2SD2012
NPN Silicon
Power Transistors
Features
• High DC Current Gain: hFE(1) =100 (Min.)
• Low Saturation Voltage: VCE(sat)=1.0V (Max.)
• High Power Dissipation: PC=25W (TC=25
O
C)
Maximum Ratings
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MCC
Revision: B 2011/06/01
Micro Commercial Components
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• Lead Free Finish/RoHS Compliant (Note1) ("P" Suffix designates
RoHS Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
• Moisure Sensitivity Level 1 TO-220
R
B
Q
H
U
L
D
C
J
K
A
F
S
T
1
3
2
N
V
MIN MAX NOTE
A .560 .625 14.22 15.88
B .380 .420 9.65 10.67
C .140 .190 3.56 4.82
D .020 .045 0.51 1.14
F .139 .161 3.53 4.09 ∅
G .190 .110 2.29 2.79
H --- .250 --- 6.35
J .012 .025 0.30 0.64
K .500 .580 12.70 14.73
L .045 .060 1.14 1.52
N .190 .210 4.83 5.33
Q .100 .135 2.54 3.43
R .080 .115 2.04 2.92
S .045 .055 1.14 1.39
T .230 .270 5.84 6.86
U ----- .050 ----- 1.27
V .045 ----- 1.15 -----
DIMENSIONS
INCHES MM
DIMMIN MAX
PIN 1. BASE
PIN 2. COLLECTOR
PIN 3. EMITTER
Symbol Rating Rating Unit
VCEO
Collector-Emitter Voltage 60 V
VCBO
Collector-Base Voltage 60 V
VEBO
Emitter-Base Voltage 7.0 V
IC Collector Current 3.0 A
IB Base Current 0.5 A
PC Collector power dissipation
TA=25OC
TC=25OC 2.0
25 W
TJ Junction Temperature -55 to +150 OC
TSTG
Storage Temperature -55 to +150 OC
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol Parameter Min Typ Max Units
OFF CHARACTERISTICS
V(BR)CEO Collector-Emitter Breakdown Voltage
(IC=50mAdc, IB=0) 60 --- --- Vdc
ICBO Collector-Base Cutoff Current
(VCB=60Vdc,IE=0) --- --- 100 uAdc
IEBO Emitter-Base Cutoff Current
(VEB=7.0Vdc, IC=0) --- --- 100 uAdc
ON CHARACTERISTICS
hFE(1)
Forward Current Transfer ratio
(IC=0.5Adc, VCE=5.0Vdc) 100 --- 320 ---
hFE(2)
Forward Current Transfer ratio
(IC=2.0Adc, VCE=5.0Vdc) 20 --- --- ---
VCE(sat) Collector-Emitter Saturation Voltage
(IC=2.0Adc, IB=0.2Adc) --- 0.4 1.0 Vdc
VBE Base-Emitter Saturation Voltage
(IC=0.5Adc, VCE=5.0Vdc) --- 0.75 1.0 Vdc
fT Transition Frequency
(VCE=5.0Vdc, IC=0.5Adc) --- 3.0 --- MHz
Cob Collector Output Capacitance
(VCB=10Vdc, IE=0, f=1.0MHz) --- 35 --- pF
Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex 7.
Mounting Torgue: 5 in-lbs Maximum
•
TM
2SD2012 MCC
Revision: B 2011/06/01
TM
Micro Commercial Components
www.mccsemi.com
2 of 4
2SD2012 MCC
Revision: B 2011/06/01
TM
Micro Commercial Components
www.mccsemi.com
3 of 4
MCC
Revision: B 2011/06/01
TM
Micro Commercial Components
www.mccsemi.com
4 of 4
Ordering Information :
***IMPORTANT NOTICE***
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make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components
Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it
convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all
risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are
represented on our website, harmless against all damages.
***LIFE SUPPORT***
MCC's products are not authorized for use as critical components in life support devices or systems without the express written
approval of Micro Commercial Components Corporation.
***CUSTOMER AWARENESS***
Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking
strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages
customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on
our web page cited below. Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine
parts, have full traceability, meet MCC's quality standards for handling and storage. MCC will not provide any warranty
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problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized
distributors.
Device Packing
Part Number-BP
Bulk;1Kpcs/Box