MIC5528 High Performance 500 mA LDO in Thin and Extra Thin DFN Packages Features General Description * Input Voltage Range: 2.5V to 5.5V * Output Voltage Range: 1.0V to 5.0V * Fixed Output Voltages: 1.1V, 1.2V, 1.8V, 2.8V, 3.0V, 3.3V * 2% Room Temperature Accuracy * Low Quiescent Current 38 A * Stable with 2.2 F Ceramic Output Capacitors * Low Dropout Voltage 260 mV @ 500 mA * Auto-Discharge and Internal Enable Pull-Down * Thermal Shutdown and Current-Limit Protection * 6-Pin 1.2 mm x 1.2 mm Extra Thin DFN Package * 6-Pin 1.2 mm x 1.2 mm Thin DFN Package The MIC5528 is a low-power, Cap, low dropout regulator designed for optimal performance in a very small footprint. It is capable of sourcing up to 500 mA of output current while only drawing 38 A of operating current. This high performance LDO is a Cap design in a thermally enhanced 1.2 mm x 1.2 mm extra thin (0.4 mm height) DFN package. It operates with small ceramic output capacitor for stability, thereby reducing required board space. Applications * * * * Portable Communication Equipment DSC, GPS, PMP, and PDAs Portable Medical Devices 5V POL Applications Ideal for battery-operated applications, the MIC5528 offers 2% accuracy, extremely low dropout voltage (260 mV @ 500 mA), and can regulate output voltages down to 1.0V. Equipped with a TTL logic-compatible enable pin, the MIC5528 can be put into a zero-off-mode current state, drawing no current when disabled. The MIC5528 is a Cap design, operating with very small ceramic output capacitors for stability, reducing required board space and component cost for space-critical applications. The MIC5528 has an operating junction temperature range of -40C to 125C. Package Types MIC5528 6-Lead Thin DFN (MT) (Top View) MIC5528 6-Lead Extra Thin DFN (MX) (Top View) VOUT 1 6 VIN VOUT 1 6 VIN VOUT 2 5 NC VOUT 2 5 NC 4 EN GND 3 GND 3 EP 2018 Microchip Technology Inc. EP 4 EN DS20005982B-page 1 MIC5528 Typical Application Circuit VIN VOUT MIC5528 EN PORTABLE COMMUNICATION EQUIPMENT VBAT GND Functional Block Diagram VIN EN ENABLE UVLO VOUT BIAS TSD LDO GND DS20005982B-page 2 2018 Microchip Technology Inc. MIC5528 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Supply Voltage (VIN) .................................................................................................................................... -0.3V to +6V Enable Voltage (VEN) .....................................................................................................................................-0.3V to VIN Power Dissipation (PD) ............................................................................................................. Internally Limited, Note 1 ESD Rating (Note 2) .................................................................................................................................................. 3 kV Operating Ratings Supply Voltage (VIN) ................................................................................................................................. +2.5V to +5.5V Enable Voltage (VEN) ..........................................................................................................................................0V to VIN Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Notice: The device is not guaranteed to function outside its operating ratings. Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) - TA)/JA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. 