TM Flip-Top BGA Sockets TM Flip-Top BGA Sockets 1.27mm and 1.00mm Pitch Table of Models Description: Socket (FRG, 1.27mm pitch) Guide Box and Base Mat'l: High Temp. Liquid Crystal Polymer (LCP) Index: -40C to 260C (-40F to 500F) Description: Socket (FRH, 1.00mm pitch) Guide Box Mat'l: High Temp. Liquid Crystal Polymer (LCP) Index: -40C to 260C (-40F to 500F) Base Mat'l: FR-4 Glass Filled Epoxy Index: -40C to 140C (-40F to 284F) Features: * Designed to save space on new and existing PC boards in test, development, programming and production applications. * No external hold-downs or soldering of BGA device required. * AIC exclusive solder ball terminals offer superior processing. * Uses same footprint as BGA device. * Available with integral, finned heat sink or coin screw clamp assembly. Specifications: Terminals: Plating: G - Gold over Nickel How It Works SMT models are shipped un-assembled to ease solderability. Thru-hole models are shipped fully assembled. Chip support plate (supplied) 1. Lower assembly is soldered to PC board with no external hold-down mechanism. Thru-hole models may be soldered to PC board or plugged into a mating socket. BGA or LGA device Upper assembly 2. Upper assembly inserts easily to lower assembly by aligning guide posts and installing four (supplied) screws. Lower assembly 4. Lid opens easily by pressing latch. 3. Finned heat sink or coin screw is screwed down to flush with bottom of lid. 5. BGA device is inserted by aligning A1 position with chamfered corner of Flip-TopTM socket. Place support plate on top of device, close lid, engage heat sink or coin screw, and socket is ready for use. Lid, Latch, Heat Sink/Coin Screw and Support Plate Material: Aluminum Solder Ball: Standard: 63Sn/37Pb Lead-free: 95.5Sn/4.0Ag/0.5Cu Detailed Installation and General Usage Instructions are provided with product. See page 15 for Generic Reflow Profiles. How To Order Terminal Support: Polyimide Film Spring Material: Stainless Steel Socket Size: 3.00mm wider and 10.00mm longer than BGA device (for packages larger than 15.00mm square).* FRG replaces FTG. * For device packages smaller than 15.00mm square, the socket size is X = .709/(18.00) and Y = .984/(25.00). Brass - Copper Alloy (C36000) ASTM-B-16 Contacts: Beryllium Copper (C17200) ASTM-B-194 Socket Size: 3.00mm wider and 10.00mm longer than BGA device (for packages larger than 15.00mm square).* 1 FR G XXXX - 821 G G XX Footprint Dash # Clamp Options If Applicable* HS - Heat Sink (3 Fins Std.) CS - Coin Screw Model Type RoHS Compliant Insulator: FR - Flip-TopTM BGA Socket Contact Plating RoHS Compliant: G - Gold Pitch G = .050/(1.27mm) H = .039/(1.00mm) Terminal Plating RoHS Compliant: G - Gold Terminal Type Number of Positions See options *See footprints section or online database. 5 Energy Way, West Warwick, RI 02893 USA Tel: 800.424.9850 | 401.823.5200 Fax: 401.823.8723 info@advanced.com | www.advanced.com Catalog 16 rev. June 09 Products shown covered by patents issued and/or pending. Specifications subject to change without notice. inch/(mm) TM TM Flip-Top BGA Sockets 1.27mm and 1.00mm Pitch SMT (Surface Mount) Terminals (for test, development and production applications) Tin/Lead: Type -690 Lead-free: Type -821 1.27mm pitch Tin/Lead: Type -752 Lead-free: Type -837 1.00mm pitch .091 (2.31) .102 (2.59) .200 (5.08) .206 (5.23) .024 Dia. (0.61) .030 Dia. (0.76) Type -754 Type -708 .091 (2.31) Thru-Hole .102 (2.59) .176 (4.47) .176 (4.47) .018 Dia. (0.46) Flip-Top BGA Sockets .125 (3.18) .010 Dia. (0.25) Footprints: .125 (3.18) 360 Pins Footprint Number 360-2 SMT (Surface Mount) Terminals (for LGA or de-balled BGA device applications) Tin/Lead: Type -713 Lead-free: Type -822 1.27mm pitch .112 (2.84) .099 (2.51) .206 (5.23) Type -712 .099 (2.51) .112 (2.84) Thru-Hole 22 x 22 rows Type -763 .125 (3.18) .010 Dia. (0.25) .125 (3.18) SMT (Surface Mount) Terminals (for BGA device test applications) Tin/Lead: Type -659 Lead-free: Type -820 1.27mm pitch * Full grid molded insulators populated to exact device pattern. * Over 1000 footprints available see page 99, search online or submit your device specs. .176 (4.47) .176 (4.47) .039/(1.00) Typ. .200 (5.08) .024 Dia. (0.61) .030 Dia. (0.76) .018 Dia. (0.46) .906 Sq. (23.00) Tin/Lead: Type -762 Lead-free: Type -838 1.00mm pitch Tin/Lead: Type -TBD Lead-free: Type -TBD 1.00mm pitch * Use our Build-A-Part feature or search in our online BGA Socket FinderTM at www.bgasockets.com. Available Online: * RoHS Qualification Test Report * Technical articles .102 (2.59) .206 (5.23) Consult Factory * Test data * Signal Integrity Performance * CAD drawings * BGA Footprints .030 Dia. (0.76) Type -657 Type -TBD Thru-Hole Available with .016/(0.41mm) Diam. tail; Type -709 .102 (2.59) .176 (4.47) .018 Dia. (0.46) inch/(mm) Consult Factory .125 (3.18) Products shown covered by patents issued and/or pending. Specifications subject to change without notice. 5 Energy Way, West Warwick, RI 02893 USA Tel: 800.424.9850 | 401.823.5200 Fax: 401.823.8723 info@advanced.com | www.advanced.com Catalog 16 rev. June 09