Rev Date: 02/10/2012 1 www.seielect.com
This specification may be changed at any time without prior notice marketing@seielect.com
Please confirm technical specifications before you order and/or use.
HPC Series
High Power Surface Mount Resistor Stackpole Electronics, Inc.
Resistive Product Solutions
The HPC series represents a breakthrough in functional design, thermal management
and end-user benefits. Borrowing from long-proven techniques used in power
semiconductors, the HPC series provides up to eight times more useful power than SMD
power resistors currently available.
The HPC series, through superior characterization, is intended to remove the
mystery of managing board level power by combining established techniques in
new ways. The result is superior technology in design options, in a cost effective
package.
Features:
• Up to 12W with no external heat sinks
• Compatible with conventional pick and place
• Only 0.5 x 0.5 PCB footprint
• Non-inductive resistive element
• Anodized heat sink top provides 800V voltage
withstanding
•
Up to 50W for short duration
• Stackpole patent no. US 7,286,358 B2
• Available in 1% and 5% tolerance
• RoHS compliant / lead-free
LWH b
Body Length Body Width Body Height Bottom Termination
0.48 0.50 0.40 0.11 inches
12.19 12.70 10.16 2.79 mm
Type / Code Unit
HPC12
Power Rating Power Rating Maximum Maximum
T
y
pe / Code
(
Watts
)
@
40ºC
(
Watts
)
@
40ºC Workin
g
Overload Inductance
w/400 LFM air flow no air flow Volta
g
eVolta
g
e1
HPC12 12W 5W 200V 400V 1,500V <2nH ±150 ppm/ºC 0.025 - 250K
Resistance
Temperature
Coefficient
Dielectric
Strength
Ohmic Range (Ω)
and Tolerance
%, 5%
Electrical Specifications
Please refer to the High Power Resistor Application Note (page 4) for more information on designing and
implementing high power resistor types.
Mechanical Specifications
Rev Date: 02/10/2012 2 www.seielect.com
This specification may be changed at any time without prior notice marketing@seielect.com
Please confirm technical specifications before you order and/or use.
HPC Series
High Power Surface Mount Resistor Stackpole Electronics, Inc.
Resistive Product Solutions
14
12
10
8
6
4
2
0 40 70 100 130
Max Peak Power (Watts) .
Ambient Temperature (Deg. C)
60
50
40
30
20
10
0
75 90
115 30 45 60
Max Peak Power (Watts) .
Peak Power Duration (seconds)
Test Test Conditions (JIS C 5202) Test Results
Short Time Overload 2.5x rated voltage for 5 seconds ±(2% + 0.1Ω)
Dielectric Withstanding Voltage 100VAC, 1 minute ±(1% + 0.05Ω)
Resistance to Soldering Heat 260ºC ±5ºC for 10 sec; ±0.5 sec (Solder Bath) ±(1% + 0.05Ω)
Solderability 235ºC ±5ºC for 2 sec.; ±0.5 sec (Colophonium flux) 95% coverage, minimum
-65ºC: 30 min.; 25ºC: 2 to 3 min.
150ºC: 30 min.; 25ºC: 2 to 3 min.
(5 cycles)
40ºC ± 2ºC, 90% to RH, rated load ±(3% + 0.1Ω)
90 min. ON, 30 min. OFF for 1,000 hrs. -0 hrs. / +48 hrs. Jumper (<0.05Ω)
70ºC ± 2ºC, 90% to RH, rated load ±(3% + 0.1Ω)
90 min. ON, 30 min OFF for 1,000 hrs. -0 hrs. / +48 hrs. Jumper (<0.05Ω)
Voltage Coefficient 1/10 rated voltage for 3 sec. max. then rated voltage for 3 sec. max. ± 100 (ppm/V)
Robustness of Termination Bend of 3mm for 5 ± 1 sec. ±(1% + 0.05Ω)
Temperature Cycle
Endurance (Damp load)
Endurance (Rated load)
± (1% + 0.05Ω)
Jumper (<0.05Ω)
Performance Characteristics
HPC12 Power Derating Curve
400 LF/M Airflow
200 LF/M Airflow
No Airflow
HPC12 Power vs. Duration
10% Duty Cycle 200 LF/M
10% Duty Cycle, No Airflow
30% Duty Cycle, 200 LF/M
33% Duty Cycle, No Airflow
Rev Date: 02/10/2012 3 www.seielect.com
This specification may be changed at any time without prior notice marketing@seielect.com
Please confirm technical specifications before you order and/or use.
HPC Series
High Power Surface Mount Resistor Stackpole Electronics, Inc.
Resistive Product Solutions
How to Order
123456789101
HPC12JT1K00
1
HPC Quantity
200
100
100 Kohm = 100K
Tape
Size
0.125 ohm = R125
0.1 ohm = R100
Four characters with the
multiplier used as the decimal
holder.
12
1%
Bulk
Resistance Value
"L" used as multiplier of 10-3
for an
y
value under 0.1 ohm.
12W Code
Packaging
Tol
J5% B
F
High Power SMD
T
12
Product Series Size Power Tolerance
Code Description
Legacy Part Number (before January 3, 2011):
Code Nominal Resistance Tolerance
12 1K 5%
T
y
pe Description Code Tolerance T
y
pes Qt
Description Code
HPC High Power SMD 12 1% 200 Tape R
5% 100 Bulk B
HPC12
HPC R
SEI Type Packaging
Rev Date: 02/10/2012 4 www.seielect.com
This specification may be changed at any time without prior notice marketing@seielect.com
Please confirm technical specifications before you order and/or use.
HPC Series
High Power Surface Mount Resistor Stackpole Electronics, Inc.
Resistive Product Solutions
High Power Chip Resistors and Thermal Management
Stackpole has developed several surface mount resistor series in addition to our current sense resistors,
which have had higher power ratings than standard resistor chips. This has caused some uncertainty and
even confusion by users as to how to reliably use these resistors at the higher power ratings in their designs.
The data sheets for the RHC, RMCP, RNCP, CSR, CSRN, CSRF, CSS, and CSSH state that the rated
power assumes an ambient temperature of no more than 100 degrees C for the CSS / CSSH series and 70
degrees C for all other high power resistor series. In addition, IPC and UL best practices dictate that the
combined temperature on any resistor due to power dissipated and ambient air shall be no more than 105C.
At first glance this wouldn’t seem too difficult, however the graph below shows typical heat rise for the CSR
½ 100 milliohm at full rated power. The heat rise for the RMCP and RNCP would be similar. The RHC with
its unique materials, design, and processes would have less heat rise and therefore would be easier to
implement for any given customer.
The 102 degrees C heat rise shown here would indicate there will be additional thermal reduction techniques
needed to keep this part under 105C total hot spot temperature if this part is to be used at 0.75 watts of
power. However, this same part at the usual power rating for this size would have a heat rise of around 72
degrees C. This additional heat rise may be dealt with using wider conductor traces, larger solder pads and
land patterns under the solder mask, heavier copper in the conductors, vias through PCB, air movement, and
heat sinks, among many other techniques. Because of the variety of methods customers can use to lower
the effective heat rise of the circuit, resistor manufacturers simply specify power ratings with the limitations
on ambient air temperature and total hot spot temperatures and leave the details of how to best accomplish
this to the design engineers. Design guidelines for products in various market segments can vary widely so it
would be unnecessarily constraining for a resistor manufacturer to recommend the use of any of these
methods over another.
Note: The final resistance value can be affected by the board layout and assembly process, especially the size of the
mounting pads and the amount of solder used. This is especially notable for resistance values ≤ 50 mΩ.
This should be taken into account when designing.