1
2
3GND
OUT
IN
DBZ PACKAGE
(TOP VIEW)
DROPOUT VOLTAGE vs LOAD CURRENT
350
300
250
200
150
100
50
0
Dropout Voltage (mV)
0 5 10 15 20 25 30
Load Current (mA)
REF3033-Q1
www.ti.com
SBVS131 JANUARY 2010
50 ppm/°C MAX, 50 μA, CMOS VOLTAGE REFERENCE
Check for Samples: REF3033-Q1
1FEATURES
Qualified for Automotive Applications
Low Dropout Voltage: 1 mV
High Output Current: 25 mA
High Accuracy: 0.2%
Low Quiescent Current: 50 μA (Max)
Excellent Specified Drift Performance
50 ppm/°C (Max), TA= 0°C to 70°C
75 ppm/°C (Max), TA= –40°C to 85°C
APPLICATIONS
Portable, Battery-Powered Equipment
Data Acquisition Systems
Medical Equipment
Hand-Held Test Equipment
DESCRIPTION
The REF30xx is a precision low-power low-dropout voltage reference family available in a tiny SOT23-3 (DBV)
package.
The REF30xx small size and low power consumption (50 μA max) make it ideal for portable and battery-powered
applications. The REF30xx does not require a load capacitor.
Unloaded, the REF30xx can be operated with supplies within 1 mV of output voltage. The device is specified for
the temperature range of –40°C to 85°C.
ORDERING INFORMATION(1)
TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING
–40°C to 85°C SOT-23 DBV Reel of 3000 REF3033AIDBZRQ1 REFI
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
REF3033-Q1
SBVS131 JANUARY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS(1)
Input voltage 7 V
Output short-circuit duration(2) Continuous
Operating temperature range –40 to 85 °C
Storage temperature range –65 to 150 °C
Junction temperature (TJmax) 150 °C
Human-body model (HBM) 2000
ESD rating V
Charged-device model (CDM) 1000
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) Short circuit to ground
ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TA= –40°C to 85°C.
TA= 25°C, ILOAD = 0, VIN = 5 V (unless otherwise noted)
PARAMETER CONDITIONS MIN TYP MAX UNIT
OUTPUT VOLTAGE
Output voltage VOUT 2.7 V < VIN < 18 V 3.294 3.3 3.306 V
Initial accuracy 0.2 %
NOISE
Output voltage noise f = 0.1 Hz to 10 Hz 36 μVPP
Voltage noise f = 10 Hz to 10 kHz 105 μVrms
LINE REGULATION VREF + 50 mV VIN 5.5 V 130 400 μV/V
OUTPUT VOLTAGE TEMPERATURE dVOUT/dT
DRIFT(1)
0°C TA70°C 20 50 ppm/°C
–30°C TA85°C 28 60 ppm/°C
–40°C TA85°C 30 65 ppm/°C
LONG-TERM STABILITY
0 to 1000 h 24 ppm
1000 h to 2000 h 15 ppm
dVOUT/dILOA 0 mA < ILOAD < 25 mA
LOAD REGULATION(2) 3 100 μV/mA
DVIN = VREF + 500 mV
THERMAL HYSTERESIS(3) dT 25 100 ppm
DROPOUT VOLTAGE VIN VOUT 1 50 mV
SHORT-CIRCUIT CURRENT ISC 45 mA
TURN-ON SETTLING TIME To 0.1%, VIN = 5 V, CL= 1 μF 120 μs
(1) Box Method used to determine over temperature drift.
(2) Typical value of load regulation reflects measurements using a force and sense contacts, see Load Regulation in Application
Information.
(3) For more detail on the thermal hysteresis procedure, see Thermal Hysteresis in Application Information.
2Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): REF3033-Q1
REF3033-Q1
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SBVS131 JANUARY 2010
ELECTRICAL CHARACTERISTICS (continued)
Boldface limits apply over the specified temperature range, TA= –40°C to 85°C.
