SN74LVC2G07
DUAL BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
SCES308D – AUGUST 2001 – REVISED MARCH 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Available in the Texas Instruments
NanoStarand NanoFreePackages
D
Supports 5-V VCC Operation
D
Inputs and Open-Drain Outputs Accept
Voltages Up To 5.5 V
D
Max tpd of 3.7 ns at 3.3 V
D
Low Power Consumption, 10-µA Max ICC
D
±24-mA Output Drive at 3.3 V
D
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
D
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
D
Ioff Supports Partial-Power-Down Mode
Operation
D
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
description/ordering information
This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open
drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high
wired-AND functions. The maximum sink current is 32 mA.
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING‡
NanoStar – WCSP (DSBGA)
0.17-mm Small Bump – YEA SN74LVC2G07YEAR
NanoFree – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
SN74LVC2G07YZAR
–40°C to 85°CNanoStar – WCSP (DSBGA)
0.23-mm Large Bump – YEP
SN74LVC2G07YEPR _ _ _
_
NanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free) SN74LVC2G07YZPR
SOT (SOT-23) – DBV Reel of 3000 SN74LVC2G07DBVR C07_
Reel of 3000 SN74LVC2G07DCKR
-
–
Reel of 250 SN74LVC2G07DCKT
_
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year , month, and sequence code,
and one following character to designate the assembly/test site.
Copyright 2003, Texas Instruments Incorporated
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
1A
GND
2A
1Y
VCC
2Y
3
2
1
4
5
6
2A
GND
1A
2Y
VCC
1Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
NanoStar and NanoFree are trademarks of Texas Instruments.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.