HLMP-AL63-116DD - Avago Technologies

HLMP-AG62/AG63, AH62/AH63, AL62/AL63

HLMP-HG62/HG63, HH62/HH63, HL62/HL63

5mm Mini Oval and Standard Oval AlInGaP LEDs

Data Sheet

Description

These Precision Optical Performance AlInGaP Oval

LEDs are speci cally designed for full color/video and

passenger information signs. The oval shaped radiation

pattern and high luminous intensity ensure that these

devices are excellent for wide  eld of view outdoor ap-

plications where a wide viewing angle and readability in

sunlight are essential. The package epoxy contains both

UV-A and UV-B inhibitors to reduce the e ects of long

term exposure to direct sunlight.

Applications

• Full color signs

Features

• Viewing Angle: 30°x70° and 40°x100°

• Colors:

590nm Amber

615nm Red-Orange

626nm Red

• Well de ned spatial radiation pattern

• High brightness material

• Superior resistance to moisture

• Package options:

Stand-o and Non Stand-o Leads

• Tinted and di used

Package Drawing B

For 5mm Standard Oval 40°x100°

Package Drawing C

Package Drawing D

Notes:

All dimensions in millimeters (inches).

Package Dimensions

For 5mm Mini Oval 30°x70°

Package Drawing A

5.20 ± 0.20

0.205 ± 0.008

8.70 ± 0.20

0.342 ± 0.008

2.54 ± 0.3

0.100 ± 0.012

1.00

0.038

3.80 ± 0.200

0.150 ± 0.008

min.

0.8

0.032

cathode lead

24.00

0.945

0.50 ± 0.10

0.020 ± 0.004

1.50 ± 0.15

0.0591 ± 0.006

11.70 ± 0.50

0.4606 ± 0.020

sq. typ.

8.70 ± 0.20

0.342 ± 0.008

5.20 ± 0.200

0.205 ± 0.008

24.00

0.945

0.70

0.028

0.8

0.032 0.50 ± 0.10

0.020 ± 0.004

sq. typ.

2.54 ± 0.3

0.100 ± 0.012

1.00

0.038

min.

cathode lead

max.

min.

0.70

0.028

max.

3.80 ± 0.200

0.150 ± 0.008

10.80±0.50

0.425±0.020

1.50±0.15

0.059±0.006

1.00

0.039

24.00

0.945

cathode lead

0.50±0.10

0.020±0.004

3.80

0.150

7.00

0.276

5.20

0.205

1.02

0.040

2.54±0.30

0.10±0.012

sq. typ.

1.02

0.040 0.50±0.10

.020±.004

3.80

0.150

5.20

0.205

7.00

0.276

25.00

0.984

0.70

.028

1.00

.039

2.54

0.10

sq. typ.

cathode lead

max.

min.

max.

min. min.

Device Selection Guide

5mm Mini Oval 30°x70°

Part Number

Color and Dominant

Wavelength λd (nm)

Typ.

Luminous Intensity

Iv (mcd) at 20 mA

Min.

Luminous Intensity

Iv (mcd) at 20 mA

Max. Stand-O

Package

Drawing

HLMP-AL62-UX0DD Amber 590 960 1990 No A

HLMP-AL62-X10DD Amber 590 1660 3500 No A

HLMP-AH62-UX0DD Red-Orange 615 960 1990 No A

HLMP-AH62-X10DD Red-Orange 615 1660 3500 No A

HLMP-AG62-UX0DD Red 626 960 1990 No A

HLMP-AG62-X10DD Red 626 1660 3500 No A

HLMP-AL63-UX0DD Amber 590 960 1990 Yes B

HLMP-AL63-X10DD Amber 590 1660 3500 Yes B

HLMP-AH63-UX0DD Red-Orange 615 960 1990 Yes B

HLMP-AH63-X10DD Red-Orange 615 1660 3500 Yes B

HLMP-AG63-UX0DD Red 626 960 1990 Yes B

HLMP-AG63-X10DD Red 626 1660 3500 Yes B

5mm Standard Oval 40°x100°

Part Number

Color and Dominant

Wavelength λd (nm)

Typ

Luminous Intensity

Iv (mcd) at 20 mA

Min.

