FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
Rev. 4.1 — 29 May 2019 Product data sheet
1 General description
The FXPS7550A4 high-performance, high-precision absolute pressure sensor consists of
a compact capacitive micro-electro-mechanical systems (MEMS) device coupled with a
digital integrated circuit (IC) producing a fully calibrated analog output.
This sensor is ideal for many automotive applications such as manifold air pressure
(MAP), turbo MAP, comfort seating and other applications requiring operating absolute
pressure ranges up to 550 kPa.
The sensing element is based on NXP's high precision capacitive pressure cell
technology. The architecture benefits from redundant pressure transducers as an
expanded quality measure. It delivers highly accurate ratiometric analog readings of
absolute pressure while operating from either a 3.3 V or 5.0 V power supply.
The sensor operates over a pressure range of 20 kPa to 550 kPa and over a wide
temperature range of –40 ºC to 130 ºC
The sensor comes in an industry-leading 4 mm x 4 mm x 1.98 mm, restriction of
hazardous substances (RoHS) compliant, high-power quad flat no-lead (HQFN)
package[1] suitable for small printed circuit board (PCB) integration. Its AEC-Q100[2]
compliance, high accuracy, reliable performance and high media resistivity make it ideal
for use in automotive, industrial, and consumer applications.
2 Features and benefits
Absolute pressure range: 20 to 550 kPa
Operating temperature range: –40 °C to 130 °C
Analog output for monitoring of the absolute pressure signal
Pressure transducer and digital signal processor (DSP)
Internal self test
Capacitance to voltage converter with anti-aliasing filter
Sigma delta ADC plus sinc filter
800 Hz or 1000 Hz low-pass filter for absolute pressure
Lead-free, 16-pin HQFN, 4 mm x 4 mm x 1.98 mm package
3 Applications
3.1 Automotive
Manifold air pressure
MAP, TurboMAP
Small engine control
Liquid propane gas (LPG) or compressed natural gas (CNG) engine management
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
2 / 22
3.2 Industrial
Compressed air
Manufacturing line control
Gas metering
Weather stations
3.3 Medical/Consumer
Blood pressure monitor
Medicine dispensing systems
White goods
4 Ordering information
Table 1. Ordering information
PackageType number
Name Description Version
FXPS7550A4 HQFN16 HQFN16, plastic, thermal enhanced quad flat pack; no leads; 16 terminals; 0.8 mm
pitch; 4 mm x 4 mm x 1.98 mm body
SOT1573-1
4.1 Ordering options
Table 2. Ordering options
Device Range (kPa) Packing Temperature range
FXPS7550A4T1 20 to 550 kPa Packing Tape and Reel –40 °C to 130 °C
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
3 / 22
5 Block diagram
aaa-029725
P-CELL 0
C2V GAIN
VREF
VREF
P-CELL 1
AAF PABS Σ
CONVERTER
SINC
FILTER
COMMON
MODE
ERROR
DETECTION
TRIM
VREG
DSP
IIR
LPF
PABS
USER
OFFSET
ADJUST
CONTROL
LOGIC
PCM
ENCODER
ANALOG
FILTER
AND
BUFFER
TEST
I/O
OTP
ARRAY
OSCILLATOR
LOW VOLTAGE
DETECTION
INTERNAL VOLTAGE
REGULATOR
LOW VOLTAGE
DETECTION
REFERENCE
VOLTAGE
VCC
VSS
VREF
VREGA
VREG
TEST
TEST
TEST
TEST
TEST
ANALOG_OUT
Figure 1. Block diagram of FXPS7550A4
6 Pinning information
6.1 Pinning
1
2
3
4
VCC
TEST
TEST
VSS
12
11
10
9
17 ANALOG_OUT
TEST
TEST
TEST
1
6
1
5
1
4
1
3
V
C
C
V
S
S
N
C
V
C
C
5
6
7
8
TEST
NC
NC
TEST
aaa-029728
Transparent top view
terminal 1
index area
Figure 2. Pin configuration for 16-pin HQFN
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
4 / 22
6.2 Pin description
Table 3. Pin description
Pin Pin name Description
2, 5, 8, 9, 10, 11 TEST Pins 2, 5, 8, 9, 10 and 11 are test pins and must be left unterminated in the
application.
3 TEST Pin 3 is required to be tied to VCC for device operation.
4, 15 VSS Pins 4 and 15 are the supply return nodes and are connected internally to the die
attach pad (pin 17).
