1k Data retention after up to 1 K cycles 20 100 years
nnvmcycp Cycling endurance 10 K 50 K cycles 2
Table continues on the next page...
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 33
Table 21. NVM reliability specifications (continued)
Symbol Description Min. Typ.1Max. Unit Notes
Data Flash
tnvmretd10k Data retention after up to 10 K cycles 5 50 years
tnvmretd1k Data retention after up to 1 K cycles 20 100 years
nnvmcycd Cycling endurance 10 K 50 K cycles 2
FlexRAM as EEPROM
tnvmretee100 Data retention up to 100% of write endurance 5 50 years
tnvmretee10 Data retention up to 10% of write endurance 20 100 years
nnvmwree16
nnvmwree128
nnvmwree512
nnvmwree4k
nnvmwree8k
Write endurance
EEPROM backup to FlexRAM ratio = 16
EEPROM backup to FlexRAM ratio = 128
EEPROM backup to FlexRAM ratio = 512
EEPROM backup to FlexRAM ratio = 4096
EEPROM backup to FlexRAM ratio = 8192
35 K
315 K
1.27 M
10 M
20 M
175 K
1.6 M
6.4 M
50 M
100 M
writes
writes
writes
writes
writes
3
1. Typical data retention values are based on measured response accelerated at high temperature and derated to a constant
25°C use profile. Engineering Bulletin EB618 does not apply to this technology. Typical endurance defined in Engineering
Bulletin EB619.
2. Cycling endurance represents number of program/erase cycles at -40°C ≤ Tj ≤ 125°C.
3. Write endurance represents the number of writes to each FlexRAM location at -40°C ≤Tj ≤ 125°C influenced by the cycling
endurance of the FlexNVM (same value as data flash) and the allocated EEPROM backup per subsystem. Minimum and
typical values assume all byte-writes to FlexRAM.
6.4.1.5 Write endurance to FlexRAM for EEPROM
When the FlexNVM partition code is not set to full data flash, the EEPROM data set size
can be set to any of several non-zero values.
The bytes not assigned to data flash via the FlexNVM partition code are used by the
FTFL to obtain an effective endurance increase for the EEPROM data. The built-in
EEPROM record management system raises the number of program/erase cycles that can
be attained prior to device wear-out by cycling the EEPROM data through a larger
EEPROM NVM storage space.
While different partitions of the FlexNVM are available, the intention is that a single
choice for the FlexNVM partition code and EEPROM data set size is used throughout the
entire lifetime of a given application. The EEPROM endurance equation and graph
shown below assume that only one configuration is ever used.
where
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
34 Freescale Semiconductor, Inc.
Writes_subsystem — minimum number of writes to each FlexRAM location for
subsystem (each subsystem can have different endurance)
EEPROM — allocated FlexNVM for each EEPROM subsystem based on DEPART;
entered with Program Partition command
EEESPLIT — FlexRAM split factor for subsystem; entered with the Program
Partition command
EEESIZE — allocated FlexRAM based on DEPART; entered with Program Partition
command
Write_efficiency —
0.25 for 8-bit writes to FlexRAM
0.50 for 16-bit or 32-bit writes to FlexRAM
nnvmcycd — data flash cycling endurance
Figure 10. EEPROM backup writes to FlexRAM
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 35
6.4.2 EzPort Switching Specifications
Table 22. EzPort switching specifications
Num Description Min. Max. Unit
Operating voltage 1.71 3.6 V
EP1 EZP_CK frequency of operation (all commands except
READ)
fSYS/2 MHz
EP1a EZP_CK frequency of operation (READ command) fSYS/8 MHz
EP2 EZP_CS negation to next EZP_CS assertion 2 x tEZP_CK ns
EP3 EZP_CS input valid to EZP_CK high (setup) 5 ns
EP4 EZP_CK high to EZP_CS input invalid (hold) 5 ns
EP5 EZP_D input valid to EZP_CK high (setup) 2 ns
EP6 EZP_CK high to EZP_D input invalid (hold) 5 ns
EP7 EZP_CK low to EZP_Q output valid 16 ns
EP8 EZP_CK low to EZP_Q output invalid (hold) 0 ns
EP9 EZP_CS negation to EZP_Q tri-state 12 ns
EP2
EP3 EP4
EP5 EP6
EP7 EP8
EP9
EZP_CK
EZP_CS
EZP_Q (output)
EZP_D (input)
Figure 11. EzPort Timing Diagram
6.4.3 Flexbus Switching Specifications
All processor bus timings are synchronous; input setup/hold and output delay are given in
respect to the rising edge of a reference clock, FB_CLK. The FB_CLK frequency may be
the same as the internal system bus frequency or an integer divider of that frequency.
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
36 Freescale Semiconductor, Inc.
The following timing numbers indicate when data is latched or driven onto the external
bus, relative to the Flexbus output clock (FB_CLK). All other timing relationships can be
derived from these values.
Table 23. Flexbus limited voltage range switching specifications
Num Description Min. Max. Unit Notes
Operating voltage 2.7 3.6 V
Frequency of operation FB_CLK MHz
FB1 Clock period 20 ns
FB2 Address, data, and control output valid 11.5 ns 1
FB3 Address, data, and control output hold 0.5 ns 1
FB4 Data and FB_TA input setup 8.5 ns 2
FB5 Data and FB_TA input hold 0.5 ns 2
1. Specification is valid for all FB_AD[31:0], FB_BE/BWEn, FB_CSn, FB_OE, FB_R/W,FB_TBST, FB_TSIZ[1:0], FB_ALE,
and FB_TS.
2. Specification is valid for all FB_AD[31:0] and FB_TA.
Table 24. Flexbus full voltage range switching specifications
Num Description Min. Max. Unit Notes
Operating voltage 1.71 3.6 V
Frequency of operation FB_CLK MHz
FB1 Clock period 1/FB_CLK ns
FB2 Address, data, and control output valid 13.5 ns 1
FB3 Address, data, and control output hold 0 ns 1
FB4 Data and FB_TA input setup 13.7 ns 2
FB5 Data and FB_TA input hold 0.5 ns 2
1. Specification is valid for all FB_AD[31:0], FB_BE/BWEn, FB_CSn, FB_OE, FB_R/W,FB_TBST, FB_TSIZ[1:0], FB_ALE,
and FB_TS.
2. Specification is valid for all FB_AD[31:0] and FB_TA.
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 37
Address
Address Data
TSIZ
AA=1
AA=0
AA=1
AA=0
FB1
FB3
FB5
FB4
FB4
FB5
FB2
FB_CLK
FB_A[Y]
FB_D[X]
FB_RW
FB_TS
FB_ALE
FB_CSn
FB_OEn
FB_BEn
FB_TA
FB_TSIZ[1:0]
Figure 12. FlexBus read timing diagram
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
38 Freescale Semiconductor, Inc.
Address
Address Data
TSIZ
AA=1
AA=0
AA=1
AA=0
FB1
FB3
FB4
FB5
FB2
FB_CLK
FB_A[Y]
FB_D[X]
FB_RW
FB_TS
FB_ALE
FB_CSn
FB_OEn
FB_BEn
FB_TA
FB_TSIZ[1:0]
Figure 13. FlexBus write timing diagram
6.5 Security and integrity modules
There are no specifications necessary for the device's security and integrity modules.
6.6 Analog
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 39
6.6.1 ADC electrical specifications
The 16-bit accuracy specifications listed in Table 25 and Table 26 are achievable on the
differential pins ADCx_DP0, ADCx_DM0.
The ADCx_DP2 and ADCx_DM2 ADC inputs are connected to the PGA outputs and are
not direct device pins. Accuracy specifications for these pins are defined in Table 27 and
Table 28.
All other ADC channels meet the 13-bit differential/12-bit single-ended accuracy
specifications.
