2018 Microchip Technology Inc. DS20005982B-page 1
MIC5528
Features
• Input Voltage Range: 2.5V to 5.5V
• Output Voltage Range: 1.0V to 5.0V
• Fixed Output Voltages: 1.1V, 1.2V, 1.8V, 2.8V,
3.0V, 3.3V
• ±2% Room Temperature Accuracy
• Low Quiescent Current 38 µA
• Stable with 2.2 µF Ceramic Output Capacitors
• Low Dropout Voltage 260 mV @ 500 mA
• Auto-Discharge and Internal Enable Pull-Down
• Thermal Shutdown and Current-Limit Protection
• 6-Pin 1.2 mm × 1.2 mm Extra Thin DFN Package
• 6-Pin 1.2 mm × 1.2 mm Thin DFN Package
Applications
• Portable Communication Equipment
• DSC, GPS, PMP, and PDAs
• Portable Medical Devices
• 5V POL Applications
General Description
The MIC5528 is a low-power, µCap, low dropout
regulator designed for optimal performance in a very
small footprint. It is capable of sourcing up to 500 mA
of output current while only drawing 38 µA of operating
current. This high performance LDO is a µCap design
in a thermally enhanced 1.2 mm × 1.2 mm extra thin
(0.4 mm height) DFN package. It operates with small
ceramic output capacitor for stability, thereby reducing
required board space.
Ideal for battery-operated applications, the MIC5528
offers ±2% accuracy, extremely low dropout voltage
(260 mV @ 500 mA), and can regulate output voltages
down to 1.0V. Equipped with a TTL logic-compatible
enable pin, the MIC5528 can be put into a
zero-off-mode current state, drawing no current when
disabled.
The MIC5528 is a µCap design, operating with very
small ceramic output capacitors for stability, reducing
required board space and component cost for
space-critical applications. The MIC5528 has an
operating junction temperature range of –40°C to
125°C.
Package Types
MIC5528
6-Lead Thin DFN (MT)
(Top View)
MIC5528
6-Lead Extra Thin DFN (MX)
(Top View)
1
2
34
5
6
EP
VOUT
VOUT
GND
VIN
NC
EN
1
2
34
5
6
EP
VOUT
VOUT
GND
VIN
NC
EN
High Performance 500 mA LDO
in Thin and Extra Thin DFN Packages
MIC5528
DS20005982B-page 2 2018 Microchip Technology Inc.
Typical Application Circuit
Functional Block Diagram
VBAT
VIN
EN
VOUT
GND
PORTABLE
COMMUNICATION
EQUIPMENT
MIC5528
VIN
EN ENABLE BIAS
UVLO
TSD LDO
VOUT
GND
2018 Microchip Technology Inc. DS20005982B-page 3
MIC5528
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN) .................................................................................................................................... –0.3V to +6V
Enable Voltage (VEN) .....................................................................................................................................–0.3V to VIN
Power Dissipation (PD) ............................................................................................................. Internally Limited, Note 1
ESD Rating (Note 2) .................................................................................................................................................. 3 kV
Operating Ratings ‡
Supply Voltage (VIN) ................................................................................................................................. +2.5V to +5.5V
Enable Voltage (VEN) ..........................................................................................................................................0V to VIN
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA)/JA.
Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the reg-
ulator will go into thermal shutdown.
2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 k in series
with 100 pF.
TABLE 1-1: ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VEN = VOUT + 1V; CIN = COUT = 2.2 µF; IOUT = 100 µA; TJ = +25°C, bold values
indicate –40°C to +85°C, unless noted. Note 1
Parameter Symbol Min. Typ. Max. Units Conditions
Output Voltage Accuracy —
–2.0 ±1 +2.0
%
Variation from nominal VOUT
–3.0 —+3.0 Variation from nominal VOUT;
–40°C to +85°C
Line Regulation — — 0.02 0.3 %/V VIN = VOUT + 1V to 5.5V; IOUT =
100 µA
Load Regulation (Note 2)——14
65 mV IOUT = 100µA to 500mA
Dropout Voltage (Note 3)V
DO
—80180 mV IOUT = 150 mA
—260500 IOUT = 500 mA
Ground Pin Current (Note 4)I
GND
—3855 µA IOUT = 0 mA
—4265 IOUT = 500 mA
Ground Pin Current in
Shutdown ISHDN —0.05 1 µAV
EN = 0V
Ripple Rejection PSRR —70— dB f = 100 Hz, IOUT = 100 mA
— 60 — f = 1 kHz, IOUT = 100 mA
Current Limit ILIM 525 800 — mA VOUT = 0V
Output Voltage Noise — — 175 — µVRMS f =10Hz to 100kHz
Auto-Discharge NFET
Resistance ——25— VEN = 0V; VIN = 3.6V; IOUT = –3 mA
Enable Input
Enable Pull-Down Resistor — — 4 — M—
Enable Input Voltage VEN
——0.2 VLogic low
1.2 — — Logic high
MIC5528
DS20005982B-page 4 2018 Microchip Technology Inc.
