7WBD3125USG - ON Semiconductor L.L.C.

September, 2010 − Rev. 1

1Publication Order Number:

7WBD3125/D

7WBD3125

2-Bit Translating Bus

Switch

The 7WBD3125 is an advanced high−speed low−power 2−bit

translating bus switch in ultra−small footprints.

Features

•High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V

•3 W Switch Connection Between 2 Ports

•Power Down Protection Provided on Inputs

•Zero Bounce

•TTL−Compatible Control Inputs

•Ultra−Small Pb−Free Packages

•These are Pb−Free Devices

This document contains information on some products that are still under development.

ON Semiconductor reserves the right to change or discontinue these products without

notice.

http://onsemi.com

See detailed ordering and shipping information in the package

dimensions section on page 6 of this data sheet.

ORDERING INFORMATION

MARKING

DIAGRAMS

ULLGA8

1.45 x 1.0

CASE 613AA

ULLGA8

1.6 x 1.0

CASE 613AB

ULLGA8

1.95 x 1.0

CASE 613AC

AHM

AJM

UDFN8

MU SUFFIX

CASE 517AJ

8AFM

AE MG

UQFN8

MU SUFFIX

CASE 523AN

US8

US SUFFIX

CASE 493

AA MG

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

A = Assembly Location

Y = Year

W = Work Week

M = Date Code

G= Pb−Free Package

D125

AYWG

Micro8]

DM SUFFIX

CASE 846A

7WBD3125

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OE1 1V

GND

OE2

Figure 1. ULLGA8/UDFN8

(Top Thru−View)

Figure 2. UQFN8

(Top Thru−View)

123

765

OE2 B1 A2

A1 B2

VCC GND

Figure 3. US8/Micro8

(Top View)

OE1

GND

VCC

OE2

OE1

Figure 4. Logic Diagram

OE1

OE2

FUNCTION TABLE

Input OEn Function

LBn = An

H Disconnect

7WBD3125

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MAXIMUM RATINGS

Symbol Parameter Value Unit

VCC DC Supply Voltage −0.5 to +7.0 V

VIN Control Pin Input Voltage −0.5 to +7.0 V

VI/O Switch Input / Output Voltage −0.5 to +7.0 V

IIK Control Pin DC Input Diode Current VIN < GND −50 mA

IOK Switch I/O Port DC Diode Current VI/O < GND −50 mA

IOON−State Switch Current $128 mA

Continuous Current Through VCC or GND $150 mA

ICC DC Supply Current Per Supply Pin $150 mA

IGND DC Ground Current per Ground Pin $150 mA

TSTG Storage Temperature Range −65 to +150 °C

TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C

TJJunction Temperature Under Bias 150 °C

qJA Thermal Resistance US8 (Note 1)

UDFN8

UQFN8

ULLGA8

Micro8

251

111

208

455

392

°C/W

PDPower Dissipation in Still Air at 85°C US8

UDFN8

UQFN8

ULLGA8

Micro8

498

1127

601

274

319

MSL Moisture Sensitivity Level 1

FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in

VESD ESD Withstand Voltage Human Body Mode (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

> 2000

> 200

N/A

ILATCHUP Latchup Performance Above VCC and Below GND at 125°C (Note 5) $200 mA

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.

2. Tested to EIA / JESD22−A114−A.

3. Tested to EIA / JESD22−A115−A.

4. Tested to JESD22−C101−A.

5. Tested to EIA / JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Max Unit

VCC Positive DC Supply Voltage 4.0 5.5 V

VIN Control Pin Input Voltage 0 5.5 V

VI/O Switch Input / Output Voltage 0 5.5 V

TAOperating Free−Air Temperature −55 +125 °C

Dt / DVInput Transition Rise or Fall Rate Control Input

Switch I/O

nS/V

7WBD3125

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DC ELECTRICAL CHARACTERISTICS

Symbol Parameter Conditions

VCC

(V)

TA = 255C

TA =

−555C to +1255C

Unit

Min Typ Max Min Max

VIK Clamp Diode Voltage II/O = −18 mA 4.5 −1.2 −1.2 V

VIH High−Level Input Voltage

(Control)

4.0 to

5.5

2.0 2.0 V

VIL Low−Level Input Voltage

(Control)