6.6.1.1 16-bit ADC operating conditions
Table 25. 16-bit ADC operating conditions
Symbol Description Conditions Min. Typ.1Max. Unit Notes
VDDA Supply voltage Absolute 1.71 3.6 V
ΔVDDA Supply voltage Delta to VDD (VDD-
VDDA)
-100 0 +100 mV 2
ΔVSSA Ground voltage Delta to VSS (VSS-
VSSA)
-100 0 +100 mV 2
VREFH ADC reference
voltage high
1.13 VDDA VDDA V
VREFL Reference
voltage low
VSSA VSSA VSSA V
VADIN Input voltage VREFL VREFH V
CADIN Input
capacitance
16 bit modes
8/10/12 bit
modes
8
4
10
5
pF
RADIN Input resistance 2 5
RAS Analog source
resistance
13/12 bit modes
fADCK < 4MHz
5
3
fADCK ADC conversion
clock frequency
≤ 13 bit modes
1.0
18.0
MHz
4
fADCK ADC conversion
clock frequency
16 bit modes
2.0
12.0
MHz
4
Table continues on the next page...
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
40 Freescale Semiconductor, Inc.
Table 25. 16-bit ADC operating conditions (continued)
Symbol Description Conditions Min. Typ.1Max. Unit Notes
Crate ADC conversion
rate
≤ 13 bit modes
No ADC hardware
averaging
Continuous
conversions enabled,
subsequent conversion
time
20.000
818.330
Ksps
5
Crate ADC conversion
rate
16 bit modes
No ADC hardware
averaging
Continuous
conversions enabled,
subsequent conversion
time
37.037
461.467
Ksps
5
1. Typical values assume VDDA = 3.0 V, Temp = 25°C, fADCK = 1.0 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
2. DC potential difference.
3. This resistance is external to MCU. The analog source resistance should be kept as low as possible in order to achieve the
best results. The results in this datasheet were derived from a system which has <8 Ω analog source resistance. The RAS/
CAS time constant should be kept to <1ns.
4. To use the maximum ADC conversion clock frequency, the ADHSC bit should be set and the ADLPC bit should be clear.
5. For guidelines and examples of conversion rate calculation, download the ADC calculator tool: http://cache.freescale.com/
files/soft_dev_tools/software/app_software/converters/ADC_CALCULATOR_CNV.zip?fpsp=1
RAS
VAS
CAS
ZAS
VADIN
ZADIN
RADIN
RADIN
RADIN
RADIN
CADIN
Pad
leakage
due to
input
protection
INPUT PININPUT PIN
INPUT PIN
INPUT PIN
SIMPLIFIED
INPUT PIN EQUIVALENT
CIRCUIT
SIMPLIFIED
CHANNEL SELECT
CIRCUIT
ADC SAR
ENGINE
Figure 14. ADC input impedance equivalency diagram
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 41
6.6.1.2 16-bit ADC electrical characteristics
Table 26. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA)
Symbol Description Conditions1Min. Typ.2Max. Unit Notes
IDDA_ADC Supply current 0.215 1.7 mA 3
fADACK
ADC
asynchronous
clock source
ADLPC=1, ADHSC=0
ADLPC=1, ADHSC=1
ADLPC=0, ADHSC=0
ADLPC=0, ADHSC=1
1.2
3.0
2.4
4.4
2.4
4.0
5.2
6.2
3.9
7.3
6.1
9.5
MHz
MHz
MHz
MHz
tADACK = 1/
fADACK
Sample Time See Reference Manual chapter for sample times
TUE Total unadjusted
error
12 bit modes
<12 bit modes
±4
±1.4
±6.8
±2.1
LSB45
DNL Differential non-
linearity
12 bit modes
<12 bit modes
±0.7
±0.2
-1.1 to
+1.9
-0.3 to 0.5
LSB45
INL Integral non-
linearity
12 bit modes
<12 bit modes
±1.0
±0.5
-2.7 to
+1.9
-0.7 to
+0.5
LSB45
EFS Full-scale error 12 bit modes
<12 bit modes
-4
-1.4
-5.4
-1.8
LSB4VADIN =
VDDA
5
EQQuantization
error
16 bit modes
≤13 bit modes
-1 to 0
±0.5
LSB4
ENOB Effective number
of bits
16 bit differential mode
Avg=32
Avg=4
16 bit single-ended mode
Avg=32
Avg=4
12.8
11.9
12.2
11.4
14.5
13.8
13.9
13.1
bits
bits
bits
bits
6
SINAD Signal-to-noise
plus distortion
See ENOB 6.02 × ENOB + 1.76 dB
THD Total harmonic
distortion
16 bit differential mode
Avg=32
16 bit single-ended mode
Avg=32
–94
-85
dB
dB
7
Table continues on the next page...
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
42 Freescale Semiconductor, Inc.
Table 26. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued)
Symbol Description Conditions1Min. Typ.2Max. Unit Notes
SFDR Spurious free
dynamic range
16 bit differential mode
Avg=32
16 bit single-ended mode
Avg=32
82
78
95
90
dB
dB
7
EIL Input leakage
error
IIn × RAS mV IIn =
leakage
current
(refer to
the MCU's
voltage
and
current
operating
ratings)
Temp sensor
slope
–40°C to 105°C 1.715 mV/°C
VTEMP25 Temp sensor
voltage
25°C 719 mV
1. All accuracy numbers assume the ADC is calibrated with VREFH = VDDA
2. Typical values assume VDDA = 3.0 V, Temp = 25°C, fADCK = 2.0 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
3. The ADC supply current depends on the ADC conversion clock speed, conversion rate and the ADLPC bit (low power).
For lowest power operation the ADLPC bit should be set, the HSC bit should be clear with 1MHz ADC conversion clock
speed.
4. 1 LSB = (VREFH - VREFL)/2N
5. ADC conversion clock <16MHz, Max hardware averaging (AVGE = %1, AVGS = %11)
6. Input data is 100 Hz sine wave. ADC conversion clock <12MHz.
7. Input data is 1 kHz sine wave. ADC conversion clock <12MHz.
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 43
Figure 15. Typical ENOB vs. ADC_CLK for 16-bit differential mode
Figure 16. Typical ENOB vs. ADC_CLK for 16-bit single-ended mode
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
44 Freescale Semiconductor, Inc.
6.6.1.3 16-bit ADC with PGA operating conditions
Table 27. 16-bit ADC with PGA operating conditions
Symbol Description Conditions Min. Typ.1Max. Unit Notes
VDDA Supply voltage Absolute 1.71 3.6 V
VREFPGA PGA ref voltage VREF_OU
T
VREF_OU
T
VREF_OU
T
V2, 3
VADIN Input voltage VSSA VDDA V
VCM Input Common
Mode range
VSSA VDDA V
RPGAD Differential input
impedance
Gain = 1, 2, 4, 8
Gain = 16, 32
Gain = 64
128
64
32
IN+ to IN-4
RAS Analog source
resistance
100 Ω 5
TSADC sampling
time
1.25 µs 6
Crate ADC conversion
rate
≤ 13 bit modes
No ADC hardware
averaging
Continuous
conversions enabled
Peripheral clock = 50
MHz
18.484 450 Ksps 7
16 bit modes
No ADC hardware
averaging
Continuous
conversions enabled
Peripheral clock = 50
MHz
37.037 250 Ksps 8
1. Typical values assume VDDA = 3.0 V, Temp = 25°C, fADCK = 6 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
2. ADC must be configured to use the internal voltage reference (VREF_OUT)
3. PGA reference is internally connected to the VREF_OUT pin. If the user wishes to drive VREF_OUT with a voltage other
than the output of the VREF module, the VREF module must be disabled.
4. For single ended configurations the input impedance of the driven input is RPGAD/2
5. The analog source resistance (RAS), external to MCU, should be kept as minimum as possible. Increased RAS causes drop
in PGA gain without affecting other performances. This is not dependent on ADC clock frequency.
