
IHM-AModulmitlowlossIGBT2undEmitterControlledDiode
IHM-AmodulewithlowlossIGBT2andEmitterControlleddiode
1
TechnischeInformation/TechnicalInformation
FZ2400R12KL4C
IGBT-Module
IGBT-modules
preparedby:DTS
approvedby:DTS
dateofpublication:2013-10-02
revision:3.2
IGBT,Wechselrichter/IGBT,Inverter
HöchstzulässigeWerte/MaximumRatedValues
Kollektor-Emitter-Sperrspannung
Collector-emittervoltage Tvj = 25°C
Tvj = 125°C VCES 1200
1200 V
Kollektor-Dauergleichstrom
ContinuousDCcollectorcurrent TC = 80°C, Tvj max = 150°C
TC = 25°C, Tvj max = 150°C
IC nom
IC2400
3700 A
A
PeriodischerKollektor-Spitzenstrom
Repetitivepeakcollectorcurrent tP = 1 ms ICRM 4800 A
Gesamt-Verlustleistung
Totalpowerdissipation TC = 25°C, Tvj max = 150 Ptot 15,0 kW
Gate-Emitter-Spitzenspannung
Gate-emitterpeakvoltage VGES +/-20 V
CharakteristischeWerte/CharacteristicValues min. typ. max.
Kollektor-Emitter-Sättigungsspannung
Collector-emittersaturationvoltage IC = 2400 A, VGE = 15 V
IC = 2400 A, VGE = 15 V VCE sat
2,10
2,40
2,60
2,90
V
V
Tvj = 25°C
Tvj = 125°C
Gate-Schwellenspannung
Gatethresholdvoltage IC = 96,0 mA, VCE = VGE, Tvj = 25°C VGEth 4,5 5,5 6,5 V
Gateladung
Gatecharge VGE = -15 V ... +15 V QG26,0 µC
InternerGatewiderstand
Internalgateresistor Tvj = 25°C RGint 0,5 Ω
Eingangskapazität
Inputcapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cies 170 nF
Rückwirkungskapazität
Reversetransfercapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cres 11,0 nF
Kollektor-Emitter-Reststrom
Collector-emittercut-offcurrent VCE = 1200 V, VGE = 0 V, Tvj = 25°C ICES 5,0 mA
Gate-Emitter-Reststrom
Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V, Tvj = 25°C IGES 400 nA
Einschaltverzögerungszeit,induktiveLast
Turn-ondelaytime,inductiveload IC = 2400 A, VCE = 600 V
VGE = ±15 V
RGon = 0,56 Ω
td on
0,35
0,37
µs
µs
Tvj = 25°C
Tvj = 125°C
Anstiegszeit,induktiveLast
Risetime,inductiveload IC = 2400 A, VCE = 600 V
VGE = ±15 V
RGon = 0,56 Ω
tr
0,23
0,21
µs
µs
Tvj = 25°C
Tvj = 125°C
Abschaltverzögerungszeit,induktiveLast
Turn-offdelaytime,inductiveload IC = 2400 A, VCE = 600 V
VGE = ±15 V
RGoff = 0,56 Ω
td off
1,15
1,20
µs
µs
Tvj = 25°C
Tvj = 125°C
Fallzeit,induktiveLast
Falltime,inductiveload IC = 2400 A, VCE = 600 V
VGE = ±15 V
RGoff = 0,56 Ω
tf
0,17
0,18
µs
µs
Tvj = 25°C
Tvj = 125°C
EinschaltverlustenergieproPuls
Turn-onenergylossperpulse IC = 2400 A, VCE = 600 V, LS = 35 nH
VGE = ±15 V
RGon = 0,56 ΩEon
320
mJ
mJ
Tvj = 25°C
Tvj = 125°C
AbschaltverlustenergieproPuls
Turn-offenergylossperpulse IC = 2400 A, VCE = 600 V, LS = 35 nH
VGE = ±15 V
RGoff = 0,56 ΩEoff
400
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Kurzschlußverhalten
SCdata VGE ≤ 15 V, VCC = 900 V
VCEmax = VCES -LsCE ·di/dt ISC
20000
A
Tvj = 125°C
tP ≤ 10 µs,
Wärmewiderstand,ChipbisGehäuse
Thermalresistance,junctiontocase proIGBT/perIGBT RthJC 8,40 K/kW
Wärmewiderstand,GehäusebisKühlkörper
Thermalresistance,casetoheatsink proIGBT/perIGBT
λPaste=1W/(m·K)/λgrease=1W/(m·K) RthCH 6,40 K/kW
TemperaturimSchaltbetrieb
Temperatureunderswitchingconditions Tvj op -40 125 °C