4.0 to

5.5

0.8 0.8 V

VOH Output Voltage High See Figure 5

IIN Input Leakage Current 0 v VIN v 5.5 V 5.5 ±0.1 ±1.0 mA

IOFF Power Off Leakage Current VI/O = 0 to 5.5 V 0±0.1 ±1.0 mA

ICC Quiescent Supply Current IO = 0,

VIN = VCC or 0 V

OE1 = OE2 = GND

OE1 = OE2 = VCC

5.5

±1.0

±0.1

±1.0

DICC Increase in Supply Current

(Control Pin)

One input at 3.4 V;

Other inputs at VCC

or GND

5.5 2.5 mA

RON Switch ON Resistance VI/O = 0,

II/O = 64 mA

II/O = 30 mA

4.5

VI/O = 2.4,

II/O = 15 mA 15 50 50

VI/O = 2.4,

II/O = 15 mA

4.0

50 70 70

AC ELECTRICAL CHARACTERISTICS

Symbol Parameter Test Condition

VCC

(V)

TA = 25 5C

TA =

−555C to +1255C

Unit

Min Typ Max Min Max

tPD Propagation Delay, Bus to Bus See Figure 6 4.0 to

5.5

0.25 0.25 ns

tEN Output Enable Time See Figure 6 4.5 to

5.5

0.8 2.5 4.2 0.8 4.2 ns

4.0 0.8 3.0 4.6 0.8 4.6

tDIS Output Disable Time 4.5 to

5.5

0.8 3.0 4.8 0.8 4.8 ns

4.0 0.8 2.9 4.4 0.8 4.4

CIN Control Input Capacitance VIN = 5 or 0 V 5.0 2.5 pF

CIO(ON) Switch On Capacitance Switch ON 5.0 10 pF

CIO(OFF) Switch Off Capacitance Switch OFF 5.0 5 pF

7WBD3125

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TYPICAL DC CHARACTERISTICS

Figure 5. Output Voltage High vs Supply Voltage

VCC, SUPPLY VOLTAGE (V)

VOH, HIGH LEVEL OUTPUT

VOLTAGE (V)

3.75

3.50

3.25

3.00

2.75

2.50

2.25

2.004.50 4.75 5.00 5.25 5.50 5.75

IOH =

−0.1 mA

−6 mA

−12 mA

−24 mA

VCC, SUPPLY VOLTAGE (V)

VOH, HIGH LEVEL OUTPUT

VOLTAGE (V)

3.75

3.50

3.25

3.00

2.75

2.50

2.25

2.004.50 4.75 5.00 5.25 5.50 5.75

IOH =

−0.1 mA

−6 mA

−12 mA

−24 mA

VCC, SUPPLY VOLTAGE (V)

VOH, HIGH LEVEL OUTPUT

VOLTAGE (V)

3.75

3.50

3.25

3.00

2.75

2.50

2.25

2.004.50 4.75 5.00 5.25 5.50 5.75

IOH =

−0.1 mA

−6 mA

−12 mA

−24 mA

TA = +85°C

VIN = VCC

TA = +25°C

VIN = VCC

TA = −40°C

VIN = VCC

7WBD3125

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AC LOADING AND WAVEFORMS

Parameter Measurement Information

CL = 50 pF*

From Output

Under Test

GND

Open

7 V

500 WS1

*CL includes probes and jig capacitance.

500 W

Test S1

tPD Open

tPLZ/tPZL 7 V

tPHZ/tPZH Open

Voltage Waveforms

Propagation Delay Times

Voltage Waveforms

Enable and Disable Times

3.5 V

Output

Control

3 V

0 V

1.5 V1.5 V

1.5 V

tPZH tPHZ

VOL

VOH

0 V

Output

Waveform 1

S1 at 7 V

(Note 6)

Waveform 2

S1 at Open

(Note 6)

VOL + 0.3 V

VOH − 0.3 V

6. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control

7. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, ZO = 50 W, tr v 2.5 ns, tf v 2.5 ns.

8. The outputs are measured one at a time, with one transition per measurement.

9. tPLZ and tPHZ are the same as tDIS.

10.tPZL and tPZH are the same as tEN.

11. tPHL and tPLH are the same as tPD.

