IR2175SPBF - INTERNATIONAL RECTIFIER

Data Sheet No. PD60208 Rev. E

IR2175(S) & (PbF)

Block Diagram

Packages

Product Summary

VOFFSET 600Vmax

IQBS 2mA

Vin +/-260mVmax

Gain temp.drift 20ppm/oC (typ.)

fo130kHz (typ.)

Overcurrent trip 2µsec (typ)

signal delay

Overcurrent trip level +/-260mV (typ.)

LINEAR CURRENT SENSING IC

8 Lead PDIP

IR2175

8 Lead SOIC

IR2175S

Features

• Floating channel up to +600V

• Monolithic integration

• Linear current feedback through shunt resistor

• Direct digital PWM output for easy interface

• Low IQBS allows the boot strap power supply

• Independent fast overcurrent trip signal

• High common mode noise immunity

• Input overvoltage protection for IGBT short circuit

condition

• Open Drain outputs

• Also available LEAD-FREE

Description

The IR2175 is a monolithic current sensing IC designed

for motor drive applications. It senses the motor phase

current through an external shunt resistor , converts from

analog to digital signal, and transfers the signal to the

low side. IR’s proprietary high voltage isolation tech-

nology is implemented to enable the high bandwidth

signal processing. The output format is discrete PWM

to eliminate need for the A/D input interface for the

IR2175. The dedicated overcurrent trip (OC) signal fa-

cilitates IGBT short circuit protection. The open-drain

outputs make easy for any interface from 3.3V to 15V . S

(Refer to Lead Assignments for cor-

rect pin configuration). This/These

diagram(s) show electrical connec-

tions only. Please refer to our Appli-

cation Notes and DesignTips for

proper circuit board layout.

V+

VCC

COMIR2175

GND

15V

To Motor Phase

PWM Output

Up to 600V

OCOvercurrent

IR2175(S) & (PbF)

www.irf.com

Recommended Operating Conditions

The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recommended

conditions.

Note 1: Capacitors are required between VB and Vs when bootstrap power is used. The external power supply,

when used, is required between VB and Vs pins.

Symbol Definition Min. Max. Units

VBHigh side floating supply voltage VS +13.0 VS +20

VSHigh side floating supply offset voltage 0.3 600

VPO Digital PWM output voltage COM VCC

VOC Overcurrent output voltage COM VCC

VCC Low side and logic fixed supply voltage 9.5 20

VIN Input voltage between VIN+ and VS-260 +260 mV

TAAmbient temperature -40 125 °C

Symbol Definition Min. Max. Units

VSHigh side offset voltage -0.3 600

VBS High side floating supply voltage -0.3 25

VCC Low side and logic fixed supply voltage -0.3 25

VIN Maximum input voltage between VIN+ and VS-5 5

VPO Digital PWM output voltage COM -0.3 VCC +0.3

VOC Overcurrent output voltage COM -0.3 VCC +0.3

dV/dt Allowable offset voltage slew rate — 50 V/ns

PDPackage power dissipation @ TA ≤ +25°C 8 lead SOIC — .625

8 lead PDIP — 1.0

RthJA Thermal resistance, junction to ambient 8 lead SOIC — 200

8 lead PDIP — 125

TJJunction temperature — 150

TSStorage temperature -55 150

TLLead temperature (soldering, 10 seconds) — 300

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage

parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal

resistance and power dissipation ratings are measured under board mounted and still air conditions.

°C/W

°C

IR2175(S) & (PbF)

www.irf.com

Note 1: ±10mV offset represents ±1.5% duty cycle fluctuation

Note 2: Gain = (full range of duty cycle in %) / (full input voltage range).

VIN Nominal input voltage range before saturation -260 — 260

VIN+ _ VS

VOC+ Overcurrent trip positive input voltage — 260 —

VOC- Overcurrent trip negative input voltage — -260 —

VOS Input offset voltage -10 0 10 VIN = 0V (Note 1)

∆VOS/∆TA Input offset voltage temperature drift — 25 — µV/oC

G Gain (duty cycle % per VIN) 155 160 165 %/V max gain error=5%

(Note 2)

∆G/∆TA Gain temperature drift — 20 — ppm/oC

ILK Offset supply leakage current — — 50 µA VB = VS = 600V

IQBS Quiescent VBS supply current — 2 — VS = 0V

IQCC Quiescent VCC supply current — — 0.5

LIN Linearity (duty cycle deviation from ideal linearity — 0.5 1 %

curve)

∆VLIN/∆TA Linearity temperature drift — .005 — %/oC

IOPO Digital PWM output sink current 20 — —

2——

IOCC OC output sink current 10 — —

1——

DC Electrical Characteristics

VCC = VBS = 15V, and TA = 25o unless otherwise specified.

