HLMP-ADxx/AGxx/ALxx/BDxx/BGxx/BLxx
5mm mini Oval Precision Optical Performance
AlInGaP Lamps
Data Sheet
Features
• Well defined spatial radiation pattern
• Viewing angles:
Major axis 70°
Minor axis 35°
• High luminous output
• Red and Amber intensity are available for:
AlInGaP (Bright)
AlInGaP II (Brightest)
• Colors:
626 nm red
630 nm red
590 nm amber
592 nm amber
• Superior resistance to moisture
• UV resistant epoxy
Applications
• Full color/video signs
Description
These Precision Optical Performance Oval LEDs are spe-
cifically designed for full color/video and passenger infor-
mation signs. The oval shaped radiation pattern (35° x 70°)
and high luminous intensity ensure that these devices
are excellent for wide field of view outdoor application
where a wide viewing angle and readability in sunlight
are essential. These lamps have very smooth, matched
radiation patterns ensuring consistent color mixing in full
color applications, message uniformity across the viewing
angle of the sign.
High efficiency LED material is used in these lamps:
Aluminum Indium Gallium Phosphide (AlInGaP) for amber
and red. Each lamp is made with an advance optical grade
epoxy offering superior high temperature and high
moisture resistance in outdoor applications. The package
epoxy contains both UV-A and UV-B inhibitors to reduce
the effects of long term exposure to direct sunlight.
Designers can select parallel or perpendicular orientation.
Both lamps are available in tinted version.
Benefits
• Viewing angle designed for wide field of view
application
• Superior performance in outdoor environments
2
Table 1. Device Selection Guide for AlInGaP II
Part Number
Color and Dominant
Wavelength
ld (nm) Typ.
Luminous
Intensity
Iv (mcd)
at 20 mA Min.
Luminous
Intensity
Iv (mcd)
at 20 mA Max. Stand-Off
Leadframe
Orientation
Package
Drawing
HLMP-AD06-NSTxx Red 630 680 2500 No Parallel A
HLMP-AD06-P00xx Red 630 880 No Parallel A
HLMP-AD06-P0Txx Red 630 880 No Parallel A
HLMP-AD06-PQ0xx Red 630 880 1500 No Parallel A
HLMP-AD06-RSTxx Red 630 1500 2500 No Parallel A
HLMP-AD06-STTxx Red 630 1900 3200 No Parallel A
HLMP-AD16-P00xx Red 630 880 Yes Parallel B
HLMP-AD16-QTTxx Red 630 1150 3200 Yes Parallel B
HLMP-AD16-RS0xx Red 630 1500 2500 Yes Parallel B
HLMP-AD16-RSTxx Red 630 1500 2500 Yes Parallel B
HLMP-AD16-RUTxx Red 630 1500 4200 Yes Parallel B
HLMP-AD16-ST0xx Red 630 1900 3200 Yes Parallel B
HLMP-AD16-STTxx Red 630 1900 3200 Yes Parallel B
HLMP-AL16-RSRxx Amber 592 1500 2500 Yes Parallel B
HLMP-AL16-RSKxx Amber 592 1500 2500 Yes Parallel B
HLMP-BD06-L00xx Red 630 400 No Perpendicular C
HLMP-BD06-P00xx Red 630 880 No Perpendicular C
HLMP-BD06-RS0xx Red 630 1500 2500 No Perpendicular C
HLMP-BD06-RSTxx Red 630 1500 2500 No Perpendicular C
HLMP-BD06-STTxx Red 630 1900 3200 No Perpendicular C
HLMP-BD16-NP0xx Red 630 680 1150 Yes Perpendicular D
HLMP-BD16-QRTxx Red 630 1150 1900 Yes Perpendicular D
HLMP-BD16-RU0xx Red 630 1500 4200 Yes Perpendicular D
HLMP-BD16-RUTxx Red 630 1500 4200 Yes Perpendicular D
HLMP-BD16-ST0xx Red 630 1900 3200 Yes Perpendicular D
HLMP-BD16-STTxx Red 630 1900 3200 Yes Perpendicular D
HLMP-BL06-N00xx Amber 592 680 No Perpendicular C
3
Table 2. Device Selection Guide for AlInGaP
Part Number
Color and Dominant
Wavelength
ld (nm) Typ.
Luminous
Intensity
Iv (mcd)
at 20 mA Min.