Figure 6. tPD, tEN, tDIS Loading and Waveforms

1.5 V 1.5 V

Input

Output

VOH

VOL

tPHL

tPLH

3 V

0 V

tPZL tPLZ

ORDERING INFORMATION

Device Package Shipping†

7WBD3125USG US8

(Pb−Free)

3000 / Tape & Reel

7WBD3125MUTAG UDFN8

(Pb−Free)

3000 / Tape & Reel

7WBD3125AMUTCG UQFN8

(Pb−Free)

3000 / Tape & Reel

7WBD3125AMX1TCG ULLGA8 – 0.5 mm Pitch

(Pb−Free)

3000 / Tape & Reel

7WBD3125BMX1TCG ULLGA8 – 0.4 mm Pitch

(Pb−Free)

3000 / Tape & Reel

7WBD3125CMX1TCG ULLGA8 – 0.35 mm Pitch

(Pb−Free)

3000 / Tape & Reel

7WBD3125DMR2G Micro8

(Pb−Free)

4000 / Tape & Reel

(In Development)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

7WBD3125

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PACKAGE DIMENSIONS

UDFN8 1.8 x 1.2, 0.4P

CASE 517AJ−01

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30 mm FROM TERMINAL TIP.

4. MOLD FLASH ALLOWED ON TERMINALS

ALONG EDGE OF PACKAGE. FLASH MAY

NOT EXCEED 0.03 ONTO BOTTOM

SURFACE OF TERMINALS.

5. DETAIL A SHOWS OPTIONAL

CONSTRUCTION FOR TERMINALS.

ÉÉ

A B

BOTTOM VIEW

BAC

CNOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

(A3)

0.05 C

CSEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A0.45 0.55

A1 0.00 0.05

A3 0.127 REF

b0.15 0.25

D1.80 BSC

E1.20 BSC

e0.40 BSC

L0.45 0.55

e/2

b2 0.30 REF

L1 0.00 0.03

L2 0.40 REF

DETAIL A

(L2)

(b2)

NOTE 5

DETAIL A

0.10

0.05

0.22

0.32

1.50

0.40 PITCH

0.66

DIMENSIONS: MILLIMETERS

MOUNTING FOOTPRINT*

SOLDERMASK DEFINED

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

7WBD3125

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PACKAGE DIMENSIONS

ULLGA8 1.45x1.0, 0.35P

CASE 613AA−01

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

4. A MAXIMUM OF 0.05 PULL BACK OF THE

PLATED TERMINAL FROM THE EDGE OF THE

PACKAGE IS ALLOWED.

ÉÉÉ

BOTTOM VIEW

0.10 B

0.05

L7X

NOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

0.05 C

SEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A−−− 0.40

A1 0.00 0.05

b0.15 0.25

D1.45 BSC

E1.00 BSC

e0.35 BSC

L0.25 0.35

L1 0.30 0.40

e/2

NOTE 4

SOLDERMASK DEFINED*

DIMENSIONS: MILLIMETERS

0.22

0.48 8X

1.18

0.53

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

0.35

MOUNTING FOOTPRINT

PKG

OUTLINE

7WBD3125

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PACKAGE DIMENSIONS

ULLGA8 1.6x1.0, 0.4P

CASE 613AB−01

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

4. A MAXIMUM OF 0.05 PULL BACK OF THE

PLATED TERMINAL FROM THE EDGE OF THE

PACKAGE IS ALLOWED.

ÉÉÉ

BOTTOM VIEW

0.10 B

0.05

L7X

NOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

0.05 C

SEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A−−− 0.40

A1 0.00 0.05

b0.15 0.25

D1.60 BSC

E1.00 BSC

e0.40 BSC

L0.25 0.35

L1 0.30 0.40

e/2

NOTE 4

SOLDERMASK DEFINED*

DIMENSIONS: MILLIMETERS

0.26

0.49 8X

1.24

0.53

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

0.40

MOUNTING FOOTPRINT

PKG

OUTLINE

7WBD3125

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PACKAGE DIMENSIONS

ULLGA8 1.95x1.0, 0.5P

CASE 613AC−01

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

4. A MAXIMUM OF 0.05 PULL BACK OF THE

PLATED TERMINAL FROM THE EDGE OF THE

PACKAGE IS ALLOWED.