2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 k in series with 100 pF. TABLE 1-1: ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN = VEN = VOUT + 1V; CIN = COUT = 2.2 F; IOUT = 100 A; TJ = +25C, bold values indicate -40C to +85C, unless noted. Note 1 Parameter Symbol Output Voltage Accuracy -- Line Regulation -- Load Regulation (Note 2) -- Dropout Voltage (Note 3) VDO Ground Pin Current (Note 4) IGND Ground Pin Current in Shutdown ISHDN Ripple Rejection PSRR Current Limit Min. Typ. Max. -2.0 1 +2.0 Units Conditions Variation from nominal VOUT % Variation from nominal VOUT; -40C to +85C -3.0 -- +3.0 -- 0.02 0.3 %/V VIN = VOUT + 1V to 5.5V; IOUT = 100 A mV IOUT = 100 A to 500 mA -- 14 65 -- 80 180 -- 260 500 -- 38 55 -- 42 65 -- 0.05 1 -- 70 -- -- 60 -- mV A A dB ILIM 525 800 -- mA Output Voltage Noise -- -- 175 -- VRMS Auto-Discharge NFET Resistance -- -- 25 -- -- -- 4 -- M -- -- 0.2 1.2 -- -- IOUT = 150 mA IOUT = 500 mA IOUT = 0 mA IOUT = 500 mA VEN = 0V f = 100 Hz, IOUT = 100 mA f = 1 kHz, IOUT = 100 mA VOUT = 0V f =10 Hz to 100 kHz VEN = 0V; VIN = 3.6V; IOUT = -3 mA Enable Input Enable Pull-Down Resistor Enable Input Voltage 2018 Microchip Technology Inc. VEN V -- Logic low Logic high DS20005982B-page 3 MIC5528 TABLE 1-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = VEN = VOUT + 1V; CIN = COUT = 2.2 F; IOUT = 100 A; TJ = +25C, bold values indicate -40C to +85C, unless noted. Note 1 Parameter Symbol Enable Input Current IEN Turn-On Time tON Note 1: 2: 3: 4: Min. Typ. Max. -- 0.01 1 -- 1.4 2 -- 50 125 Units A s Conditions VEN = 0V VEN = 5.5V IOUT = 150 mA Specification for packaged product only. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. For outputs below 2.5V, dropout voltage is the input-to-output differential with the minimum input voltage 2.5V. Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum of the load current plus the ground pin current. DS20005982B-page 4 2018 Microchip Technology Inc. MIC5528 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions TS -65 -- +150 C -- Maximum Junction Temperature Range TJ -40 -- +150 C -- Junction Operating Temperature Range TJ -40 -- +125 C -- Lead Temperature -- -- -- +260 C Soldering, 10s JA -- 173 -- C/W Temperature Ranges Storage Temperature Range Package Thermal Resistances Thermal Resistance 6-Lead Extra Thin DFN Note 1: -- The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125C rating. Sustained junction temperatures above +125C can impact the device reliability. 2018 Microchip Technology Inc. DS20005982B-page 5 MIC5528 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 2-1: Ratio. Power Supply Rejection FIGURE 2-4: Voltage. Ground Current vs. Supply FIGURE 2-2: Current. Dropout Voltage vs. Output FIGURE 2-5: Current. Ground Current vs. Load FIGURE 2-3: Temperature. Dropout Voltage vs. FIGURE 2-6: Temperature. Ground Current vs. DS20005982B-page 6 2018 Microchip Technology Inc. MIC5528 FIGURE 2-7: Current. Output Voltage vs. Output FIGURE 2-10: Voltage. Current Limit vs. Supply FIGURE 2-8: Voltage. Output Voltage vs. Supply FIGURE 2-11: Output Noise Spectral Density (MIC5528-3.3YMT). VEN (1V/div) VOUT (2V/div) VIN = 4.3V VOUT = 3.3V CIN = COUT = 2.2F Time (40s/div) FIGURE 2-9: Temperature. Output Voltage vs. 2018 Microchip Technology Inc. FIGURE 2-12: Enable Turn-On. DS20005982B-page 7 MIC5528 PSRR (dB) VIN = 4.3V VOUT = 3.3V CIN = COUT = 2.2F VEN (1V/div) VOUT (2V/div) Time (100s/div) FIGURE 2-13: Auto-Discharge (No Load). 0 VOUT = 1.1V VIN = 2.7V -10 V IN_AC = 400 mVp-p -20 CIN = 0 F -30 COUT = 2.2 F -40 IOUT = 500 mA -50 IOUT = 300 mA -60 -70 IOUT = 100 A -80 IOUT = 150 mA -90 -100 0.01 0.1 1 10 100 1000 10000 FREQUENCY (kHz) FIGURE 2-16: Ratio. Power Supply Rejection VOUT (AC-COUPLED) (100mV/div) VIN (1V/div) VOUT = 3.3V CIN = COUT = 2.2F IOUT = 500mA GROUND CURRENT (A) 70 VOUT = 1.1V 60 IOUT = 500 mA 50 40 IOUT = 100 A 30 20 10 0 2.0 2.5 Time (20s/div) IOUT (200mA/div) VOUT (AC-COUPLED) (100mV/div) Line Transient. VIN = 4.3V VOUT = 3.3V CIN = COUT = 2.2F FIGURE 2-17: Voltage. GROUND CURRENT (A) FIGURE 2-14: 50 45 40 35 30 25 20 15 10 5 0 FIGURE 2-15: DS20005982B-page 8 Load Transient. 