Luminous Intensity

Iv (mcd) at 20 mA

Max. Stand-O

Package

Drawing

HLMP-HL62-TX0DD Amber 590 800 1990 No C

HLMP-HH62-TX0DD Red-Orange 615 800 1990 No C

HLMP-HG62-TX0DD Red 626 800 1990 No C

HLMP-HL63-TX0DD Amber 590 800 1990 Yes D

HLMP-HH63-TX0DD Red-Orange 615 800 1990 Yes D

HLMP-HG63-TX0DD Red 626 800 1990 Yes D

Notes:

1. The luminous intensity is measured on the mechanical axis of the lamp package.

2. Tolerance for each intensity limit is ± 15%.

3. Please refer to AN 5352 for detail information on features of stand-o and non stand-o LEDs.

Part Numbering System

HLMP- x x 62/63 - x x x x x

Packaging Option

DD: Ammopacks

Color Bin Selection

0: Open distribution

Maximum Intensity Bin

Refer to Device Selection Guide

Minimum Intensity Bin

Refer to Device Selection Guide.

Color

G: Red 626nm

H: Red Orange 615nm

L: Amber 590nm

Package

A: 5mm Mini Oval 30° x 70°

H: 5mm Standard Oval 40°x100°

Absolute Maximum Ratings

TA = 25°C

Parameter Value Unit

DC Forward Current [1] 50 mA

Peak Forward Current 100 [2] mA

Power Dissipation 120 mW

Reverse Voltage 5 (IR = 100 μA) V

LED Junction Temperature 130 °C

Operating Temperature Range -40 to +100 °C

Storage Temperature Range -40 to +100 °C

Notes:

1. Derate linearly as shown in Figure 4.

2. Duty Factor 30%, frequency 1kHz.

Note: Please refer to AB 5337 for complete information on part numbering system.

Electrical / Optical Characteristics

TA = 25°C

Parameter Symbol Min. Typ. Max. Units Test Conditions

Forward Voltage

Amber

Red

Red-Orange

VF1.8

2.2

2.1

2.0

2.4 V IF = 20 mA

Reverse Voltage VR5V

IR = 100 μA

Dominant Wavelength [1]

Amber

Red

Red-Orange

λd

584.5

620

612

594.5

630

621.7

nm IF = 20 mA

Peak Wavelength

Amber

Red

Red-Orange

λPEAK

590

626

615

Peak of Wavelength of Spectral

Distribution at IF = 20 mA

Thermal Resistance RθJ-PIN 240 °C/W LED Junction-to-Anode Lead

Luminous E cacy [2]

Amber

Red

Red-Orange

ηV

480

150

260

lm/W Emitted Luminous Power/Emitted

Radiant Power

Notes:

1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. Tolerance for each color of dominant

wavelength is ± 0.5nm.

2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is

the luminous e cacy in lumens/watt.

Figure 1. Relative intensity vs. peak wavelength

Figure 5. Representative Radiation pattern for 30°x70° Lamp -Major Axis

Figure 2. Forward current vs. forward voltage

Figure 4. Maximum forward current vs. ambient temperature

Figure 3. Relative luminous intensity vs. forward current

0 0.5 1 1.5 2 2.5 3

FORWARD VOLTAGE - V

FORWARD CURRENT - mA

AMBER

RED-ORANGE

RED

0.5

1.5

2.5

0 10203040 50

DC FORWARD CURRENT - mA

RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA)

0 20 40 60 80 100 12

- AMBIENT TEMPERATURE - ºC

- FORWARD CURRENT - mA

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

-90 -60 -30 0 30 60 90

ANGULAR DISPLACEMENT - DEGREES

NORMALIZED INTENSITY

Figure 7. Representative Radiation pattern for 40°x100° Lamp -Major AxisFigure 6. Representative Radiation pattern 30°x70° Lamp -Minor Axis