6. The minimum sampling time is dependent on input signal frequency and ADC mode of operation. A minimum of 1.25µs
time should be allowed for Fin=4 kHz at 16-bit differential mode. Recommended ADC setting is: ADLSMP=1, ADLSTS=2 at
8 MHz ADC clock.
7. ADC clock = 18 MHz, ADLSMP = 1, ADLST = 00, ADHSC = 1
8. ADC clock = 12 MHz, ADLSMP = 1, ADLST = 01, ADHSC = 1
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 45
6.6.1.4 16-bit ADC with PGA characteristics with Chop enabled
(ADC_PGA[PGACHPb] =0)
Table 28. 16-bit ADC with PGA characteristics
Symbol Description Conditions Min. Typ.1Max. Unit Notes
IDDA_PGA Supply current Low power
(ADC_PGA[PGALPb]=0)
420 644 μA 2
IDC_PGA Input DC current A 3
Gain =1, VREFPGA=1.2V,
VCM=0.5V
1.54 μA
Gain =64, VREFPGA=1.2V,
VCM=0.1V
0.57 μA
GGain4 PGAG=0
PGAG=1
PGAG=2
PGAG=3
PGAG=4
PGAG=5
PGAG=6
0.95
1.9
3.8
7.6
15.2
30.0
58.8
1
2
4
8
16
31.6
63.3
1.05
2.1
4.2
8.4
16.6
33.2
67.8
RAS < 100Ω
BW Input signal
bandwidth
16-bit modes
< 16-bit modes
4
40
kHz
kHz
PSRR Power supply
rejection ratio
Gain=1 -84 dB VDDA= 3V
±100mV,
fVDDA= 50Hz,
60Hz
CMRR Common mode
rejection ratio
Gain=1
Gain=64
-84
-85
dB
dB
VCM=
500mVpp,
fVCM= 50Hz,
100Hz
VOFS Input offset
voltage
0.2 mV Output offset =
VOFS*(Gain+1)
TGSW Gain switching
settling time
10 µs 5
dG/dT Gain drift over full
temperature
range
Gain=1
Gain=64
6
31
10
42
ppm/°C
ppm/°C
dG/dVDDA Gain drift over
supply voltage
Gain=1
Gain=64
0.07
0.14
0.21
0.31
%/V
%/V
VDDA from 1.71
to 3.6V
Table continues on the next page...
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
46 Freescale Semiconductor, Inc.
Table 28. 16-bit ADC with PGA characteristics (continued)
Symbol Description Conditions Min. Typ.1Max. Unit Notes
EIL Input leakage
error
All modes IIn × RAS mV IIn = leakage
current
(refer to the
MCU's voltage
and current
operating
ratings)
VPP,DIFF Maximum
differential input
signal swing where VX = VREFPGA × 0.583
V6
SNR Signal-to-noise
ratio
Gain=1
Gain=64
80
52
90
66
dB
dB
16-bit
differential
mode,
Average=32
THD Total harmonic
distortion
Gain=1
Gain=64
85
49
100
95
dB
dB
16-bit
differential
mode,
Average=32,
fin=100Hz
SFDR Spurious free
dynamic range
Gain=1
Gain=64
85
53
105
88
dB
dB
16-bit
differential
mode,
Average=32,
fin=100Hz
ENOB Effective number
of bits
Gain=1, Average=4
Gain=64, Average=4
Gain=1, Average=32
Gain=2, Average=32
Gain=4, Average=32
Gain=8, Average=32
Gain=16, Average=32
Gain=32, Average=32
Gain=64, Average=32
11.6
7.2
12.8
11.0
7.9
7.3
6.8
6.8
7.5
13.4
9.6
14.5
14.3
13.8
13.1
12.5
11.5
10.6
bits
bits
bits
bits
bits
bits
bits
bits
bits
16-bit
differential
mode,fin=100H
z
SINAD Signal-to-noise
plus distortion
ratio
See ENOB 6.02 × ENOB + 1.76 dB
1. Typical values assume VDDA =3.0V, Temp=25°C, fADCK=6MHz unless otherwise stated.
2. This current is a PGA module adder, in addition to ADC conversion currents.
3. Between IN+ and IN-. The PGA draws a DC current from the input terminals. The magnitude of the DC current is a strong
function of input common mode voltage (VCM) and the PGA gain.
4. Gain = 2PGAG
5. After changing the PGA gain setting, a minimum of 2 ADC+PGA conversions should be ignored.
6. Limit the input signal swing so that the PGA does not saturate during operation. Input signal swing is dependent on the
PGA reference voltage and gain setting.
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 47
6.6.2 CMP and 6-bit DAC electrical specifications
Table 29. Comparator and 6-bit DAC electrical specifications
Symbol Description Min. Typ. Max. Unit
VDD Supply voltage 1.71 3.6 V
IDDHS Supply current, High-speed mode (EN=1, PMODE=1) 200 μA
IDDLS Supply current, low-speed mode (EN=1, PMODE=0) 20 μA
VAIN Analog input voltage VSS – 0.3 VDD V
VAIO Analog input offset voltage 20 mV
VHAnalog comparator hysteresis1
CR0[HYSTCTR] = 00
CR0[HYSTCTR] = 01
CR0[HYSTCTR] = 10
CR0[HYSTCTR] = 11
5
10
20
30
mV
mV
mV
mV
VCMPOh Output high VDD – 0.5 V
VCMPOl Output low 0.5 V
tDHS Propagation delay, high-speed mode (EN=1,
PMODE=1)
20 50 200 ns
tDLS Propagation delay, low-speed mode (EN=1,
PMODE=0)
80 250 600 ns
Analog comparator initialization delay2 40 μs
IDAC6b 6-bit DAC current adder (enabled) 7 μA
INL 6-bit DAC integral non-linearity –0.5 0.5 LSB3
DNL 6-bit DAC differential non-linearity –0.3 0.3 LSB
1. Typical hysteresis is measured with input voltage range limited to 0.6 to VDD-0.6V.
2. Comparator initialization delay is defined as the time between software writes to change control inputs (Writes to DACEN,
VRSEL, PSEL, MSEL, VOSEL) and the comparator output settling to a stable level.
3. 1 LSB = Vreference/64
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
48 Freescale Semiconductor, Inc.
0.04
0.05
0.06
0.07
0.08
P Hystereris (V)
00
01
10
HYSTCTR
Setting
0
0.01
0.02
0.03
0.1 0.4 0.7 1 1.3 1.6 1.9 2.2 2.5 2.8 3.1
CM
10
11
Vin level (V)
Figure 17. Typical hysteresis vs. Vin level (VDD=3.3V, PMODE=0)
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 49
0 08
0.1
0.12
0.14
0.16
0.18
P Hystereris (V)
00
01
10
HYSTCTR
Setting
0
0.02
0.04
0.06
0.08
0.1 0.4 0.7 1 1.3 1.6 1.9 2.2 2.5 2.8 3.1
CMP
10
11
Vin level (V)
Figure 18. Typical hysteresis vs. Vin level (VDD=3.3V, PMODE=1)
