REG1117FA-5/KTTT - Texas Instruments High-Performance Analog

FEATURES

DFIXED AND ADJUSTABLE VERSIONS

D2.85V MODEL FOR SCSI-2 ACTIVE

TERMINATION

DOUTPUT CURRENT:

REG1117: 800mA max

REG1117A: 1A max

DOUTPUT TOLERANCE: +1% max

DDROPOUT VOLTAGE:

REG1117: 1.2V max at IO = 800mA

REG1117A: 1.3V max at IO = 1A

DINTERNAL CURRENT LIMIT

DTHERMAL OVERLOAD PROTECTION

DSOT-223 AND DDPAK SURFACE-MOUNT

PACKAGES

APPLICATIONS

DSCSI-2 ACTIVE TERMINATION

DHAND-HELD DATA COLLECTION DEVICES

DHIGH EFFICIENCY LINEAR REGULATORS

DBATTERY-POWERED INSTRUMENTATION

DBATTERY MANAGEMENT CIRCUITS FOR

NOTEBOOK AND PALMTOP PCs

DCORE VOLTAGE SUPPLY: FPGA, PLD, DSP,

CPU

DESCRIPTION

The REG1117 is a family of easy-to-use three-terminal

voltage regulators. The family includes a variety of fixed-

and adjustable-voltage versions, two currents (800mA and

1A) and two package types (SOT-223 and DDPAK). See

the chart below for available options.

Output voltage of the adjustable versions is set with two

external resistors. The REG1117 low dropout voltage

allows its use with as little as 1V input-output voltage

differential.

Laser trimming assures excellent output voltage accuracy

without adjustment. An NPN output stage allows output

stage drive to contribute to the load current for maximum

efficiency.

800mA 1A

VOLTAGE SOT-223 DDPAK SOT-223 DDPAK

1.8V n n

2.5V n n

2.85V n

3.3V n n

5V n n

Adjustable n n n

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 !     !   

All trademarks are the property of their respective owners.

REG1117

REG1117A

SBVS001D − OCTOBER 1992 − REVISED JULY 2004

800mA and 1A Low Dropout Positive Regulator

1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable

www.ti.com

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments

semiconductor products and disclaimers thereto appears at the end of this data sheet.

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ABSOLUTE MAXIMUM RATINGS(1)

Power Dissipation Internally Limited. . . . . . . . . . . . . . . . . . . . . . . . . .

Input Voltage +15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Junction Temperature Range −40°C to +125°C. . . . . . . .

Storage Temperature Range −65 °C to +150°C. . . . . . . . . . . . . . . . .

Lead Temperature (soldering, 10s)(2) +300°C. . . . . . . . . . . . . . . . .

(1) Stresses above these ratings may cause permanent damage.

(2) See Soldering Methods section.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

CONNECTION DIAGRAM

Front View

Plastic SOT−223 Plastic DDPAK

Tab is VOUT

VIN

VOUT

Ground

(Adj.)(1)

Tab is

VOUT

VIN

VOUT

Ground

(Adj.)(1)

NOTE: (1) Adjustable−Voltage Model.

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PACKAGE/ORDERING INFORMATION (1)

