April 2012
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSQ500L • Rev. 1.0.3
FSQ500L — Compact, Green Mode, Fairchild Power Switch (FPS™)
FSQ500L
Compact, Green Mode, Fairchild Power Switch (FPS™)
Features
Single Chip 700V SenseFET Power Switch
Precision Fixed Operating Frequency: 130kHz
No-load consumption 250mW at 265VAC with
Burst Mode and Down to 60mW with External Bias
Internal Startup Switch
Soft-Start Time Tuned by External Capacitor
Under-Voltage Lockout (UVLO) with Hysteresis
Pulse-by-Pulse Current Limit
Overload Protection (OLP) and Internal Thermal
Shutdown Function (TSD) with Hysteresis
Auto-Restart Mode
No Need for Auxiliary Bias Winding
Applications
Cost-Effective Linear Power Supplies Replacement
Charger and Adapter for Mobile Phone, PDA, MP3,
and Cordless Phone
Related Resources
AN4137 — Design Guidelines for Off-line Flyback
Converters Using Fairchild Power Switch (FPS™)
AN4141 — Troubleshooting and Design Tips for
Fairchild Power Switch (FPS™) Flyback
Applications
AN-4147 — Design Guidelines for RCD Snubber of
Flyback Converters
AN-6075 — Compact Green Mode Adapter Using
FSQ500L for Low Cost
AN-4138 — Design Considerations for Battery
Charger Using Green Mode Fairchild Power Switch
(FPS™)
Evaluation Board: FEBFSQ500L_H257v1
Description
The FSQ500L is specially designed for a replacement of
linear power supplies with low cost. This device
combines current-mode Pulse Width Modulator (PWM)
with a senseFET. The integrated PWM controller
features include: a fixed oscillator, Under Voltage
Lockout (UVLO) protection, Overload Protection (OLP),
Leading-Edge Blanking (LEB), an optimized gate turn-
on/turn-off driver, Thermal Shutdown (TSD) protection
with hysteresis, and temperature-compensated
precision-current sources for loop compensation. When
compared to a linear power supply, the FSQ500L device
reduces total size and weight, while increasing
efficiency, productivity, and system reliability. This
device provides a basic platform for cost-effective
flyback converters.
Maximum Output Power(1)
230VAC ± 15%(2) 85-265VAC
Adapter(3) Open
Frame(4) Adapter(3) Open
Frame(4)
2.5W 3.0W 2.0W 2.5W
Notes:
1. The junction temperature can limit the maximum
output power.
2. 230VAC or 100/115VAC with doubler.
3. Typical continuous power in a non-ventilated
enclosed adapter measured at 50°C ambient.
4. Maximum practical continuous power in an open
frame design at 50°C ambient.
Ordering Information
Part Number Operating
Temperature Range Package Packing Method
FSQ500L -40°C to +85°C 4-Lead, Small Outline Package (SOT223-4L) Tape & Reel
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSQ500L • Rev. 1.0.3 2
FSQ500L — Compact, Green Mode, Fairchild Power Switch (FPS™)
Application Circuit Diagram
D
GNDVFB VCC
AC
IN DC
OUT
PWM
Figure 1. Typical Application Circuit
Internal Block Diagram
S
R
Q
OSC
Rsense
(0.3V)
OLP
TSD
LEB
IFB
I
8R
R250ns
VREF UVLO
HV/REG
1
D
6.5V
HV/REG OFF
4
GND
2
VCC
3
VFB
VBURL/VBURH
VOLP
A/R
S
R
Q
VCC VCC
Soft-Soft
7.7VZ
IDELAY
VSD
(BURST MODE:IFB/2)
Figure 2. Internal Block Diagram
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSQ500L • Rev. 1.0.3 3
FSQ500L — Compact, Green Mode, Fairchild Power Switch (FPS™)
Pin Assignments
GND
VCC VFBD
FSQ500L
Figure 3. Package / Pin Diagram
Pin Definitions
Pin # Name Description
1 D
High-voltage power senseFET drain connection. In addition, at startup, the internal high-voltage
current source supplies internal bias and charges the external capacitor connected to the VCC pin.
Once VCC reaches 6.0V, all internal blocks are activated. The internal high-voltage current source
is alive until VCC reaches 6.5V. After that, the internal high voltage current source turns on and off
irregularly to maintain VCC at 6.5V.