6.6.3 12-bit DAC electrical characteristics
6.6.3.1 12-bit DAC operating requirements
Table 30. 12-bit DAC operating requirements
Symbol Desciption Min. Max. Unit Notes
VDDA Supply voltage 1.71 3.6 V
VDACR Reference voltage 1.13 3.6 V 1
TATemperature −40 105 °C
CLOutput load capacitance 100 pF 2
ILOutput load current 1 mA
1. The DAC reference can be selected to be VDDA or the voltage output of the VREF module (VREF_OUT)
2. A small load capacitance (47 pF) can improve the bandwidth performance of the DAC
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
50 Freescale Semiconductor, Inc.
6.6.3.2 12-bit DAC operating behaviors
Table 31. 12-bit DAC operating behaviors
Symbol Description Min. Typ. Max. Unit Notes
IDDA_DACL
P
Supply current — low-power mode 150 μA
IDDA_DAC
HP
Supply current — high-speed mode 700 μA
tDACLP Full-scale settling time (0x080 to 0xF7F) —
low-power mode
100 200 μs 1
tDACHP Full-scale settling time (0x080 to 0xF7F) —
high-power mode
15 30 μs 1
tCCDACLP Code-to-code settling time (0xBF8 to
0xC08) — low-power mode and high-speed
mode
0.7 1 μs 1
Vdacoutl DAC output voltage range low — high-
speed mode, no load, DAC set to 0x000
100 mV
Vdacouth DAC output voltage range high — high-
speed mode, no load, DAC set to 0xFFF
VDACR
−100
VDACR mV
INL Integral non-linearity error — high speed
mode
±8 LSB 2
DNL Differential non-linearity error — VDACR > 2
V
±1 LSB 3
DNL Differential non-linearity error — VDACR =
VREF_OUT
±1 LSB 4
VOFFSET Offset error ±0.4 ±0.8 %FSR 5
EGGain error ±0.1 ±0.6 %FSR 5
PSRR Power supply rejection ratio, VDDA > = 2.4 V 60 90 dB
TCO Temperature coefficient offset voltage 3.7 μV/C 6
TGE Temperature coefficient gain error 0.000421 %FSR/C
Rop Output resistance load = 3 kΩ 250 Ω
SR Slew rate -80h F7Fh 80h
High power (SPHP)
Low power (SPLP)
1.2
0.05
1.7
0.12
V/μs
CT Channel to channel cross talk -80 dB
BW 3dB bandwidth
High power (SPHP)
Low power (SPLP)
550
40
kHz
1. Settling within ±1 LSB
2. The INL is measured for 0+100mV to VDACR−100 mV
3. The DNL is measured for 0+100 mV to VDACR−100 mV
4. The DNL is measured for 0+100mV to VDACR−100 mV with VDDA > 2.4V
5. Calculated by a best fit curve from VSS+100 mV to VDACR−100 mV
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 51
6. VDDA = 3.0V, reference select set for VDDA (DACx_CO:DACRFS = 1), high power mode(DACx_C0:LPEN = 0), DAC set
to 0x800, Temp range from -40C to 105C
Figure 19. Typical INL error vs. digital code
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
52 Freescale Semiconductor, Inc.
Figure 20. Offset at half scale vs. temperature
6.6.4 Voltage reference electrical specifications
Table 32. VREF full-range operating requirements
Symbol Description Min. Max. Unit Notes
VDDA Supply voltage 1.71 3.6 V
TATemperature −40 105 °C
CLOutput load capacitance 100 nF 1, 2
1. CL must be connected to VREF_OUT if the VREF_OUT functionality is being used for either an internal or external
reference.
2. The load capacitance should not exceed +/-25% of the nominal specified CL value over the operating temperature range of
the device.
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 53
Table 33. VREF full-range operating behaviors
Symbol Description Min. Typ. Max. Unit Notes
Vout Voltage reference output with factory trim at
nominal VDDA and temperature=25C
1.1915 1.195 1.1977 V
Vout Voltage reference output — factory trim 1.1584 1.2376 V
Vout Voltage reference output — user trim 1.193 1.197 V
Vstep Voltage reference trim step 0.5 mV
Vtdrift Temperature drift (Vmax -Vmin across the full
temperature range)
80 mV
Ibg Bandgap only current 80 µA 1
Ilp Low-power buffer current 360 uA 1
Ihp High-power buffer current 1 mA 1
ΔVLOAD Load regulation
current = ± 1.0 mA
200
µV 1, 2
Tstup Buffer startup time 20 µs
Vvdrift Voltage drift (Vmax - Vmin across the full voltage
range)
2 mV 1
1. See the chip's Reference Manual for the appropriate settings of the VREF Status and Control register.
2. Load regulation voltage is the difference between the VREF_OUT voltage with no load vs. voltage with defined load
Table 34. VREF limited-range operating requirements
Symbol Description Min. Max. Unit Notes
TATemperature 0 50 °C
Table 35. VREF limited-range operating behaviors
Symbol Description Min. Max. Unit Notes
Vout Voltage reference output with factory trim 1.173 1.225 V
Symbol Description Min Max Unit Notes
VREFH Voltage reference
output with factory
trim
1.173 1.225 V
VREFL Voltage reference
output
0.38 0.42 V
IBIASP_AFE_4µA P-bias current
output
3.5µ 4.5µ A
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
54 Freescale Semiconductor, Inc.
6.7 Timers
See General switching specifications.
6.8 Communication interfaces
6.8.1 CAN switching specifications
See General switching specifications.
6.8.2 DSPI switching specifications (limited voltage range)
The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with
master and slave operations. Many of the transfer attributes are programmable. The tables
below provide DSPI timing characteristics for classic SPI timing modes. Refer to the
DSPI chapter of the Reference Manual for information on the modified transfer formats
used for communicating with slower peripheral devices.
Table 37. Master mode DSPI timing (limited voltage range)
Num Description Min. Max. Unit Notes
Operating voltage 2.7 3.6 V
Frequency of operation 25 MHz
DS1 DSPI_SCK output cycle time 2 x tBUS ns
DS2 DSPI_SCK output high/low time (tSCK/2) − 2 (tSCK/2) + 2 ns
DS3 DSPI_PCSn valid to DSPI_SCK delay (tBUS x 2) −
2
ns 1
DS4 DSPI_SCK to DSPI_PCSn invalid delay (tBUS x 2) −
2
ns 2
DS5 DSPI_SCK to DSPI_SOUT valid 8.5 ns
DS6 DSPI_SCK to DSPI_SOUT invalid −2 ns
DS7 DSPI_SIN to DSPI_SCK input setup 15 ns
DS8 DSPI_SCK to DSPI_SIN input hold 0 ns
1. The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK].
2. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC].
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 55
DS3 DS4
DS1
DS2
DS7 DS8
First data Last data
DS5
First data Data Last data
DS6
Data
DSPI_PCSn
DSPI_SCK
(CPOL=0)
DSPI_SIN
DSPI_SOUT
Figure 21. DSPI classic SPI timing — master mode
Table 38. Slave mode DSPI timing (limited voltage range)
Num Description Min. Max. Unit
Operating voltage 2.7 3.6 V
Frequency of operation 12.5 MHz
DS9 DSPI_SCK input cycle time 4 x tBUS ns
DS10 DSPI_SCK input high/low time (tSCK/2) − 2 (tSCK/2) + 2 ns
DS11 DSPI_SCK to DSPI_SOUT valid 10 ns
DS12 DSPI_SCK to DSPI_SOUT invalid 0 ns
DS13 DSPI_SIN to DSPI_SCK input setup 2 ns
DS14 DSPI_SCK to DSPI_SIN input hold 7 ns
DS15 DSPI_SS active to DSPI_SOUT driven 14 ns
DS16 DSPI_SS inactive to DSPI_SOUT not driven 14 ns
First data Last data
First data Data Last data
Data
DS15
DS10 DS9
DS16
DS11
DS12
DS14
DS13
DSPI_SS
DSPI_SCK
(CPOL=0)
DSPI_SOUT
DSPI_SIN
Figure 22. DSPI classic SPI timing — slave mode
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
56 Freescale Semiconductor, Inc.
6.8.3 DSPI switching specifications (full voltage range)
The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with
master and slave operations. Many of the transfer attributes are programmable. The tables
below provides DSPI timing characteristics for classic SPI timing modes. Refer to the
DSPI chapter of the Reference Manual for information on the modified transfer formats
used for communicating with slower peripheral devices.
Table 39. Master mode DSPI timing (full voltage range)
Num Description Min. Max. Unit Notes
Operating voltage 1.71 3.6 V 1
Frequency of operation 12.5 MHz
DS1 DSPI_SCK output cycle time 4 x tBUS ns
DS2 DSPI_SCK output high/low time (tSCK/2) - 4 (tSCK/2) + 4 ns
DS3 DSPI_PCSn valid to DSPI_SCK delay (tBUS x 2) −
4
ns 2
DS4 DSPI_SCK to DSPI_PCSn invalid delay (tBUS x 2) −
4
ns 3
DS5 DSPI_SCK to DSPI_SOUT valid 10 ns
DS6 DSPI_SCK to DSPI_SOUT invalid -4.5 ns
DS7 DSPI_SIN to DSPI_SCK input setup 20.5 ns
DS8 DSPI_SCK to DSPI_SIN input hold 0 ns
1. The DSPI module can operate across the entire operating voltage for the processor, but to run across the full voltage
range the maximum frequency of operation is reduced.
