SN74LVC2G07
DUAL BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
SCES308D – AUGUST 2001 – REVISED MARCH 2003
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
Available in the Texas Instruments
NanoStarand NanoFreePackages
D
Supports 5-V VCC Operation
D
Inputs and Open-Drain Outputs Accept
Voltages Up To 5.5 V
D
Max tpd of 3.7 ns at 3.3 V
D
Low Power Consumption, 10-µA Max ICC
D
±24-mA Output Drive at 3.3 V
D
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
D
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
D
Ioff Supports Partial-Power-Down Mode
Operation
D
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
description/ordering information
This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open
drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high
wired-AND functions. The maximum sink current is 32 mA.
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
TAPACKAGEORDERABLE
PART NUMBER TOP-SIDE
MARKING
NanoStar – WCSP (DSBGA)
0.17-mm Small Bump – YEA SN74LVC2G07YEAR
NanoFree – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
Reel of 3000
SN74LVC2G07YZAR
CV
–40°C to 85°CNanoStar – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Reel
of
3000
SN74LVC2G07YEPR _ _ _
CV
_
40 C
to
85 C
NanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free) SN74LVC2G07YZPR
SOT (SOT-23) – DBV Reel of 3000 SN74LVC2G07DBVR C07_
SOT (SC 70) DCK
Reel of 3000 SN74LVC2G07DCKR
CV
SOT
(SC
-
70)
DCK
Reel of 250 SN74LVC2G07DCKT
CV
_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year , month, and sequence code,
and one following character to designate the assembly/test site.
Copyright 2003, Texas Instruments Incorporated
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
1A
GND
2A
1Y
VCC
2Y
3
2
1
4
5
6
2A
GND
1A
2Y
VCC
1Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
NanoStar and NanoFree are trademarks of Texas Instruments.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN74LVC2G07
DUAL BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
SCES308D AUGUST 2001 REVISED MARCH 2003
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
description/ordering information (continued)
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
FUNCTION TABLE
(each buffer/driver)
INPUT
AOUTPUT
Y
H H
L L
logic diagram (positive logic)
1A 1Y
16
2A 2Y
34
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC 0.5 V to 6.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) 0.5 V to 6.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1) 0.5 V to 6.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high or low state, VO
(see Notes 1 and 2) 0.5 V to 6.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) 50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0) 50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±100 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 3): DBV package 165°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCK package 259°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
YEA/YZA package 143°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
YEP/YZP package 123°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The value of VCC is provided in the recommended operating conditions table.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
SN74LVC2G07
DUAL BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
SCES308D AUGUST 2001 REVISED MARCH 2003
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions (see Note 4)
MIN MAX UNIT
VCC
Su
pp
ly voltage
Operating 1.65 5.5
V
V
CC
Supply
voltage
Data retention only 1.5
V
VCC = 1.65 V to 1.95 V 0.65 ×VCC
VIH
High level in
p
ut voltage
VCC = 2.3 V to 2.7 V 1.7
V
V
IH
High
-
level
input
voltage
VCC = 3 V to 3.6 V 2
V
VCC = 4.5 V to 5.5 V 0.7 ×VCC
VCC = 1.65 V to 1.95 V 0.35 ×VCC
VIL
Low level in
p
ut voltage
VCC = 2.3 V to 2.7 V 0.7
V
V
IL
Low
-
level
input
voltage
VCC = 3 V to 3.6 V 0.8
V
VCC = 4.5 V to 5.5 V 0.3 ×VCC
VIInput voltage 0 5.5 V
VOOutput voltage 0 5.5 V
VCC = 1.65 V 4
VCC = 2.3 V 8
IOL Low-level output current
VCC =3V
16 mA
V
CC =
3
V
24
VCC = 4.5 V 32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20
t/vInput transition rise or fall rate VCC = 3.3 V ± 0.3 V 10 ns/V
VCC = 5 V ±0.5 V 5
TAOperating free-air temperature 40 85 °C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYPMAX UNIT
IOL = 100
m
A1.65 V to 5.5 V 0.1
IOL = 4 mA 1.65 V 0.45
IOL = 8 mA 2.3 V 0.3
V
OL IOL = 16 mA
3V
0.4
V
IOL = 24 mA
3
V
0.55
IOL = 32 mA 4.5 V 0.55
IIA inputs VI = 5.5 V or GND 0 to 5.5 V ±5
m
A
Ioff VI or VO = 5.5 V 0±10
m
A
ICC VI = 5.5 V or GND, IO = 0 1.65 V to 5.5 V 10
m
A
ICC One input at VCC 0.6 V, Other inputs at VCC or GND 3 V to 5.5 V 500
m
A
CiVI = VCC or GND 3.3 V 3.5 pF
All typical values are at VCC = 3.3 V, TA = 25°C.
SN74LVC2G07
DUAL BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
SCES308D AUGUST 2001 REVISED MARCH 2003
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
VCC = 1.8 V
± 0.15 V VCC = 2.5 V
± 0.2 V VCC = 3.3 V
± 0.3 V VCC = 5 V
± 0.5 V UNIT
(INPUT)
(OUTPUT)
MIN MAX MIN MAX MIN MAX MIN MAX
tpd AY1.5 8.6 1 4.4 1 3.7 1 2.9 ns
operating characteristics, TA = 25°C
PARAMETER
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V
UNIT
PARAMETER
TYP TYP TYP TYP
UNIT
Cpd Power dissipation capacitance f = 10 MHz 3 3 4 4 pF
SN74LVC2G07
DUAL BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
SCES308D AUGUST 2001 REVISED MARCH 2003
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
(OPEN DRAIN)
VM
th
tsu
From Output
Under Test CL
(see Note A)
LOAD CIRCUIT
S1 VLOAD
Open
GND
RL
RL
Data Input
Timing Input VI
0 V
VI
0 V
0 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VI
0 V
Input
Output
W aveform 1
S1 at VLOAD
(see Note B)
Output
W aveform 2
S1 at VLOAD
(see Note B)
VOL
tPZL
tPZH
tPLZ
tPHZ
VLOAD/2
0 V
VOL + V
VLOAD/2 V
0 V
VI
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 .