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

-90 -60 -30 0 30 60 90

ANGULAR DISPLACEMENT - DEGREES

NORMALIZED INTENSITY

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

-90 -60 -30 0 30 60 90

ANGULAR DISPLACEMENT - DEGREES

NORMALIZED INTENSITY

Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)

Bin

Intensity (mcd) at 20 mA

Min Max

U 960 1150

V 1150 1380

W 1380 1660

X 1660 1990

Y 1990 2400

Z 2400 2900

1 2900 3500

Tolerance for each bin limit is ± 15%

VF Bin Table (V at 20mA)

Bin ID Min Max

VD 1.8 2.0

VA 2.0 2.2

VB 2.2 2.4

Tolerance for each bin limit is ±0.05V

Amber Color Bin Limits

Bin Min Max

1 584.5 587.0

2 587.0 589.5

4 589.5 592.0

6 592.0 594.5

Tolerance for each bin limit is ± 0.5nm.

Figure 9. Relative Light Output vs Junction temperatureFigure 8. Representative Radiation pattern 40°x100° Lamp –Minor Axis

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

-90 -60 -30 0 30 60 90

ANGULAR DISPLACEMENT - DEGREES

NORMALIZED INTENSITY

0.1

-50 -25 0 25 50 75 100 125 150

JUNCTION TEMPERATURE - °C

RELATIVE LOP (NORMALIZE AT 25 °C )

AMBER

RED-ORANGE RED

Precautions:

Lead Forming:

• The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering on PC board.

• For better control, it is recommended to use proper

tool to precisely form and cut the leads to applicable

length rather than doing it manually.

• If manual lead cutting is necessary, cut the leads after

the soldering process. The solder connection forms

a mechanical ground which prevents mechanical

stress due to lead cutting from traveling into LED

package. This is highly recommended for hand solder

operation, as the excess lead length also acts as small

heat sink.

Soldering and Handling:

• Care must be taken during PCB assembly and

soldering process to prevent damage to the LED

component.

• LED component may be e ectively hand soldered

to PCB. However, it is only recommended under

unavoidable circumstances such as rework. The

closest manual soldering distance of the soldering

heat source (soldering iron’s tip) to the body is

1.59mm. Soldering the LED using soldering iron tip

1.59mm

closer than 1.59mm might damage the LED.

• ESD precaution must be properly applied on the

soldering station and personnel to prevent ESD

damage to the LED component that is ESD sensitive.

Do refer to Avago application note AN 1142 for details.

The soldering iron used should have grounded tip to

ensure electrostatic charge is properly grounded.

• Recommended soldering condition:

Wave

Soldering [1, 2]

Manual Solder

Dipping

Pre-heat temperature 105 °C Max. -

Preheat time 60 sec Max -

Peak temperature 250 °C Max. 260 °C Max.

Dwell time 3 sec Max. 5 sec Max

Note:

1. Above conditions refers to measurement with thermocouple

mounted at the bottom of PCB.

2. It is recommended to use only bottom preheaters in order to reduce

thermal stress experienced by LED.

• Wave soldering parameters must be set and

maintained according to the recommended

temperature and dwell time. Customer is advised

to perform daily check on the soldering pro le to

ensure that it is always conforming to recommended

soldering conditions.

Note:

1. PCB with di erent size and design (component density) will have

di erent heat mass (heat capacity). This might cause a change in

temperature experienced by the board if same wave soldering

setting is used. So, it is recommended to re-calibrate the soldering

pro le again before loading a new type of PCB.

2. Avago Technologies’ high brightness LED are using high e ciency

LED die with single wire bond as shown below. Customer is advised

to take extra precaution during wave soldering to ensure that the

maximum wave temperature does not exceed 250°C and the solder

contact time does not exceeding 3sec. Over-stressing the LED

during soldering process might cause premature failure to the LED

due to delamination.

Avago Technologies LED con guration

Anode

Note: Electrical connection between bottom surface of LED die and

the lead frame is achieved through conductive paste.

• Any alignment  xture that is being applied during

wave soldering should be loosely  tted and should

not apply weight or force on LED. Non metal material

is recommended as it will absorb less heat during

wave soldering process.