2. The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK].
3. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC].
DS3 DS4
DS1
DS2
DS7 DS8
First data Last data
DS5
First data Data Last data
DS6
Data
DSPI_PCSn
DSPI_SCK
(CPOL=0)
DSPI_SIN
DSPI_SOUT
Figure 23. DSPI classic SPI timing — master mode
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 57
Table 40. Slave mode DSPI timing (full voltage range)
Num Description Min. Max. Unit
Operating voltage 1.71 3.6 V
Frequency of operation 6.25 MHz
DS9 DSPI_SCK input cycle time 8 x tBUS ns
DS10 DSPI_SCK input high/low time (tSCK/2) - 4 (tSCK/2) + 4 ns
DS11 DSPI_SCK to DSPI_SOUT valid 20 ns
DS12 DSPI_SCK to DSPI_SOUT invalid 0 ns
DS13 DSPI_SIN to DSPI_SCK input setup 2 ns
DS14 DSPI_SCK to DSPI_SIN input hold 7 ns
DS15 DSPI_SS active to DSPI_SOUT driven 19 ns
DS16 DSPI_SS inactive to DSPI_SOUT not driven 19 ns
First data Last data
First data Data Last data
Data
DS15
DS10 DS9
DS16
DS11
DS12
DS14
DS13
DSPI_SS
DSPI_SCK
(CPOL=0)
DSPI_SOUT
DSPI_SIN
Figure 24. DSPI classic SPI timing — slave mode
6.8.4 I2C switching specifications
See General switching specifications.
6.8.5 UART switching specifications
See General switching specifications.
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
58 Freescale Semiconductor, Inc.
6.8.6 I2S/SAI Switching Specifications
This section provides the AC timing for the I2S/SAI module in master mode (clocks are
driven) and slave mode (clocks are input). All timing is given for noninverted serial clock
polarity (TCR2[BCP] is 0, RCR2[BCP] is 0) and a noninverted frame sync (TCR4[FSP]
is 0, RCR4[FSP] is 0). If the polarity of the clock and/or the frame sync have been
inverted, all the timing remains valid by inverting the bit clock signal (BCLK) and/or the
frame sync (FS) signal shown in the following figures.
6.8.6.1 Normal Run, Wait and Stop mode performance over the full
operating voltage range
This section provides the operating performance over the full operating voltage for the
device in Normal Run, Wait and Stop modes.
Table 41. I2S/SAI master mode timing in Normal Run, Wait and Stop modes
(full voltage range)
Num. Characteristic Min. Max. Unit
Operating voltage 1.71 3.6 V
S1 I2S_MCLK cycle time 40 ns
S2 I2S_MCLK pulse width high/low 45% 55% MCLK period
S3 I2S_TX_BCLK/I2S_RX_BCLK cycle time (output) 80 ns
S4 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low 45% 55% BCLK period
S5 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/
I2S_RX_FS output valid
15 ns
S6 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/
I2S_RX_FS output invalid
-1.0 ns
S7 I2S_TX_BCLK to I2S_TXD valid 15 ns
S8 I2S_TX_BCLK to I2S_TXD invalid 0 ns
S9 I2S_RXD/I2S_RX_FS input setup before
I2S_RX_BCLK
20.5 ns
S10 I2S_RXD/I2S_RX_FS input hold after I2S_RX_BCLK 0 ns
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 59
S1 S2 S2
S3
S4
S4
S5
S9
S7
S9 S10
S7
S8
S6
S10
S8
I2S_MCLK (output)
I2S_TX_BCLK/
I2S_RX_BCLK (output)
I2S_TX_FS/
I2S_RX_FS (output)
I2S_TX_FS/
I2S_RX_FS (input)
I2S_TXD
I2S_RXD
Figure 25. I2S/SAI timing — master modes
Table 42. I2S/SAI slave mode timing in Normal Run, Wait and Stop modes
(full voltage range)
Num. Characteristic Min. Max. Unit
Operating voltage 1.71 3.6 V
S11 I2S_TX_BCLK/I2S_RX_BCLK cycle time (input) 80 ns
S12 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low
(input)
45% 55% MCLK period
S13 I2S_TX_FS/I2S_RX_FS input setup before
I2S_TX_BCLK/I2S_RX_BCLK
5.8 ns
S14 I2S_TX_FS/I2S_RX_FS input hold after
I2S_TX_BCLK/I2S_RX_BCLK
2 ns
S15 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output valid 20.6 ns
S16 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output invalid 0 ns
S17 I2S_RXD setup before I2S_RX_BCLK 5.8 ns
S18 I2S_RXD hold after I2S_RX_BCLK 2 ns
S19 I2S_TX_FS input assertion to I2S_TXD output valid1 25 ns
1. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
60 Freescale Semiconductor, Inc.
S15
S13
S15
S17 S18
S15
S16
S16
S14
S16
S11
S12
S12
I2S_TX_BCLK/
I2S_RX_BCLK (input)
I2S_TX_FS/
I2S_RX_FS (output)
I2S_TXD
I2S_RXD
I2S_TX_FS/
I2S_RX_FS (input) S19
Figure 26. I2S/SAI timing — slave modes
6.8.6.2 VLPR, VLPW, and VLPS mode performance over the full operating
voltage range
This section provides the operating performance over the full operating voltage for the
device in VLPR, VLPW, and VLPS modes.
Table 43. I2S/SAI master mode timing in VLPR, VLPW, and VLPS modes
(full voltage range)
Num. Characteristic Min. Max. Unit
Operating voltage 1.71 3.6 V
S1 I2S_MCLK cycle time 62.5 ns
S2 I2S_MCLK pulse width high/low 45% 55% MCLK period
S3 I2S_TX_BCLK/I2S_RX_BCLK cycle time (output) 250 ns
S4 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low 45% 55% BCLK period
S5 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/
I2S_RX_FS output valid
45 ns
S6 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/
I2S_RX_FS output invalid
0 ns
S7 I2S_TX_BCLK to I2S_TXD valid 45 ns
S8 I2S_TX_BCLK to I2S_TXD invalid 0 ns
S9 I2S_RXD/I2S_RX_FS input setup before
I2S_RX_BCLK
53 ns
S10 I2S_RXD/I2S_RX_FS input hold after I2S_RX_BCLK 0 ns
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 61
S1 S2 S2
S3
S4
S4
S5
S9
S7
S9 S10
S7
S8
S6
S10
S8
I2S_MCLK (output)
I2S_TX_BCLK/
I2S_RX_BCLK (output)
I2S_TX_FS/
I2S_RX_FS (output)
I2S_TX_FS/
I2S_RX_FS (input)
I2S_TXD
I2S_RXD
Figure 27. I2S/SAI timing — master modes
Table 44. I2S/SAI slave mode timing in VLPR, VLPW, and VLPS modes (full
voltage range)
Num. Characteristic Min. Max. Unit
Operating voltage 1.71 3.6 V
S11 I2S_TX_BCLK/I2S_RX_BCLK cycle time (input) 250 ns
S12 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low
(input)