6, 7, 14 NC Pins 6, 7 and 14 are not internally connected and can be left unconnected in the
application.
12 ANALOG_OUT Pin 12 provides a ratiometric analog output proportional to the absolute pressure
sensor data.
1, 13, 16 VCC Pins 1, 13 and 16 supply power to the device. An external capacitor must be
connected between these pins and VSS, as shown in the application diagram.
17 PAD Pin 17 is the die attach flag and must be connected to VSS.
7 Functional description
7.1 Voltage regulators
The device derives its internal supply voltage from the VCC and VSS pins. An external
filter capacitor is required for VCC, as shown in Figure 12.
A reference generator provides a reference voltage for the ΣΔ converter.
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
5 / 22
aaa-029736
COMPARATOR
VCC
VOLTAGE
REGULATOR
REFERENCE
GENERATOR
DIGITAL
LOGIC
DSP
OTP
ARRAY
Σ
CONVERTER
VREF
VREF VREGA
VREGA
VCC
VCC
VREG
C2V
TRIMTRIM
BIAS
GENERATOR
TRIM
VOLTAGE
REGULATOR
BANDGAP
REFERENCE
VREG_MOD
VREG
VREGA
VREF
OSCILLATOR
COMPARATOR
POR
VCC_UV_ERR
COMPARATOR
Figure 3. Voltage regulation and monitoring
7.2 Pressure sensor signal path
7.2.1 ΣΔ converter
A second order sigma delta modulator converts the voltage from the analog front end to a
data stream that is input to the DSP. A simplified block diagram is shown in Figure 4.
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
6 / 22
aaa-023446
z-1
1 - z-1
1 - bit
quantizer
second
integrator
ADC
V = +VREF, 0 V, -VREF
Y(Z) = {0,1}
β2= 1
α2= 1
DAC
z-1
1 - z-1
first
integrator
V = C x Vx/CINT1
VX
CTOP
transducer
C = CTOP - CBOT
CBOT
CINT1
β1= 1
α1=
Figure 4. ΣΔ converter block diagram
The sigma delta modulator operates at a frequency of 1 MHz, with the transfer function in
Equation 1.
(1)
7.2.2 Digital signal processor (DSP)
A DSP is used to perform signal filtering and compensation. A diagram illustrating the
signal processing flow within the DSP is shown in Figure 5.
aaa-029737
ΣOUT = Y(Z)
SINC
FILTER TRIM
IIR
LPF PABS
USER OFFSET
AND
GAIN ADJUST
Figure 5. Signal chain diagram
7.2.2.1 Decimation sinc filter
In Equation 2, the output of the ΣΔ modulator is decimated and converted to a parallel
value by two third-order sinc filters; the first with a decimation ratio of 24 and the second
with a decimation ratio of 4.
(2)
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
7 / 22
aaa-023449
frequency (Hz)
103105
104
20
magnitude
(dB)
-120
-100
-80
-60
-40
-20
0
minimum
typical
maximum
Figure 6. Sinc filter response
7.2.2.2 Signal trim and compensation
The device includes digital trim to compensate for sensor offset, sensitivity, and
nonlinearity over temperature.
7.2.2.3 Low-pass filter
Data from the sinc filter is processed by an infinite impulse response (IIR) low-pass filter
with the transfer function and coefficients shown in Equation 3.
(3)
Table 4. IIR low pass filter coefficients
Filter
number
Typical –3 dB
frequency
Filter
order
Filter coefficients (24 bit) Group
delay (μs)
Typical
attenuation @
1000 Hz (dB)
a00.088642612609670
n11 0.029638050039039 d11 1
n12 0.087543281056143 d12 –1.422792640957290
n13 0.029695285913601 d13 0.511435253566960
n21 0.250241278804809 d21 1
n22 0.499999767379068 d22 –1.503329908017845
1 800 Hz 4
n23 0.249758953816089 d23 0.621996524706640
418 4.95
a00.129604264748411
n11 0.043719804402508 d11 1
n12 0.087543281056143 d12 –1.300502656562698
n13 0.043823599710731 d13 0.430106921311110
n21 0.250296586927511 d21 1
n22 0.499999648540934 d22 –1.379959571988366
2 1000 Hz 4
n23 0.249703764531484 d23 0.555046257157745
333 2.99
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
8 / 22
aaa-029738
frequency (Hz)
1 104
103
10 102
-60
-40
-80
-20
0
magnitude
(dB)
-100
minimum
typical
maximum
Figure 7.  800 Hz, 4-pole, low-pass filter response
aaa-029891
frequency (Hz)
1 104
103
10 102
400
600
200
800
1000
delay
(µs)
0
minimum
typical
maximum
Figure 8. 800 Hz, 4-pole output signal delay
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
9 / 22
aaa-029739
frequency (Hz)
1 104
103
10 102
-60
-40
-80
-20
0
magnitude
(dB)
-100
minimum
typical
maximum
Figure 9.  1000 Hz, 4-pole, low-pass filter response
aaa-029892
frequency (Hz)
1 104
103
10 102
400
600
200
800
1000
delay
(µs)
0
minimum
typical
maximum
Figure 10. 1000 Hz, 4-pole output signal delay
7.3 Analog output function
7.3.1 Analog output signal chain
The device provides an analog output ratiometric to the supply voltage. The analog
output is enabled by default. Selecting the analog output enables the following functions:
The non-interpolated PABS sensor data output is saturated to 10 bits and converted to
an unsigned value.