Enable Input Current IEN
—0.01 1 µA VEN = 0V
—1.4 2 V
EN = 5.5V
Turn-On Time tON —50125 µs IOUT = 150 mA
Note 1: Specification for packaged product only.
2: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Changes in
output voltage due to heating effects are covered by the thermal regulation specification.
3: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential. For outputs below 2.5V, dropout voltage is the input-to-output
differential with the minimum input voltage 2.5V.
4: Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum of
the load current plus the ground pin current.
TABLE 1-1: ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VEN = VOUT + 1V; CIN = COUT = 2.2 µF; IOUT = 100 µA; TJ = +25°C, bold values
indicate –40°C to +85°C, unless noted. Note 1
Parameter Symbol Min. Typ. Max. Units Conditions
2018 Microchip Technology Inc. DS20005982B-page 5
MIC5528
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Storage Temperature Range TS–65 — +150 °C —
Maximum Junction Temperature Range TJ–40 — +150 °C —
Junction Operating Temperature Range TJ–40 — +125 °C —
Lead Temperature — — — +260 °C Soldering, 10s
Package Thermal Resistances
Thermal Resistance 6-Lead Extra Thin DFN JA —173—°C/W—
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
MIC5528
DS20005982B-page 6 2018 Microchip Technology Inc.
2.0 TYPICAL PERFORMANCE CURVES
FIGURE 2-1: Power Supply Rejection
Ratio.
FIGURE 2-2: Dropout Voltage vs. Output
Current.
FIGURE 2-3: Dropout Voltage vs.
Temperature.
FIGURE 2-4: Ground Current vs. Supply
Voltage.
FIGURE 2-5: Ground Current vs. Load
Current.
FIGURE 2-6: Ground Current vs.
Temperature.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
2018 Microchip Technology Inc. DS20005982B-page 7
MIC5528
FIGURE 2-7: Output Voltage vs. Output
Current.
FIGURE 2-8: Output Voltage vs. Supply
Voltage.
FIGURE 2-9: Output Voltage vs.
Temperature.
FIGURE 2-10: Current Limit vs. Supply
Voltage.
FIGURE 2-11: Output Noise Spectral
Density (MIC5528-3.3YMT).
FIGURE 2-12: Enable Turn-On.
VIN = 4.3V
VOUT = 3.3V
CIN = COUT = 2.2μF
Time (40μs/div)
VEN
(1V/div)
VOUT
(2V/div)
MIC5528
DS20005982B-page 8 2018 Microchip Technology Inc.
FIGURE 2-13: Auto-Discharge (No Load).
FIGURE 2-14: Line Transient.
FIGURE 2-15: Load Transient.
FIGURE 2-16: Power Supply Rejection
Ratio.
FIGURE 2-17: Ground Current vs. Input
Voltage.
FIGURE 2-18: Ground Current vs. Output
Current.