2 VCC
This pin is connected to a storage capacitor. A high-voltage regulator connected between pin 1 (D)
and this pin provides the supply voltage to the FSQ500L at startup and when switching during
normal operation. The FSQ500L eliminates the need for auxiliary bias winding and associated
external components.
3 VFB
This pin is internally connected to the non-inverting input of the PWM comparator. The collector of
an opto-coupler is typically tied to this pin. For stable operation, a capacitor should be placed
between this pin and GND. If the voltage of this pin reaches 4.5V, the overload protection triggers,
which shuts down the FPS.
4 GND This pin is the control ground and the senseFET source.
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSQ500L • Rev. 1.0.3 4
FSQ500L — Compact, Green Mode, Fairchild Power Switch (FPS™)
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol Parameter Min. Max. Unit
VDS Drain Pin Voltage(5) 700 V
VCC Supply Voltage 10 V
VFB Feedback Voltage Range -0.3 VCC V
PD Total Power Dissipation 0.78 W
IDM Drain Current Pulsed(6) 0.41 A
TJ Operating Junction Temperature -40 Internally Limited
°C
TSTG Storage Temperature -55 +150 °C
Notes:
5. LDMOS available drain voltage is -0.3V ~ 700V.
6. Repetitive rating: pulse width is limited by maximum junction temperature.
Thermal Impedance
Symbol Parameter Value Unit
θJA Junction-to-Ambient Thermal Resistance(7) +160 °C/W
Note:
7. Free-standing with no heat sink; minimum land pattern.
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSQ500L • Rev. 1.0.3 5
FSQ500L — Compact, Green Mode, Fairchild Power Switch (FPS™)
Electrical Characteristics
TJ = 25°C unless otherwise specified.
Symbol Parameter Condition Min. Typ. Max. Unit
SenseFET Section
BVDSS Drain-Source Breakdown Voltage VCC = 6.5V, VFB = 0V, ID = 150μA 700 V
IDSS Zero-Gate-Voltage Drain Current VCC = 6.5V, VFB = 0V, VDS = 560V 150 μA
RDS(ON) Drain-Source On-State Resistance TJ = 25°C, ID = 25mA 25 29
Ω
TJ = 100°C, ID = 25mA 35 41
Ω
CISS Input Capacitance(8) V
GS = 6.5V 42 pF
COSS Output Capacitance(8) V
DS = 40V, fS = 1MHz 25 pF
tr Rise Time(8) V
DS = 350V, ID = 25mA 100 ns
tf Fall Time(8) V
DS = 350V, lD = 25mA 50 ns
Control Section
fS Switching Frequency VCC = 6.5V, VFB = 1.0V 120 130 140 kHz
ΔfS Switching Frequency Variation(8) -25°C < TJ < 125°C ±5 ±7 %
IFB(Burst) Feedback Source Current VCC = 6.5V, VFB = 0V 98 110 122 μA
IFB(Normal) VCC = 6.5V 200 225 250 μA
DMAX Maximum Duty Ratio VCC = 6.5V, VFB = 4.0V 54 60 66 %
DMIN Minimum Duty Ratio VCC = 6.5V, VFB = 0V 0 %
VSTART UVLO Threshold Voltage VFB = 0V, VCC Sweep 5.5 6.0 6.5 V
VSTOP After Turn-on, VFB = 0V, VCC Sweep 4.5 5.0 5.5 V
VDLY_EN Shutdown Delay Current Enable
Voltage VFB = VSD, VCC Sweep from 6V 6.0 6.5 7.0 V
Burst-Mode Section
VBURH
Burst Mode Voltage VCC = 6.5V, VFB Sweep
0.75 0.80 0.85 V
VBURL 0.70 0.75 0.80 V
HYS 30 50 80 mV
Protection Section
ILIM Peak Current Limit di/dt = 150mA/µs 245 280 315 mA
VSD Shutdown Feedback Voltage VCC = 6.5V, VFB Sweep 4.1 4.5 4.9 V
IDELAY Shutdown Delay Current VCC = 6.5V, VFB = 4.0V 4 5 6 μA
tLEB Leading Edge Blanking Time(8) 250 ns
tCLD Current Limit Delay Time(8) 100 ns
TDS Thermal Shutdown Temperature(8) 130 140 150
°C
HYS 80
°C
Total Device Section
IOP-BURST Operating Supply Current (Control
Part Only)
VCC = 6.5V, VFB = 0V 360 430 500 μA
IOP-FB VCC = 6.5V, VFB = 4V 640 760 880 μA
ICH Startup Charging Current VCC = VFB = 0V, VDS = 40V 3.3 mA
VCCREG Supply Shunt Regulator VDS = 40V, VFB = 0V 6.0 6.5 7.0 V
VCCREG_
TSD Supply Shunt Regulator During
TSD(8) 5.2 5.7 6.2 V
Note:
8. These parameters, although guaranteed, are not 100% tested in production.
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSQ500L • Rev. 1.0.3 6
FSQ500L — Compact, Green Mode, Fairchild Power Switch (FPS™)
Typical Performance Characteristics
These characteristic graphs are measured at TA = 25°C.
Operating Supply Current (IOP) vs Temperature
370
390
410
430
450
470
490
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature ()
IOP (μA)
Sw itching Frequency (f
S
) vs Temperature
120
125
130
135
140
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature ()
f
S
(KHZ)
Figure 4. Operating Supply Current (IOP_Burst)
vs. Temperature
Figure 5. Switching Frequency (fS)
vs. Temperature
UVLO Threshold Voltage (V
START
) vs Temperature
5.5
5.7
5.9
6.1
6.3
6.5
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature ()
V
START
(V)
UVLO Threshold Voltage (VSTOP) vs Temperature
4.5
4.7
4.9
5.1
5.3
5.5
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature ()
VSTOP (V)
Figure 6. UVLO Threshold Voltage (VSTART)
vs. Temperature
Figure 7. UVLO Threshold Voltage (VSTOP)
vs. Temperature
Burst Mode Voltage (V
BURH
) vs Temperature
750
770
790
810
830
850
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature ()
V
BURH
(mV)
Burst Mode Voltage (V
BURL
) vs Temperature
700
720
740
760
780
800
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature ()
V
BURL
(mV)
Figure 8. Burst-Mode Voltage (VBURH)
vs. Temperature
Figure 9. Burst-Mode Voltage (VBURL)
vs. Temperature
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSQ500L • Rev. 1.0.3 7
FSQ500L — Compact, Green Mode, Fairchild Power Switch (FPS™)
Typical Performance Characteristics (Continued)
These characteristic graphs are measured at TA = 25°C.
Maximum Duty Ratio (D
MAX
) vs Temperature
56.0
57.0
58.0
59.0
60.0
61.0
62.0
63.0
64.0
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature ()
D
MAx
(%)
Shutdown Feedback Voltage (V
SD
) vs Temperature
4.0
4.2
4.4
4.6
4.8
5.0
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature ()
V
SD
(V)
Figure 10. Maximum Duty Ratio (DMAX) vs. Temperature Figure 11. Shutdown Feedback Voltage (VSD)
vs. Temperature
Peak Current Limit (I
LIM
) vs Temperature
240.0
250.0
260.0
270.0
280.0
290.0
300.0
310.0
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature ()
I
LIM
(mA)
Shutdown Delay Current (I
DELAY
) vs Temperature
4.5
4.7
4.9
5.1
5.3
5.5
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature ()
I
DELAY
(μA)
Figure 12. Peak Current Limit (ILIM) vs. Temperature Figure 13. Shutdown Delay Current (IDELAY)
vs. Temperature
Supply Shunt Regulator (V
CCREG
) vs Temperature
6.0
6.2
6.4
6.6
6.8
7.0
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature ()
V
CCRGE
(V)
Figure 14. Supply Shunt Regulator (VCCREG)
vs. Temperature
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSQ500L • Rev. 1.0.3 8
FSQ500L — Compact, Green Mode, Fairchild Power Switch (FPS™)
Functional Description
1. Startup and VCC Regulation: At startup, an internal
high-voltage current source supplies the internal bias
and charges the external capacitor (CA) connected to
the VCC pin, as illustrated in Figure 15. An internal high-
voltage regulator (HV/REG) located between the D and
VCC pins regulates the VCC to be 6.5V and supplies
operating current. Therefore, FSQ500L needs no
auxiliary bias winding.