PRODUCT VO/IOPACKAGE-LEAD PACKAGE

DESIGNATOR

OPERATING

TEMPERATURE

RANGE

PACKAGE

MARKING ORDERING

NUMBER

TRANSPORT

MEDIA,

QUANTITY

−40°C t o

REG1117-2.85 Rails, 80

REG1117-2.85 2.85/800mA SOT223-3 DCY −40°C to

+125°CBB11172 REG1117-2.85 Tape and Reel,

2500

−40°C to

REG1117-3.3 Rails, 80

REG1117-3.3 3.3/800mA SOT223-3 DCY −40°C to

+125°CBB11174 REG1117-3.3 Tape and Reel,

2500

REG1117F-3.3

3.3/800mA

DDPAK-3

KTT

−40

C to

BB1117F4

REG1117F-3.3KTTT Tape and Reel,

REG1117F-3.3 3.3/800mA DDPAK-3 KTT

−40 C to

+125°CBB1117F4 REG1117F-3.3/500 Tape and Reel,

500

−40°C to

REG1117-5 Rails, 80

REG1117-5 5V/800mA SOT223-3 DCY −40°C to

+125°CBB11175 REG1117-5 Tape and Reel,

2500

−40°C to

REG1117 Rails, 80

REG1117 Adj./800mA SOT223-3 DCY −40°C to

+125°CBB1117 REG1117 Tape and Reel,

2500

−40°C to

REG1117A-1.8 Rails, 80

REG1117A-1.8 1.8V/1A SOT223-3 DCY −40°C to

+125°CR111718 REG1117A-1.8 Tape and Reel,

2500

REG1117FA-1.8

1.8/1A

DDPAK-3

KTT

−40

C to

REG1117FA1.8

REG1117FA-1.8KTTT Tape and Reel,

REG1117FA-1.8 1.8/1A DDPAK-3 KTT

−40 C to

+125°CREG1117FA1.8 REG1117FA-1.8/500 Tape and Reel,

500

−40°C to

REG1117A-2.5 Rails, 80

REG1117A-2.5 2.5/1A SOT223-3 DCY −40°C to

+125°CR111725 REG1117A-2.5 Tape and Reel,

2500

REG1117FA-2.5

2.5/1A

DDPAK-3

KTT

−40

C to

REG1117FA2.5

REG1117FA-2.5KTTT Tape and Reel,

REG1117FA-2.5 2.5/1A DDPAK-3 KTT

−40 C to

+125°CREG1117FA2.5 REG1117FA-2.5/500 Tape and Reel,

500

REG1117FA-5

5/1A

DDPAK-3

KTT

−40

C to

BB1117FA5.0

REG1117FA-5/KTTT Tape and Reel,

REG1117FA-5 5/1A DDPAK-3 KTT

−40 C to

+125°CBB1117FA5.0 REG1117FA-5/500 Tape and Reel,

500

−40°C to

REG1117A Rails, 80

REG1117A Adj./1A SOT223-3 DCY −40°C to

+125°CBB1117A REG1117A Tape and Reel,

2500

REG1117FA

Adj./1A

DDPAK-3

KTT

−40

C to

REG1117FA

REG1117FA/KTTT Tape and Reel,

REG1117FA Adj./1A DDPAK-3 KTT

−40 C to

+125°CREG1117FA REG1117FA/500 Tape and Reel,

500

(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.

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ELECTRICAL CHARACTERISTICS

At TJ = +25°C, unless otherwise noted.

