data sheet D-8 TPS2375 TPS2376 TPS2377 PW-8 www.ti.com............................................................................................................................................................ SLVS525B - APRIL 2004 - REVISED APRIL 2008 IEEE 802.3af PoE POWERED DEVICE CONTROLLERS FEATURES APPLICATIONS * * * * * * * * * * * * * * * * 1 Fully Supports IEEE 802.3af Specification Integrated 0.58-, 100-V, Low-Side Switch 15-kV System Level ESD Capable Supports Use of Low-Cost Silicon Rectifiers Programmable Inrush Current Control Fixed 450-mA Current Limit Fixed and Adjustable UVLO Options Open-Drain, Power-Good Reporting Overtemperature Protection Industrial Temperature Range: -40C to 85C 8-Pin SOIC and TSSOP Packages VoIP Phones WLAN Access Points Security Cameras Internet Appliances POS Terminals TPS2376 (TOP VIEW) TPS2375/77 (TOP VIEW) 1 2 3 4 ILIM CLASS DET VSS VDD N/C 8 1 7 2 6 3 PG RTN 5 4 ILIM CLASS DET VSS VDD UVLO 8 7 6 PG RTN 5 DESCRIPTION These easy-to-use 8-pin integrated circuits contain all of the features needed to develop an IEEE 802.3af compliant powered device (PD). The TPS2375 family is a second generation PDC (PD Controller) featuring 100-V ratings and a true open-drain, power-good function. In addition to the basic functions of detection, classification and undervoltage lockout (UVLO), these controllers include an adjustable inrush limiting feature. The TPS2375 has 802.3af compliant UVLO limits, the TPS2377 has legacy UVLO limits, and the TPS2376 has a programmable UVLO with a dedicated input pin. The TPS2375 family specifications incorporate a voltage offset of 1.5 V between its limits and the IEEE 802.3af specifications to accommodate the required input diode bridges used to make the PD polarity insensitive. Additional resources can be found on the TI Web site www.ti.com. RJ-45 1 TX Pair Detect Data to Ethernet PHY 2 7 8 100 mF, 100 V VDD CLASS R(ICLASS) 357 W, 1% Spare Pair Data to Ethernet PHY VRTN RTN 3 RX Pair V (PG-RTN) TO DC/DC CONVERTER ILIM R(ILIM) 178 kW, 1% Class 3 Current 100 kW PG DET VSS Spare Pair 0.1mF, 100 V 10 % R(DET) 24.9 kW, 1% TPS2375 SMAJ58A 4 5 VDD Input Current DF01S 2 Places Classify Power Up & Inrush Note: Class 3 PD Depicted. PG Pullup Resistor Is Optional. Note: All Voltages With Respect to VSS. 6 Figure 1. Typical Application Circuit and Startup Waveforms 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2004-2008, Texas Instruments Incorporated data sheet TPS2375 TPS2376 TPS2377 SLVS525B - APRIL 2004 - REVISED APRIL 2008............................................................................................................................................................ www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. AVAILABLE OPTIONS -40C to 85C (1) PACKAGE (1) UVLO THRESHOLDS (NOMINAL) TA TYPE LOW HIGH SO-8 TSSOP-8 MARKING 802.3af 30.5 V 39.3 V TPS2375D TPS2375PW 2375 Adjustable 1.93 V 2.49 V TPS2376D TPS2376PW 2376 Legacy 30.5 V 35.1 V TPS2377D TPS2377PW 2377 Add an R suffix to the device type for tape and reel. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) , voltages are referenced to V(VSS) TPS237x VDD, RTN, DET, PG Voltage -0.3 V to 100 V ILIM, UVLO -0.3 V to 10 V CLASS -0.3 V to 12 V RTN Current, sinking (2) (3) 0 to 515 mA PG Current, sourcing 0 to 5 mA DET 0 to 1 mA CLASS 0 to 50 mA ILIM 0 to 1 mA Human body model ESD 2 kV Charged device model 500 V System level (contact/air) at RJ-45 (4) 8/15 kV TJ Maximum junction temperature range Internally limited Tstg Storage temperature range -65C to 150C (1) (2) (3) (4) Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds - Green Packages 260C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds - Nongreen Packages 235C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. I(RTN) = 0 SOA limited to V(RTN) = 80 V and I(RTN) = 515 mA. Surges applied to RJ-45 of Figure 1 between pins of RJ-45, and between pins and output voltage rails per EN61000-4-2, 1999. DISSIPATION RATING TABLE (1) JA (LOW-K) C/W JA (HIGH-K) C/W POWER RATING (HIGH-K) TA = 85C mW D (SO-8) 238 150 266 PW (TSSOP-8) 258.5 159 251 PACKAGE (1) 2 Tested per JEDEC JESD51. High-K is a (2 signal - 2 plane) test board and low-K is a double sided board with minimum pad area and natural convection. Submit Documentation Feedback Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 data sheet TPS2375 TPS2376 TPS2377 www.ti.com............................................................................................................................................................ SLVS525B - APRIL 2004 - REVISED APRIL 2008 RECOMMENDED OPERATING CONDITIONS MIN MAX VDD, PG, RTN 0 57 UVLO 0 5 Operating current range (sinking) RTN 0 350 Classification resistor (1) CLASS Input voltage range R(ILIM) Inrush limit program resistor (1) Sinking current UNIT V V mA 255 4420 62.5 500 k 0 2 mA PG TJ Operating junction temperature -40 125 C TA Operating free-air temperature -40 85 C (1) Voltage should not be eternally applied to CLASS and ILIM. ELECTRICAL CHARACTERISTICS V(VDD) = 48 V, R(DET) = 24.9 k, R(CLASS) = 255 , R(ILIM) = 178 k, and -40C TJ 125C, unless otherwise noted. Positive currents are into pins. V(UVLO) = 0 V for classification and V(UVLO) = 5 V otherwise for the TPS2376. Typical values are at 25C. All voltages are with respect to VSS unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 0.3 3 A 4 12 A 0.1 5 A DETECTION Offset current DET open, V(VDD) = V(RTN) = 1.9 V, measure I(VDD) + I(RTN) Sleep current DET open, V(VDD) = V(RTN) = 10.1 V, measure I(VDD) + I(RTN) DET leakage current V(DET) = V(VDD) = 57 V, measure I(DET) Detection current V(RTN) = V(VDD), R(DET) = 24.9 k, measure I(VDD) + I(RTN) + I(DET) V(VDD) = 1.4 V 53.7 56 58.3 A V(VDD) = 10.1 V 395 410 417 A CLASSIFICATION I(CLASS) V(CL_ON) V(CU_OFF) V(CU_H) Classification current (1) Classification lower threshold Classification upper threshold R(CLASS) = 4420 , 13 V(VDD) 21 V 2.2 2.4 2.8 R(CLASS) = 953 , 13 V(VDD) 21 V 10.3 10.6 11.3 R(CLASS) = 549 , 13 V(VDD) 21 V 17.7 18.3 19.5 R(CLASS) = 357 , 13 V(VDD) 21 V 27.1 28.0 29.5 R(CLASS) = 255 , 13 V(VDD) 21 V 38.0 39.4 41.2 Regulator turns on, V(VDD) rising 10.2 11.3 13.0 V Regulator turns off, V(VDD) rising 21 21.9 23 V