45% 55% MCLK period
S13 I2S_TX_FS/I2S_RX_FS input setup before
I2S_TX_BCLK/I2S_RX_BCLK
30 ns
S14 I2S_TX_FS/I2S_RX_FS input hold after
I2S_TX_BCLK/I2S_RX_BCLK
7.6 ns
S15 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output valid 67 ns
S16 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output invalid 0 ns
S17 I2S_RXD setup before I2S_RX_BCLK 30 ns
S18 I2S_RXD hold after I2S_RX_BCLK 6.5 ns
S19 I2S_TX_FS input assertion to I2S_TXD output valid1 72 ns
1. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
62 Freescale Semiconductor, Inc.
S15
S13
S15
S17 S18
S15
S16
S16
S14
S16
S11
S12
S12
I2S_TX_BCLK/
I2S_RX_BCLK (input)
I2S_TX_FS/
I2S_RX_FS (output)
I2S_TXD
I2S_RXD
I2S_TX_FS/
I2S_RX_FS (input) S19
Figure 28. I2S/SAI timing — slave modes
6.9 Human-machine interfaces (HMI)
6.9.1 TSI electrical specifications
Table 45. TSI electrical specifications
Symbol Description Min. Typ. Max. Unit Notes
VDDTSI Operating voltage 1.71 3.6 V
CELE Target electrode capacitance range 1 20 500 pF 1
fREFmax Reference oscillator frequency 8 15 MHz 2, 3
fELEmax Electrode oscillator frequency 1 1.8 MHz 2, 4
CREF Internal reference capacitor 1 pF
VDELTA Oscillator delta voltage 500 mV 2, 5
IREF Reference oscillator current source base current
2 μA setting (REFCHRG = 0)
32 μA setting (REFCHRG = 15)
2
36
3
50
μA 2, 6
IELE Electrode oscillator current source base current
2 μA setting (EXTCHRG = 0)
32 μA setting (EXTCHRG = 15)
2
36
3
50
μA 2, 7
Pres5 Electrode capacitance measurement precision 8.3333 38400 fF/count 8
Pres20 Electrode capacitance measurement precision 8.3333 38400 fF/count 9
Pres100 Electrode capacitance measurement precision 8.3333 38400 fF/count 10
MaxSens Maximum sensitivity 0.003 12.5 fF/count 11
Res Resolution 16 bits
Table continues on the next page...
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 63
Table 45. TSI electrical specifications (continued)
Symbol Description Min. Typ. Max. Unit Notes
TCon20 Response time @ 20 pF 8 15 25 μs 12
ITSI_RUN Current added in run mode 55 μA
ITSI_LP Low power mode current adder 1.3 2.5 μA 13
1. The TSI module is functional with capacitance values outside this range. However, optimal performance is not guaranteed.
2. Fixed external capacitance of 20 pF.
3. REFCHRG = 2, EXTCHRG=0.
4. REFCHRG = 0, EXTCHRG = 10.
5. VDD = 3.0 V.
6. The programmable current source value is generated by multiplying the SCANC[REFCHRG] value and the base current.
7. The programmable current source value is generated by multiplying the SCANC[EXTCHRG] value and the base current.
8. Measured with a 5 pF electrode, reference oscillator frequency of 10 MHz, PS = 128, NSCN = 8; Iext = 16.
9. Measured with a 20 pF electrode, reference oscillator frequency of 10 MHz, PS = 128, NSCN = 2; Iext = 16.
10. Measured with a 20 pF electrode, reference oscillator frequency of 10 MHz, PS = 16, NSCN = 3; Iext = 16.
11. Sensitivity defines the minimum capacitance change when a single count from the TSI module changes, it is equal to (Cref
* Iext)/( Iref * PS * NSCN). Sensitivity depends on the configuration used. The typical value listed is based on the following
configuration: Iext = 6 μA (EXTCHRG = 2), PS = 128, NSCN = 2, Iref = 16 μA (REFCHRG = 7), Cref = 1.0 pF. The
minimum sensitivity describes the smallest possible capacitance that can be measured by a single count (this is the best
sensitivity but is described as a minimum because it’s the smallest number). The minimum sensitivity parameter is based
on the following configuration: Iext = 2 μA (EXTCHRG = 0), PS = 128, NSCN = 32, Iref = 32 μA (REFCHRG = 15).
12. Time to do one complete measurement of the electrode. Sensitivity resolution of 0.0133 pF, PS = 0, NSCN = 0, 1
electrode, EXTCHRG = 7.
13. REFCHRG=0, EXTCHRG=4, PS=7, NSCN=0F, LPSCNITV=F, LPO is selected (1 kHz), and fixed external capacitance of
20 pF. Data is captured with an average of 7 periods window.
7 Dimensions
7.1 Obtaining package dimensions
Package dimensions are provided in package drawings.
To find a package drawing, go to http://www.freescale.com and perform a keyword
search for the drawing’s document number:
If you want the drawing for this package Then use this document number
80-pin LQFP 98ASS23174W
81-pin MAPBGA 98ASA00344D
8 Pinout
Dimensions
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
64 Freescale Semiconductor, Inc.
8.1 K10 Signal Multiplexing and Pin Assignments
The following table shows the signals available on each pin and the locations of these
pins on the devices supported by this document. The Port Control Module is responsible
for selecting which ALT functionality is available on each pin.