REG1117, REG1 117A

PARAMETER CONDITION MIN TYP MAX UNIT

OUTPUT VOLT AGE

REG1117-2.85 IO = 10mA, VIN = 4.85V 2.820 2.85 2.880 V

See Note 1 IO = 0 to 800mA, VIN = 4.05V to 10V 2.790 2.85 2.910 V

REG1117-3.3 IO = 10mA, VIN = 5.3V 3.270 3.30 3.330 V

See Note 1 IO = 0 to 800mA, VIN = 4.8V to 10V 3.240 3.30 3.360 V

REG1117-5 IO = 10mA, VIN = 7V 4.950 5.00 5.050 V

See Note 1 IO = 0 to 800mA, VIN = 6.5V to 10V 4.900 5.00 5.100 V

REG1117A-1.8 IO = 10mA, VIN = 3.8V 1.782 1.8 1.818 V

See Note 1 IO = 0 to 1A, VIN = 3.8V to 10V 1.764 1.8 1.836 V

REG1117A-2.5 IO = 10mA, VIN = 4.5V 2.475 2.5 2.525 V

See Note 1 IO = 0 to 1A, VIN = 4.5V to 10V 2.450 2.5 2.550 V

REG1117A-5 IO = 10mA, VIN = 7V 4.950 5.0 5.050 V

See Note 1 IO = 0 to 1A, VIN = 7V to 10V 4.900 5.0 5.100 V

REFERENCE VOLT AGE

REG1117 (Adjustable) IO = 10mA, VIN − VO = 2V 1.238 1.250 1.262 V

See Note 1 IO = 10 to 800mA, VIN − VO = 1.4 to 10V 1.225 1.250 1.280 V

REG1117A (Adjustable) IO = 10mA, VIN − VO = 2V 1.238 1.250 1.262 V

See Note 1 IO = 10mA to 1A, VIN − VO = 1.4 to 10V 1.225 1.250 1.280 V

LINE REGULATION

REG1117-2.85(1) IO = 0, VIN = 4.25 to 10V 1 7 mV

REG1117-3.3(1) IO = 0, VIN = 4.8 to 10V 2 7 mV

REG1117-5(1) IO = 0, VIN = 6.5 to 15V 3 10 mV

REG1117 (Adjustable)(1) IO = 10mA, VIN − VO = 1.5 to 13.75V 0.1 0.4 %

REG1117A (Adjustable)(1) IO = 10mA, VIN − VO = 1.5 to 13.75V 0.1 0.4 %

REG1117A-1.8(1) IO = 0, VIN = 3.8V to 10V 1 7 mV

REG1117A-2.5(1) IO = 0, VIN = 4.5V to 10V 1 7 mV

REG1117A-5.0(1) IO = 0, VIN = 7V to 15V 3 10 mV

LOAD REGULATION

REG1117-2.85(1) IO = 0 to 800mA, VIN = 4.25V 2 10 mV

REG1117-3.3(1) IO = 0 to 800mA, VIN = 4.8V 3 12 mV

REG1117-5(1) IO = 0 to 800mA, VIN = 6.5V 3 15 mV

REG1117 (Adjustable)(1)(2) IO = 10 to 800mA, VIN − VO = 3V 0.1 0.4 %

REG1117A (Adjustable)(1)(2) IO = 10mA to 1A, VIN − VO = 3V 0.1 0.4 %

REG1117A-1.8(1) IO = 0 to 1A, VIN = 3.8V 2 10 mV

REG1117A-2.5 IO = 0 to 1A, VIN = 4.5V 2 10 mV

REG1117A-5 IO = 0 to 1A, VIN = 7.0V 3 15 mV

DROPOUT VOLTAGE(3)

All Models(1) IO = 100mA 1.00 1.10 V

See Note 1 IO = 500mA 1.05 1.15 V

REG1117 Models(1) IO = 800mA 1.10 1.20 V

REG1117A IO = 1A 1.2 1.30 V

See Note 1 IO = 1A 1.2 1.55 V

(1) Specification applies over the full specified junction temperature range, 0°C to +125°C.

(2) REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation.

(3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.

(4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG11 17 models), IO = 1A (REG1117A),

VIN − VO = 1.4V (reading taken 10ms after pulse).

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ELECTRICAL CHARACTERISTICS (continued)

At TJ = +25°C, unless otherwise noted.

REG1117, REG1 117A

PARAMETER UNITMAXTYPMINCONDITION

CURRENT LIMIT

REG1117 Models VIN − VO = 5V 800 950 1200 mA

REG1117A VIN − VO = 5V 1000 1250 1600 mA

MINIMUM LOAD CURRENT

Adjustable Models(1)(2) VIN − VO = 13.75V 1.7 5 mA

QUIESCENT CURRENT

Fixed-Voltage Models(1) VIN − VO = 5V 4 10 mA

ADJUSTABLE PIN CURRENT(1)(2) IO = 10mA, VIN − VO = 1.4 to 10V 50 120 µA

vs Load Current, REG11 17(1) IO = 10mA to 800mA, VIN − VO = 1.4 to 10V 0.5 5 µA

vs Load Current, REG11 17A(1) IO = 10mA to 1A, VIN − VO = 1.4 to 10V 0.5 5 µA

THERMAL REGULATION

All Models(4) 30ms Pulse 0.01 0.1 %/W

RIPPLE REJECTION

All Models f = 120Hz, VIN − VOUT = 3V + 1VPP Ripple 62 dB

TEMPERATURE DRIFT

Fixed-Voltage Models TJ = 0°C to +125°C 0.5 %

Adjustable Models TJ = 0°C to +125°C 2 %

LONG-TERM STABILITY

All Models TA = 125°C, 1000Hr 0.3 %

OUTPUT NOISE

rms Noise, All Models f = 10Hz to 10kHz 0.003 %

THERMAL RESISTANCE

Thermal Resistance, qJC (Junction-to-Case at Tab)

3-Lead SOT-223 Surface-Mount 15 °C/W

3-Lead DDPAK Surface-Mount f > 50Hz 2°C/W

dc 3 °C/W

Thermal Resistance, qJA (Junction-to-Case at Tab)

3-Lead DDPAK Surface-Mount No Heatsink 65 °C/W

(1) Specification applies over the full specified junction temperature range, 0°C to +125°C.