The 10-bit sensor value is input into a summer clocked at 10 MHz.
The carry from the summer circuit generates a PCM output.
The PCM signal is filtered by a 2-pole active low pass filter to generate an analog
signal.
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
10 / 22
7.3.2 Analog output transfer function
The analog output transfer function for a 5.0 V supply is as shown in Figure 11.
aaa-029745
absolute pressure (kPa)
0 400 450 500 550350300 600200 25050 100 150
2
3
1
4
5
analog
output
(V)
0
Figure 11. Analog output transfer function
8 Maximum ratings
Absolute maximum ratings are the limits the device can be exposed to without
permanently damaging it. Absolute maximum ratings are stress ratings only; functional
operation at these ratings is not guaranteed. Exposure to absolute maximum ratings
conditions for extended periods might affect device reliability.
This device contains circuitry to protect against damage due to high static voltage or
electrical fields. NXP advises that normal precautions be taken to avoid application of any
voltages higher than maximum-rated voltages to this high-impedance circuit.
Table 5. Maximum ratings
Symbol Parameter Conditions Min Max Unit
VCCMAX Supply Voltage VCC, VCCIO
[1] +6.0 V
VIOMAX Input/Output Max on pins ANALOG_OUT
TESTx
[1] –0.3 VCC + 0.3 V
hDROP Drop shock To concrete, tile or steel surface, 10 drops,
any orientation
[2] 1.2 m
Tstg Storage [2] –40 +130 °C
TJ
Temperature range
Junction [3] –40 +150°C °C
PMAX Continuous [3] 600 kPa
PBURST
Maximum absolute pressure
Burst (tested at 100 ms) [2] 1650 kPa
PMIN Minimum absolute pressure Continuous [1] 20 kPa
fSEAL Pressure sealing force Applied to top face of package [1] 10 N
θJA Thermal resistance [4] 120 °C/W
ESD and latch-up protection characteristics
VESD Human body model (HBM) [2] –2000 2000 V
VESD
Electrostatic discharge (per
AEC-Q100, Rev H) Charge device model (CDM) [2] [5] –500 500 V
[1] Parameter verified by parametric and functional validation.
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
11 / 22
[2] Parameter verified by qualification testing (Per AEC-Q100 Rev H or per NXP specification).
[3] Functionality verified by modeling, simulation and/or design verification.
[4] Thermal resistance provided with device mounted to a two-layer, 1.6 mm FR-4 PCB as documented in AN1902 with one signal layer and one ground
layer.
[5] CDM tested at ±750 V for corner pins and ±500 V for all other pins.
Caution
This device is sensitive to mechanical shock. Improper handling can cause permanent damage to the part.
Caution
msc896
This is an ESD sensitive device. Improper handling can cause permanent damage to the part.
9 Operating range
Table 6. Electrical characteristics—supply and I/O
VCC_min ≤ (VCC - VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified.
Symbol Parameter Conditions Min Max Units
VCC Supply voltage Measured at VCC
[1] 3.10 5.25 V
TAVCC = 5.0 V, unless otherwise stated.
Production tested operating temperature
range
[1]
TL
–40
TH
+130
°C
TA
Operating temperature range
Guaranteed operating temperature range [1] –40 +130 °C
VCC_RAMP Supply power on ramp rate [2] [3] 0.00001 10 V/μs
[1] Parameter tested 100 % at final test.
[2] Functionality verified by modeling, simulation and/or design verification..
[3] Parameter verified by parametric and functional validation.
10 Static characteristics
Table 7. Static characteristics
VCC_min ≤ (VCC - VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified.
Symbol Parameter Condition Min Typ Max Units
Supply and I/O
IqQuiescent supply current VCC = 5.0 V [1] 8.0 mA
Temperature sensor signal chain
VOH_ANA Output high voltage ANALOG_OUT,
ILoad = –100 µA
[1] Vcc – 0.2 V
VOL_ANA Output low voltage ANALOG_OUT,
ILoad = 100 µA
[1] 0.2 V
VOUT_3dB Analog output low-pass filter frequency
typical value
–3 dB, 2-pole [2] 8 20 kHz
VOUT_3dBTol Analog output low-pass filter frequency
typical tolerance
–3 dB, 2-pole [2] –5 5 %
Absolute pressure sensor signal chain
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
12 / 22
Symbol Parameter Condition Min Typ Max Units
PABS Absolute pressure range [1] [3] 20 550 kPa
PSENS Absolute pressure output sensitivity VCC = 5.0 V.
Tested at PA = 300 kPa
and 400 kPa
[2] 8.68 mV/k
Pa
PACC_HiT Absolute pressure accuracy VCC = 5.0 V.
85 °C < TA ≤ 130 °C
[4] –3 +3 %FSS
PACC_Typ Absolute pressure accuracy VCC = 5.0 V.
0° C ≤ TA ≤ 85 °C
[4] –2 +2 %FSS
PACC_LoT Absolute pressure accuracy VCC = 5.0 V.
–40 °C ≤ TA< 0 °C
[4] –3 +3 %FSS
POFF Absolute pressure analog offset At pressure span extremes
VCC = 5.0 V.
[4] 0.2 V
VFSS Output voltage span At pressure span extremes
VCC = 5.0 V.
[5] 4.6 V
[1] Parameter verified by pass/fail testing at final test.
[2] Functionality verified by modeling, simulation and/or design verification.
[3] Parameter verified by characterization.
[4] Parameter tested 100 % at final test.
[5] Parameter verified by functional evaluation.
11 Dynamic characteristics
Table 8. Dynamic characteristics
VCC_min ≤ (VCC – VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified.
Symbol Parameter Condition Min Typ Max Units
Signal chain
tSigChain Signal chain sample time [1] 48 μs
fc0 Cutoff frequency, filter
option #0, 4-pole
[1] [2] 800 Hz
fc1
PABS low-pass filter
Cutoff frequency, filter
option #1, 4-pole
[1] [2] 1000 Hz
tSigDelay Signal delay (sinc filter to output delay,
excluding the PABS LPF)
[1] 128 μs
fPackage Package resonance frequency [1] 27.1 kHz
[1] Functionality verified by modeling, simulation and/or design verification.
[2] Parameter verified by functional evaluation.
12 Media compatibility—pressure sensors only
For more information regarding media compatibility information, contact your local sales
representative.
13 Application information
Note: A gel is used to provide media protection against corrosive elements which
may otherwise damage metal bond wires and/or IC surfaces. Highly pressurized gas
molecules may permeate through the gel and then occupy boundaries between material
surfaces within the sensor package. When decompression occurs, the gas molecules
may collect, form bubbles and possibly result in delamination of the gel from the material
it protects. If a bubble is located on the pressure transducer surface or on the bond wires,
the sensor measurement may shift from its calibrated transfer function. In some cases,
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
13 / 22
these temporary shifts could be outside the tolerances listed in the data sheet. In rare
cases, the bubble may bend the bond wires and result in a permanent shift.
aaa-029731
VCC
VCC TEST (pin3)
VSS
C1
C2 R1
VCC
ADCREF+
ADC_IN
ADC
ANALOG_OUT
FXPS7xxxA4
ADCREF-
Figure 12. Application diagram of FXPS7550A4
Table 9. External component recommendations
Name Type Description Purpose
C1 Ceramic 0.1 μF, 10 %, 10 V minimum, X7R VCC power supply decoupling
C2 Ceramic 47 pF, 10 %, 10 V minimum, X7R Analog output filtering
R1 General purpose 51 kΩ, 5 %, 200 PPM Analog output pull-down resistor
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
14 / 22
14 Package outline
Figure 13. Package outline HQFN (SOT1573-1)
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
15 / 22
Figure 14. Package outline detail HQFN (SOT1573-1)
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
16 / 22
Figure 15. Package outline note HQFN (SOT1573-1)
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
17 / 22
15 References
[1] Assembly guidelines for quad flat no-lead (HQFN) and small outline no-lead (SON) packages — NXP
Application Note (AN) 1902, Rev. 8.0 - 6 February 2018, 51 pages,
https://www.nxp.com/docs/en/application-note/AN1902.pdf
[2] AEC documents on Automotive Electronics Council Component Technical Committee’s site:
http://www.aecouncil.com/AECDocuments.html
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
18 / 22
16 Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supercedes
FXPS7550A4 v.4.1 20190529 Product data sheet - FXPS7550A4 v.4
Modifications Section 3.1: Added application "Liquid propane gas (LPG) or compressed natural gas (CNG)
engine management."
Section 13, Figure 12: Revised the symbol for R1 from a capacitor symbol to a resistor symbol.
FXPS7550A4 v.4 20190507 Product data sheet - FXPS7550A4 v.3
FXPS7550A4 v.3 20190506 Preliminary data sheet - FXPS7550A4 v.2
FXPS7550A4 v.2 20190408 Preliminary data sheet - FXPS7550A4 v.1
FXPS7550A4 v.1 20180913 Preliminary data sheet - -
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
19 / 22
17 Legal information
17.1 Data sheet status
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product
development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
20 / 22
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
17.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
NXP — is a trademark of NXP B.V.
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
FXPS7550A4 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 4.1 — 29 May 2019
21 / 22
Tables
Tab. 1. Ordering information ..........................................2
Tab. 2. Ordering options ................................................2
Tab. 3. Pin description ...................................................4
Tab. 4. IIR low pass filter coefficients ............................7
Tab. 5. Maximum ratings ............................................. 10
Tab. 6. Electrical characteristics—supply and I/O ....... 11
Tab. 7. Static characteristics ....................................... 11
Tab. 8. Dynamic characteristics .................................. 12
Tab. 9. External component recommendations ........... 13
Tab. 10. Revision history ...............................................18
Figures
Fig. 1. Block diagram of FXPS7550A4 .........................3
Fig. 2. Pin configuration for 16-pin HQFN .................... 3
Fig. 3. Voltage regulation and monitoring .....................5
Fig. 4. ΣΔ converter block diagram .............................. 6
Fig. 5. Signal chain diagram ........................................ 6
Fig. 6. Sinc filter response ........................................... 7
Fig. 7. 800 Hz, 4-pole, low-pass filter response ........... 8
Fig. 8. 800 Hz, 4-pole output signal delay ....................8
Fig. 9. 1000 Hz, 4-pole, low-pass filter response ......... 9
Fig. 10. 1000 Hz, 4-pole output signal delay ..................9
Fig. 11. Analog output transfer function ....................... 10
Fig. 12. Application diagram of FXPS7550A4 .............. 13
Fig. 13. Package outline HQFN (SOT1573-1) ..............14
Fig. 14. Package outline detail HQFN (SOT1573-1) .... 15
Fig. 15. Package outline note HQFN (SOT1573-1) ...... 16
NXP Semiconductors FXPS7550A4
Analog absolute pressure sensor, 20 to 550 kPa
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2019. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 May 2019
Document identifier: FXPS7550A4
Contents
1 General description ............................................ 1
2 Features and benefits .........................................1
3 Applications .........................................................1
3.1 Automotive ......................................................... 1
3.2 Industrial ............................................................ 2
3.3 Medical/Consumer ............................................. 2
4 Ordering information .......................................... 2
4.1 Ordering options ................................................ 2
5 Block diagram ..................................................... 3
6 Pinning information ............................................ 3
6.1 Pinning ............................................................... 3
6.2 Pin description ................................................... 4
7 Functional description ........................................4
7.1 Voltage regulators ............................................. 4
7.2 Pressure sensor signal path ..............................5
7.2.1 ΣΔ converter ...................................................... 5
7.2.2 Digital signal processor (DSP) ...........................6
7.2.2.1 Decimation sinc filter ......................................... 6
7.2.2.2 Signal trim and compensation ........................... 7
7.2.2.3 Low-pass filter ................................................... 7
7.3 Analog output function .......................................9
7.3.1 Analog output signal chain ................................ 9
7.3.2 Analog output transfer function ........................10
8 Maximum ratings ...............................................10
9 Operating range ................................................ 11
10 Static characteristics ........................................ 11
11 Dynamic characteristics ...................................12
12 Media compatibility—pressure sensors
only ..................................................................... 12
13 Application information ....................................12
14 Package outline .................................................14
15 References ......................................................... 17
16 Revision history ................................................ 18
17 Legal information ..............................................19