LM5000
www.ti.com
SNVS176D –MAY 2004–REVISED MARCH 2007
LM5000 High Voltage Switch Mode Regulator
Check for Samples: LM5000
1FEATURES DESCRIPTION
The LM5000 is a monolithic integrated circuit
2• 80V Internal Switch specifically designed and optimized for flyback, boost
• Operating Input Voltage Range of 3.1V to 40V or forward power converter applications. The internal
• Pin Selectable Operating Frequency power switch is rated for a maximum of 80V, with a
current limit set to 2A. Protecting the power switch
– 300kHz/700kHz (-3) are current limit and thermal shutdown circuits. The
– 600kHz/1.3MHz (-6) current mode control scheme provides excellent
• Adjustable Output Voltage rejection of line transients and cycle-by-cycle current
limiting. An external compensation pin and the built-in
• External Compensation slope compensation allow the user to optimize the
• Input Undervoltage Lockout frequency compensation. Other distinctive features
• Softstart include softstart to reduce stresses during start-up
and an external shutdown pin for remote ON/OFF
• Current Limit control. There are two operating frequency ranges
• Over Temperature Protection available. The LM5000-3 is pin selectable for either
• External Shutdown 300kHz (FS Grounded) or 700kHz (FS Open). The
• Small 16-Lead TSSOP or 16-Lead WSON LM5000-6 is pin selectable for either 600kHz (FS
Grounded) or 1.3MHz (FS Open). The device is
Package available in a low profile 16-lead TSSOP package or
a thermally enhanced 16-lead WSON package.
APPLICATIONS
• Flyback Regulator
• Forward Regulator
• Boost Regulator
• DSL Modems
• Distributed Power Converters
Typical Application Circuit
Figure 1. LM5000 Flyback Converter
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2004–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM5000
SNVS176D –MAY 2004–REVISED MARCH 2007
www.ti.com
Connection Diagram
Figure 2. Top View
PIN DESCRIPTIONS
Pin Name Function
1 COMP Compensation network connection. Connected to the output of the voltage error amplifier. The RC
compenstion network should be connected from this pin to AGND. An additional 100pF high frequency
capacitor to AGND is recommended.
2 FB Output voltage feedback input.
3 SHDN Shutdown control input, Open = enable, Ground = disable.
4 AGND Analog ground, connect directly to PGND.
5 PGND Power ground.
6 PGND Power ground.
7 PGND Power ground.
8 PGND Power ground.
9 SW Power switch input. Switch connected between SW pins and PGND pins
10 SW Power switch input. Switch connected between SW pins and PGND pins
11 SW Power switch input. Switch connected between SW pins and PGND pins
12 BYP Bypass-Decouple Capacitor Connection, 0.1µF ceramic capacitor recommended.
13 VIN Analog power input. A small RC filter is recommended, to suppress line glitches. Typical values of 10Ω
and ≥0.1µF are recommended.
14 SS Softstart Input. External capacitor and internal current source sets the softstart time.
15 FS Switching frequency select input. Open = Fhigh. Ground = Flow
16 TEST Factory test pin, connect to ground.
- Exposed Pad Connect to system ground plane for reduced thermal resistance.
underside of WSON
package
2Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Links: LM5000
LM5000
www.ti.com
SNVS176D –MAY 2004–REVISED MARCH 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
VIN -0.3V to 40V
SW Voltage -0.3V to 80V
FB Voltage -0.3V to 5V
COMP Voltage -0.3V to 3V
All Other Pins -0.3V to 7V
Maximum Junction Temperature 150°C
Power Dissipation(3) Internally Limited
Lead Temperature 216°C
Infrared (15 sec.) 235°C
ESD Susceptibility(4) Human Body Model 2kV
Machine Model 200V
Storage Temperature −65°C to +150°C
(1) Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the
device is intended to be functional, but device parameter specifications may not be ensured. For ensured specifications and test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal
resistance, θJA, and the ambient temperature, TA. See the Electrical Characteristics table for the thermal resistance of various layouts.
The maximum allowable power dissipation at any ambient temperature is calculated using: PD(MAX) = (TJ(MAX) −TA)/θJA. Exceeding
the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown.
(4) The human body model is a 100 pF capacitor discharged through a 1.5kΩresistor into each pin. The machine model is a 200pF
capacitor discharged directly into each pin.