Symbol Definition Min. Typ. Max. Units Test Conditions

VO = 1V

VO = 0.1V

VO = 1V

VO = 0.1V

Symbol Definition Min. Typ. Max. Units Test Conditions

Propagation delay characteristics

fo Carrier frequency output 100 130 180 kHz

∆f/∆TATemperature drift of carrier frequency — 500 — ppm/oC

Dmin Minimum duty — 9 — %

Dmax Maximum duty — 91 — % VIN+=+260mV

BW fo bandwidth — 15 — kHz

PHS Phase shift at 1kHz — -10 — o

tdoc Propagation delay time of OC 1 2 —

twoc Low true pulse width of OC — 1.5 —

AC Electrical Characteristics

VCC = VBS = 15V, and TA = 25o unless otherwise specified.

figure 1

VIN = 0 & 5V

VIN+=-260mV,

VIN+ = 100mVpk -pk

sine wave, gain=-3dB

VIN+ =100mVpk-pk

sine wave

µsec

IR2175(S) & (PbF)

www.irf.com

Application Hint:

T emperature drift of the output carrier frequency can be cancelled by measuring both a PWM period and the on-time

of PWM (Duty) at the same time. Since both periods vary in the same direction, computing the ratio between these

values at each PWM period gives consistent measurement of the current feedback over the temperature drift.

Vin+= -260mV

Vs = 0V

Vin+= +260mV

Vs = 0V

Duty=91%

Duty=9%

Carrier Frequency =

130kHz

Timing Waveforms

Figure 1 Output waveform

IR2175(S) & (PbF)

www.irf.com

Lead Assignment

Lead Definitions

Symbol Description

VCC Low side and logic supply voltage

COM Low side logic ground

VIN+ Positive sense input

VBHigh side supply

VSHigh side return

PO Digital PWM output

OC Overcurrent output (negative logic)

N.C. No connection

IR2175S IR2175

1VC

COM

VIN

1VC

COM

VIN

8 lead SOIC

Also available LEAD-FREE (PbF) 8 lead PDIP

Also available LEAD-FREE (PbF)

IR2175(S) & (PbF)

www.irf.com

Case Outlines

01-6014

01-3003 01 (MS-001AB)

8 Lead PDIP

01-6027

01-0021 11 (MS-012AA)

8 Lead SOIC

D B

0. 25 [.010 ] A

4312

4 . OUT LIN E CONFORMS T O JEDE C OUT L INE MS-012A A .

NOTES:

1. DI MENSIONING & TOLERANCI NG PER ASME Y14.5M-1994.

2 . CONT ROL LING DIMENSION: MILLIMET ER

3 . D IMENSIONS ARE SHOW N IN MILLIMET ER S [INCHES] .

K x 4 5°

8X L 8X c

FOOTPRINT

8X 0.72 [ . 02 8]

6. 46 [ . 2 55]

3X 1.27 [ . 05 0] 8X 1.78 [ . 07 0]

5 D IMENSION DOES NOT INCLUD E MOLD PROTRUSIONS.

6 D IMENSION DOES NOT INCLUD E MOLD PROTRUSIONS.

MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].

7 D IMENSION IS T HE L ENGT H OF L EAD FOR SOLD ERING T O

A SUBSTRATE.

MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].

0. 25 [.010 ] CAB

e1 A

8X b

0. 10 [.004 ]

.189

.1497

0°

.013

.050 BASIC

.0532

.0040

.2284

.0099

.016

.1968

.1574

8°

.020

.0688

.0098

.2440

.0196

.050

4.80

3.80

0.33

1.35

0.10

5.80

0.25

0.40

0°

1.27 BASIC

5.00

4.00

0.51

1.75

0.25

6.20

0.50

1.27

MIN MAX MILLIMETERSINC H ES MIN MAX

DIM

8°

c .0075 .0098 0.19 0.25

.025 BASIC 0.635 BASIC

IR2175(S) & (PbF)

www.irf.com

Basic Part (Non-Lead Free)

8-Lead PDIP IR2175 order IR2175

8-Lead SOIC IR2175S order IR2175S

Leadfree Part

8-Lead PDIP IR2175 order IR2175PbF

8-Lead SOIC IR2175S order IR2175SPbF

ORDER INFORMATION

LEADFREE PART MARKING INFORMATION

Lead Free Released

Non-Lead Free

Released

Part number

Date code

IRxxxxxx

YWW?

?XXXX

Pin 1

Identifier

IR logo

Lot Code

(Prod mode - 4 digit SPN code)

Assembly site code

Per SCOP 200-002

?MARKING CODE

Thisproduct has been designed and qualified for the industrial market.

Qualification Standards can be found on IR’s Web Site http://www.irf.com

Data and specifications subject to change without notice.

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105

9/6/2004