D. The outputs are measured one at a time with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VM.
G. tPLZ is measured at VOL + V.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
VMVM
VMVM
VMVM
VM
VMVM
VM
VM
VM
VI
VM
VM
1.8 V ±0.15 V
2.5 V ±0.2 V
3.3 V ±0.3 V
5 V ±0.5 V
1 k
500
500
500
VCC RL
2 × VCC
2 × VCC
6 V
2 × VCC
VLOAD CL
30 pF
30 pF
50 pF
50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V
VCC
VCC
3 V
VCC
VI
VCC/2
VCC/2
1.5 V
VCC/2
VM
tr/tf
2 ns
2 ns
2.5 ns
2.5 ns
INPUT
tPZL (see Notes E and F)
tPLZ (see Notes E and G)
tPHZ/tPZH
VLOAD
VLOAD
VLOAD
TEST S1
VLOAD/2
Figure 1. Load Circuit and Voltage Waveforms
MECHANICAL DATA
MPDS026D – FEBRUAR Y 1997 – REVISED FEBRUAR Y 2002
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DBV (R-PDSO-G6) PLASTIC SMALL-OUTLINE
0,10
M
0,20
0,95
0°–8°
0,25
0,55
0,35
Gage Plane
0,15 NOM
4073253-5/G 01/02
2,60
3,00
0,50
0,25
1,50
1,70
46
31
2,80
3,00
1,45
0,95 0,05 MIN
Seating Plane
6X
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation.
MECHANICAL DATA
MPDS114 – FEBRUARY 2002
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DCK (R-PDSO-G6) PLASTIC SMALL-OUTLINE PACKAGE
0,15
Gage Plane
0,10
M
0,10
0,65
0°–8°0,46
0,26
0,13 NOM
4093553-3/D 01/02
0,15
0,30
1,40
1,10 2,40
1,80
46
2,15
1,85
1 3
1,10
0,80 0,10
0,00
Seating Plane
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-203
MECHANICAL DATA
MXBG003A NOVEMBER 2001 – REVISED MAY 2002
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
YEA (R–XBGA–N6) DIE–SIZE BALL GRID ARRAY
ÉÉ
ÉÉ
4203167–3/C 04/2002
0,85
0,95
0,50 MAX
0,35 MAX
1,45
1,35
A
BA
MC
0,05
0,05
0,05
0,10
0,15 C
SEATING PLANE
C
C
M
0,15
0,19
0,25
PIN A1 INDEX AREA
1
6X
2
A
B
B
C
0,50
0,50
1,00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. NanoStar package configuration.
D. Package complies to JEDEC MO–211 variation EA.
E. This package is tin–lead (SnPb). Refer to the 6 YZA package (drawing 4204151) for lead–free.
 
MXBG005A – JANUARY 2002 – REVISED APRIL 2002
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
YZA (R-XBGA-N6) DIE-SIZE BALL GRID ARRAY
12
A
B
C
0,19
0,15
6X
0,15
0,10
0,95
0,85
1,35
1,45
AB
Seating Plane
C
0,05 C
4204151-3/B 03/2002
Pin A1 Index Area
0,50 MAX
0,35 MAX
1,00
0,50
0,50
0,25
0,05
0,05 BCA
MC
M
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. NanoFree package configuration.
D. Package complies to JEDEC MO-211 variation EA.
E. This package is lead-free. Refer to the 6 YEA package (drawing 4203167) for tin-lead (SnPb).
NanoFree is a trademark of Texas Instruments.
MECHANICAL DATA
MXBG019 – OCTOBER 2002
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
YZP (R-XBGA-N6) DIE-SIZE BALL GRID ARRAY
4204741-3/A 10/2002
Seating Plane
0,15
0,20 C
1,45
1,35
A0,85
0,95 B
1
6X
2
A
B
0,20
0,25
C
Pin A1 Index Area
0,50 Max
1,00
0,50
0,50
0,25
0,05
0,05 MCBCA
0,05 C
M
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. NanoFree package configuration.
NOTES: D. This package is lead-free. Refer to the 6 YEP package (drawing 4204725) for tin-lead (SnPb).
NanoFree is a trademark of Texas Instruments.
MECHANICAL DATA
MXBG022 – OCTOBER 2002
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
YEP (R-XBGA-N6) DIE-SIZE BALL GRID ARRAY
4204725-3/A 10/2002
Seating Plane
0,15
0,20 C
1,45
1,35
A0,85
0,95 B
1
6X
2
A
B
0,20
0,25
C
Pin A1 Index Area
0,50 Max
1,00
0,50
0,50
0,25
0,05
0,05 MCB
CA
0,05 C
M
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. NanoFree package configuration.
D. This package is tin-lead (SnPb). Refer to the 6 YZP package (drawing 420741) for lead-free.
NanoFree is a trademark of Texas Instruments.
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Copyright 2003, Texas Instruments Incorporated