(2) REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation.

(3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.

(4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG11 17 models), IO = 1A (REG1117A),

VIN − VO = 1.4V (reading taken 10ms after pulse).

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SIMPLIFIED SCHEMATIC

Thermal

Limit

10X VOUT

VIN

Ground (Fixed−voltage Models)

Adj. (Adjustable−voltage Model)

(Substrate)

Current

Limit

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TYPICAL CHARACTERISTICS

At TA = +25°C, all models, unless otherwise noted.

SHORT−CIRCUIT CURRENT vs TEMPERATURE

1400

1300

1200

1100

1000

900

800

−50 −25 0 25 50 75 100

Temperature (_C)

Short−Circuit Current (mA)

REG1117A

REG1117 Models

LOAD REGULATION

(∆

ILOAD = 800mA)

−2

−3

−4

−5

−6

−7−50 −25 0 25 50 75 100

Temperature (_C)

Output Voltage Deviation (mV)

REG1117−2.85

REG1117A−1.8

REG1117−5

LINE REGULATION vs TEMPERATURE

−1

−2

−50 −25 0 25 50 75 100

Temperature (_C)

Output Voltage Change (mV)

REG1117A−1.8

VIN =3.8Vto10V

VIN =6.5Vto15V

REG1117−5

RIPPLE REJECTION vs FREQUENCY

Frequency (Hz)

Ripple Rejection (dB)

100

010 100 1k 10k 100k

IOUT =100mA

VRIPPLE =1.0V

OUTPUT VOLTAGE vs TEMPERATURE

2.0

1.0

−1.0

−2.0

−50 −25 0 25 50 75 100

Temperature (_C)

Output Voltage Change (%)

IO=10mA

QUIESCENT CURRENT vs TEMPERATURE

−50 −25 0 25 50 75 100

Temperature (_C)

Quiescent Current (mA)

Fixed−Voltage Models

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TYPICAL CHARACTERISTICS (continued)

At TA = +25°C, all models, unless otherwise noted.

LOAD TRANSIENT RESPONSE

0.1

−0.1

0.5

−0.5

Load Current (A) Output Voltage

Deviations (V)

0 20406080100

Time (µs)

CIN =10

µF

COUT =10

µF

Tantalum

VIN =4.25V

Preload = 0.1A

LINE TRANSIENT RESPONSE

−20

−40

5.25

4.25

3.25

Input Voltage (V) Output Voltage

Deviation (mV)

0 20 40 60 80 100 120 140 160 180 200

Time (µs)

CIN =1

µF

COUT =10

µFTantalum

IOUT =0.1A

APPLICATIONS INFORMATION

Figure 1 shows the basic hookup diagram for fixed-voltage

models. All models require an output capacitor for proper

operation, and for improving high-frequency load

regulation; a 10µF tantalum capacitor is recommended.

Aluminum electrolytic types of 50µF or greater can also be

used. A high-quality capacitor should be used to assure

that the ESR (Effective Series Resistance) is less than

0.5Ω.

REG1117 VO

VIN

10µF

Tantalum 10µF

Tantalum

Figure 1. Fixed-Voltage Model—Basic

Connections

Figure 2 shows a hookup diagram for the adjustable

voltage model. Resistor values are shown for some

commonly-used output voltages. Values for other voltages

can be calculated from the equation shown in Figure 2. For

best load regulation, connect R1 close to the output pin and

R2 close to the ground side of the load as shown.

THERMAL CONSIDERATIONS

The REG1117 has current limit and thermal shutdown

circuits that protect it from overload. The thermal shutdown

activates at approximately TJ = 165°C. For continuous

operation, however, the junction temperature should not

be allowed to exceed 125°C. Any tendency to activate the

thermal shutdown in normal use is an indication of an

inadequate heat s i n k o r e x c essive pow er dissipa t ion. The

power dissipation is equal to:

PD = (VIN – VOUT) IOUT

The junction temperature can be calculated by:

TJ = TA + PD (qJA)

where TA is the ambient temperature, and qJA is the

junction-to-ambient thermal resistance.

REG1117

(Adj)

VIN VO

10µF

C3(1)

10µF

Load

NOTES: (1) C3optional. Improves high−frequency line rejection. (2) Resistors are standard 1% values.