81
MAP
BGA
80
LQFP
Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 EzPort
E4 1 PTE0 ADC1_SE4a ADC1_SE4a PTE0 SPI1_PCS1 UART1_TX I2C1_SDA RTC_CLKOUT
E3 2 PTE1/
LLWU_P0
ADC1_SE5a ADC1_SE5a PTE1/
LLWU_P0
SPI1_SOUT UART1_RX I2C1_SCL SPI1_SIN
E2 3 PTE2/
LLWU_P1
ADC1_SE6a ADC1_SE6a PTE2/
LLWU_P1
SPI1_SCK UART1_CTS_
b
F4 4 PTE3 ADC1_SE7a ADC1_SE7a PTE3 SPI1_SIN UART1_RTS_
b
SPI1_SOUT
E7 VDD VDD VDD
F7 VSS VSS VSS
H7 5 PTE4/
LLWU_P2
DISABLED PTE4/
LLWU_P2
SPI1_PCS0 UART3_TX
G4 6 PTE5 DISABLED PTE5 SPI1_PCS2 UART3_RX
E6 7 VDD VDD VDD
G7 8 VSS VSS VSS
F1 9 PTE16 ADC0_SE4a ADC0_SE4a PTE16 SPI0_PCS0 UART2_TX FTM_CLKIN0 FTM0_FLT3
F2 10 PTE17 ADC0_SE5a ADC0_SE5a PTE17 SPI0_SCK UART2_RX FTM_CLKIN1 LPTMR0_
ALT3
G1 11 PTE18 ADC0_SE6a ADC0_SE6a PTE18 SPI0_SOUT UART2_CTS_
b
I2C0_SDA
G2 12 PTE19 ADC0_SE7a ADC0_SE7a PTE19 SPI0_SIN UART2_RTS_
b
I2C0_SCL
L6 VSS VSS VSS
K1 13 PGA0_DP/
ADC0_DP0/
ADC1_DP3
PGA0_DP/
ADC0_DP0/
ADC1_DP3
PGA0_DP/
ADC0_DP0/
ADC1_DP3
K2 14 PGA0_DM/
ADC0_DM0/
ADC1_DM3
PGA0_DM/
ADC0_DM0/
ADC1_DM3
PGA0_DM/
ADC0_DM0/
ADC1_DM3
L1 15 PGA1_DP/
ADC1_DP0/
ADC0_DP3
PGA1_DP/
ADC1_DP0/
ADC0_DP3
PGA1_DP/
ADC1_DP0/
ADC0_DP3
L2 16 PGA1_DM/
ADC1_DM0/
ADC0_DM3
PGA1_DM/
ADC1_DM0/
ADC0_DM3
PGA1_DM/
ADC1_DM0/
ADC0_DM3
F5 17 VDDA VDDA VDDA
G5 18 VREFH VREFH VREFH
G6 19 VREFL VREFL VREFL
F6 20 VSSA VSSA VSSA
Pinout
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 65
81
MAP
BGA
80
LQFP
Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 EzPort
L3 21 VREF_OUT/
CMP1_IN5/
CMP0_IN5/
ADC1_SE18
VREF_OUT/
CMP1_IN5/
CMP0_IN5/
ADC1_SE18
VREF_OUT/
CMP1_IN5/
CMP0_IN5/
ADC1_SE18
K5 22 DAC0_OUT/
CMP1_IN3/
ADC0_SE23
DAC0_OUT/
CMP1_IN3/
ADC0_SE23
DAC0_OUT/
CMP1_IN3/
ADC0_SE23
L7 RTC_
WAKEUP_B
RTC_
WAKEUP_B
RTC_
WAKEUP_B
L4 23 XTAL32 XTAL32 XTAL32
L5 24 EXTAL32 EXTAL32 EXTAL32
K6 25 VBAT VBAT VBAT
J6 26 PTA0 JTAG_TCLK/
SWD_CLK/
EZP_CLK
TSI0_CH1 PTA0 UART0_CTS_
b/
UART0_COL_
b
FTM0_CH5 JTAG_TCLK/
SWD_CLK
EZP_CLK
H8 27 PTA1 JTAG_TDI/
EZP_DI
TSI0_CH2 PTA1 UART0_RX FTM0_CH6 JTAG_TDI EZP_DI
J7 28 PTA2 JTAG_TDO/
TRACE_SWO/
EZP_DO
TSI0_CH3 PTA2 UART0_TX FTM0_CH7 JTAG_TDO/
TRACE_SWO
EZP_DO
H9 29 PTA3 JTAG_TMS/
SWD_DIO
TSI0_CH4 PTA3 UART0_RTS_
b
FTM0_CH0 JTAG_TMS/
SWD_DIO
J8 30 PTA4/
LLWU_P3
NMI_b/
EZP_CS_b
TSI0_CH5 PTA4/
LLWU_P3
FTM0_CH1 NMI_b EZP_CS_b
K7 31 PTA5 DISABLED PTA5 FTM0_CH2 CMP2_OUT I2S0_TX_
BCLK
JTAG_TRST_
b
E5 VDD VDD VDD
G3 VSS VSS VSS
K8 32 PTA12 CMP2_IN0 CMP2_IN0 PTA12 CAN0_TX FTM1_CH0 I2S0_TXD0 FTM1_QD_
PHA
L8 33 PTA13/
LLWU_P4
CMP2_IN1 CMP2_IN1 PTA13/
LLWU_P4
CAN0_RX FTM1_CH1 I2S0_TX_FS FTM1_QD_
PHB
K9 34 PTA14 DISABLED PTA14 SPI0_PCS0 UART0_TX I2S0_RX_
BCLK
I2S0_TXD1
L9 35 PTA15 DISABLED PTA15 SPI0_SCK UART0_RX I2S0_RXD0
J10 36 PTA16 DISABLED PTA16 SPI0_SOUT UART0_CTS_
b/
UART0_COL_
b
I2S0_RX_FS I2S0_RXD1
H10 37 PTA17 ADC1_SE17 ADC1_SE17 PTA17 SPI0_SIN UART0_RTS_
b
I2S0_MCLK
L10 38 VDD VDD VDD
K10 39 VSS VSS VSS
L11 40 PTA18 EXTAL0 EXTAL0 PTA18 FTM0_FLT2 FTM_CLKIN0
K11 41 PTA19 XTAL0 XTAL0 PTA19 FTM1_FLT0 FTM_CLKIN1 LPTMR0_
ALT1
Pinout
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
66 Freescale Semiconductor, Inc.
81
MAP
BGA
80
LQFP
Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 EzPort
J11 42 RESET_b RESET_b RESET_b
G11 43 PTB0/
LLWU_P5
ADC0_SE8/
ADC1_SE8/
TSI0_CH0
ADC0_SE8/
ADC1_SE8/
TSI0_CH0
PTB0/
LLWU_P5
I2C0_SCL FTM1_CH0 FTM1_QD_
PHA
G10 44 PTB1 ADC0_SE9/
ADC1_SE9/
TSI0_CH6
ADC0_SE9/
ADC1_SE9/
TSI0_CH6
PTB1 I2C0_SDA FTM1_CH1 FTM1_QD_
PHB
G9 45 PTB2 ADC0_SE12/
TSI0_CH7
ADC0_SE12/
TSI0_CH7
PTB2 I2C0_SCL UART0_RTS_
b
FTM0_FLT3
G8 46 PTB3 ADC0_SE13/
TSI0_CH8
ADC0_SE13/
TSI0_CH8
PTB3 I2C0_SDA UART0_CTS_
b/
UART0_COL_
b
FTM0_FLT0
D10 47 PTB10 ADC1_SE14 ADC1_SE14 PTB10 SPI1_PCS0 UART3_RX FB_AD19 FTM0_FLT1
C10 48 PTB11 ADC1_SE15 ADC1_SE15 PTB11 SPI1_SCK UART3_TX FB_AD18 FTM0_FLT2
49 VSS VSS VSS
50 VDD VDD VDD
B10 51 PTB16 TSI0_CH9 TSI0_CH9 PTB16 SPI1_SOUT UART0_RX FB_AD17 EWM_IN
E9 52 PTB17 TSI0_CH10 TSI0_CH10 PTB17 SPI1_SIN UART0_TX FB_AD16 EWM_OUT_b
D9 53 PTB18 TSI0_CH11 TSI0_CH11 PTB18 CAN0_TX FTM2_CH0 I2S0_TX_
BCLK
FB_AD15 FTM2_QD_
PHA
C9 54 PTB19 TSI0_CH12 TSI0_CH12 PTB19 CAN0_RX FTM2_CH1 I2S0_TX_FS FB_OE_b FTM2_QD_
PHB
B9 55 PTC0 ADC0_SE14/
TSI0_CH13
ADC0_SE14/
TSI0_CH13
PTC0 SPI0_PCS4 PDB0_EXTRG FB_AD14 I2S0_TXD1
D8 56 PTC1/
LLWU_P6
ADC0_SE15/
TSI0_CH14
ADC0_SE15/
TSI0_CH14
PTC1/
LLWU_P6
SPI0_PCS3 UART1_RTS_
b
FTM0_CH0 FB_AD13 I2S0_TXD0
C8 57 PTC2 ADC0_SE4b/
CMP1_IN0/
TSI0_CH15
ADC0_SE4b/
CMP1_IN0/
TSI0_CH15
PTC2 SPI0_PCS2 UART1_CTS_
b
FTM0_CH1 FB_AD12 I2S0_TX_FS
B8 58 PTC3/
LLWU_P7
CMP1_IN1 CMP1_IN1 PTC3/
LLWU_P7
SPI0_PCS1 UART1_RX FTM0_CH2 CLKOUT I2S0_TX_
BCLK
59 VSS VSS VSS
60 VDD VDD VDD
A8 61 PTC4/
LLWU_P8
DISABLED PTC4/
LLWU_P8
SPI0_PCS0 UART1_TX FTM0_CH3 FB_AD11 CMP1_OUT
D7 62 PTC5/
LLWU_P9
DISABLED PTC5/
LLWU_P9
SPI0_SCK LPTMR0_
ALT2
I2S0_RXD0 FB_AD10 CMP0_OUT
C7 63 PTC6/
LLWU_P10
CMP0_IN0 CMP0_IN0 PTC6/
LLWU_P10
SPI0_SOUT PDB0_EXTRG I2S0_RX_
BCLK
FB_AD9 I2S0_MCLK
B7 64 PTC7 CMP0_IN1 CMP0_IN1 PTC7 SPI0_SIN I2S0_RX_FS FB_AD8
A7 65 PTC8 ADC1_SE4b/
CMP0_IN2
ADC1_SE4b/
CMP0_IN2