ÉÉÉÉ

BOTTOM VIEW

0.10 B

0.05

L7X

NOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

0.05 C

SEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A−−− 0.40

A1 0.00 0.05

b0.15 0.25

D1.95 BSC

E1.00 BSC

e0.50 BSC

L0.25 0.35

L1 0.30 0.40

e/2

NOTE 4

SOLDERMASK DEFINED*

DIMENSIONS: MILLIMETERS

0.30

0.49 8X

1.24

0.53

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

0.50

MOUNTING FOOTPRINT

PKG

OUTLINE

7WBD3125

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PACKAGE DIMENSIONS

ÉÉ

UQFN8, 1.6x1.6, 0.5P

CASE 523AN−01

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

BOTTOM VIEW

0.10 B

0.05

CNOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

(A3)

0.05 C

CSEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A0.45 0.60

A1 0.00 0.05

A3 0.13 REF

b0.15 0.25

D1.60 BSC

L1 −−− 0.15

E1.60 BSC

e0.50 BSC

L0.35 0.45

DETAIL A

ÇÇ

ÉÉ

DETAIL B

OPTIONAL

MOLD CMPD

EXPOSED Cu

CONSTRUCTION

OPTIONAL

CONSTRUCTION

DETAIL B

DETAIL A

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

PITCH

0.35

DIMENSIONS: MILLIMETERS

0.25

1.70

0.50

L3 0.25 0.35

(0.10) (0.15)

0.53

7WBD3125

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PACKAGE DIMENSIONS

US8

CASE 493−02

ISSUE B

DIM

MIN MAX MIN MAX

INCHES

1.90 2.10 0.075 0.083

MILLIMETERS

B2.20 2.40 0.087 0.094

C0.60 0.90 0.024 0.035

D0.17 0.25 0.007 0.010

F0.20 0.35 0.008 0.014

G0.50 BSC 0.020 BSC

H0.40 REF 0.016 REF

J0.10 0.18 0.004 0.007

K0.00 0.10 0.000 0.004

L3.00 3.20 0.118 0.126

M0 6 0 6

N5 10 5 10

P0.23 0.34 0.010 0.013

R0.23 0.33 0.009 0.013

S0.37 0.47 0.015 0.019

U0.60 0.80 0.024 0.031

V0.12 BSC 0.005 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION “A” DOES NOT INCLUDE MOLD

FLASH, PROTRUSION OR GATE BURR.

MOLD FLASH. PROTRUSION AND GATE

BURR SHALL NOT EXCEED 0.140 MM

(0.0055”) PER SIDE.

4. DIMENSION “B” DOES NOT INCLUDE

INTER−LEAD FLASH OR PROTRUSION.

INTER−LEAD FLASH AND PROTRUSION

SHALL NOT E3XCEED 0.140 (0.0055”) PER

SIDE.

5. LEAD FINISH IS SOLDER PLATING WITH

THICKNESS OF 0.0076−0.0203 MM.

(300−800 “).

6. ALL TOLERANCE UNLESS OTHERWISE

SPECIFIED ±0.0508 (0.0002 “).

SEATING

DETAIL E

R 0.10 TYP

−Y−

−X−

−T−

DETAIL E

0.10 (0.004) XY

T0.10 (0.004)

____

PLANE

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

ǒmm

inchesǓ

SCALE 8:1

3.8

0.15

0.50

0.0197

1.0

0.0394

0.30

0.012

1.8

0.07

7WBD3125

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PACKAGE DIMENSIONS

Micro8t

CASE 846A−02

ISSUE H

0.08 (0.003) A S

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED

0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.

PIN 1 ID

8 PL

0.038 (0.0015)

−T−

SEATING

PLANE

A1 cL

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

8X 8X

6X ǒmm

inchesǓ

SCALE 8:1

1.04

0.041

0.38

0.015

5.28

0.208

4.24

0.167

3.20

0.126

0.65

0.0256

DIM

MIN NOM MAX MIN

MILLIMETERS

−− −− 1.10 −−

INCHES

A1 0.05 0.08 0.15 0.002

b0.25 0.33 0.40 0.010

c0.13 0.18 0.23 0.005

D2.90 3.00 3.10 0.114

E2.90 3.00 3.10 0.114

e0.65 BSC

L0.40 0.55 0.70 0.016

−− 0.043

0.003 0.006

0.013 0.016

0.007 0.009

0.118 0.122

0.026 BSC

0.021 0.028

NOM MAX

4.75 4.90 5.05 0.187 0.193 0.199

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

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PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

7WBD3125/D

Micro8 is a trademark of International Rectifier.

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