© Semiconductor Components Industries, LLC, 2007
September, 2007 - Rev. 3
1Publication Order Number:
SMF5.0AT1/D
SMF5.0AT1 Series
200 W Transient
Voltage Suppressor
SOD-123 Flat Lead Package
The SMF5.0A Series is designed to protect voltage sensitive
components from high voltage, high energy transients. Excellent
clamping capability, high surge capability, low zener impedance and
fast response time. Because of its small size, it is ideal for use in
cellular phones, portable devices, business machines, power supplies
and many other industrial/consumer applications.
Features
•Stand-off Voltage: 5 - 58 Volts
•Peak Power - 200 Watts @ 1 ms (SMF5.0A - SMF58A)
•Low Leakage
•Response Time is Typically < 1 ns
•ESD Rating of Class 3 (> 16 kV) per Human Body Model
•ESD Rating of Level 4 (8 kV Contact Discharge) per IEC61000-4-2
•EFT (Electrical Fast Transients) Rating of 40 A per IEC61000-4-4
•Low Profile - Maximum Height of 1.0 mm
•Small Footprint - Footprint Area of 8.45 mm2
•Supplied in 8 mm Tape and Reel - 3,000 Units per Reel
•Cathode Indicated by Polarity Band
•Lead Orientation in Tape: Cathode Lead to Sprocket Holes
•Pb-Free Packages are Available
Mechanical Characteristics:
CASE: Void‐free, transfer‐molded, thermosetting plastic
Epoxy Meets UL 94 V-0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
PLASTIC SURFACE MOUNT
ZENER OVERVOLTAGE
TRANSIENT SUPPRESSOR
5 - 58 VOLTS
200 WATT PEAK POWER
Device Package Shipping†
ORDERING INFORMATION
12
1: CATHODE
2: ANODE
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SOD-123FL
CASE 498
PLASTIC
MARKING DIAGRAM
1
CATHODE
2
ANODE
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
DEVICE MARKING INFORMATION
SMFxxxAT1G SOD-123FL
(Pb-Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
xx = Device Code (Refer to page 3)
M = Date Code
G= Pb-Free Package
(Note: Microdot may be in either location)
xxMG
G
Uni-Directional TVS
IPP
IF
V
I
IR
IT
VRWM
VCVBR
VF
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
Maximum Ppk Dissipation (PW-10/1000 ms) (Note 1) SMF5.0A - SMF58A Ppk 200 W
Maximum Ppk Dissipation @ TA = 25°C, (PW-8/20 ms) (Note 2) Ppk 1000 W
DC Power Dissipation @ TA = 25°C (Note 3)
Derate above 25°C
Thermal Resistance, Junction-to-Ambient (Note 3)
°PD°
RqJA
385
4.0
325
°mW
mW/°C
°C/W
Thermal Resistance, Junction-to-Lead (Note 3) RqJcathode 26 °C/W
Operating and Storage Temperature Range TJ, Tstg -55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Non-repetitive current pulse at TA = 25°C, per waveform of Figure 2.
2. Non-repetitive current pulse at TA = 25°C, per waveform of Figure 3.
3. Mounted with recommended minimum pad size, DC board FR-4.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless
otherwise noted, VF = 3.5 V Max. @ IF (Note 4) = 12 A)
Symbol Parameter
IPP Maximum Reverse Peak Pulse Current
VCClamping Voltage @ IPP
VRWM Working Peak Reverse Voltage
IRMaximum Reverse Leakage Current @ VRWM
VBR Breakdown Voltage @ IT
ITTest Current
IFForward Current
VFForward Voltage @ IF
4. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms,
duty cycle = 4 pulses per minute maximum.
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3
ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.25 Volts @ 200 mA)
Device* Marking
VRWM (V) VBR @ IT (V) (Note 6) ITIR @ VRWM VC(Max) IPP(Max) (A)
(Note 5) Min Nom Max (mA) (mA) (V) (Note 7)
SMF5.0A, G KE 5 6.4 6.7 7 10 400 9.2 21.7
SMF6.0A, G KG 6 6.67 7.02 7.37 10 400 10.3 19.4
SMF6.5A, G KK 6.5 7.22 7.6 7.98 10 250 11.2 17.9
SMF7.0A, G KM 7 7.78 8.2 8.6 10 100 12 16.7
SMF7.5A, G KP 7.5 8.33 8.77 9.21 1 50 12.9 15.5
SMF8.0A, G KR 8 8.89 9.36 9.83 1 25 13.6 14.7
SMF8.5A, G KT 8.5 9.44 9.92 10.4 1 10 14.4 13.9
SMF9.0A, G KV 9 10 10.55 11.1 1 5 15.4 13.0
SMF10A, G KX 10 11.1 11.7 12.3 1 2.5 17 11.8
SMF11A, G KZ 11 12.2 12.85 13.5 1 2.5 18.2 11.0
SMF12A, G LE 12 13.3 14 14.7 1 2.5 19.9 10.1
SMF13A, G LG 13 14.4 15.15 15.9 1 1 21.5 9.3
SMF14A, G LK 14 15.6 16.4 17.2 1 1 23.2 8.6
SMF15A, G LM 15 16.7 17.6 18.5 1 1 24.4 8.2
SMF16A, G LP 16 17.8 18.75 19.7 1 1 26 7.7
SMF17A, G LR 17 18.9 19.9 20.9 1 1 27.6 7.2
SMF18A, G LT 18 20 21 22.1 1 1 29.2 6.8
SMF20A, G LV 20 22.2 23.35 24.5 1 1 32.4 6.2
SMF22A, G LX 22 24.4 25.6 26.9 1 1 35.5 5.6
SMF24A, G LZ 24 26.7 28.1 29.5 1 1 38.9 5.1
SMF26A, G ME 26 28.9 30.4 31.9 1 1 42.1 4.8
SMF28A, G MG 28 31.1 32.8 34.4 1 1 45.4 4.4
SMF30A, G MK 30 33.3 35.1 36.8 1 1 48.4 4.1
SMF33A, G MM 33 36.7 38.7 40.6 1 1 53.3 3.8
SMF36A, G MP 36 40 42.1 44.2 1 1 58.1 3.4
SMF40A, G MR 40 44.4 46.8 49.1 1 1 64.5 3.1
SMF43A, G MT 43 47.8 50.3 52.8 1 1 69.4 2.9
SMF45A, G MV 45 50 52.65 55.3 1 1 72.7 2.8
SMF48A, G MX 48 53.3 56.1 58.9 1 1 77.4 2.6
SMF51A, G MZ 51 56.7 59.7 62.7 1 1 82.4 2.4
SMF54A, G NE 54 60 63.15 66.3 1 1 87.1 2.3
SMF58A, G NG 58 64.4 67.8 71.2 1 1 93.6 2.1
5. A transient suppressor is normally selected according to the Working Peak Reverse Voltage (VRWM) which should be equal to or greater
than the DC or continuous peak operating voltage level.
6. VBR measured at pulse test current IT at ambient temperature of 25°C.
7. Surge current waveform per Figure 2 and derate per Figure 3.
*The “G'' suffix indicates Pb-Free package available.
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4
tP
, PULSE WIDTH (ms)
100
1000
10,000
1.0 10 100
10
01234
0
50
100
t, TIME (ms)
VALUE (%)
HALF VALUE - IRSM
2
PEAK VALUE - IRSM
tr
TYPICAL PROTECTION CIRCUIT
Vin VL
Zin
LOAD
tP
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE PEAK
CURRENT DECAYS TO 50%
OF IRSM.
Figure 1. Pulse Rating Curve Figure 2. 10 X 1000 ms Pulse Waveform
1000 10,000
Figure 3. 8 X 20 ms Pulse Waveform
PP
, PEAK POWER (WATTS)
tr≤ 10 ms
100
80
60
40
20
00 25 50 75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
120
140
160
Figure 4. Pulse Derating Curve
PEAK PULSE DERATING IN % OF
PEAK POWER OR CURRENT @ TA = 25°C
100
90
80
70
60
50
40
30
20
10
0020406080
t, TIME (ms)
% OF PEAK PULSE CURRENT
tP
tr
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
PEAK VALUE IRSM @ 8 ms
HALF VALUE IRSM/2 @ 20 ms
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5
1.2
1.0
0.8
0.6
0.4
0.2
0
-55 25 85 150
T, TEMPERATURE (°C)
V , TYPICAL FORWARD VOLTAGE (VOLTS)
F
25 50 75 100 125 175
T, TEMPERATURE (°C)
P , MAXIMUM POWER DISSIPATION (m
W
D
150
1000
100
1
1 10 1000
WORKING PEAK REVERSE VOLTAGE (VOLTS)
C, CAPACITANCE (pF)
MEASURED @ 50% VRWM
MEASURED @ ZERO BIAS
Figure 5. Typical Derating Factor for Duty Cycle
DERATING FACTOR
1 ms
10 ms
1
0.7
0.5
0.3
0.05
0.1
0.2
0.01
0.02
0.03
0.07
100 ms
0.1 0.2 0.5 2 5 10 501 20 100
D, DUTY CYCLE (%)
PULSE WIDTH
10 ms
Figure 6. Steady State Power Derating
Figure 7. Forward Voltage Figure 8. Capacitance versus Working Peak
Reverse Voltage
10
100
350
300
250
200
150
400
100
50
0
0
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6
PACKAGE DIMENSIONS
SOD-123FL
CASE 498-01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION
OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
D
E
b
A
A1
L
c
POLARITY INDICATOR
OPTIONAL AS NEEDED
HE
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.90 0.95 1.00 0.035
INCHES
A1 0.00 0.05 0.10 0.000
b0.70 0.90 1.10 0.028
c0.10 0.15 0.20 0.004
D1.50 1.65 1.80 0.059
E2.50 2.70 2.90 0.098
L0.55 0.75 0.95 0.022
0.037 0.039
0.002 0.004
0.035 0.043
0.006 0.008
0.065 0.071
0.106 0.114
0.030 0.037
NOM MAX
3.40 3.60 3.80 0.134 0.142 0.150
HE
- -
0°8°0°8°
q
q
q
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
mm
inches
0.91
0.036
1.22
0.048
2.36
0.093
4.19
0.165
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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SMF5.0AT1/D
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