PTC8 I2S0_MCLK FB_AD7
D6 66 PTC9 ADC1_SE5b/
CMP0_IN3
ADC1_SE5b/
CMP0_IN3
PTC9 I2S0_RX_
BCLK
FB_AD6 FTM2_FLT0
C6 67 PTC10 ADC1_SE6b ADC1_SE6b PTC10 I2C1_SCL I2S0_RX_FS FB_AD5
Pinout
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 67
81
MAP
BGA
80
LQFP
Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 EzPort
C5 68 PTC11/
LLWU_P11
ADC1_SE7b ADC1_SE7b PTC11/
LLWU_P11
I2C1_SDA I2S0_RXD1 FB_RW_b
69 VSS VSS VSS
70 VDD VDD VDD
D5 71 PTC16 DISABLED PTC16 UART3_RX FB_CS5_b/
FB_TSIZ1/
FB_BE23_16_
BLS15_8_b
C4 72 PTC17 DISABLED PTC17 UART3_TX FB_CS4_b/
FB_TSIZ0/
FB_BE31_24_
BLS7_0_b
D4 73 PTD0/
LLWU_P12
DISABLED PTD0/
LLWU_P12
SPI0_PCS0 UART2_RTS_
b
FB_ALE/
FB_CS1_b/
FB_TS_b
D3 74 PTD1 ADC0_SE5b ADC0_SE5b PTD1 SPI0_SCK UART2_CTS_
b
FB_CS0_b
C3 75 PTD2/
LLWU_P13
DISABLED PTD2/
LLWU_P13
SPI0_SOUT UART2_RX FB_AD4
B3 76 PTD3 DISABLED PTD3 SPI0_SIN UART2_TX FB_AD3
A3 77 PTD4/
LLWU_P14
DISABLED PTD4/
LLWU_P14
SPI0_PCS1 UART0_RTS_
b
FTM0_CH4 FB_AD2 EWM_IN
A2 78 PTD5 ADC0_SE6b ADC0_SE6b PTD5 SPI0_PCS2 UART0_CTS_
b/
UART0_COL_
b
FTM0_CH5 FB_AD1 EWM_OUT_b
B2 79 PTD6/
LLWU_P15
ADC0_SE7b ADC0_SE7b PTD6/
LLWU_P15
SPI0_PCS3 UART0_RX FTM0_CH6 FB_AD0 FTM0_FLT0
A1 80 PTD7 DISABLED PTD7 CMT_IRO UART0_TX FTM0_CH7 FTM0_FLT1
A11 NC NC NC
B11 NC NC NC
C11 NC NC NC
K3 NC NC NC
H4 NC NC NC
F3 NC NC NC
H1 NC NC NC
H2 NC NC NC
J1 NC NC NC
J2 NC NC NC
J3 NC NC NC
H3 NC NC NC
K4 NC NC NC
H5 NC NC NC
J5 NC NC NC
H6 NC NC NC
Pinout
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
68 Freescale Semiconductor, Inc.
81
MAP
BGA
80
LQFP
Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 EzPort
J9 NC NC NC
J4 NC NC NC
H11 NC NC NC
F11 NC NC NC
E11 NC NC NC
D11 NC NC NC
E10 NC NC NC
F10 NC NC NC
F9 NC NC NC
F8 NC NC NC
E8 NC NC NC
B6 NC NC NC
A6 NC NC NC
A5 NC NC NC
B5 NC NC NC
B4 NC NC NC
A4 NC NC NC
A10 NC NC NC
A9 NC NC NC
B1 NC NC NC
C2 NC NC NC
C1 NC NC NC
D2 NC NC NC
D1 NC NC NC
E1 NC NC NC
8.2 K10 Pinouts
The below figure shows the pinout diagram for the devices supported by this document.
Many signals may be multiplexed onto a single pin. To determine what signals can be
used on which pin, see the previous section.
Pinout
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 69
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
VSSA
VREFL
VREFH
VDDA
PGA1_DM/ADC1_DM0/ADC0_DM3
PGA1_DP/ADC1_DP0/ADC0_DP3
PGA0_DM/ADC0_DM0/ADC1_DM3
PGA0_DP/ADC0_DP0/ADC1_DP3
PTE19
PTE18
PTE17
PTE16
VSS
VDD
PTE5
PTE4/LLWU_P2
PTE3
PTE2/LLWU_P1
PTE1/LLWU_P0
PTE0
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
PTD7
PTD6/LLWU_P15
PTD5
PTD4/LLWU_P14
PTD3
PTD2/LLWU_P13
PTD1
PTD0/LLWU_P12
PTC17
PTC16
VDD
VSS
PTC11/LLWU_P11
PTC10
PTC9
PTC8
PTC7
PTC6/LLWU_P10
PTC5/LLWU_P9
PTC4/LLWU_P8
VDD
VSS
PTC3/LLWU_P7
PTC2
PTC1/LLWU_P6
PTC0
PTB19
PTB18
PTB17
PTB16
VDD
VSS
PTB11
PTB10
PTB3
PTB2
PTB1
PTB0/LLWU_P5
RESET_b
PTA19
PTA18
VSS
VDD
PTA17
PTA16
PTA15
PTA14
PTA13/LLWU_P4
PTA12
PTA5
PTA4/LLWU_P3
PTA3
PTA2
PTA1
PTA0
VBAT
EXTAL32
XTAL32
DAC0_OUT/CMP1_IN3/ADC0_SE23
VREF_OUT/CMP1_IN5/CMP0_IN5/ADC1_SE18
Figure 29. K10 80 LQFP Pinout Diagram
Pinout
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
70 Freescale Semiconductor, Inc.
1
A PTD7
B NC
C NC
D NC
E NC
F PTE16
G PTE18
H NC
J NC
KPGA0_DP/
1
LPGA1_DP/
2
PTD5
PTD6/
NC
NC
PTE2/
PTE17
PTE19
NC
NC
PGA0_DM/
2
PGA1_DM/
3
PTD4/
PTD3
PTD2/
PTD1
PTE1/
NC
VSS
NC
NC
NC
3
VREF_OUT/
4
NC
NC
PTC17
PTD0/
PTE0
PTE3
PTE5
NC
NC
NC
4
XTAL32
5
NC
NC
PTC11/
PTC16
VDD
VDDA
VREFH
NC
NC
DAC0_OUT/
5
EXTAL32
6
NC
NC
PTC10
PTC9
VDD
VSSA
VREFL
NC
PTA0
VBAT
6
VSS
7
PTC8
PTC7
PTC6/
PTC5/
VDD
VSS
VSS
PTE4/
PTA2
PTA5
7
RTC_
8
PTC4/
PTC3/
PTC2
PTC1/
NC
NC
PTB3
PTA1
PTA4/
PTA12
8
PTA13/
9
NC
PTC0
PTB19
PTB18
PTB17
NC
PTB2
PTA3
NC
PTA14
9
PTA15
10
NC
PTB16
PTB11
PTB10
NC
NC
PTB1
PTA17
PTA16
VSS
10
VDD
11
ANC
BNC
CNC
DNC
ENC
FNC
G
PTB0/
HNC
JRESET_b
KPTA19
11
LPTA18
LLWU_P14 LLWU_P8
LLWU_P15 LLWU_P7
LLWU_P13 LLWU_P11 LLWU_P10
LLWU_P12 LLWU_P9 LLWU_P6
LLWU_P1 LLWU_P0
LLWU_P5
LLWU_P2
LLWU_P3
ADC0_DM0/
ADC1_DM3
ADC0_DP0/
ADC1_DP3 CMP1_IN3/
ADC0_SE23
WAKEUP_B LLWU_P4
CMP1_IN5/
CMP0_IN5/
ADC1_SE18
ADC1_DP0/
ADC0_DP3 ADC1_DM0/
ADC0_DM3
Figure 30. K10 81 MAPBGA Pinout Diagram
9 Revision History
The following table provides a revision history for this document.
Table 46. Revision History
Rev. No. Date Substantial Changes
1 3/2012 Initial public release
Table continues on the next page...
Revision History
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc. 71
Table 46. Revision History (continued)
Rev. No. Date Substantial Changes
2 4/2012 Replaced TBDs throughout.
Updated "Power consumption operating behaviors" table.
Updated "ADC electrical specifications" section.
Updated "VREF full-range operating behaviors" table.
Updated "I2S/SAI Switching Specifications" section.
Updated "TSI electrical specifications" table.
Revision History
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
72 Freescale Semiconductor, Inc.
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Rev. 2, 4/2012
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