Note: In order to further assist customer in designing jig accurately

that  t Avago Technologies’ product, 3D model of the product is

available upon request.

• At elevated temperature, LED is more susceptible to

mechanical stress. Therefore, PCB must allowed to

cool down to room temperature prior to handling,

which includes removal of alignment  xture or pallet.

• If PCB board contains both through hole (TH) LED and

other surface mount components, it is recommended

that surface mount components be soldered on

the top side of the PCB. If surface mount need to be

on the bottom side, these components should be

soldered using re ow soldering prior to insertion the

TH LED.

• Recommended PC board plated through holes (PTH)

size for LED component leads.

LED component

lead size Diagonal

Plated through

hole diameter

0.45 x 0.45 mm

(0.018x 0.018 inch)

0.636 mm

(0.025 inch)

0.98 to 1.08 mm

(0.039 to 0.043 inch)

0.50 x 0.50 mm

(0.020x 0.020 inch)

0.707 mm

(0.028 inch)

1.05 to 1.15 mm

(0.041 to 0.045 inch)

• Over-sizing the PTH can lead to twisted LED after

clinching. On the other hand under sizing the PTH can

cause di culty inserting the TH LED

Example of Wave Soldering Temperature Pro le for TH LED

Ammo Packs Drawing

030 40 90 100

250

200

150

100

TIME (MINUTES)

PREHEAT

TURBULENT WAVE LAMINAR WAVE

HOT AIR KNIFE

Recommended solder:

Sn63 (Leaded solder alloy)

SAC305 (Lead free solder alloy)

Flux: Rosin flux

Solder bath temperature:

245°C± 5°C (maximum peak

temperature = 250°C)

Dwell time: 1.5 sec - 3.0 sec

(maximum = 3sec)

Note: Allow for board to be

sufficiently cooled to room

temperature before exerting

TEMPERATURE (°C)

10 20 60 70 80

mechanical force.

6.35±1.30

0.25±0.0512

12.70±1.00

0.50±0.0394

20.50±1.00

0.8071±0.0394

4.00±0.20

0.1575±0.008

0.70±0.20

0.0276±0.0079

12.70±0.30

0.50±0.0118

9.125±0.625

0.3593±0.0246

18.00±0.50

0.7087±0.0197

TYP

VIEW A - A

CATHODE

Packaging Box for Ammo Packs

LABEL ON THIS

SIDE OF BOX

FROM LEFT SIDE OF BOX

ADHESIVE TAPE MUST BE

FACING UPWARDS.

ANODE LEAD LEAVES

THE BOX FIRST.

Note: For InGaN device, the ammo pack packaging box contain ESD logo

Packaging Label

(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)

(1P) Item: Part Number

(1T) Lot: Lot Number

LPN:

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

DeptID: Made In: Country of Origin

(Q) QTY: Quantity

CAT: Intensity Bin

BIN: Refer to below information

(9D) Date Code: Date Code

STANDARD LABEL LS0002

RoHS Compliant

e3 max temp 250C

DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR

AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAIN-

TENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS.

CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUP-

PLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.

Acronyms and De nition:

BIN:

(i) Color bin only or VF bin only

(Applicable for part number with color bins but

without VF bin OR part number with VF bins and no

color bin)

(ii) Color bin incorporated with VF Bin

(Applicable for part number that have both color bin

and VF bin)

(ii) Avago Baby Label (Only available on bulk packaging)

Example:

(i) Color bin only or VF bin only

BIN: 2 (represent color bin 2 only)

BIN: VB (represent VF bin “VB” only)

(ii) Color bin incorporate with VF Bin

BIN: 2VB

VB: VF bin “VB”

2: Color bin 2 only

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

C/O: Country of Origin

Customer P/N:

Supplier Code:

QUANTITY: Packing Quantity

CAT: Intensity Bin

BIN: Refer to below information

DATECODE: Date Code

RoHS Compliant

e3 max tem

250C

Lam

s Bab

Label

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-1314EN - April 19, 2011