Hysteresis 0.5 0.78 1 V 1 A 1.0 mA Leakage current V(CLASS) = 0 V, V(VDD) = 57 V On resistance I(RTN) = 300 mA Leakage current V(VDD) = V(RTN) = 30 V, V(UVLO) = 0 V (TPS2376) Current limit V(RTN) = 1 V 405 461 515 mA Inrush limit V(RTN) = 2 V, R(ILIM) = 178 k 100 130 180 mA Inrush current termination V(RTN) falling, R(ILIM) = 178 k, inrush statenormal operation 85% 91% 100% 15 25 PASS DEVICE rDS(on) I(LIM) (1) (2) (2) Current rise time into inrush R(ILIM) = 69.8 k, V(RTN-VSS) = 5 V, I(RTN) = 30 mA300 mA, V(VDD) increasing past upper UVLO Current limit response time Apply load 20 , time measured to I(RTN) = 45 mA Leakage current, ILIM V(VDD) = 15 V, V(UVLO) = 0 V 0.58 15 A s 2 2.5 1 s A Classification is tested with exact resistor values. A 1% tolerance classification resistor assures compliance with IEEE 802.3af limits. This parameter specifies the RTN current value, as a percentage of the steady state inrush current, below which it must fall to make PG assert (open-drain). Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 Submit Documentation Feedback 3 data sheet TPS2375 TPS2376 TPS2377 SLVS525B - APRIL 2004 - REVISED APRIL 2008............................................................................................................................................................ www.ti.com ELECTRICAL CHARACTERISTICS (continued) V(VDD) = 48 V, R(DET) = 24.9 k, R(CLASS) = 255 , R(ILIM) = 178 k, and -40C TJ 125C, unless otherwise noted. Positive currents are into pins. V(UVLO) = 0 V for classification and V(UVLO) = 5 V otherwise for the TPS2376. Typical values are at 25C. All voltages are with respect to VSS unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PG Latchoff voltage threshold rising V(RTN) rising 9.5 10.0 10.5 V PG deglitch Delay rising and falling PG 75 150 225 s I(PG) = 2 mA, V(RTN) = 34 V, V(VDD) = 38 V, V(RTN) falling 0.12 0.4 I(PG) = 2 mA, V(RTN) = 0 V, V(VDD) = 25 V, for TPS2376 V(UVLO) = 0 V 0.12 0.4 0.1 1 Output low voltage Leakage current V(PG) = 57 V, V(RTN) = 0 V V V A UVLO V(UVLO_R) V(UVLO_F) TPS2375 Voltage at VDD V(VDD) rising 38.4 39.3 40.4 V(VDD) falling 29.6 30.5 31.5 8.3 8.8 9.1 V(VDD) rising 2.43 2.49 2.57 V(VDD) falling 1.87 1.93 1.98 Hysteresis 0.53 0.56 0.58 V(VDD) rising 34.1 35.1 36.0 V(VDD) falling 29.7 30.5 31.4 4.3 4.5 4.8 Hysteresis TPS2376 Voltage at UVLO TPS2377 Voltage at VDD Hysteresis TPS2376 Input leakage, UVLO V(UVLO) = 0 V to 5 V -1 1 V V V A THERMAL SHUTDOWN Shutdown temperature Temperature rising C 135 Hysteresis C 20 BIAS CURRENT Operating current 4 Submit Documentation Feedback I(VDD) 240 450 A Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 data sheet TPS2375 TPS2376 TPS2377 www.ti.com............................................................................................................................................................ SLVS525B - APRIL 2004 - REVISED APRIL 2008 DEVICE INFORMATION FUNCTIONAL BLOCK DIAGRAM 12 V VDD 8 DET 3 Detection Comparator + - 22 V CLASS 2 10 V Regulator Classification Comparator + PG 6 PG Comparator - 1.5 V & 10 V Delay 150 mS - + S R Q 0 = Fault 0 = Inrush S R 2.5 V UVLO '76 Only 7 ILIM 1 UVLO Comp. - RTN 5 Thermal Shutdown, Counter, and Latch + See Note 2.5 V + Q 1 = Limiting Current Mirror 45 mV 1 1:1 0 - + - EN Current Limit Amp. 800 W 0.08 W VSS 4 Note: For the TPS2376, the UVLO comparator connects to the UVLO pin and not to the UVLO divider. Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 Submit Documentation Feedback 5 data sheet TPS2375 TPS2376 TPS2377 SLVS525B - APRIL 2004 - REVISED APRIL 2008............................................................................................................................................................ www.ti.com TERMINAL FUNCTIONS PIN NAME PIN NUMBER I/O DESCRIPTION 1 O Connect a resistor from ILIM to VSS to set the start-up inrush current limit. The equation for calculating the resistor is shown in the detailed pin description section for ILIM. 2 2 O Connect a resistor from CLASS to VSS to set the classification of the powered device (PD). The IEEE classification levels and corresponding resistor values are shown in Table 1. DET 3 3 O Connect a 24.9-k detection resistor from DET to VDD for a valid PD detection. VSS 4 4 I Return line on the source side of the TPS2375 from the PSE. RTN 5 5 O Switched output side return line used as the low-side reference for the TPS2375 load. PG 6 6 O Open-drain, power-good output; active high. UVLO - 7 I Used only on the TPS2376. Connect a resistor divider from VDD to VSS to implement the adjustable UVLO feature of the TPS2376. NC 7 - VDD 8 8 TPS2375/77 TPS2376 ILIM 1 CLASS No connection I Positive line from the rectified PSE provided input. Detailed Pin Description The following descriptions refer to the schematic of Figure 1 and the functional block diagram. ILIM: A resistor from this pin to VSS sets the inrush current limit per Equation 1: I + 25000 (LIM) R (ILIM) (1) where ILIM is the desired inrush current value, in amperes, and R(ILIM) is the value of the programming resistor from ILIM to VSS, in ohms. The practical limits on R(ILIM) are 62.5 k to 500 k. A value of 178 k is recommended for compatibility with legacy PSEs. Inrush current limiting prevents current drawn by the bulk capacitor from causing the line voltage to sag below the lower UVLO threshold. Adjustable inrush current limiting allows the use of arbitrarily large capacitors and also accommodates legacy systems that require low inrush currents. The ILIM pin must not be left open or shorted to VSS. CLASS: Classification is implemented by means of an external resistor, R(CLASS), connected between CLASS and VSS. The controller draws current from the input line through R(CLASS) when the input voltage lies between 13 V and 21 V. The classification currents specified in the electrical characteristics table include the bias current flowing into VDD and any RTN leakage current. Table 1. CLASSIFICATION CLASS PD POWER (W) R(CLASS) () 802.3af LIMITS (mA) 0 0.44 - 12.95 4420 1% 0-4 1 0.44 - 3.84 953 1% 9 - 12 2 3.84 - 6.49 549 1% 17 - 20 3 6.49 - 12.95 357 1% 26 - 30 4 - 255 1% 36 - 44 NOTE Default class Reserved for future use The CLASS pin must not be shorted to ground. DET: Connect a resistor, R(DET), between DET and VDD. This resistor should equal 24.9 k, 1% for most applications. R(DET) is connected across the input line when V(VDD) lies between 1.4 V and 11.3 V, and is disconnected when the line voltage exceeds this range to conserve power. This voltage range has been chosen to allow detection with two silicon rectifiers between the controller and the RJ-45 connector. VSS: This is the input supply negative rail that serves as a local ground to the TPS2375. 