TA= 25°C, ILOAD = 0, VIN = 5 V (unless otherwise noted)
PARAMETER CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
VREF +
Supply voltage VSILOAD = 0(4) 5.5 V
0.001
VREF +
Over temperature –40°C TA85°C 5.5
0.05
Quiescent current 42 50 μA
Over temperature –40°C TA85°C 59 μA
TEMPERATURE RANGE
Specified range –40 85 °C
Operating range –40 85 °C
Thermal resistance
Junction to case θJC 110 °C/W
Junction to free air θJA 336 °C/W
(4) For ILOAD > 0, see Typical Characteristics.
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): REF3033-Q1
TEMPERATURE DRIFT (0°C to +70°C)
50
45
40
35
30
25
20
15
10
5
0
Number of Units
5 10 15 20 25 30 4035 45 50 55 6560
Drift (ppm/°C)
TEMPERATURE DRIFT (–40°C to +125°C)
100
90
80
70
60
50
40
30
20
10
0
Number of Units
5 10 15 20 25 30 4035 45 50 55 6560
Drift (ppm/°C)
OUTPUT VOLTAGE vs TEMPERATURE
2.502
2.500
2.498
2.496
2.494
2.492
2.490
Output Voltage (V)
–40 –20 0 20 6040 80 100 120 140
Temperature (°C)
MAXIMUM LOAD CURRENT vs TEMPERATURE
35
30
25
20
15
10
5
Maximum Load Current (mA)
–40 –20 0 20 6040 80 100 120 140
Temperature (°C)
LOAD REGULATION vs TEMPERATURE
6
5
4
3
2
1
0
Load Regulation (µV/mA)
Temperature (°C)
–40 –20 0 20 6040 80 100 120 140
QUIESCENT CURRENT vs TEMPERATURE
60
50
40
30
20
10
0
IQ(µA)
Temperature (°C)
–40 –20 0 20 6040 80 100 120 140
REF3033-Q1
SBVS131 JANUARY 2010
www.ti.com
TYPICAL CHARACTERISTICS
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Product Folder Link(s): REF3033-Q1
LINE REGULATION vs TEMPERATURE
200
150
100
50
0
–50
Line Regulation (µV/V)
Temperature (°C)
–40 –20 0 20 6040 80 100 120 140
OUTPUT IMPEDANCE vs FREQUENCY
100
10
1
0.1
0.01
Output Impedance (dB)
1 10 100 1k 10k 100k
Frequency (Hz)
POWER-SUPPLY REJECTION RATIO vs FREQUENCY
90
80
70
60
50
40
30
20
10
0
PSRR (dB)
1 10 100 1k 10k 100k
Frequency (Hz)
OUTPUT VOLTAGE vs SUPPLY VOLTAGE (No Load)
2.500010
2.500000
2.499990
2.499980
2.499970
2.499960
2.499950
2.499940
2.499930
2.499920
Output Voltage (V)
2.5 3 3.5 4 4.5 5 5.5 6
Supply (V)
OUTPUT VOLTAGE
vs SUPPLY VOLTAGE (ILOAD = 25mA)
2.500200
2.500100
2.500000
2.499900
2.499800
2.499700
2.499600
2.499500
2.499400
2.499300
Output Voltage (V)
2.5 3 3.5 4 4.5 5 5.5 6
Supply (V)
REF3033-Q1
www.ti.com
SBVS131 JANUARY 2010
TYPICAL CHARACTERISTICS (continued)
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): REF3033-Q1
STEP RESPONSE, CL= 0, 3V STARTUP
40µs/div
VIN
VOUT
3V/div
1V/div
STEP RESPONSE, CL= 0, 5V STARTUP
10µs/div
VIN
5V/div
1V/div
VOUT
LINE TRANSIENT RESPONSE
10µs/div
500mV/div
50mV/div
VIN
VOUT
0-1mA LOAD TRANSIENT (CL= 0)
10µs/div
20mV/div
IL= 1mA
VOUT
IL= 0mA
0-5mA LOAD TRANSIENT (CL= 0)
10µs/div
20mV/div
IL= 5mA
VOUT
IL= 0mA
1-6mA LOAD TRANSIENT (CL=1µF)
40µs/div
20mV/div
VOUT
IL= 0mA
IL= 6mA
REF3033-Q1
SBVS131 JANUARY 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
6Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): REF3033-Q1
0.1Hz TO 10Hz NOISE
10µV/div
1.0s/div
1-25mA LOAD TRANSIENT (CL= 1µF)
100µs/div
20mV/div
VOUT
IL= 1mA
IL= 25mA
LONG-TERM STABILITY 0 TO 1000 HOURS
80
70
60
50
40
30
20
10
0
Absolute Output Voltage Drift (ppm)
0 100 200 300 400 500 600 700 800 900 1000
Time (hours)
LONG-TERM STABILITY 1000 TO 2000 HOURS
Absolute Output Voltage Drift (ppm)
1200 1300 1600 1800 1900 2000
Time (hours)
80
70
60
50
40
30
20
10
0
1000 1100 1400 1500 1700
LONG-TERM STABILITY 0 TO 2000 HOURS
Absolute Output Voltage Drift (ppm)
0 200 400 600 800 1000 1200 1400 1600 1800 2000