5.0 5.5 Ground Current vs. Input VOUT = 1.1V VIN = 2.5V 0 Time (20s/div) 3.0 3.5 4.0 4.5 INPUT VOLTAGE (V) 100 200 300 400 OUTPUT CURRENT (mA) FIGURE 2-18: Current. 500 Ground Current vs. Output 2018 Microchip Technology Inc. MIC5528 10 1.1 NOISE (V/Hz) OUTPUT VOLTAGE (V) 1.12 1.08 1.06 1.04 1.02 VOUT = 1.1V VIN = 2.5V 1 0 100 200 300 400 OUTPUT CURRENT (mA) FIGURE 2-19: Current. 1 0.1 0.01 0.001 500 VOUT = 1.1V VIN = 2.5V CIN = COUT = 2.2 F IOUT = 100 A Output Noise (10 Hz - 10 MHz) = 154 Vrms 10 100 1K 10K 100K 1M 10M FREQUENCY (Hz) Output Voltage vs. Output FIGURE 2-22: Density. Output Noise Spectral OUTPUT VOLTAGE (V) 1.40 VIN (DC Coupled, 2V/Div) 1.20 0.80 VIN 0.60 0.40 0.20 VOUT 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 INPUT VOLTAGE (V) FIGURE 2-20: Voltage. Output Voltage vs. Input 1000 900 800 700 600 500 400 300 200 100 0 0.0V 1.1V VOUT = 1.1V VOUT = 1.1V VIN = VEN IOUT = 0 0.00 CURRENT LIMIT (mA) 5.0V 1.00 VIN = 0V to 5.0V 0.0V IOUT = 100 A VOUT (DC Coupled, 500 mV/Div) Time = 10 s/Div FIGURE 2-23: Start-Up from VIN. VEN (DC Coupled, 1V/Div) 2.5V VEN 3.0 FIGURE 2-21: Voltage. 3.5 4.0 4.5 INPUT VOLTAGE (V) 5.0 Current Limit vs. Input 2018 Microchip Technology Inc. 1.1V VOUT = 1.1V VOUT = 1.1V CIN = COUT = 2.2 F 2.5 0.0V VOUT 5.5 VIN = 2.5V 0.0V VOUT (DC Coupled, 500 mV/Div) IOUT = 100 A Time = 10 s/Div FIGURE 2-24: Start-Up from ENABLE. DS20005982B-page 9 MIC5528 VOUT = 1.1V 2.5V VOUT = 1.1V 500 mA VIN = 2.5V IOUT = 0 0.0V VEN VEN (DC Coupled, 1V/Div) 1.1V IOUT 100 A IOUT (DC Coupled, 200 mA/Div) VOUT VOUT VOUT (DC Coupled, 500 mV/Div) Time = 40 s/Div FIGURE 2-25: Auto-Discharge (No Load). VOUT (AC Coupled, 100 mV/Div) FIGURE 2-28: VOUT = 1.1V 3.5V Time = 40 s/Div Load Transient. VOUT = 1.1V 500 mA 2.5V VIN (DC Coupled, 1V/Div) IOUT 1 mA IOUT (DC Coupled, 200 mA/Div) VIN VOUT VOUT VOUT (AC Coupled, 10 mV/Div) FIGURE 2-26: Time = 40 s/Div Line Transient. VOUT (AC Coupled, 100 mV/Div) FIGURE 2-29: Time = 40 s/Div Load Transient. VOUT = 1.1V VOUT = 1.1V 5.5V 150 mA 2.5V VIN IOUT VIN (DC Coupled, 2V/Div) 100 A IOUT (DC Coupled, 200 mA/Div) VOUT VOUT VOUT (AC Coupled, 50 mV/Div) VOUT (AC Coupled, 100 mV/Div) Time = 40 s/Div Time = 40 s/Div FIGURE 2-27: DS20005982B-page 10 Line Transient. FIGURE 2-30: Load Transient. 2018 Microchip Technology Inc. MIC5528 VOUT = 1.1V 150 mA IOUT 1 mA IOUT (DC Coupled, 200 mA/Div) VOUT VOUT (AC Coupled, 100 mV/Div) Time = 40 s/Div FIGURE 2-31: Load Transient. 2018 Microchip Technology Inc. DS20005982B-page 11 MIC5528 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Pin Name 1, 2 VOUT Output Voltage. When disabled, the MIC5528 switches in an internal 25 load to discharge the external capacitors. 3 GND Ground. 4 EN Enable Input: Active-High. High = ON; Low = OFF. The MIC5528 has an internal pull-down and this pin can be left floating. 5 NC No Connection. 6 VIN Supply input. EP ePad DS20005982B-page 12 Description Exposed Heatsink Pad. Connect to GND for best thermal performance. 2018 Microchip Technology Inc. MIC5528 4.0 APPLICATION INFORMATION The MIC5528 is a high performance, low power 500 mA LDO. The MIC5528 includes an auto-discharge circuit that is switched on when the regulator is disabled through the enable pin. The MIC5528 also offers an internal pull-down resistor on the enable pin to ensure the output is disabled if the control signal is tri-stated. The MIC5528 regulator is fully protected from damage due to fault conditions, offering linear current-limiting and thermal shutdown. 