VIN = 4.3V
VOUT = 3.3V
CIN = COUT = 2.2μF
Time (100μs/div)
VEN
(1V/div)
VOUT
(2V/div)
VOUT = 3.3V
CIN = COUT = 2.2μF
IOUT = 500mA
Time (20μs/div)
VIN
(1V/div)
VOUT
(AC-COUPLED)
(100mV/div)
VIN = 4.3V
VOUT = 3.3V
CIN = COUT = 2.2μF
Time (20μs/div)
IOUT
(200mA/div)
VOUT
(AC-COUPLED)
(100mV/div)
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
0.01 0.1 1 10 100 1000 10000
PSRR (dB)
FREQUENCY (kHz)
V
IN
= 2.7V
V
IN
_AC = 400 mVp-p
C
IN
= 0 μF
C
OUT
= 2.2 μF
I
OUT
= 300 mA
I
OUT
= 500 mA
I
OUT
= 150 mA
I
OUT
= 100 μA
V
OUT
= 1.1V
70
I
OUT
= 500 mA
2018 Microchip Technology Inc. DS20005982B-page 9
MIC5528
FIGURE 2-19: Output Voltage vs. Output
Current.
FIGURE 2-20: Output Voltage vs. Input
Voltage.
FIGURE 2-21: Current Limit vs. Input
Voltage.
FIGURE 2-22: Output Noise Spectral
Density.
FIGURE 2-23: Start-Up from VIN.
FIGURE 2-24: Start-Up from ENABLE.
0.0V
5.0V
0.0V
1.1V
VOUT = 1.1V
VIN = 0V to 5.0V
IOUT = 100 µA
VOUT (DC Coupled, 500 mV/Div)
VIN (DC Coupled, 2V/Div)
Time = 10 µs/Div
VIN
VOUT
Time = 10 µs/Div
VOUT = 1.1V
VIN = 2.5V
IOUT = 100 µA
0.0V
2.5V VEN (DC Coupled, 1V/Div)
VOUT (DC Coupled, 500 mV/Div)
1.1V
0.0V
VEN
VOUT
MIC5528
DS20005982B-page 10 2018 Microchip Technology Inc.
FIGURE 2-25: Auto-Discharge (No Load).
FIGURE 2-26: Line Transient.
FIGURE 2-27: Line Transient.
FIGURE 2-28: Load Transient.
FIGURE 2-29: Load Transient.
FIGURE 2-30: Load Transient.
2.5V
0.0V
VEN (DC Coupled, 1V/Div)
VOUT (DC Coupled, 500 mV/Div)
Time = 40 µs/Div
1.1V
VOUT = 1.1V
VIN = 2.5V
IOUT = 0
VEN
VOUT
2.5V
3.5V
Time = 40 µs/Div
VIN (DC Coupled, 1V/Div)
VOUT (AC Coupled, 10 mV/Div)
VOUT = 1.1V
VOUT
VIN
Time = 40 µs/Div
2.5V
5.5V
VIN (DC Coupled, 2V/Div)
VOUT (AC Coupled, 50 mV/Div)
VOUT = 1.1V
VOUT
VIN
Time = 40 µs/Div
100 µA
500 mA
VOUT (AC Coupled, 100 mV/Div)
IOUT (DC Coupled, 200 mA/Div)
VOUT = 1.1V
VOUT
IOUT
1 mA
500 mA
IOUT (DC Coupled, 200 mA/Div)
Time = 40 µs/Div
VOUT (AC Coupled, 100 mV/Div)
VOUT = 1.1V
VOUT
IOUT
100 µA
150 mA
IOUT (DC Coupled, 200 mA/Div)
Time = 40 µs/Div
VOUT (AC Coupled, 100 mV/Div)
VOUT = 1.1V
VOUT
IOUT
2018 Microchip Technology Inc. DS20005982B-page 11
MIC5528
FIGURE 2-31: Load Transient.
1 mA
150 mA
IOUT (DC Coupled, 200 mA/Div)
Time = 40 µs/Div
VOUT (AC Coupled, 100 mV/Div)
VOUT = 1.1V
VOUT
IOUT
MIC5528
DS20005982B-page 12 2018 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin Number Pin Name Description
1, 2 VOUT Output Voltage. When disabled, the MIC5528 switches in an internal 25 load to
discharge the external capacitors.
3 GND Ground.
4 EN Enable Input: Active-High. High = ON; Low = OFF. The MIC5528 has an internal
pull-down and this pin can be left floating.
5 NC No Connection.
6 VIN Supply input.
EP ePad Exposed Heatsink Pad. Connect to GND for best thermal performance.
