www.ti.com
FEATURES
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1IN+
1IN−
FEEDBACK
DTC
CT
RT
GND
C1
2IN+
2IN−
REF
OUTPUT CTRL
VCC
C2
E2
E1
D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
DESCRIPTION
TL494PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E JANUARY 1983 REVISED FEBRUARY 2005
Complete PWM Power-Control CircuitryUncommitted Outputs for 200-mA Sink orSource CurrentOutput Control Selects Single-Ended orPush-Pull OperationInternal Circuitry Prohibits Double Pulse atEither OutputVariable Dead Time Provides Control OverTotal RangeInternal Regulator Provides a Stable 5-VReference Supply With 5% ToleranceCircuit Architecture Allows EasySynchronization
The TL494 incorporates all the functions required in the construction of a pulse-width-modulation (PWM) controlcircuit on a single chip. Designed primarily for power-supply control, this device offers the flexibility to tailor thepower-supply control circuitry to a specific application.
The TL494 contains two error amplifiers, an on-chip adjustable oscillator, a dead-time control (DTC) comparator,a pulse-steering control flip-flop, a 5-V, 5%-precision regulator, and output-control circuits.
The error amplifiers exhibit a common-mode voltage range from –0.3 V to V
CC
2 V. The dead-time controlcomparator has a fixed offset that provides approximately 5% dead time. The on-chip oscillator can be bypassedby terminating RT to the reference output and providing a sawtooth input to CT, or it can drive the commoncircuits in synchronous multiple-rail power supplies.
The uncommitted output transistors provide either common-emitter or emitter-follower output capability. TheTL494 provides for push-pull or single-ended output operation, which can be selected through the output-controlfunction. The architecture of this device prohibits the possibility of either output being pulsed twice duringpush-pull operation.
The TL494C is characterized for operation from 0 °C to 70 °C. The TL494I is characterized for operation from–40 °C to 85 °C.
AVAILABLE OPTIONS
PACKAGED DEVICES
(1)
SHRINK SMALL THIN SHRINKT
A
SMALL OUTLINE PLASTIC DIP SMALL OUTLINE
OUTLINE SMALL OUTLINE(D) (N) (NS)
(DB) (PW)
0°C to 70 °C TL494CD TL494CN TL494CNS TL494CDB TL494CPW–40 °C to 85 °C TL494ID TL494IN
(1) The D, DB, NS, and PW packages are available taped and reeled. Add the suffix R to device type (e.g., TL494CDR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1983–2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
GND
VCC
Reference
Regulator
C1
Pulse-Steering
Flip-Flop
C1
1D
DTC
CT
RT
PWM
Comparator
+
Error Amplifier 1
0.1 V Dead-Time Control
Comparator
Oscillator
OUTPUT CTRL
(see Function Table)
0.7 mA
E1
C2
E2
+
Error Amplifier 2
1IN+
1IN−
2IN+
2IN−
FEEDBACK
REF
6
5
4
1
2
16
15
3
13
8
9
11
10
12
14
7
Q1
Q2
0.7 V
TL494
PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E JANUARY 1983 REVISED FEBRUARY 2005
FUNCTION TABLE
INPUT TO
OUTPUT FUNCTIONOUTPUT CTRL
V
I
= GND Single-ended or parallel outputV
I
= V
ref
Normal push-pull operation
FUNCTIONAL BLOCK DIAGRAM
2
www.ti.com
Absolute Maximum Ratings
(1)
Recommended Operating Conditions
TL494PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E JANUARY 1983 REVISED FEBRUARY 2005
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage
(2)
41 VV
I
Amplifier input voltage V
CC
+ 0.3 VV
O
Collector output voltage 41 VI
O
Collector output current 250 mAD package 73DB package 82θ
JA
Package thermal impedance
(3) (4)
N package 67 °C/WNS package 64PW package 108Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °CT
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltages are with respect to the network ground terminal.(3) Maximum power disipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperatire is P
D
= (T
J
(max) T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 °C can affect reliability.(4) The package thermal impedance is calculated in accordance with JESD 51-7.