VO= x (1.25V) + (50µA) (R2)

R1+R

This term is negligible with

proper choice of values−see

table at right.

VOUT R1R2

(V)(

Ω)(2) (Ω)(2)

1.25 Open Short

1.5 750 147

2.1 158 107

2.85 169 215

3 137 191

3.3 115 187

5 113 340

10 113 787

Figure 2. Adjustable-Voltage Model—Basic Connections

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A simple experiment will determine whether the maximum

recommended junction temperature is exceeded in an

actual circuit board and mounting configuration: Increase

the ambient temperature above that expected in normal

operation until the device’s thermal shutdown is activated.

If this occurs at more than 40°C above the maximum

expected ambient temperature, then TJ will be less than

125°C during normal operation.

The internal protection circuitry of the REG1117 was

designed to protect against overload conditions. It was not

intended to replace proper heat sinking. Continuously

running the REG1117 into thermal shutdown will degrade

reliability.

LAYOUT CONSIDERATIONS

The DDPAK (REG1117F-3.3 and REG1117FA) is a

surface-mount power package that has excellent thermal

characteristics. For best thermal performance, the

mounting tab should be soldered directly to a circuit board

copper area, as shown in Figure 3. Increasing the copper

area improves heat dissipation. Figure 4 shows typical

thermal resistance from junction-to-ambient as a function

of the copper area.

3−Lead DDPAK(1)

NOTE: (1) For improved thermal performance increase

footprint area. See Figure 4 (Thermal Resistance vs

Circuit Board Copper Area).

All measurements

in inches.

0.45

0.085

0.2

0.51

0.10

0.155 0.05

Figure 3. DDPAK Footprint

THERMAL RESISTANCE vs

CIRCUIT BOARD COPPER AREA

10 012345

Copper Area (inches2)

REG1117F

DDPAK Surface Mount Package

1oz copper

Thermal Resistance, qJA (°C/W)

Circuit Board Copper Area

REG1117F

DDPAK Surface−Mount Package

Figure 4. DDPAK Thermal Resistance versus Circuit Board Copper Area

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The SOT-223 package derives heat sinking from

conduction through its copper leads, especially the large

mounting tab. These must be soldered to a circuit board

with a substantial amount of copper remaining, as shown

in Figure 5. Circuit board traces connecting the tab and t h e

leads should be made as large as practical. The mounting

tab of both packages is electrically connected to VOUT.

Total Area: 50 x 50mm

35 x 17 mm

16 x 10 mm 16 x 10 mm

Without backside copper: JA ≈59_C/W

With solid backside copper: JA ≈49_C/W

Figure 5. SOT-223 Circuit Board Layout Example

Other nearby circuit traces, including those on the back

side of the circuit board, help conduct heat away from the

device, even though they may not be electrically

connected. Make all nearby copper traces as wide as

possible and leave only narrow gaps between traces.

Table 1 shows approximate values of qJA for various circuit

board and copper areas for the SOT-223 package. Nearby

heat dissipating components, circuit board mounting

conditions, and ventilation can dramatically affect the

actual qJA. Proper heat sinking significantly increases the

maximum power dissipation at a given ambient

temperature, as shown in Figure 6.

Table 1. SOT-223 qJA for Various Board

Configurations

(1)

SOT-223

THERMAL

T OTAL PC

BOARD

TOPSIDE

(1)

COPPER

BACKSIDE

COPPER

THERMAL

RESISTANCE

JUNCTION-

BOARD

AREA

COPPER

AREA

COPPER

AREA

JUNCTION-

TO-AMBIENT

2500mm22500mm22500mm246°C/W

2500mm21250mm22500mm247°C/W

2500mm2950mm22500mm249°C/W

2500mm22500mm20 51°C/W

2500mm21800mm20 53°C/W

1600mm2600mm21600mm255°C/W

2500mm21250mm20 58°C/W

2500mm2915mm20 59°C/W

1600mm2600mm20 67°C/W

900mm2340mm2900mm272°C/W

900mm2340mm20 85°C/W

(1) Tab is attached to the topside copper.

SOLDERING METHODS

Both REG1117 packages are suitable for infrared reflow

and vapor-phase reflow soldering techniques. The high

rate of temperature change that occurs with wave

soldering or hand soldering can damage the REG1117.