6 Submit Documentation Feedback Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 data sheet TPS2375 TPS2376 TPS2377 www.ti.com............................................................................................................................................................ SLVS525B - APRIL 2004 - REVISED APRIL 2008 RTN: This pin provides the switched negative power rail used by the downstream circuits. The operational and inrush current limit control current into the pin. The PG circuit monitors the RTN voltage and also uses it as the return for the PG pin pulldown transistor. The internal MOSFET body diode clamps VSS to RTN when voltage is present between VDD and RTN and the PoE input is not present. PG: This pin goes to a high resistance state when the internal MOSFET that feeds the RTN pin is enabled, and the device is not in inrush current limiting. In all other states except detection, the PG output is pulled to RTN by the internal open-drain transistor. Performance is assured with at least 4 V between VDD and RTN. PG is an open-drain output; therefore, it may require a pullup resistor or other interface. UVLO: This pin is specific to the TPS2376; it is not internally connected on the TPS2375 and TPS2377. The UVLO pin is used with an external resistor divider between VDD and VSS to set the upper and lower UVLO thresholds. The hysteresis, as measured as a percentage of the upper UVLO, is the same as the TPS2375. The TPS2376 enables the output when V(UVLO) exceeds the upper UVLO threshold. When current begins to flow, VDD sags due to cable resistance and the dynamic resistance of the input diodes. The lower UVLO threshold must be below the lowest voltage that the input reaches. The TPS2376 implements adjustable UVLO thresholds, but is otherwise functionally equivalent to the TPS2375. The TPS2375 offers fixed UVLO thresholds designed to maximize hysteresis while maintaining compatibility with the IEEE 802.3af standard. The TPS2377 offers fixed UVLO thresholds optimized for use with legacy PoE systems. VDD: This is the positive input supply to the TPS2375, which is also common to downstream load circuits. This pin provides operating power and allows the controller to monitor the line voltage to determine the mode of operation. Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 Submit Documentation Feedback 7 data sheet TPS2375 TPS2376 TPS2377 SLVS525B - APRIL 2004 - REVISED APRIL 2008............................................................................................................................................................ www.ti.com TYPICAL CHARACTERISTICS Graphs over temperature are interpolations between the marked data points. I(VDD) + I(RTN) IN DETECTION 6 11.3 30 Resistance - k TA = 125C 4 TA = 25C 3 Classification Turnon Voltage - V 35 5 Current - A CLASSIFICATION TURNON VOLTAGE vs TEMPERATURE PD DETECTION RESISTANCE vs V(PI) 2 25 20 Specification Limits 15 1 11.2 11.1 TA = -40C 0 0 1 2 3 4 5 6 7 8 9 10 10 11 1 3 5 V(VDD) - V 9 11.0 11 -40 -20 0 20 40 60 80 100 120 TA - Free-Air Temperature - C V(PI) - V Figure 2. Figure 3. Figure 4. CLASSIFICATION TURNOFF VOLTAGE vs TEMPERATURE I(VDD) CURRENT vs VDD PASS DEVICE RESISTANCE vs TEMPERATURE 21.94 0.9 0.350 0.300 21.93 21.92 0.250 Pass Device Resistance - TA = 125C I (VDD) - mA Classification Turnoff Voltage - V 7 TA = 25C TA = -40C 0.200 21.91 0.150 21.90 -40 -20 0 20 40 60 80 100 0.100 22 120 TA - Free-Air Temperature - C 27 32 37 42 47 52 0.8 0.7 0.6 0.5 0.4 -40 -20 57 0 20 40 60 80 Figure 5. Figure 6. Figure 7. TPS2375 UVLO RISING vs TEMPERATURE TPS2375 UVLO FALLING vs TEMPERATURE TPS2376 UVLO RISING vs TEMPERATURE 39.5 100 120 TA - Free-Air Temperature - C VDD - V 30.60 2.489 30.56 2.488 V (UVLO) - V VDD - V VDD - V 39.4 30.52 30.48 39.3 39.2 -40 -20 0 20 40 60 80 100 120 TA - Free-Air Temperature - C Figure 8. 8 Submit Documentation Feedback 2.487 2.486 30.44 2.485 30.40 -40 -20 0 20 40 60 80 100 120 TA - Free-Air Temperature - C 2.484 -40 -20 Figure 9. 0 20 40 60 80 100 120 TA - Free-Air Temperature - C Figure 10. Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 data sheet TPS2375 TPS2376 TPS2377 www.ti.com............................................................................................................................................................ SLVS525B - APRIL 2004 - REVISED APRIL 2008 TYPICAL CHARACTERISTICS (continued) Graphs over temperature are interpolations between the marked data points. TPS2376 UVLO FALLING vs TEMPERATURE TPS2377 UVLO RISING vs TEMPERATURE 1.929 35.20 1.928 35.15 TPS2377 UVLO FALLING vs TEMPERATURE 30.65 1.926 35.10 VDD - V VDD - V V (UVLO) - V 30.60 1.927 30.55 35.05 1.925 30.50 35.00 1.924 1.923 -40 -20 34.95 0 20 40 60 80 100 120 0 20 40 60 80 30.45 -40 -20 100 120 0 20 40 60 80 100 120 TA - Free-Air Temperature - C TA - Free-Air Temperature - C TA - Free-Air Temperature - C Figure 11. Figure 12. Figure 13. INRUSH STATE TERMINATION THRESHOLD vs TEMPERATURE INRUSH CURRENT vs TEMPERATURE CURRENT LIMIT vs TEMPERATURE 440 350 94.0 75 k 325 93.5 300 93.0 275 92.5 92.0 435 I (RTN) - mA I (ILIM) - mA Percent of Inrush Limit Current -40 -20 250 225 125 k 200 175 91.5 178 k 150 91.0 430 125 90.5 -40 -20 0 20 40 60 80 100 -40 -20 100 120 0 20 40 60 80 100 120 425 TA - Free-Air Temperature - C TA - Free-Air Temperature - C -40 -20 0 20 40 60 80 100 120 TA - Free-Air Temperature - C Figure 14. Figure 15. Figure 16. PG DEGLITCH PERIOD vs TEMPERATURE PG Deglitch Period - s 180 160 140 120 -40 -20 0 20 40 60 80 100 120 TA - Free-Air Temperature - C Figure 17. Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 Submit Documentation Feedback 9 data sheet TPS2375 TPS2376 TPS2377 SLVS525B - APRIL 2004 - REVISED APRIL 2008............................................................................................................................................................ www.ti.com APPLICATION INFORMATION OVERVIEW The IEEE 802.3af specification defines a process for safely powering a PD over a cable, and then removing power if a PD is disconnected. The process proceeds through three operational states: detection, classification, and operation. The intent behind the process is to leave an unterminated cable unpowered while the PSE periodically checks for a plugged-in device; this is referred to as detection. The low power levels used during detection are unlikely to cause damage to devices not designed for PoE. If a valid PD signature is present, then the PSE may optionally inquire how much power the PD requires; this is referred to as classification. The PD may return a default full-power signature, or one of four other choices. Knowing the power demand of each PD allows the PSE to intelligently allocate power between PDs, and also to protect itself against overload. The PSE powers up a valid PD, and then monitors its output for overloads. The maintain power signature (MPS) is presented by the powered PD to assure the PSE that it is there. The PSE monitors its output for the MPS to see if the PD is removed, and turns the port off, if it loses the MPS. Loss of MPS returns the PSE to the initial state of detection. Figure 18 shows the operational states as a function of PD input voltage range. The PD input is typically an RJ-45 (8-pin) connector, referred to as the power interface (PI). PD input requirements differ from PSE output requirements to account for voltage drops in the cable and margin. The specification uses a cable resistance of 20 to derive the voltage limits at the PD from the PSE output requirements. Although the standard specifies an output power of 15.4 W at the PSE output, there is only 12.95 W available at the input of the PD due to the worst case power loss in the cable. The PSE can apply voltage either between the RX and TX pairs, or between the two spare pairs as shown in Figure 1. The applied voltage can be of either polarity. The PSE cannot apply voltage to both paths at the same time. The PD uses input diode bridges to accept power from any of the possible PSE configurations. The voltage drops associated with the input bridges cause a difference between the IEEE 802.3af limits at the PI and the TPS2375 specifications. The PSE is required to current limit between 350 mA and 400 mA during normal operation, and it must disconnect the PD if it draws this current for more than 75 ms. The PSE may set lower output current limits based on the PD advertised power requirements, as discussed below. 2.7 10.1 14.5 20.5 30 Maximum Input Voltage Must Turn On by- Voltage Rising Lower Limit - Proper Operation Must Turn Off by - Voltage Falling Shut down Classify Detect 0 Classification Upper Limit Classification Lower Limit Detection Upper Limit Detection Lower Limit The following discussion is intended as an aid in understanding the operation of the TPS2375, but not as a substitute for the actual IEEE 802.3af standard. Standards change and should always be referenced when making design decisions. Normal Operation 36 42 57 PI Voltage (V) Figure 18. IEEE 802.3 PD Limits INTERNAL THRESHOLDS In order to implement the PoE functionality as shown in Figure 18, the TPS2375 has a number of internal comparators with hysteresis for stable switching between the various states. Figure 19 relates the parameters in the Electrical Characteristics section to the PoE states. The mode labeled idle between classification and detection implies that the DET, CLASS, PG, and RTN pins are all high impedance. 10 Submit Documentation Feedback Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 data sheet TPS2375 TPS2376 TPS2377 Operational Mode www.ti.com............................................................................................................................................................ SLVS525B - APRIL 2004 - REVISED APRIL 2008 PD Powered Idle Classification Detection V(VDD) V(CU_H) 1.4V V(CL_ON) V(UVLO_F) V(UVLO_R) V(CU_OFF) Figure 19. Threshold Voltages DETECTION This feature of IEEE 802.3af eliminates powering and potentially damaging Ethernet devices not intended for application of 48 V. When a voltage in the range of 2.7 V to 10.1 V is applied to the PI, an incremental resistance of 25 k signals the PSE that the PD is capable of accepting power. A PD that is capable of accepting power, but is not ready, may present an incorrect signature intentionally. The incremental resistance is measured by applying two different voltages to the PI and measuring the current it draws. These two test voltages must be within the specified range and be at least 1 V apart. The incremental resistance equals the difference between the voltages divided by the difference between the currents. The allowed range of resistance is 23.75 k to 26.25 k. The TPS2375 is in detection mode whenever the supply voltage is below the lower classification threshold. The TPS2375 draws a minimum of bias power in this condition, while PG and RTN are high impedance and the circuits associated with ILIM and CLASS are disabled. The DET pin is pulled to ground during detection. Current flowing through R(DET) to VSS (Figure 1) produces the detection signature. For most applications, a 24.9-k, 1%, resistor is recommended. R(DET) can be a small, low-power resistor because it only sees a stress of about 5 mW. When the input voltage rises above the 11.3 V lower classification comparator threshold, the DET pin goes to an open-drain condition to conserve power. The input diode bridge incremental resistance can be hundreds of ohms at the low currents seen at 2.7 V on the PI. The bridge resistance is in series with R(DET) and increases the total resistance seen by the PSE. This varys with the type of diode selected by the designer, and it is not usually specified on the diode data sheet. The value of R(DET) may be adjusted downwards to accommodate a particular diode type. CLASSIFICATION Once the PSE has detected a PD, it may optionally classify the PD. This process allows a PSE to determine the PD power requirements in order to allot only as much power as necessary from its fixed input power source. This allows the PSE to power the maximum number of PDs from a particular power budget. This step is optional because some PSEs can afford to allot the full power to every powered port. The classification process applies a voltage between 14.5 V and 20.5 V to the input of the PD, which in turn draws a fixed current set by R(CLASS). The PSE measures the PD current to determine which of the five available classes (Table 1) that the PD is signalling. The total current drawn from the PSE during classification is the sum of bias currents and current through R(CLASS). The TPS2375 disconnects R(CLASS) at voltages above the classification range to avoid excessive power dissipation (Figure 18 and Figure 19). The value of R(CLASS) should be chosen from the values listed in Table 1 based on the average power requirements of the PD. The power rating of this resistor should be chosen so that it is not overstressed for the required 75-ms classification period, during which 10 V is applied. The PD could be in classification for extended periods during bench test conditions, or if an auxiliary power source with voltage within the classification range is connected to the PD front end. Thermal protection may activate and turn classification off if it continues for more than 75 ms, but the design must not rely on this function to protect the resistor. Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 Submit Documentation Feedback 11 data sheet TPS2375 TPS2376 TPS2377 SLVS525B - APRIL 2004 - REVISED APRIL 2008............................................................................................................................................................ www.ti.com UNDERVOLTAGE LOCKOUT (UVLO) The TPS2375 incorporates an undervoltage lockout (UVLO) circuit that monitors line voltage to determine when to apply power to the downstream load and allow the PD to power up. The IEEE 802.3af specification dictates a maximum PD turnon voltage of 42 V and a minimum turnoff voltage of 30 V (Figure 19). The IEEE 802.3af standard assumes an 8-V drop in the cabling based on a 20- feed resistance and a 400-mA maximum inrush limit. Because the minimum PSE output voltage is 44 V, the PD must continue to operate properly with input voltages as low as 36 V. The TPS2375 UVLO limits are designed to meet the turnon, turnoff, and hysteresis requirements. Various legacy PSE systems in the field do not meet the minimum output voltage of 44 V. The TPS2377 UVLO limits are designed to support these systems with a lower turnon voltage and smaller hysteresis. Although the TPS2377 works with compliant PSEs, it could potentially exhibit startup instabilities if the PSE output voltage rises slowly. The TPS2375 is recommended for applications with compliant PSEs. In order to provide flexibility for noncompliant designs, the TPS2376 allows the designer to program the turnon thresholds with a resistor divider. The hysteresis of the TPS2376, measured as a percentage of the turnon voltage, is similar to that of the TPS2375. To use the TPS2376, connect a resistor divider between VDD and VSS with the tap connected to the UVLO pin. The total divider resistance appears in parallel with the R(DET), and the combination of the two should equal 24.9 k. The divider ratio should be chosen to obtain 2.5 V at the UVLO pin when V(VDD) is at the desired turnon voltage. The TPS2375 uses the UVLO function to control the load through an onboard MOSFET switch. Figure 19 graphically shows the relationships of the UVLO thresholds defined in the Electrical Characteristics section to the TPS2375 operational states. PROGRAMMABLE INRUSH CURRENT LIMIT AND FIXED OPERATIONAL CURRENT LIMIT Inrush limiting is beneficial for a number of reasons. First, it provides a mechanism to keep the inrush current below the 400 mA, 50 ms, maximum inrush allowed by the standard. Second, by reducing the level of the current limit below the PSE operational limit, which can be as low as the classification power divided by the PSE voltage, it allows an arbitrarily large bulk capacitor to be charged. Third, some legacy PSEs may not tolerate large inrush currents while powering their outputs up. The TPS2375 operational current limit protects the internal power switch from instantaneous output faults and current surges. The minimum operational current limit level of 405 mA is above the maximum PSE output current limit of 400 mA. This current limit allows the PD to draw the maximum available power and also allows the PSE to detect fault conditions. The TPS2375 incorporates a state machine that controls the inrush and operational current limit states. When V(VDD) is below the lower UVLO threshold, the current limit state machine is reset. In this condition, the RTN pin is high impedance, and at V(VDD) once the output capacitor is discharged by the downstream circuits. When V(VDD) rises above the UVLO turnon threshold, the TPS2375 enables the internal power MOSFET with the current limit set to the programmed inrush value. The load capacitor charges and the RTN pin voltage falls from V(VDD) to nearly V(VSS). Once the inrush current falls about 10% below the programmed limit, the current limit switches to the internal 450-mA operational level after a 150-s delay. This switchover can be seen in the operation of PG, which goes active (open drain) after inrush terminates as seen in Figure 1. The internal power MOSFET is disabled if the input voltage drops below the lower UVLO threshold. When in the operating current-limit state, a fault on the output or a large input transient can cause the internal MOSFET to limit current. The RTN voltage rises above its normal operating level of less than 0.5 V while in current-limit state. If V(RTN) rises above 10 V for more than 150 s, the MOSFET is latched off. The PD input voltage must drop below the lower UVLO threshold to clear this latch. If the RTN voltage does not exceed 10 V while in current-limit state, but the condition persists long enough to overheat the TPS2375, the thermal limit circuit activates, as described in the thermal protection section. Practical values of R(ILIM) lie between 62.5 k and 500 k. The pin must not be left open. An inrush level of 140 mA, set by an R(ILIM) of 178 k, should be used with TPS2377 applications for compatibility with legacy systems. This same inrush current level suffices for many TPS2375 applications. The inrush limit, the bulk capacitor size, and the downstream dc/dc converter startup method must be chosen so that the converter input current does not exceed the inrush current limit while it is active. This can be achieved by using the PG output to enable the downstream converter after inrush finishes, by delaying the converter startup until inrush finishes, or by increasing the value of the inrush current limit. 