MIN MAX UNIT
V
CC
Supply voltage 7 40 VV
I
Amplifier input voltage –0.3 V
CC
2 VV
O
Collector output voltage 40 VCollector output current (each transistor) 200 mACurrent into feedback terminal 0.3 mAf
OSC
Oscillator frequency 1 300 kHzC
T
Timing capacitor 0.47 10000 nFR
T
Timing resistor 1.8 500 k TL494C 0 70T
A
Operating free-air temperature °CTL494I –40 85
3
www.ti.com
N
n1(xnX)2
N1
Electrical Characteristics
Reference Section
Oscillator Section
Error-Amplifier Section
TL494
PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E JANUARY 1983 REVISED FEBRUARY 2005
over recommended operating free-air temperature range, V
CC
= 15 V, f = 10 kHz (unless otherwise noted)
TL494C, TL494IPARAMETER TEST CONDITIONS
(1)
UNITMIN TYP
(2)
MAX
Output voltage (REF) I
O
= 1 mA 4.75 5 5.25 VInput regulation V
CC
= 7 V to 40 V 2 25 mVOutput regulation I
O
= 1 mA to 10 mA 1 15 mVOutput voltage change with temperature T
A
= MIN to MAX 2 10 mV/VShort-circuit output current
(3)
REF = 0 V 25 mA
(1) For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.(2) All typical values, except for parameter changes with temperature, are at T
A
= 25 °C.(3) Duration of short circuit should not exceed one second.
C
T
= 0.01 µF, R
T
= 12 k (see Figure 1 )
TL494C, TL494IPARAMETER TEST CONDITIONS
(1)
UNITMIN TYP
(2)
MAX
Frequency 10 kHzStandard deviation of frequency
(3)
All values of V
CC
, C
T
, R
T
, and T
A
constant 100 Hz/kHzFrequency change with voltage V
CC
= 7 V to 40 V, T
A
= 25 °C 1 Hz/kHzFrequency change with temperature
(4)
T
A
= MIN to MAX 10 Hz/kHz
(1) For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.(2) All typical values, except for parameter changes with temperature, are at T
A
= 25 °C.(3) Standard deviation is a measure of the statistical distribution about the mean as derived from the formula:
(4) Temperature coefficient of timing capacitor and timing resistor are not taken into account.
See Figure 2
TL494C, TL494IPARAMETER TEST CONDITIONS UNITMIN TYP
(1)
MAX
Input offset voltage V
O
(FEEDBACK) = 2.5 V 2 10 mVInput offset current V
O
(FEEDBACK) = 2.5 V 25 250 nAInput bias current V
O
(FEEDBACK) = 2.5 V 0.2 1 µA–0.3 toCommon-mode input voltage range V
CC
= 7 V to 40 V VV
CC
2Open-loop voltage amplification V
O
= 3 V, V
O
= 0.5 V to 3.5 V, R
L
= 2 k 70 95 dBUnity-gain bandwidth V
O
= 0.5 V to 3.5 V, R
L
= 2 k 800 kHzCommon-mode rejection ratio V
O
= 40 V, T
A
= 25 °C 65 80 dBOutput sink current (FEEDBACK) V
ID
= –15 mV to –5 V, V (FEEDBACK) = 0.7 V 0.3 0.7 mAOutput source current (FEEDBACK) V
ID
= 15 mV to 5 V, V (FEEDBACK) = 3.5 V –2 mA
(1) All typical values, except for parameter changes with temperature, are at T
A
= 25 °C.
4
www.ti.com
Electrical Characteristics
Output Section
Dead-Time Control Section
PWM Comparator Section
Total Device
Switching Characteristics
TL494PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E JANUARY 1983 REVISED FEBRUARY 2005
over recommended operating free-air temperature range, V
CC
= 15 V, f = 10 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
Collector off-state current V
CE
= 40 V, V
CC
= 40 V 2 100 µAEmitter off-state current V
CC
= V
C
= 40 V, V
E
= 0 –100 µACommon emitter V
E
= 0, I
C
= 200 mA 1.1 1.3Collector-emitter saturation voltage VEmitter follower V
O(C1 or C2)
= 15 V, I
E
= –200 mA 1.5 2.5Output control input current V
I
= V
ref
3.5 mA
(1) All typical values, except for temperature coefficient, are at T
A
= 25 °C.
See Figure 1
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
Input bias current (DEAD-TIME CTRL) V
I
= 0 to 5.25 V –2 –10 µAV
I
(DEAD-TIME CTRL) = 0, C
T
= 0.01 µF,Maximum duty cycle, each output 45 %R
T
= 12 k Zero duty cycle 3 3.3Input threshold voltage (DEAD-TIME CTRL) VMaximum duty cycle 0
(1) All typical values, except for temperature coefficient, are at T
A
= 25 °C.
See Figure 1
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
Input threshold voltage (FEEDBACK) Zero duty cyle 4 4.5 VInput sink current (FEEDBACK) V (FEEDBACK) = 0.7 V 0.3 0.7 mA
(1) All typical values, except for temperature coefficient, are at T
A
= 25 °C.