Time (hours)
80
70
60
50
40
30
20
10
0
REF3033-Q1
www.ti.com
SBVS131 JANUARY 2010
TYPICAL CHARACTERISTICS (continued)
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): REF3033-Q1
R1
Q2
Q1
+
Vbe1
+
Vbe2
1
3
REF30xx
2
0.47µF
VIN
VOUT
REF3033-Q1
SBVS131 JANUARY 2010
www.ti.com
THEORY OF OPERATION
The REF30xx is a series, CMOS, precision bandgap voltage reference. Its basic topology is shown in Figure 1.
The transistors Q1 and Q2 are biased such that the current density of Q1 is greater than that of Q2. The
difference of the two base-emitter voltages, Vbe1 Vbe2, has a positive temperature coefficient and is forced
across resistor R1. This voltage is gained up and added to the base-emitter voltage of Q2, which has a negative
coefficient. The resulting output voltage is virtually independent of temperature. The curvature of the bandgap
voltage, as seen in the typical curve, "Output Voltage vs Temperature," is due to the slightly nonlinear
temperature coefficient of the base-emitter voltage of Q2.
Figure 1. Simplified Schematic of Bandgap Reference
APPLICATION INFORMATION
For normal operation, the REF30xx does not require a capacitor on the output. If a capacitive load is connected,
special care must be taken with the combination of low equivalent series resistance (ESR) capacitors and high
capacitance. This caution is especially true for low-output voltage devices; therefore, the REF3012 should only
have a low-ESR capacitance of 10 μF or less. Figure 2 shows the typical connections required for operation of
the REF30xx. A supply bypass capacitor of 0.47 μF is always recommended.
Figure 2. Typical Connections for Operating REF30xx
Supply Voltage
The REF30xx family of references features an extremely low dropout voltage. With the exception of the
REF3012, which has a minimum supply requirement of 1.8 V, the REF30xx can be operated with a supply of
only 1 mV above the output voltage in an unloaded condition. For loaded conditions, a typical dropout voltage
versus load is shown on the cover page.
The REF30xx features a low quiescent current, which is extremely stable over changes in both temperature and
supply. The typical room temperature quiescent current is 42 μA, and the maximum quiescent current over
temperature is just 59 μA. Additionally, the quiescent current typically changes less than 2.5 μA over the entire
supply range, as shown in Figure 3.
8Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): REF3033-Q1
SUPPLY CURRENT vs INPUT VOLTAGE
42.5
42.0
41.5
41.0
40.5
40.0
IQ(µA)
1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
VIN (V)
REF3033-Q1
www.ti.com
SBVS131 JANUARY 2010
Figure 3. Supply Current vs Supply Voltage
Supply voltages below the specified levels can cause the REF30xx to momentarily draw currents greater than
the typical quiescent current. Using a power supply with a fast rising edge and low output impedance easily
prevents this.
Thermal Hysteresis
Thermal hysteresis for the REF30xx is defined as the change in output voltage after operating the device at
25°C, cycling the device through the specified temperature range, and returning to 25°C, and can be expressed
as:
Where
VHYST = Calculated hysteresis
VPRE = Output voltage measured at 25°C pretemperature cycling
VPOST = Output voltage measured when device has been operated at 25°C, cycled through specified range
–40°C to 85°C, and returned to operation at 25°C.
Temperature Drift
The REF30xx is designed to exhibit minimal drift error, defined as the change in output voltage over varying
temperature. Using the "box" method of drift measurement, the REF30xx features a typical drift coefficient of
20 ppm from 0°C to 70°C—the primary temperature range of use for many applications. For automotive
temperature ranges of –40°C to 85°C, the REF30xx family drift increases to a typical value of 50 ppm.
Noise Performance
The REF30xx generates noise less than 50 μVp-p between frequencies of 0.1 Hz to 10 Hz, and can be seen in
the typical characteristic curve "0.1 to 10Hz Voltage Noise." The noise voltage of the REF30xx increases with
output voltage and operating temperature. Additional filtering may be used to improve output noise levels,
although care should be taken to ensure the output impedance does not degrade AC performance.
Long-Term Stability
Long term stability refers to the change of the output voltage of a reference over a period of months or years.
This effect lessens as time progresses as is apparent by the long term stability curves. The typical drift value for
the REF30xx is 24 ppm from 0 to 1000 hours and 15 ppm from 1000 to 2000 hours. This parameter is
characterized by measuring 30 units at regular intervals for a period of 2000 hours.
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): REF3033-Q1
Output Pin
Meter
VOUT
+
Sense Line Force Line
Load
IL
Contact and
Trace Resistance
OPA703
REF3025
+5V
–5V
+5V
10kW
10kW
+2.5V
–2.5V
REF3033-Q1
SBVS131 JANUARY 2010
www.ti.com
Load Regulation
Load regulation is defined as the change in output voltage due to changes in load current. Load regulation for the
REF30xx is measured using force and sense contacts as pictured in Figure 4. The force and sense lines tied to
the contact area of the output pin reduce the impact of contact and trace resistance, resulting in accurate
measurement of the load regulation contributed solely by the REF30xx. For applications requiring improved load
regulation, force and sense lines should be used.
Figure 4. Accurate Load Regulation
Application Circuits
Negative Reference Voltage
For applications requiring a negative and positive reference voltage, the OPA703 and REF30xx can be used to
provide a dual supply reference from a ±5-V supply. Figure 5 shows the REF3025 used to provide a ±2.5-V
supply reference voltage. The low offset voltage and low drift of the OPA703 complement the low drift
performance of the REF30xx to provide an accurate solution for split-supply applications.
Figure 5. REF3025 Combined with OPA703 to Create Positive and Negative Reference Voltages
10 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): REF3033-Q1
ADS7822
VCC
CS
DOUT
DCLOCK
VREF
+In
–In
GND
+
+
5W
1µF to 10µF
1µF to
10µF
3.3V
0.1µF
VIN
V+
VS
Microcontroller
REF3033
GND
ADS8324
VCC
CS
DOUT
DCLOCK
VREF
+In
–In
GND
+
+
5W
1µF to 10µF
1µF to 10µF
0.1µF
0V to 1.25V Microcontroller
2.5V Supply
REF3012
GND
VIN
VOUT
2.5V
1.25V VS
REF3033-Q1
www.ti.com
SBVS131 JANUARY 2010
Data Acquisition
Often data acquisition systems require stable voltage references to maintain necessary accuracy. The REF30xx
family features stability and a wide range of voltages suitable for most microcontrollers and data converters.
Figure 6 and Figure 7 show two basic data acquisition systems.
Figure 6. Basic Data Acquisition System 1
Figure 7. Basic Data Acquisition System 2
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Product Folder Link(s): REF3033-Q1
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
REF3033AIDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF REF3033-Q1 :
Catalog: REF3033
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
PACKAGE OPTION ADDENDUM
www.ti.com 14-May-2010
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
REF3033AIDBZRQ1 SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Jul-2010
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
REF3033AIDBZRQ1 SOT-23 DBZ 3 3000 195.0 200.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Jul-2010
Pack Materials-Page 2
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