12 Submit Documentation Feedback Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 data sheet TPS2375 TPS2376 TPS2377 www.ti.com............................................................................................................................................................ SLVS525B - APRIL 2004 - REVISED APRIL 2008 MAINTAIN POWER SIGNATURE Once a valid PD has been detected and powered, the PSE uses the maintain power signature (MPS) to determine when to remove power from the PI. The PSE removes power from that output port if it detects loss of MPS for 300 ms or more. A valid MPS requires the PD to draw at least 10 mA and also have an ac impedance less than 26.25 k in parallel with 0.05 F. TI's reference designs meet the requirements necessary to maintain power. POWER GOOD The TPS2375 includes a power-good circuit that can be used to signal the PD circuitry that the load capacitor is fully charged. This pin is intended for use as an enable signal for downstream circuitry. If the converter tries to start up while inrush is active, and draws a current equal to the inrush limit, a latchup condition occurs in which the PD never successfully starts. Using the PG pin is the safest way to assure that there are no undesired interactions between the inrush limit, the converter startup characteristic, and the size of the bulk capacitor. The PG pin goes to an open-drain state approximately 150 s after the inrush current falls 10% below the regulated value. PG pulldown current is only assured when the voltage difference between VDD and RTN exceeds 4 V. This is not a limiting factor because the dc/dc converter should not be able to run from 4 V. The PG output is pulled to RTN whenever the MOSFET is disabled or is in inrush current limiting. Referencing PG to RTN simplifies the interface to the downstream dc/dc converter or other circuit because it is referenced to RTN, not VSS. Care must be used in interfacing the PG pin to the downstream circuits. The pullup to VDD shown in Figure 1 may not be appropriate for a particular dc/dc converter interface. The PG pin connects to an internal open-drain, 100-V transistor capable of sinking 2 mA to a voltage below 0.4 V. The PG pin can be left open if it is not used. THERMAL PROTECTION The controller may overheat after operation in current-limit state or classification for an extended period of time, or if the ambient temperature becomes excessive. The TPS2375 protects itself by disabling the RTN and CLASS pins when the internal die temperature reaches about 140C. It automatically restarts when the die temperature has fallen approximately 20C. If this cycle occurs eight times, then the device latches off until the supply voltage drops below the lower classification threshold. This feature prevents the part from operating indefinitely in fault, and ensures that the PSE recognizes the fault condition when using dc MPS. Thermal protection is active whenever the TPS2375 is not in detection. Figure 20 shows how the TPS2375 responds when it is enabled into a short. The TPS2375 starts in the inrush current-limit state when the input voltage exceeds the upper UVLO limit. A power dissipation of over 5 W heats the die from 25C to 140C in approximately 400 ms. The TPS2375 then shuts down until the die temperature drops to about 120C, which occurs in about 20 ms. This process repeats eight times before the TPS2375 latches off. The PG pin is high because RTN is tied to VDD. V(PI) = 44 V, R(ILIM) = 178 kW Ch1: VDD @ 50 V/div CH2: RTN @ 50 V/div CH3: V(PG) @ 50 V/div Iin @ 100 mA/div Figure 20. TPS2375 Started Into Short Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 Submit Documentation Feedback 13 data sheet TPS2375 TPS2376 TPS2377 SLVS525B - APRIL 2004 - REVISED APRIL 2008............................................................................................................................................................ www.ti.com POWER SYSTEM DESIGN The PSE is a power and current limited source, which imposes certain constraints on the PD power supply design. DC/DC converters have both a constant input power characteristic that causes them to draw high currents at low voltage, and they tend to go to a full input power mode during start-up that is often 25% or more above their rated power. Improper design of the power system can cause the PD to not start up with all combinations of Ethernet lines and PSE sources. The following guidelines should be used: 1. Set the TPS2375 inrush to a moderate value as previously discussed. 2. Hold the dc/dc converter off during inrush as previously discussed. 