2018 Microchip Technology Inc. DS20005982B-page 13
MIC5528
4.0 APPLICATION INFORMATION
The MIC5528 is a high performance, low power
500 mA LDO. The MIC5528 includes an
auto-discharge circuit that is switched on when the
regulator is disabled through the enable pin. The
MIC5528 also offers an internal pull-down resistor on
the enable pin to ensure the output is disabled if the
control signal is tri-stated. The MIC5528 regulator is
fully protected from damage due to fault conditions,
offering linear current-limiting and thermal shutdown.
4.1 Input Capacitor
The MIC5528 is a high performance, high bandwidth
device. An input capacitor of 2.2 µF is required from the
input to ground to provide stability. Low-ESR ceramic
capacitors provide optimal performance at a minimum
of space. Additional high frequency capacitors, such as
small-valued NPO dielectric-type capacitors, help filter
out high frequency noise and are good practice in any
RF-based circuit. X5R or X7R dielectrics are
recommended for the input capacitor. Y5V dielectrics
lose most of their capacitance over temperature and
are therefore, not recommended.
4.2 Output Capacitor
The MIC5528 requires an output capacitor of 2.2 µF or
greater to maintain stability. The design is optimized for
use with low-ESR ceramic chip capacitors. High-ESR
capacitors are not recommended because they may
cause high frequency oscillation. The output capacitor
can be increased, but performance has been optimized
for a 2.2 µF ceramic output capacitor and does not
improve significantly with larger capacitance.
X7R/X5R dielectric-type ceramic capacitors are
recommended because of their temperature
performance. X7R-type capacitors change capacitance
by 15% over their operating temperature range and are
the most stable type of ceramic capacitors. Z5U and
Y5V dielectric capacitors change value by as much as
50% and 60%, respectively, over their operating
temperature ranges. To use a ceramic chip capacitor
with Y5V dielectric, the value must be much higher than
an X7R ceramic capacitor to ensure the same
minimum capacitance over the equivalent operating
temperature range.
4.3 No-Load Stability
Unlike many other voltage regulators, the MIC5528
remains stable and in regulation with no load. This is
especially important in CMOS RAM keep-alive
applications.
4.4 Enable/Shutdown
The MIC5528 comes with an active-high enable pin
that allows the regulator to be disabled. Forcing the
enable pin low disables the regulator and sends it into
an off mode current state drawing virtually zero current.
When disabled the MIC5528 switches an internal 25
load on the regulator output to discharge the external
capacitor.
Forcing the enable pin high enables the output voltage.
The MIC5528 has an internal pull-down resistor on the
enable pin to disable the output when the enable pin is
floating.
4.5 Thermal Considerations
The MIC5528 is designed to provide 500 mA of
continuous current in a very small package. Maximum
ambient operating temperature can be calculated
based on the output current and the voltage drop
across the part. For example, if the input voltage is
3.6V, the output voltage is 3.3V, and the output current
is 500 mA. The actual power dissipation of the
regulator circuit can be determined using Equation 4-1:
EQUATION 4-1:
Because this device is CMOS and the ground current
is typically <100 µA over the load range, the power
dissipation contributed by the ground current is <1%
and can be ignored Equation 4-2:
EQUATION 4-2:
To determine the maximum ambient operating
temperature of the package, use the
junction-to-ambient thermal resistance of the device
Equation 4-3:
PDVIN VOUT
–IOUT
VIN
+IGND
=
PD3.6V3.3V–500mA0.150W==
MIC5528
DS20005982B-page 14 2018 Microchip Technology Inc.
EQUATION 4-3:
Substituting PD for PD(MAX) and solving for the ambient
operating temperature will give the maximum operating
conditions for the regulator circuit. The
junction-to-ambient thermal resistance for the
minimum footprint is 173°C/W.
The maximum power dissipation must not be exceeded
for proper operation.
For example, when operating the MIC5528-3.3YMX at
an input voltage of 3.6V and a 500 mA load with a
minimum footprint layout, the maximum ambient
operating temperature TA can be determined as in
Equation 4-4:
EQUATION 4-4:
Therefore, the maximum ambient operating
temperature allowed in a thermally enhanced 1.2 mm ×
1.2 mm XTDFN package is 99°C. For a full discussion
of heat sinking and thermal effects on voltage
regulators, refer to the “Regulator Thermals” section of
Microchip’s Designing with Low-Dropout Voltage
Regulators handbook.