INSPEC Abstract Number: B91007604, C91012627.

Kelly, E.G. “Thermal Characteristics of Surface 5WK9Ω

Packages.” The Proceedings of SMTCON. Surface Mount

Technology Conference and Exposition: Competitive

Surface Mount Technology, April 3−6, 1990, Atlantic City,

NJ, USA. Abstract Publisher: IC Manage, 1990, Chicago,

IL, USA.

Power Dissipation (Watts)

0 255075100125

Ambient Temperature (_C)

MAXIMUM POWER DISSIPATION

vs AMBIENT TEMPERATURE

PD=(T

J(max) −TA)/ JA

TJ(max) = 150_C

DDPAK

SOT−223

JA =85

_C/W

(340mm2topside copper,

no backside copper)

JA =46

_C/W

(2500mm2topside and

backside copper)

JA =27

_C/W

(4in2one oz copper

mounting pad)

JA =65

_C/W

(no heat sink)

Figure 6. Maximum Power Dissipation versus Ambient Temperature

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10µF10µF

REG1117−2.85

110Ω

10µF10µF

1N5817

5V TERMPWR

2.85V 2.85V

TERMPWR

1N5817

(Upto27Lines)

REG1117−2.85

Figure 7. SCSI Active Termination Configuration

REG1117−5

GND

In Out

10µF100

µF

5V to 10V

10µF+

VIN > 12V

1kΩ

Figure 8. Adjusting Output of Fixed Voltage Models

REG1117−5

GND

In Out

10µF100

µF

7.5VVIN >9.0V

2.5VOUT

REF1004−2.5

Figure 9. Regulator with Reference

REG1117−5

GND

In Out

REG1117−5

GND

In Out

10µF

100µF

6.5V

1kΩ

50Ω

5.2V Line

5.0V Battery

VIN

Figure 10. Battery Backed-Up Regulated Supply

REG1117−5

GND

In Out

10µF 100µF

VOUT =−5V

VIN

Floating Input

Figure 11. Low Dropout Negative Supply

PACKAGING INFORMATION

Orderable Device Status (1) Package

Type Package

Drawing Pins Package

Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

REG1117 ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117-2.85 ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117-2.85/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117-2.85/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117-2.85G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117-3.3 ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117-3.3/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117-3.3/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117-3.3G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117-5 ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117-5/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117-5/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117-5G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117A ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117A-1.8 ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117A-1.8/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117A-1.8/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117A-1.8G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117A-2.5 ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117A-2.5/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117A-2.5/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117A-2.5G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117A/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

PACKAGE OPTION ADDENDUM

www.ti.com 11-Nov-2009

Addendum-Page 1

Orderable Device Status (1) Package

Type Package

Drawing Pins Package

Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

REG1117A/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117AG4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

REG1117F-3.3 OBSOLETE DDPAK/

TO-263 KTT 3 TBD Call TI Call TI

REG1117F-3.3/500 ACTIVE DDPAK/

TO-263 KTT 3 500 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117F-3.3/500G3 ACTIVE DDPAK/

TO-263 KTT 3 500 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117F-3.3KTTT ACTIVE DDPAK/

TO-263 KTT 3 50 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117F33KTTTG3 ACTIVE DDPAK/

TO-263 KTT 3 50 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FA OBSOLETE DDPAK/

TO-263 KTT 3 TBD Call TI Call TI

REG1117FA-1.8 OBSOLETE DDPAK/

TO-263 KTT 3 TBD Call TI Call TI

REG1117FA-1.8KTTT ACTIVE DDPAK/

TO-263 KTT 3 50 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FA-2.5 OBSOLETE DDPAK/

TO-263 KTT 3 TBD Call TI Call TI

REG1117FA-2.5/500 ACTIVE DDPAK/

TO-263 KTT 3 500 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FA-2.5KTTT ACTIVE DDPAK/

TO-263 KTT 3 50 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FA-25/500G3 ACTIVE DDPAK/

TO-263 KTT 3 500 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FA-5.0 OBSOLETE DDPAK/

TO-263 KTT 3 TBD Call TI Call TI

REG1117FA-5.0/500 ACTIVE DDPAK/

TO-263 KTT 3 500 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FA-5.0KTTT ACTIVE DDPAK/