4.1 Input Capacitor The MIC5528 is a high performance, high bandwidth device. An input capacitor of 2.2 F is required from the input to ground to provide stability. Low-ESR ceramic capacitors provide optimal performance at a minimum of space. Additional high frequency capacitors, such as small-valued NPO dielectric-type capacitors, help filter out high frequency noise and are good practice in any RF-based circuit. X5R or X7R dielectrics are recommended for the input capacitor. Y5V dielectrics lose most of their capacitance over temperature and are therefore, not recommended. 4.2 Output Capacitor The MIC5528 requires an output capacitor of 2.2 F or greater to maintain stability. The design is optimized for use with low-ESR ceramic chip capacitors. High-ESR capacitors are not recommended because they may cause high frequency oscillation. The output capacitor can be increased, but performance has been optimized for a 2.2 F ceramic output capacitor and does not improve significantly with larger capacitance. X7R/X5R dielectric-type ceramic capacitors are recommended because of their temperature performance. X7R-type capacitors change capacitance by 15% over their operating temperature range and are the most stable type of ceramic capacitors. Z5U and Y5V dielectric capacitors change value by as much as 50% and 60%, respectively, over their operating temperature ranges. To use a ceramic chip capacitor with Y5V dielectric, the value must be much higher than an X7R ceramic capacitor to ensure the same minimum capacitance over the equivalent operating temperature range. 4.3 No-Load Stability 4.4 Enable/Shutdown The MIC5528 comes with an active-high enable pin that allows the regulator to be disabled. Forcing the enable pin low disables the regulator and sends it into an off mode current state drawing virtually zero current. When disabled the MIC5528 switches an internal 25 load on the regulator output to discharge the external capacitor. Forcing the enable pin high enables the output voltage. The MIC5528 has an internal pull-down resistor on the enable pin to disable the output when the enable pin is floating. 4.5 Thermal Considerations The MIC5528 is designed to provide 500 mA of continuous current in a very small package. Maximum ambient operating temperature can be calculated based on the output current and the voltage drop across the part. For example, if the input voltage is 3.6V, the output voltage is 3.3V, and the output current is 500 mA. The actual power dissipation of the regulator circuit can be determined using Equation 4-1: EQUATION 4-1: P D = V IN - V OUT I OUT + V IN I GND Because this device is CMOS and the ground current is typically <100 A over the load range, the power dissipation contributed by the ground current is <1% and can be ignored Equation 4-2: EQUATION 4-2: P D = 3.6V - 3.3V 500mA = 0.150W To determine the maximum ambient operating temperature of the package, use the junction-to-ambient thermal resistance of the device Equation 4-3: Unlike many other voltage regulators, the MIC5528 remains stable and in regulation with no load. This is especially important in CMOS RAM keep-alive applications. 2018 Microchip Technology Inc. DS20005982B-page 13 MIC5528 EQUATION 4-3: Where: T J MAX - T A P D MAX = ------------------------------- JA TJ(MAX) = 125C, the maximum junction temperature of the die. JA = Thermal resistance of 173C/W for the XTDFN. Substituting PD for PD(MAX) and solving for the ambient operating temperature will give the maximum operating conditions for the regulator circuit. The junction-to-ambient thermal resistance for the minimum footprint is 173C/W. The maximum power dissipation must not be exceeded for proper operation. For example, when operating the MIC5528-3.3YMX at an input voltage of 3.6V and a 500 mA load with a minimum footprint layout, the maximum ambient operating