NB3L553 2.5 V / 3.3 V / 5.0 V 1:4 Clock Fanout Buffer Description The NB3L553 is a low skew 1-to 4 clock fanout buffer, designed for clock distribution in mind. The NB3L553 specifically guarantees low output-to-output skew. Optimal design, layout and processing minimize skew within a device and from device to device. http://onsemi.com MARKING DIAGRAMS* Features * * * * * * * * * * Input/Output Clock Frequency up to 200 MHz Low Skew Outputs (35 ps), Typical RMS Phase Jitter (12 kHz - 20 MHz): 29 fs (Typical) Output goes to Three-State Mode via OE Operating Range: VDD = 2.375 V to 5.25 V 5 V Tolerant Input Clock ICLK Ideal for Networking Clocks Packaged in 8-pin SOIC Industrial Temperature Range These are Pb-Free Devices 8 SOIC-8 D SUFFIX CASE 751 8 1 3L553 ALYW G 1 3L553 A L Y W G 1 DFN8 MN SUFFIX CASE 506AA 1 Q1 = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package 6P MG G 6P = Specific Device Code M = Date Code G = Pb-Free Package (Note: Microdot may be in either location) Q2 ICLK Q3 *For additional marking information, refer to Application Note AND8002/D. Q4 PINOUT DIAGRAM OE VDD Figure 1. Block Diagram Q0 Q1 GND 1 8 2 7 3 6 4 5 OE Q3 Q2 ICLK ORDERING INFORMATION Package Shipping NB3L553DG SOIC-8 (Pb-Free) 98 Units/Rail NB3L553DR2G SOIC-8 (Pb-Free) 2500/Tape & Reel NB3L553MNR4G* DFN-8 (Pb-Free) 1000/Tape & Reel Device *Contact Sales Representative For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2012 July, 2012 - Rev. 8 1 Publication Order Number: NB3L553/D NB3L553 Table 1. OE, OUTPUT ENABLE FUNCTION OE Function 0 Disable 1 Enable Table 2. PIN DESCRIPTION Pin # Name Type Description 1 VDD Power 2 Q0 (LV)CMOS/(LV)TTL Output Clock Output 0 3 Q1 (LV)CMOS/(LV)TTL Output Clock Output 1 4 GND Power 5 ICLK (LV)CMOS Input 6 Q2 (LV)CMOS/(LV)TTL Output Clock Output 2 7 Q3 (LV)CMOS/(LV)TTL Output Clock Output 3 8 OE (LV)TTL Input - EP Thermal Exposed Pad Positive supply voltage (2.375 V to 5.25 V) Negative supply voltage; Connect to ground, 0 V Clock Input. 5.0 V tolerant VDD for normal operation. Pin has no internal pullup or pull down resistor for open condition default. Use from 1 to 10 kOhms external resistor to force an open condition default state. (DFN8 only) Thermal exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply (GND) or leave unconnected, floating open. http://onsemi.com 2 NB3L553 Table 3. MAXIMUM RATINGS Symbol VDD Parameter Positive Power Supply Condition 1 Condition 2 Rating Unit GND = 0 V - 6.0 V OE ICLK GND = 0 V and VDD = 2.375 V to 5.25 V GND - 0.5 v VI v VDD + 0.5 GND - 0.5 v VI v 5.75 V VI Input Voltage TA Operating Temperature Range, Industrial - - -40 to +85 C Tstg Storage Temperature Range - - -65 to +150 C qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm SOIC-8 190 130 C/W C/W qJC Thermal Resistance (Junction-to-Case) (Note 1) SOIC-8 41 to 44 C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 C/W C/W qJC Thermal Resistance (Junction-to-Case) (Note 1) DFN8 35 to 40 C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. JEDEC standard multilayer