3. The converter should have a softstart that keeps the peak input start-up current below 400 mA, and preferably only a modest amount over the operating current, with a 44-V PSE source and a 20- loop. 4. If step 3 cannot be met, the bulk input capacitor should not discharge more than 8 V during converter start up from a 400-mA limited, 44-V source with a 20- line. Start-up must be completed in less than 50 mS Step 4 requires a balance between the converter output capacitance, load, and input bulk capacitance. While there are some cases which may not require all these measures, such as a 1-W PD with minimal converter output capacitance, it is always a good practice to follow them. AUXILIARY POWER SOURCE ORING Many PoE capable devices are designed to operate from either a wall adapter or PoE power. A local power solution adds cost and complexity, but allows a product to be used regardless of PoE availability. Attempting to create solutions where the two power sources coexist in a specific controlled manner results in additional complexity, and is not generally recommended. Figure 21 demonstrates three methods of diode ORing external power into a PD. Option 1 inserts power on the output side of the PoE power conversion. Option 2 inserts power on the TPS2375 output. Option 3 applies power to the TPS2375 input. Each of these options has advantages and disadvantages. The wall adapter must meet a minimum 1500-Vac dielectric withstand test voltage to the ac input power and to ground for options 2 and 3. Inserting a Diode in This Location With Option 2, Allows PoE To Start With Aux Power Present. ~ + VDD R (DET) 0.1 F DET Option 3 Auxiliary Power Input Option 2 Use only one option Option 1 DC/DC Converter Main DC/DC Converter Output UCC3809 or UCC3813 CLASS VSS ~ - SMAJ58A ~ + ILIM R(ILIM) 22 F TPS237X RJ-45 ~ - RTN R (CLASS) For Option 2, The Capacitor Must Be Right At The Output To Control The Transients. Optional Regulator A Full Wave Bridge Gives Flexibility To Use Supply With Either Polarity See TI Document SLVR030 For A Typical Application Circuit. Figure 21. Auxiliary Power ORing 14 Submit Documentation Feedback Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 data sheet TPS2375 TPS2376 TPS2377 www.ti.com............................................................................................................................................................ SLVS525B - APRIL 2004 - REVISED APRIL 2008 Option 1 consists of ORing power to the output of the PoE dc/dc converter. This option is preferred in cases where PoE is added to an existing design that uses a low-voltage wall adapter. The relatively large PD capacitance reduces the potential for harmful transients when the adapter is plugged in. The wall adapter output may be grounded if the PD incorporates an isolated converter. This solution requires two separate regulators, but low-voltage adapters are readily available. The PoE power can be given priority by setting its output voltage above that from the auxiliary source. Option 2 has the benefits that the adapter voltage may be lower than the TPS2375 UVLO, and that the bulk capacitor shown can control voltage transients caused by plugging an adapter in. The capacitor size and location are chosen to control the amount of ringing that can occur on this node, which can be affected by additional filtering components specific to a dc/dc converter design. The optional diode blocks the adapter voltage from reverse biasing the input, and allows a PoE source to apply power provided that the PSE output voltage is greater than the adapter voltage. The penalty of the diode is an additional power loss when running from PSE power. The PSE may not be able to detect and start powering without the diode. This means that the adapter may continue to power the PD until removed. Auxiliary voltage sources can be selected to be above or below the PoE operational voltage range. If automatic PoE precedence is desired when using the low-voltage auxiliary source option, make sure that the TPS2375 inrush program limit is set higher than the maximum converter input current at its lowest operating voltage. It is difficult to use PG with the low-voltage auxiliary source because the converter must operate during a condition when the TPS2375 would normally disable it. Circuits may be designed to force operation from one source or the other depending on the desired operation and the auxiliary source voltage chosen. However, they are not recommended because they increase complexity and thus cost. Option 3 inserts the power before the TPS2375. It is necessary for the adapter to meet the TPS2375 UVLO turnon requirement and to limit the maximum voltage to 57 V. This option provides a valid power-good signal and simplifies power priority issues. The disadvantage of this method is that it is the most likely to cause transient voltage problems. Plugging a powered adapter in applies a step input voltage to a node that has little capacitance to control the dv/dt and voltage ringing. If the wall mount supply applies power to the PD before the PSE, it prevents the PSE from detecting the PD. If the PSE is already powering the PD when the auxiliary source is plugged in, priority is given to the higher supply voltage. ESD The TPS2375 has been tested using the surge of EN61000-4-2 in an evaluation module (EVM) using the circuit in Figure 1. The levels used were 8-kV contact discharge and 15-kV air discharge. Surges were applied between the RJ-45 and the dc EVM outputs, and between an auxiliary power input jack and the dc outputs. No failures were observed. ESD requirements for a unit that incorporates the TPS2375 have much broader scope and operational implications than those used in TI's testing. Unit level requirements should not be confused with EVM testing that only validated the TPS2375. EXTERNAL COMPONENTS Transformer Nodes on an Ethernet network commonly interface to the outside world via an isolation transformer per IEEE 802.3 requirements, see Figure 1. For powered devices, the isolation transformer must include a center tap on the media (cable) side. Proper termination is required around the transformer to provide correct impedance matching and to avoid radiated and conducted emissions. Transformers must be specifically rated to work with the Ethernet chipset, and the IEEE 802.3af standard. Input Diodes or Diode Bridges The IEEE 802.3af requires the PD to accept power on either set of input pairs in either polarity. This requirement is satisfied by using two full-wave input bridge rectifiers as shown in Figure 1. Silicon p-n diodes with a 1-A or 1.5-A rating and a minimum breakdown of 100 V are recommended. Diodes exhibit large dynamic resistance under low-current operating conditions such as in detection. The diodes should be tested for their behavior under this condition. The diode forward drops must be less than 1.5 V at 500 A and at the lowest operating temperature. Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 Submit Documentation Feedback 15 TPS2375 TPS2376 TPS2377 data sheet SLVS525B - APRIL 2004 - REVISED APRIL 2008............................................................................................................................................................ www.ti.com Input Capacitor The IEEE 802.3af requires a PD input capacitance between 0.05 F and 0.12 F during detection. This capacitor should be located directly adjacent to the TPS2375 as shown in Figure 1. A 100-V, 10%, X7R ceramic capacitor meets the specification over a wide temperature range. Load Capacitor The IEEE 802.3af specification requires that the PD maintain a minimum load capacitance of 5 F. It is permissible to have a much larger load capacitor, and the TPS2375 can charge in excess of 470 F before thermal issues become a problem. However, if the load capacitor is too large, the PD design may violate IEEE 802.3af requirements. If the load capacitor is too large, there can be a problem with inadvertent power shutdown by the PSE caused by failure to meet the MPS. This is caused by having a long input current dropout due to a drop in input voltage with a large capacitance-to-load ratio. The standard gives Equation 2: I 180 (PD) C v 10 mA (2) where C is the bulk capacitance in F and I(PD) is the PD load current in mA. A particular design may have a tendency to cause ringing at the RTN pin during startup, inadvertent hot-plugs of the PoE input, or plugging in a wall adapter. It is recommended that a minimum value of 1 F be used at the output of the TPS2375 if downstream filtering prevents placing the larger bulk capacitor right on the output. When using ORing option 2, it is recommended that a large capacitor such as a 22 F be placed across the TPS2375 output. Transient Suppressor Voltage transients on the TPS2375 can be caused by connecting or disconnecting the PD, or by other environmental conditions like ESD. The TPS2375 is specified to operate with absolute maximum voltages V(VDD-VSS) and V(RTN-VSS) of 100 V. A transient voltage suppressor, such as the SMAJ58A, should be installed after the bridge and across the TPS2375 input as shown in Figure 1. Various configurations of output filters and the insertion of local power sources across either the TPS2375 input or output have the potential to cause stresses outside the absolute maximum ratings of the device. Designers should be aware of this possibility and account for it in their circuit designs. For example, use adequate capacitance across the output to limit the magnitude of voltage ringing caused by downstream filters. Plugging an external power source across the output may cause ESD-like events. Some form of protection should be considered based on a study of the specific waveforms seen in an application circuit. Layout The layout of the PoE front end must use good practices for power and EMI/ESD. A basic set of recommendations include: 1. The parts placement must be driven by the power flow in a point-to-point manner such as RJ-45 Ethernet transformer diode bridges TVS and 0.1-F capacitor TPS2375 output capacitor. 2. There should not be any crossovers of signals from one part of the flow to another. 3. All leads should be as short as possible with wide power traces and paired signal and return. 4. Spacing consistent with safety standards like IEC60950 must be observed between the 48-V input voltage rails and between the input and an isolated converter output. 5. The TPS2375 should be over a local ground plane or fill area referenced to VSS to aid high-speed operation. 6. Large SMT component pads should be used on power dissipating devices such as the diodes and the TPS2375. Use of added copper on local power and ground to help the PCB spread and dissipate the heat is recommended. Pin 4 of the TPS2375 has the lowest thermal resistance to the die. 16 Submit Documentation Feedback Copyright (c) 2004-2008, Texas Instruments Incorporated Product Folder Link(s): TPS2375 TPS2376 TPS2377 PACKAGE OPTION ADDENDUM www.ti.com 18-Jun-2008 PACKAGING INFORMATION (1) Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS2375D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2375DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2375DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2375DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2375PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2375PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2375PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2375PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2376D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2376DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2376DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2376DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2376PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2376PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2376PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2376PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2377D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2377DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2377DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2377DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2377PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2377PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2377PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2377PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM The marketing status values are defined as follows: Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 18-Jun-2008 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS2375DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TPS2375PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TPS2376DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TPS2376PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TPS2377DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TPS2377PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS2375DR SOIC D 8 2500 340.5 338.1 20.6 TPS2375PWR TSSOP PW 8 2000 367.0 367.0 35.0 TPS2376DR SOIC D 8 2500 367.0 367.0 35.0 TPS2376PWR TSSOP PW 8 2000 367.0 367.0 35.0 TPS2377DR SOIC D 8 2500 367.0 367.0 35.0 TPS2377PWR TSSOP PW 8 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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