VREF UVLO
HV/REG
6.5V
2
D
3
VCC
C
A
Transformer
ICH
ISTART
Figure 15. Startup Block
2. Feedback Control: FSQ500L employs current mode
control, as shown in Figure 16. An opto-coupler (such as
the FOD817A) and shunt regulator (such as the KA431)
are typically used to implement the feedback network.
Comparing the feedback voltage with the voltage across
the Rsense resistor makes it possible to control the
switching duty cycle. When the reference pin voltage of
the regulator exceeds the internal reference voltage of
2.5V, the opto-coupler LED current increases, pulling
down the feedback voltage and reducing the duty cycle.
This typically happens when the line input voltage
increases or the output load current decreases.
2.1 Pulse-by-Pulse Current Limit: Because current
mode control is employed, the peak current through the
senseFET is limited by the non-inverting input of PWM
comparator (VFB*), as shown in Figure 16. Assuming
that 225µA current source flows only through the
internal resistor (8R + R = 12kΩ), the cathode voltage of
diode D2 is about 2.7V. Since D1 is blocked when the
feedback voltage (VFB) exceeds 2.7V, the maximum
voltage of the cathode of D2 is clamped at this voltage,
clamping VFB*. Therefore, the peak value of the current
through the senseFET is limited.
2.2 Leading-Edge Blanking (LEB): At the instant the
internal senseFET is turned on, a high-current spike
occurs through the senseFET, caused by primary-side
capacitance and secondary-side rectifier reverse
recovery. Excessive voltage across the Rsense resistor
would lead to incorrect feedback operation in the current
mode PWM control. To counter this effect, the FPS
employs a leading-edge blanking (LEB) circuit. This
circuit inhibits the PWM comparator for a short time (tLEB
= 250ns) after the senseFET turns on.
2OSC
VCC
IDELAY IFB
VSD
R
8R
Gate
driver
OLP
D1 D2
+
VFB*
-
VFB
KA431
CB
VO
FOD817A
Rsense
SenseFET
VCC
Figure 16. Pulse Width Modulation (PWM) Circuit
3. Protection Circuits: The FSQ500L has two self-
protective functions: overload protection (OLP) and
thermal shutdown (TSD). While OLP is implemented as
auto-restart mode, there is no switching when TSD
triggers. Once the overload condition is detected,
switching is terminated, the senseFET remains off, and
HV/REG turns off. This causes VCC to fall. When VCC
falls below the under voltage lockout (UVLO) stop
voltage of 5.0V, the protection is reset and the startup
circuit charges the VCC capacitor. When VCC reaches the
start voltage of 6.0V, the FSQ500L resumes its normal
operation. If the fault condition is still not removed, the
senseFET and HV/REG remain off and VCC drops to
VSTOP again. In this manner, the auto-restart can
alternately enable and disable the switching of the
power senseFET until the fault condition is eliminated,
as shown in Figure 17.
Because these protection circuits are fully integrated
into the IC without external components, reliability is
improved without increasing cost.
Fault
situation
5.0V
6.0V
VCC
VDS
t
OLP
occurs OLP
removed
Normal
operation
Normal
operation
Power
on
6.5V
Figure 17. Auto Restart Protection Waveforms
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSQ500L • Rev. 1.0.3 9
FSQ500L — Compact, Green Mode, Fairchild Power Switch (FPS™)
3.1 Overload Protection (OLP): Overload is defined as
the load current exceeding its normal level due to an
unexpected abnormal event. In this situation, the
protection circuit should trigger to protect the SMPS.
However, even when the SMPS is in the normal
operation, the overload protection circuit can be
triggered during the load transition. To avoid this
undesired operation, the overload protection circuit is
designed to trigger after a specified time to determine
whether the situation is transient or a true overload.
Because of the pulse-by-pulse current limit capability,
the maximum peak current through the senseFET is
limited and, therefore, the maximum input power is
restricted with a given input voltage. If the output
consumes more than this maximum power, the output
voltage (VO) decreases below the set voltage. This
reduces the current through the opto-coupler LED,
which also reduces the opto-coupler transistor current,
thus increasing the feedback voltage (VFB). If VFB
exceeds 2.7V, D1 is blocked and the 5µA current source
starts to charge CB slowly up to VCC. In this condition,
VFB continues increasing until it reaches 4.5V, when the
switching operation is terminated, as shown in Figure
18. The delay time for shutdown is the time required to
charge CB from 2.7V to 4.5V with 5µA. In general, a 10
~ 50ms delay time is typical for most applications. This
protection is implemented in auto restart mode.