Luminous
Intensity
Iv (mcd)
at 20 mA Max. Stand-Off
Leadframe
Orientation
Package
Drawing
HLMP-AG01-K00xx Red 626 310 No Parallel A
HLMP-AL01-L00xx Amber 590 400 No Parallel A
HLMP-AL01-LP0xx Amber 590 400 1150 No Parallel A
HLMP-AL01-N00xx Amber 590 680 No Parallel A
HLMP-AL01-NR0xx Amber 590 680 1900 No Parallel A
HLMP-AL01-PQKxx Amber 590 880 1150 No Parallel A
HLMP-AL11-NR0xx Amber 590 880 1900 Yes Parallel B
HLMP-BG01-LM0xx Red 626 400 520 No Perpendicular C
HLMP-BG01-MN0xx Red 626 520 680 No Perpendicular C
HLMP-BL01-NR0xx Red 626 680 1900 No Perpendicular C
HLMP-BL11-KN0xx Red 626 310 880 Yes Perpendicular D
HLMP-BL11-NR0xx Red 626 680 1900 Yes Perpendicular D
4
Part Numbering System
HLMP - X X X X - X X X XX
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin; Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin
0: No Color Bin Limitation
B: Color bin 2 and 3 only
K: Color bins 2 and 4 only
R: Color Bins 1, 2, 4, and 6 with VF max of 2.6 V
S: Color bins 2 and 4 with VF max of 2.6 V
T: Red Color with VF max of 2.6 V
Maximum Intensity Bin
0: No Iv Bin Limitation
Minimum Intensity Bin
Tint Option
1 or 6: Matching Color Tints
Standoff Option
0: Without
1: With
Color
D: 630 nm Red
G: 626 nm Red
L: 590 or 592 nm Amber
Package
A: 5 mm Mini Oval, Parallel
B: 5 mm Mini Oval, Perpendicular
Note: Please refer to AB 5337 for complete information on part numbering system.
5
Package Dimensions
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244)
MIN.
0.70 (0.028)
MAX.
1.00
(0.039)MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244)
MIN.
0.70 (0.028)
MAX.
1.00
(0.039)MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
1.50 ±0.15
(0.059 ± 0.006)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244)
MIN.
0.70 (0.028)
MAX.
1.00
(0.039)MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244)
MIN.
0.70 (0.028)
MAX.
1.00
(0.039)MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
1.50 ±0.15
(0.059 ± 0.006)
HLMP-ALXX Pkg Dimensions
A
B
C
D
11.70 + 0.13
– 0.08
0.461 + 0.005
– 0.003)(
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY
MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 IN.) DOWN THE LEADS.
3. RECOMMENDED PC BOARD HOLE DIAMETERS:
– LAMP PACKAGES A AND C WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/1.067 mm (0.044/0.042 IN.).
– LAMP PACKAGES B AND D WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS.
6
Absolute Maximum Ratings at TA = 25˚C
Parameter Red and Amber
DC Forward Current[1] 50 mA
Peak Pulsed Forward Current[2] 100 mA
Average Forward Current 30 mA
Reverse Voltage (IR = 100 µA) 5 V
Power Dissipation 120 mW
LED Junction Temperature 130°C
Operating Temperature Range –40°C to +100°C
Storage Temperature Range –40°C to +100°C
Notes:
1. Derate linearly as shown in figure 4.
2. Duty Factor 30%, Frequency 1kHz.
Electrical/Optical Characteristics at TA = 25°C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Typical Viewing Angle
Major 2q1/2 70 deg
Minor 35
Forward Voltage VF V IF = 20 mA
Red (ld = 626 nm) 2.0 2.4
Red (ld = 630 nm)
Option xx0xx 2.2 2.4
Option xxTxx 2.3 2.6
Amber (ld = 590 nm) 2.0 2.4
Amber (ld = 592 nm)
Option xx0xx 2.2 2.4
Option xxRxx, xxSxx 2.3 2.6
Reverse Voltage
Amber, Red VR 5 20 V IR = 100 µA
Peak Wavelength Peak of Wavelength of
Amber (ld = 592 nm) lpeak 594 nm Spectral Distribution
Red (ld = 630 nm) 639 at IF = 20 mA
Spectral Halfwidth Wavelength Width at
Amber (ld = 592 nm) ∆l1/2 17 nm Spectral Distribution 1/2
Red (ld = 630 nm) 17 Power Point at IF = 20 mA
Capacitance VF = 0, F = 1 MHz
Amber, Red C 40 pF
Luminous Efficacy Emitted Luminous
Amber (ld = 592 nm) hv 500 lm/W Power/Emitted Radiant
Red (ld = 630 nm) 155 Power at IF = 20 mA
Thermal Resistance RQJ-PIN 240 °C/W LED Junction-to-
Cathode Lead
Notes:
1. 2q1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/hv where Iv is the luminous intensity in candelas and hv is
the luminous efficacy in lumens/watt.