temperature TA can be determined as in Equation 4-4: EQUATION 4-4: 0.15W = 125C - T A 173C/W T A = 99C Therefore, the maximum ambient operating temperature allowed in a thermally enhanced 1.2 mm x 1.2 mm XTDFN package is 99C. For a full discussion of heat sinking and thermal effects on voltage regulators, refer to the "Regulator Thermals" section of Microchip's Designing with Low-Dropout Voltage Regulators handbook. DS20005982B-page 14 2018 Microchip Technology Inc. MIC5528 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 6-Lead TDFN* XX 6-Lead XTDFN* XX Legend: XX...X Y YY WW NNN e3 * Example CF Example CF Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC(R) designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. , , Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar () symbol may not be to scale. 2018 Microchip Technology Inc. DS20005982B-page 15 MIC5528 6-Lead Thin DFN 1.2 mm x 1.2 mm Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20005982B-page 16 2018 Microchip Technology Inc. MIC5528 6-Lead Extra Thin DFN 1.2 mm x 1.2 mm Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. 2018 Microchip Technology Inc. DS20005982B-page 17 MIC5528 NOTES: DS20005982B-page 18 2018 Microchip Technology Inc. MIC5528 APPENDIX A: REVISION HISTORY Revision A (March 2018) * Converted Micrel document MIC5528 to Microchip data sheet DS20005982A. * Minor text changes throughout. Revision B (October 2018) * Updated Output Voltage information in Features. * Updated Output Voltage information in Product Identification System section accordingly. 2018 Microchip Technology Inc. DS20005982B-page 19 MIC5528 NOTES: DS20005982B-page 20 2018 Microchip Technology Inc. MIC5528 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Examples: Device -X.X X XX -XX Part No. Output Voltage Junction Temp. Range Package Media Type MIC5528: High Performance Single 500 mA Cap LDO in Thin and Extra Thin DFN Packages, Featuring Auto Discharge & Internal Enable Pull-Down Device: 1.1 1.2 1.8 2.8 3.0 3.3 = = = = = = Junction Temperature Range: Y = Package: MT = MX = 6-Lead 1.2 mm x 1.2 mm x 0.6 mm TDFN 6-Lead 1.2 mm x 1.2 mm x 0.4 mm XTDFN Media Type: T5 TR 500/Reel 5,000/Reel Output Voltage: Note: = = 1.1V (MX Package only) 1.2V (MX Package only) 1.8V (MX Package only) 2.8V (MX Package only) 3.0V (MX Package only) 3.3V -40C to +125C, RoHS-Compliant a) MIC5528-1.1YMX-T5: MIC5528, 1.1V Output Voltage, -40C to +125C Temperature Range, 6-Lead XTDFN, 500/Reel b) MIC5528-1.2YMX-TR: MIC5528, 1.2V Output Voltage, -40C to +125C Temperature Range, 6-Lead XTDFN, 5,000/Reel c) MIC5528-1.8YMX-T5: MIC5528, 1.8V Output Voltage, -40C to +125C Temperature Range, 6-Lead XTDFN, 500/Reel d) MIC5528-2.8YMX-TR: MIC5528, 2.8V Output Voltage, -40C to +125C Temperature Range, 6-Lead XTDFN, 5,000/Reel e) MIC5528-3.3YMT-T5: MIC5528, 3.3V Output Voltage, -40C to +125C Temperature Range, 6-Lead TDFN, 500/Reel f) MIC5528-3.3YMT-TR: MIC5528, 3.3V Output Voltage, -40C to +125C Temperature Range, 6-Lead TDFN, 5,000/Reel g) MIC5528-3.0YMX-T5: MIC5528, 3.0V Output Voltage, -40C to +125C Temperature Range, 6-Lead XTDFN, 500/Reel h) MIC5528-3.3YMX-TR: MIC5528, 3.3V Output Voltage, -40C to +125C Temperature Range, 6-Lead XTDFN, 5,000/Reel Other voltage options available. Contact your Microchip Sales Office for more information. Note 1: 2018 Microchip Technology Inc. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005982B-page 21 MIC5528 NOTES: DS20005982B-page 22 2018 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. 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QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-3786-4 == ISO/TS 16949 == 2018 Microchip Technology Inc. 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