TO-263 KTT 3 50 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FA-5.0KTTTG ACTIVE DDPAK/

TO-263 KTT 3 50 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FA/500 ACTIVE DDPAK/

TO-263 KTT 3 500 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FA/500G3 ACTIVE DDPAK/

TO-263 KTT 3 500 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FA1.8KTTTG3 ACTIVE DDPAK/

TO-263 KTT 3 50 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FA2.5KTTTG3 ACTIVE DDPAK/

TO-263 KTT 3 50 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FA5.0/500G3 ACTIVE DDPAK/

TO-263 KTT 3 500 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FAKTTT ACTIVE DDPAK/

TO-263 KTT 3 50 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117FAKTTTG3 ACTIVE DDPAK/

TO-263 KTT 3 50 Green (RoHS &

no Sb/Br) CU SN Level-2-260C-1 YEAR

REG1117G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

PACKAGE OPTION ADDENDUM

www.ti.com 11-Nov-2009

Addendum-Page 2

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com 11-Nov-2009

Addendum-Page 3

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

REG1117-2.85/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3

REG1117-3.3/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3

REG1117-5/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3

REG1117/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3

REG1117A-1.8/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3

REG1117A-2.5/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3

REG1117A/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3

REG1117F-3.3/500 DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2

REG1117F-3.3KTTT DDPAK/

TO-263 KTT 3 50 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2

REG1117FA-1.8KTTT DDPAK/

TO-263 KTT 3 50 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2

REG1117FA-2.5/500 DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2

REG1117FA-2.5KTTT DDPAK/

TO-263 KTT 3 50 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2

REG1117FA-5.0/500 DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2

REG1117FA-5.0KTTT DDPAK/ KTT 3 50 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 27-Jan-2012

Pack Materials-Page 1

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

TO-263

REG1117FA/500 DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2

REG1117FAKTTT DDPAK/

TO-263 KTT 3 50 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

REG1117-2.85/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0

REG1117-3.3/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0

REG1117-5/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0

REG1117/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0

REG1117A-1.8/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0

REG1117A-2.5/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0

REG1117A/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0

REG1117F-3.3/500 DDPAK/TO-263 KTT 3 500 346.0 346.0 41.0

REG1117F-3.3KTTT DDPAK/TO-263 KTT 3 50 346.0 346.0 41.0

REG1117FA-1.8KTTT DDPAK/TO-263 KTT 3 50 346.0 346.0 41.0

REG1117FA-2.5/500 DDPAK/TO-263 KTT 3 500 346.0 346.0 41.0

REG1117FA-2.5KTTT DDPAK/TO-263 KTT 3 50 346.0 346.0 41.0

PACKAGE MATERIALS INFORMATION

www.ti.com 27-Jan-2012

Pack Materials-Page 2

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

REG1117FA-5.0/500 DDPAK/TO-263 KTT 3 500 346.0 346.0 41.0

REG1117FA-5.0KTTT DDPAK/TO-263 KTT 3 50 346.0 346.0 41.0

REG1117FA/500 DDPAK/TO-263 KTT 3 500 346.0 346.0 41.0

REG1117FAKTTT DDPAK/TO-263 KTT 3 50 346.0 346.0 41.0

PACKAGE MATERIALS INFORMATION

www.ti.com 27-Jan-2012

Pack Materials-Page 3

MECHANICAL DATA

MPDS094A – APRIL 2001 – REVISED JUNE 2002

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE

4202506/B 06/2002

6,30 (0.248)

6,70 (0.264)

2,90 (0.114)

3,10 (0.122)

6,70 (0.264)

7,30 (0.287) 3,70 (0.146)

3,30 (0.130)

0,02 (0.0008)

0,10 (0.0040)

1,50 (0.059)

1,70 (0.067)

0,23 (0.009)

0,35 (0.014)

1 2 3

0,66 (0.026)

0,84 (0.033)

1,80 (0.071) MAX

Seating Plane

0°–10°

Gauge Plane

0,75 (0.030) MIN

0,25 (0.010)

0,08 (0.003)

0,10 (0.004) M

2,30 (0.091)

4,60 (0.181) M

0,10 (0.004)

NOTES: A. All linear dimensions are in millimeters (inches).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. Falls within JEDEC TO-261 Variation AA.

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