PDMAX
TJMAX
TA
–
JA
--------------------------------
=
Where:
TJ(MAX) = 125°C, the maximum junction
temperature of the die.
JA = Thermal resistance of 173°C/W for the
XTDFN.
0.15W125CT
A
–173C/W=
TA99C=
2018 Microchip Technology Inc. DS20005982B-page 15
MIC5528
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Example6-Lead TDFN*
XX
Example6-Lead XTDFN*
XX
CF
CF
Legend: XX...X Product code or customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
, , Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar () symbol may not be to scale.
3
e
3
e
MIC5528
DS20005982B-page 16 2018 Microchip Technology Inc.
6-Lead Thin DFN 1.2 mm x 1.2 mm Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 Microchip Technology Inc. DS20005982B-page 17
MIC5528
6-Lead Extra Thin DFN 1.2 mm x 1.2 mm Package Outline and Recommended Land
Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
MIC5528
DS20005982B-page 18 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20005982B-page 19
MIC5528
APPENDIX A: REVISION HISTORY
Revision A (March 2018)
• Converted Micrel document MIC5528 to Micro-
chip data sheet DS20005982A.
• Minor text changes throughout.
Revision B (October 2018)
• Updated Output Voltage information in Features.
• Updated Output Voltage information in Product
Identification System section accordingly.
MIC5528
DS20005982B-page 20 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20005982B-page 21
MIC5528
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) MIC5528-1.1YMX-T5: MIC5528, 1.1V Output
Voltage, –40°C to +125°C
Temperature Range, 6-Lead
XTDFN, 500/Reel
b) MIC5528-1.2YMX-TR: MIC5528, 1.2V Output
Voltage, –40°C to +125°C
Temperature Range, 6-Lead
XTDFN, 5,000/Reel
c) MIC5528-1.8YMX-T5: MIC5528, 1.8V Output
Voltage, –40°C to +125°C
Temperature Range, 6-Lead
XTDFN, 500/Reel
d) MIC5528-2.8YMX-TR: MIC5528, 2.8V Output
Voltage, –40°C to +125°C
Temperature Range, 6-Lead
XTDFN, 5,000/Reel
e) MIC5528-3.3YMT-T5: MIC5528, 3.3V Output
Voltage, –40°C to +125°C
Temperature Range, 6-Lead
TDFN, 500/Reel
f) MIC5528-3.3YMT-TR: MIC5528, 3.3V Output
Voltage, –40°C to +125°C
Temperature Range, 6-Lead
TDFN, 5,000/Reel
g) MIC5528-3.0YMX-T5: MIC5528, 3.0V Output
Voltage, –40°C to +125°C
Temperature Range, 6-Lead
XTDFN, 500/Reel
h) MIC5528-3.3YMX-TR: MIC5528, 3.3V Output
Voltage, –40°C to +125°C
Temperature Range, 6-Lead
XTDFN, 5,000/Reel
Device:
MIC5528: High Performance Single 500 mA µCap
LDO in Thin and Extra Thin DFN Pack-
ages, Featuring Auto Discharge & Internal
Enable Pull-Down
Output Voltage:
1.1 = 1.1V (MX Package only)
1.2 = 1.2V (MX Package only)
1.8 = 1.8V (MX Package only)
2.8 = 2.8V (MX Package only)
3.0 = 3.0V (MX Package only)
3.3 = 3.3V
Junction
Temperature
Range:
Y = –40°C to +125°C, RoHS-Compliant
Package: MT = 6-Lead 1.2 mm x 1.2 mm x 0.6 mm TDFN
MX = 6-Lead 1.2 mm x 1.2 mm x 0.4 mm XTDFN
Media Type: T5 = 500/Reel
TR = 5,000/Reel
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
Device -X.X XXX -XX
Part No. Output
Voltage
Junction
Temp. Range
Package Media Type
Note: Other voltage options available. Contact your Microchip Sales
Office for more information.
MIC5528
DS20005982B-page 22 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20005982B-page 23
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
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Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3786-4
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS20005982B-page 24 2018 Microchip Technology Inc.
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