VFB
t
2.7V
4.5V
Overload protection
T12= CB*(4.5-2.7)/IDELAY
T1T2
Figure 18. Overload Protection
3.2 Thermal Shutdown (TSD): The senseFET and the
control IC in one package makes it easy for the control
IC to detect an abnormal over temperature of the
senseFET. When the temperature exceeds
approximately 140°C, the thermal shutdown triggers.
When TSD triggers, delay current is disabled, switching
operation stops, and VCC through the internal high-
voltage current source is set to 5.7V from 6.5V, as
shown in Figure 19. Since TSD signal prohibits the
senseFET from switching, there is no switching until the
junction temperature decreases sufficiently. If the
junction temperature is lower than 60°C typically, TSD
signal is removed and VCC is set to 6.5V again. While
VCC increases from 5.7V to 6.5V, the soft-start function
makes the senseFET turn on and off with no voltage
and/or current stress.
Fault
situation
5.7V
6.0V
VCC
VDS
t
TSD
occurs
TSD
removed
Normal
operation
Normal
operation
Power
on
6.5V
Figure 19. Over-Temperature Protection (OTP)
4. Soft-Start: The soft-start time is tuned by an external
VCC capacitor (CA), which increases PWM comparator
non-inverting input voltage together with the senseFET
current slowly after it starts up. Before VCC reaches
VSTART, CA is charged by the current ICH-ISTART, where ICH
and ISTART are described in Figure 15. After VCC reaches
VSTART, all internal blocks are activated, so that the
current consuming inside IC becomes IOP. Therefore, CA
is charged by the current ICH-IOP, which makes the
increasing slope of VCC become sluggish. VCC is shifted
by 6.0V negatively (it is performed in soft-start block in
Figure 2), and then VCC -6.0V is an input of one of the
input terminals of the PWM comparator. The drain
current follows VCC -6.0V instead of the VFB* because of
the low-dominant feature of the PWM comparator. The
soft-start time can be made long or short by selecting
CA, as described in Figure 20. During tS/S, IDELAY is
disabled to avoid unwanted OLP. Typically, tS/S is
around 4.6ms with 27µF of CA.
6V
5V
VCC
t
VSTART
VSTOP
VCCREG
t1t2
t1=CA×6V/(ICH-ISTART) tS/S=CA×0.5V/(ICH-IOP)
6.5V
tS/S
Figure 20. Soft-Start Function
The peak value of the drain current of the power
switching device is progressively increased to establish
the correct working conditions for transformers,
inductors, and capacitors. The voltage on the output
capacitors is progressively increased with the intention
of smoothly establishing the required output voltage. It
also helps to prevent transformer saturation and reduce
stress on the secondary diode during startup.
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSQ500L • Rev. 1.0.3 10
FSQ500L — Compact, Green Mode, Fairchild Power Switch (FPS™)
5. Burst Operation: To minimize power dissipation in
standby mode, the FPS enters burst-mode operation.
During the burst mode operation, IFB(Burst) decreases half
of IFB(Normal). As the load decreases, the feedback
voltage decreases. As shown in Figure 21, the device
automatically enters burst mode when the feedback
voltage drops below VBURL (750mV). At this point,
switching stops and the output voltages start to drop at a
rate dependent on standby current load. This causes the
feedback voltage to rise. Once it passes VBURH (800mV),
switching resumes. The feedback voltage then falls and
the process repeats. Burst mode alternately enables
and disables switching of the power senseFET, reducing
switching loss in standby mode.
VFB
VDS
0.75V
0.80V
IDS
Vo
Voset
time
Switching
disabled
t1t2t3
Switching
disabled t4
Figure 21. Burst-Mode Operation
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSQ500L • Rev. 1.0.3 11
FSQ500L — Compact, Green Mode, Fairchild Power Switch (FPS™)
Package Dimensions
Figure 22. 4-Lead, Small Outline Package (SOT223-4L)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’ s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSQ500L • Rev. 1.0.3 12
FSQ500L — Compact, Green Mode, Fairchild Power Switch (FPS™)