3. The luminous intensity is measured on the mechanical axis of the lamp package.
4. The optical axis is closely aligned with the package mechanical axis.
5. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
6. For Options -xxRxx, -xxSxx and -xxTxx, max. forward voltage (Vf) is 2.6 V. Refer to Vf bin table.
7
Figure 1. Relative intensity vs. wavelength.
Figure 2a. Amber, red forward current vs.
forward voltage.
Figure 2b. Forward current vs. forward voltage
for option -xxTxx red, and option
-xxRxx and -xxSxx amber.
Figure 4. Amber, red maximum forward current
vs. ambient temperature.
Figure 3. Amber, red relative luminous intensity
vs. forward current.
0
70
60
40
20
CURRENT – mA
VF – FORWARD VOLTAGE – V
1.0 3.0
AMBER
HLMP-ALXX fig 3
1.5 2.0 2.5
10
30
50
RED
0
40
20
DC FORWARD CURRENT – mA
FORWARD VOLTAGE – V
0 3.01.0 1.5 2.5
10
30
50
0.5 2.0
AMBER
RED
RELATIVE INTENSITY
(NORMALIZED AT 20 mA)
0
0
FORWARD CURRENT – mA
20 30
2.0
1.0
50
0.5
1.5
2.5
10 40
AMBER
RED
HLMP-ALXX fig 7
IF – FORWARD CURRENT – mA
0
0
TA – AMBIENT TEMPERATURE – °C
40 80
50
40
30
20
10
20 60 100
RqJA = 585° C/W
RqJA = 780° C/W
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
500 550 600 650 700
WAVELENGTH - nm
RELATIVE INTENSITY
REDAMBER
8
Figure 5. Spatial radiation pattern – 35 x 70 degree lamps.
Vf Bin Table [2,3]
Bin Id Min. Max.
VA 2.0 2.2
VB 2.2 2.4
VC 2.4 2.6
Notes:
1. All bin categories are established for classification of products.
Products may not be available in all bin categories. Please contact
your Avago representative for further information.
2. Vf bin table only available for those numbers with options -xxRxx,
-xxSxx, -xxTxx.
3. Tolerance for each bin limit is ± 0.05V
HLMP-ALXX fig 8a
RELATIVE INTENSITY – %
100
0
VERTICAL ANGULAR DISPLACEMENT – DEGREES
80
60
50
70
20
50
10
30
40
40 020 -10 -30 -50
90
30 10 -20 -40
HLMP-ALXX fig 8b
RELATIVE INTENSITY – %
100
0
HORIZONTAL ANGULAR DISPLACEMENT – DEGREES
80
60
50
70
20
50
10
30
40
40 020 -10 -30 -50
90
30 10 -20 -40
Intensity Bin Limits (mcd at 20 mA)
Bin Name Min. Max.
K 310 400
L 400 520
M 520 680
N 680 880
P 880 1150
Q 1150 1500
R 1500 1900
S 1900 2500
T 2500 3200
U 3200 4200
Tolerance for each bin limit is ±15%.
Amber Color Bin Limits (nm at 20 mA)
Bin Name Min. Max.
1 584.5 587.0
2 587.0 589.5
4 589.5 592.0
6 592.0 594.5
Tolerance for each bin limit is ± 0.5 nm.
9
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
Avago Technologies LED configuration
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 60 sec Max -
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
AllnGaP Device
CATHODE
10
Example of Wave Soldering Temperature Profile for TH LED
0 10 20 30 40 50 60 70 80 90 100
250
200
150
100
50
TIME (MINUTES)
PREHEAT
TURBULENT WAVE LAMINAR WAVE
HOT AIR KNIFE
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Ammo Packs Drawing
Note: The ammo-packs drawing is applicable for packaging option –DD & –ZZ and regardless of standoff or non-standoff.
11
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label
Packaging Box for Ammo Packs
Note: For InGaN device, the ammo pack packaging box contains ESD logo.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
AVAGO
TECHNOLOGIES
ANODE
MOTHER LABEL
CATHODE
C
A
+
–
ANODE LEAD LEAVES
THE BOX FIRST.
LABEL ON
THIS SIDE
OF BOX.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes 5989-1903EN
AV02-1542EN - February 20, 2009
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF
A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL
RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH
Acronyms and Definition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
(ii) Avago Baby Label (Only available on bulk packaging)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label
