DS16005 Rev. 8 - 2 1 of 2 S3A/B-S3M/B
S3A/B - S3M/B
3.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
Features
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
A, B, D, G, J, K, M Designates SMC Package
SMB SMC
Dim Min Max Min Max
A3.30 3.94 5.59 6.22
B4.06 4.57 6.60 7.11
C1.96 2.21 2.75 3.18
D0.15 0.31 0.15 0.31
E5.00 5.59 7.75 8.13
G0.10 0.20 0.10 0.20
H0.76 1.52 0.76 1.52
J2.00 2.62 2.00 2.62
All Dimensions in mm
A
B
C
D
G
H
E
J
Maximum Ratings and Electrical Characteristics @ TA= 25°C unless otherwise specified
Glass Passivated Die Construction
Low Forward Voltage Drop and High Current
Capability
Surge Overload Rating to 100A Peak
Ideally Suited for Automatic Assembly
Mechanical Data
Case: Molded Plastic
Case Material - UL Flammability Rating
Classification 94V-0
Moisture sensitivity: Level 1 per J-STD-020A
Terminals: Solder Plated Terminal - Solderable
per MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
Weight: SMB 0.093 grams (approx)
SMC 0.21 grams (approx)
Marking: Type Number & Date Code,
See Page 2
Ordering Information: See Page 2
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic Symbo S3
A/AB
S3
B/BB
S3
D/DB
S3
G/GB
S3
J/JB
S3
K/KB
S3
M/MB Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
50 100 200 400 600 800 1000 V
RMS Reverse Voltage VR(RMS) 30 70 140 280 420 560 700 V
Average Rectified Output Current @TT= 75°C IO3.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
(JEDEC Method)
IFSM 100 A
Forward Voltage @ IF= 3.0A VFM 1.15 V
Peak Reverse Current @TA= 25°C
at Rated DC Blocking Voltage @ TA= 125 °C IRM 10
250 µA
Typical Total Capacitance (Note 1) CT40 pF
Typical Thermal Resistance Junction to Terminal
(Note 2) RJT 10 °C/W
Operating and Storage Temperature Range Tj, TSTG -65 to +150 °C
Notes: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
2. Thermal resistance: Junction to Terminal, unit mounted on PC board with 5.0 mm2(0.013 mm thick) copper pad as heat sink.
DS16005 Rev. 8 - 2 2 of 2 S3A/B-S3M/B
0
1.5
T , TERMINAL TEMPERATURE (ºC)
Fi
g
. 1 Forward Current Deratin
g
Curve
T
I , AVERAGE FORWARD CURRENT (A)
AV
0.5
1.0
2.0
2.5
25 50 75 100 125 150
3
.
0
Resistive or
Inductive Load
0.01
0.1
1.0
10
100
1000
0 20 40 60 80 100 120 140
I , INSTANTANE
O
US REVERSE CURRENT (µA)
R
PERCENT OF RATED PEAK REVERSE VOLTAGE (%
)
Fig. 4 Typical Reverse Characteristics
T = 125°C
j
T = 25°C
j
0
20
40
60
110 100
I , PEAK F
O
RWARD SURGE CURRENT (A)
FSM
NUMBER OF CYCLES AT 60 Hz
Fig. 3 Forward Surge Current Derating Curve
Single Half-Sine-Wave
JEDEC Method
80
100
120
I , INSTANTANEOUS FORWARD CURRENT (A)
F
0.01
0.1
1.0
10
V , INSTANTANEOUS FORWARD VOLTAGE (V)
Fi
g
.2 T
y
pical Forward Characteristics
F
0 0.4 0.8 1.2 1.6 2.0
I PULSE WIDTH = 300 S
F
µ
XXXX = Product type marking code, ex. ES1
A
= Manufacturers’ code marking
YWW = Date code marking
Y = Last digit of year ex: 2 for 2002
WW = Week code 01 to 52
YWW
XXXX
Marking Information
Notes: 3. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
*x = Device type, e.g. S3AB-13 (SMB package); S3A-13 (SMC Package).
Device*Packaging Shipping
S3xB-13
S3x-13
SMB
SMC 3000/Tape & Reel
Ordering Information (Note 3)