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
V
CC
= 15 V 6 10R
T
= V
ref
,Standby supply current mAAll other inputs and outputs open
V
CC
= 40 V 9 15Average supply current V
I
(DEAD-TIME CTRL) = 2 V, See Figure 1 7.5 mA
(1) All typical values, except for temperature coefficient, are at T
A
= 25 °C.
T
A
= 25 °C
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
Rise time 100 200 nsCommon-emitter configuration, See Figure 3Fall time 25 100 nsRise time 100 200 nsEmitter-follower configuration, See Figure 4Fall time 40 100 ns
(1) All typical values, except for temperature coefficient, are at T
A
= 25 °C.
5
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Test
Inputs DTC
FEEDBACK
RT
CT
GND
50 k
12 k
0.01 µF
VCC
REF
OUTPUT
CTRL
E2
C2
E1
C1 Output 1
Output 2
150
2 W 150
2 W
VCC = 15 V
TEST CIRCUIT
1IN+
VCC
VCC
0 V
0 V
Voltage
at C1
Voltage
at C2
Voltage
at CT
DTC
FEEDBACK
0 V
0.7 V
0% MAX 0%
Threshold Voltage
Threshold Voltage
VOLTAGE WA VEFORMS
Duty Cycle
Error
Amplifiers
7
14
12
8
9
11
10
4
3
6
5
1
2
16
15
13
1IN−
2IN−
2IN+
TL494
PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E JANUARY 1983 REVISED FEBRUARY 2005
Figure 1. Operational Test Circuit and Waveforms
6
www.ti.com
PARAMETER MEASUREMENT INFORMATION
+
+
VI
Vref
FEEDBACK
Amplifier Under Test
Other Amplifier
Output
Each Output
Circuit
68
2 W
15 V
CL = 15 pF
(See Note A)
90%
10%
90%
10%
tftr
TEST CIRCUIT OUTPUT VOLTAGE WAVEFORM
NOTE A: CL includes probe and jig capacitance.
TL494PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E JANUARY 1983 REVISED FEBRUARY 2005
Figure 2. Amplifier Characteristics
Figure 3. Common-Emitter Configuration
Figure 4. Emitter-Follower Configuration
7
www.ti.com
TYPICAL CHARACTERISTICS
Df = 1%
40
10
100
1 k 4 k 10 k 40 k 100 k 400 k 1 M
f − Oscillator Frequency and Frequency Variation − Hz
OSCILLATOR FREQUENCY AND
FREQUENCY VARIATION
vs
TIMING RESISTANCE
400
1 k
4 k
10 k
40 k
100 k
RT − T iming Resistance −
0.1 µF
−2% −1%
0% 0.01 µF
0.001 µF
VCC = 15 V
TA = 25°C
CT = 1 µF
Frequency variation (f) is the change in oscillator frequency that occurs over the full temperature range.
10
0
100
20
110 100 1 M
AAmplifier Voltage Amplification − dB
30
f − Frequency − Hz
AMPLIFIER VOLTAGE AMPLIFICATION
vs
FREQUENCY
1 k
VCC = 15 V
VO = 3 V
TA = 25°C
10 k
40
50
60
70
80
90
100 k
TL494
PULSE-WIDTH-MODULATION CONTROL CIRCUITS
SLVS074E JANUARY 1983 REVISED FEBRUARY 2005
Figure 5.
Figure 6.
8
PACKAGE OPTION ADDENDUM
www.ti.com 20-Aug-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TL494CD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CDE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CDRG3 PREVIEW SOIC D 16 TBD Call TI Call TI
TL494CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CJ OBSOLETE CDIP J 16 TBD Call TI Call TI
TL494CN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL494CNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL494CNSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CNSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CPW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CPWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI
TL494CPWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494CPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 20-Aug-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TL494ID ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494IDE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494IDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494IDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494IDRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL494IN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL494INE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TL494MJ OBSOLETE CDIP J 16 TBD Call TI Call TI
TL494MJB OBSOLETE CDIP J 16 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 20-Aug-2011
Addendum-Page 3
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TL494CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
TL494CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
TL494CDRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
TL494CDRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
TL494CNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
TL494CPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
TL494IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TL494CDR SOIC D 16 2500 333.2 345.9 28.6
TL494CDR SOIC D 16 2500 367.0 367.0 38.0
TL494CDRG4 SOIC D 16 2500 333.2 345.9 28.6
TL494CDRG4 SOIC D 16 2500 367.0 367.0 38.0
TL494CNSR SO NS 16 2000 367.0 367.0 38.0
TL494CPWR TSSOP PW 16 2000 367.0 367.0 35.0
TL494IDR SOIC D 16 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated