2007-08-30Rev. 2.6 Page 1
SPP02N60S5
Cool MOS™ Power Transistor VDS 600 V
RDS(on) 3
ID1.8 A
Feature
New revolutionary high voltage technology
Ultra low gate charge
Periodic avalanche rated
Extreme dv/dtrated
Ultra low effective capacitances
Improved transconductance
PG-TO220
2
P
-
TO220
-
3
-
1
23
1
Type Package Ordering Code
SPP02N60S5 PG-TO220 Q67040-S4181
Marking
02N60S5
Maximum Ratings
Parameter Symbol Value Unit
Continuous drain current
TC = 25 °C
TC = 100 °C
ID
1.8
1.1
A
Pulsed drain current, t
p
limited by T
j
max ID
p
uls 3.2
Avalanche energy, single pulse
ID = 1.35 A, VDD = 50 V
EAS 50 mJ
Avalanche energy, repetitive tAR limited by Tjmax1
)
ID = 1.8 A, VDD = 50 V
EAR 0.07
Avalanche current, repetitive t
AR
limited by T
j
max I
AR
1.8 A
Gate source voltage VGS ±20 V
Gate source voltage AC (f >1Hz) VGS ±30
Power dissipation, TC = 25°C Ptot 25 W
Operating and storage temperature T
j
,Tst
g
-55... +150 °C
http://store.iiic.cc/
2007-08-30Rev. 2.6 Page 2
SPP02N60S5
Maximum Ratings
Parameter Symbol Value Unit
Drain Source voltage slope
VDS = 480 V, ID = 1.8 A, Tj = 125 °C
dv/dt20 V/ns
Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Thermal resistance, junction - case RthJC - - 5 K/W
Thermal resistance, junction - ambient, leaded RthJA --62
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area 2)
RthJA
-
-
-
35
62
-
Soldering temperature, wavesoldering
1.6 mm (0.063 in.) from case for 10s3)
Tsold - - 260 °C
Electrical Characteristics, at Tj=25°C unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Drain-source breakdown voltage V(BR)DSS VGS=0V, ID=0.25mA 600 - - V
Drain-Source avalanche
breakdown voltage
V(BR)DS VGS=0V, ID=1.8A - 700 -
Gate threshold voltage VGS(th) ID=80µΑ,VGS=VDS 3.5 4.5 5.5
Zero gate voltage drain current IDSS VDS=600V, VGS=0V,
Tj=25°C,
Tj=150°C
-
-
0.5
-
1
50
µA
Gate-source leakage current IGSS VGS=20V, VDS=0V - - 100 nA
Drain-source on-state resistance RDS(on) VGS=10V, ID=1.1A,
Tj=25°C
Tj=150°C
-
-
2.7
7.3
3
-
http://store.iiic.cc/
2007-08-30Rev. 2.6 Page 3
SPP02N60S5
Electrical Characteristics , at T
j
= 25 °C, unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Characteristics
Transconductance gfs VDS2*ID*RDS(on)max,
ID=1.1A
- 1.4 - S
Input capacitance Ciss VGS=0V, VDS=25V,
f=1MHz
- 240 - pF
Output capacitance Coss - 77 -
Reverse transfer capacitance Crss - 4.4 -
Turn-on delay time td(on) VDD=350V, VGS=0/10V,
ID=1.8A, RG=50
- 35 - ns
Rise time tr- 35 -
Turn-off delay time td(off) - 35 42
Fall time tf- 20 30
Gate Charge Characteristics
Gate to source charge Qgs VDD=350V, ID=1.8A - 2.3 - nC
Gate to drain charge Qgd - 4.5 -
Gate charge total QgVDD=350V, ID=1.8A,
VGS=0 to 10V
- 7.3 9.5
Gate plateau voltage V(plateau) VDD=350V, ID=1.8A - 8 - V
1Repetitve avalanche causes additional power losses that can be calculated as PAV=EAR*f.
2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
3Soldering temperature for TO-263: 220°C, reflow
http://store.iiic.cc/
2007-08-30Rev. 2.6 Page 4
SPP02N60S5
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Inverse diode continuous
forward current
ISTC=25°C - - 1.8 A
Inverse diode direct current,
pulsed
ISM - - 3.2
Inverse diode forward voltage VSD VGS=0V, IF=IS- 1 1.2 V
Reverse recovery time trr VR=350V, IF=IS ,
diF/dt=100A/µs
- 860 1460 ns
Reverse recovery charge Qrr - 1.6 - µC
Typical Transient Thermal Characteristics
Symbol Value Unit Symbol Value Unit
typ. typ.
Thermal resistance
Rth1 0.1 K/W
Rth2 0.184
Rth3 0.306
Rth4 1.207
Rth5 0.974
Rth6 0.251
Thermal capacitance
Cth1 0.00002806 Ws/K
Cth2 0.0001113
Cth3 0.0001679
Cth4 0.000547
Cth5 0.001388
Cth6 0.019
External Heatsink
TjTcase
Tamb
Cth1 Cth2
Rth1 Rth,n
Cth,n
Ptot (t)
http://store.iiic.cc/
2007-08-30Rev. 2.6 Page 5
SPP02N60S5
1 Power dissipation
Ptot = f(TC)
0 20 40 60 80 100 120 °C 160
TC
0
2
4
6
8
10
12
14
16
18
20
22
24
W
28
SPP02N60S5
Ptot
2 Safe operating area
ID= f ( VDS )
parameter : D = 0 , TC=25°C
10 010 110 210 3
V
VDS
-2
10
-1
10
0
10
1
10
A
ID
tp = 0.001 ms
tp = 0.01 ms
tp = 0.1 ms
tp = 1 ms
DC
3 Typ. output characteristic
ID = f (VDS); Tj=25°C
parameter: tp= 10 µs, VGS
0 5 10 15 V 25
VDS
0
1
2
3
4
A
6
ID
6V
7V
7.5V
8V
8.5V
9V
10V
12V
20V
4 Drain-source on-state resistance
RDS(on) = f(Tj)
parameter : ID = 1.1 A, VGS = 10 V
-60 -20 20 60 100 °C 180
Tj
0
2
4
6
8
10
12
14
17 SPP02N60S5
RDS(on)
typ
98%
http://store.iiic.cc/
2007-08-30Rev. 2.6 Page 6
SPP02N60S5
5 Typ. transfer characteristics
ID= f ( VGS ); VDS 2 x ID x RDS(on)max
parameter: tp = 10 µs
0 4 8 12 VGS 20
V
0
1
2
3
4
A
6
ID
6 Typ. gate charge
VGS =f (QGate)
parameter: ID = 1.8 A pulsed
0 1 2 3 4 5 6 7 8 nC 10
QGate
0
2
4
6
8
10
12
V
16 SPP02N60S5
VGS
0.2 VDS max
0.8 VDS max
7 Forward characteristics of body diode
IF = f (VSD)
parameter: T
, tp= 10 µs
0 0.4 0.8 1.2 1.6 2 2.4 V3
VSD
-2
10
-1
10
0
10
1
10
A
SPP02N60S5
IF
Tj = 25 °C typ
Tj = 25 °C (98%)
Tj = 150 °C typ
Tj = 150 °C (98%)
8 Avalanche SOA
IAR = f (tAR)
par.: Tj 150 °C
10 -3 10 -2 10 -1 10 010 110 210 4
µs
tAR
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
A
2
IAR
Tj(START)=25°C
Tj(START)=125°C
http://store.iiic.cc/
2007-08-30Rev. 2.6 Page 7
SPP02N60S5
9 Avalanche energy
EAS = f(Tj)
par.: ID = 1.35 A, VDD = 50 V
20 40 60 80 100 120 °C 160
Tj
0
10
20
30
mJ
50
EAS
10 Drain-source breakdown voltage
V(BR)DSS = f(Tj)
-60 -20 20 60 100 °C 180
Tj
540
560
580
600
620
640
660
680
V
720
SPP02N60S5
V(BR)DSS
11 Typ. capacitances
C = f(VDS)
parameter: VGS=0V, f=1 MHz
0 10 20 30 40 50 60 70 80 V 100
VDS
0
10
1
10
2
10
3
10
4
10
pF
C
Ciss
Coss
Crss
http://store.iiic.cc/
2007-08-30Rev. 2.6 Page 8
SPP02N60S5
Definition of diodes switching characteristics
http://store.iiic.cc/
2007-08-30Rev. 2.6 Page 9
SPP02N60S5
PG-TO220-3-1, PG-TO220-3-21
http://store.iiic.cc/
2007-08-30Rev. 2.6 Page 10
SPP02N60S5
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
http://store.iiic.cc/