board - 2S2P (2 signal, 2 power) Table 4. ATTRIBUTES Characteristic ESD Protection Value Human Body Model Machine Model Charged Device Model Moisture Sensitivity, Indefinite Time Out of Drypack (Note 2) Flammability Rating Oxygen Index: 28 to 34 Transistor Count > 2 kV > 150 V > TBD kV Level 1 UL-94 code V-0 @ 0.125 in 531 Devices Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test 2. For additional Moisture Sensitivity information, refer to Application Note AND8003/D. http://onsemi.com 3 NB3L553 Table 5. DC CHARACTERISTICS (VDD = 2.375 V to 2.625 V, GND = 0 V, TA = -40C to +85C) (Note 3) Symbol Characteristic IDD Power Supply Current @ 135 MHz, No Load VOH Output HIGH Voltage - IOH = -16 mA VOL Output LOW Voltage - IOL = 16 mA Min Typ Max Unit - 25 30 mA 1.7 - - V - - 0.4 V VIH, ICLK Input HIGH Voltage, ICLK (VDD/2)+0.5 - 5.0 V VIL, ICLK Input LOW Voltage, ICLK - - (VDD/2)-0.5 V VIH, OE Input HIGH Voltage, OE 1.8 - VDD V VIL, OE Input LOW Voltage, OE - - 0.7 V ZO Nominal Output Impedance - 20 - W CIN Input Capacitance, ICLK, OE - 5.0 - pF IOS Short Circuit Current - 28 - mA Min Typ Max Unit - 35 40 mA 2.4 - - V - - 0.4 V VDD - 0.4 - - V DC CHARACTERISTICS (VDD = 3.15 V to 3.45 V, GND = 0 V, TA = -40C to +85C) (Note 3) Symbol Characteristic IDD Power Supply Current @ 135 MHz, No Load VOH Output HIGH Voltage - IOH = -25 mA VOL Output LOW Voltage - IOL = 25 mA VOH Output HIGH Voltage - IOH = -12 mA (CMOS level) VIH, ICLK Input HIGH Voltage, ICLK (VDD/2)+0.7 - 5.0 V VIL, ICLK Input LOW Voltage, ICLK - - (VDD/2)-0.7 V VIH, OE Input HIGH Voltage, OE 2.0 - VDD V VIL, OE Input LOW Voltage, OE 0 - 0.8 V ZO Nominal Output Impedance - 20 - W CIN Input Capacitance, OE - 5.0 - pF IOS Short Circuit Current - 50 - mA Min Typ Max Unit - 45 85 mA 2.4 - - V - - 0.4 V VDD - 0.4 - - V DC CHARACTERISTICS (VDD = 4.75 V to 5.25 V, GND = 0 V, TA = -40C to +85C) (Note 3) Symbol Characteristic IDD Power Supply Current @ 135 MHz, - No Load VOH Output HIGH Voltage - IOH = -35 mA VOL Output LOW Voltage - IOL = 35 mA VOH Output HIGH Voltage - IOH = -12 mA (CMOS level) VIH, ICLK Input HIGH Voltage, ICLK (VDD/2) + 1 - 5.0 V VIL, ICLK Input LOW Voltage, ICLK - - (VDD/2) - 1 V VIH, OE Input HIGH Voltage, OE 2.0 - VDD V VIL, OE V Input LOW Voltage, OE - - 0.8 ZO Nominal Output Impedance - 20 - W CIN Input Capacitance, OE - 5.0 - pF IOS Short Circuit Current - 80 - mA http://onsemi.com 4 NB3L553 Table 6. AC CHARACTERISTICS; VDD = 2.5 V +5% (VDD = 2.375 V to 2.625 V, GND = 0 V, TA = -40C to +85C) (Note 3) Symbol Min Typ Max Unit fin Input Frequency Characteristic - - 200 MHz tr/tf Output rise and fall times; 0.8 V to 2.0 V - 1.0 1.5 ns tpd Propagation Delay, CLK to Qn (Note 4) 2.2 3.0 5.0 ns tskew Output-to-output skew; (Note 5) - 35 50 ps tskew Device-to-device skew, (Note 5) - - 500 ps AC CHARACTERISTICS; VDD = 3.3 V +5% (VDD = 3.15 V to 3.45 V, GND = 0 V, TA = -40C to +85C) (Note 3) Symbol fin Characteristic Conditions Input Frequency fcarrier = 100 MHz Min Typ Max Unit - - 200 MHz - 18 - fs tjitter (f) RMS Phase Jitter (Integrated 12 kHz - 20 MHz) (See Figures 2 and 3) tr/tf Output rise and fall times; 0.8 V to 2.0 V - 0.6 1.0 ns tpd Propagation Delay, CLK to Qn (Note 4) 2.0 2.4 4.0 ns tskew Output-to-output skew; (Note 5) - 35 50 ps tskew Device-to-device skew, (Note 5) - - 500 ps AC CHARACTERISTICS; VDD = 5.0 V +5% (VDD = 4.75 V to 5.25 V, GND = 0 V, TA = -40C to +85C) (Note 3) Symbol fin Characteristic Min Input Frequency fcarrier = 100 MHz Min Typ Max Unit - - 200 MHz - 29 - fs tjitter (f) RMS Phase Jitter (Integrated 12 kHz - 20 MHz) (See Figures 2 and 3) tr/tf Output rise and fall times; 0.8 V to 2.0 V - 0.3 0.7 ns tpd Propagation Delay, CLK to Qn (Note 4) 1.7 2.5 4.0 ns tskew Output-to-output skew; (Note 5) - 35 50 ps tskew Device-to-device skew, (Note 5) - - 500 ps 3. Outputs loaded with external RL = 33 W series resistor and CL = 15 pF to GND. Duty cycle out = duty in. A 0.01 mF decoupling capacitor should be connected between VDD and GND. 4. Measured with rail-to-rail input clock 5. Measured on rising edges at VDD / 2 between any two outputs with equal loading. http://onsemi.com 5 NB3L553 Figure 2. Phase Noise Plot at 100 MHz at an Operating Voltage of 3.3 V, Room Temperature The above plot captured using Agilent E5052A shows Additive Phase Noise of the NB3L553 device measured with an input source generated by Agilent E8663B. The RMS phase jitter contributed by the device (integrated between 12 kHz to 20 MHz; as shown in the shaded area) is 18 fs (RMS Phase Jitter of the input source is 75.40 fs and Output (DUT+Source) is 93.16 fs). Figure 3. Phase Noise Plot at 100 MHz at an Operating Voltage of 5 V, Room Temperature The above plot captured using Agilent E5052A shows Additive Phase Noise of the NB3L553 device measured with an input source generated by Agilent E8663B. The RMS phase jitter contributed by the device (integrated between 12 kHz to 20 MHz; as shown in the shaded area) is 29 fs (RMS Phase Jitter of the input source is 75.40 fs and Output (DUT+Source) is 103.85 fs). http://onsemi.com 6 NB3L553 PACKAGE DIMENSIONS SOIC-8 NB CASE 751-07 ISSUE AK -X- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. A 8 5 S B 0.25 (0.010) M Y M 1 4 -Y- K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE -Z- 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 NB3L553 PACKAGE DIMENSIONS DFN8 2x2, 0.5P CASE 506AA-01 ISSUE E D PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C A B L1 CC CC CC DETAIL A E OPTIONAL CONSTRUCTIONS DIM A A1 A3 b D D2 E E2 e K L L1 EE EE EXPOSED Cu TOP VIEW A DETAIL B 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L MOLD CMPD DETAIL B OPTIONAL CONSTRUCTION 0.08 C (A3) NOTE 4 SIDE VIEW DETAIL A A1 SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* D2 1 C MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.30 REF 0.25 0.35 --- 0.10 4 8X L 1.30 PACKAGE OUTLINE 8X 0.50 E2 K 8 5 e/2 e 0.90 8X 2.30 b 0.10 C A B 0.05 C 1 NOTE 3 8X 0.50 PITCH 0.30 BOTTOM VIEW DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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