Operating Conditions
Operating Junction Temperature Range(1) −40°C to +125°C
Supply Voltage(1) 3.1V to 40V
(1) Supply voltage, bias current product will result in aditional device power dissipation. This power may be significant. The thermal
dissipation design should take this into account.
Electrical Characteristics
Specifications in standard type face are for TJ= 25°C and those with boldface type apply over the full Operating
Temperature Range (TJ=−40°C to +125°C) Unless otherwise specified. VIN = 12V and IL= 0A, unless otherwise specified.
Symbol Parameter Conditions Min(1) Typ(2) Max(1) Units
IQQuiescent Current FB = 2V (Not Switching) 2.0 2.5 mA
FS = 0V
FB = 2V (Not Switching) 2.1 2.5 mA
FS = Open
VSHDN = 0V 18 30 µA
VFB Feedback Voltage 1.2330 1.259 1.2840 V
ICL Switch Current Limit 1.35 2.0 2.7 A
%VFB/ΔVIN Feedback Voltage Line 3.1V ≤VIN ≤40V 0.001 0.04 %/V
Regulation
IBFB Pin Bias Current(3) 55 200 nA
(1) All limits specified at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are
100% production tested. All limits at temperature extremes are specified via correlation using standard Statistical Quality Control (SQC)
methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely norm.
(3) Bias current flows into FB pin.
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM5000
LM5000
SNVS176D –MAY 2004–REVISED MARCH 2007
www.ti.com
Electrical Characteristics (continued)
Specifications in standard type face are for TJ= 25°C and those with boldface type apply over the full Operating
Temperature Range (TJ=−40°C to +125°C) Unless otherwise specified. VIN = 12V and IL= 0A, unless otherwise specified.
Symbol Parameter Conditions Min(1) Typ(2) Max(1) Units
BV Output Switch Breakdown TJ= 25°C, ISW = 0.1µA 80 V
Voltage TJ= -40°C to + 125°C, ISW =76
0.5µA
VIN Input Voltage Range 3.1 40 V
gmError Amp Transconductance ΔI = 5µA 150 410 750 µmho
AVError Amp Voltage Gain 280 V/V
DMAX Maximum Duty Cycle FS = 0V 85 90 %
LM5000-3
Maximum Duty Cycle FS = 0V 85 90 %
LM5000-6
TMIN Minimum On Time 165 ns
fSSwitching Frequency LM5000- FS = 0V 240 300 360
3FS = Open 550 700 840 kHz
Switching Frequency LM5000- FS = 0V 485 600 715
6FS = Open 1.055 1.3 1.545 MHz
ISHDN Shutdown Pin Current VSHDN = 0V −1-2 µA
ILSwitch Leakage Current VSW = 80V 0.008 5µA
RDSON Switch RDSON ISW = 1A 160 445 mΩ
ThSHDN SHDN Threshold Output High 0.9 0.6 V
Output Low 0.6 0.3 V
UVLO On Threshold 2.74 2.92 3.10 V
Off Threshold 2.60 2. 77 2.96 V
OVP VCOMP Trip 0.67 V
ISS Softstart Current 811 14 µA
θJA Thermal Resistance TSSOP, Package only 150 °C/W
WSON, Package only 45
4Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Links: LM5000
0 5 10 15 20 25 30 35 40
VIN (V)
0
50
100
150
200
250
300
350
400
RDS(ON) (m:)
25oC
125oC
-40oC
TEMPERATURE (oC)
FEEDBACK VOLTAGE (V)
1.2300
1.2400
1.2500
1.2600
1.2700
1.2800
-40 -20 020 40 60 80 100 120
0 5 10 15 20 25 30 35 40
VIN (V)
2
3
4
5
6
7
8
9
10
Iq (mA)
-40oC
125oC25oC
0 5 10 15 20 25 30 35 40
VIN (V)
2
3
4
5
6
7
8
9
10
Iq (mA)
-40oC
125oC25oC
-40oC
25oC
125oC
Iq (mA)
1.000
1.200
1.400
1.600
1.800
2.000
2.200
2.400
2.600
2.800
3.000
VIN (V)
0510 15 20 25 30 35 40
VIN (V)
Iq (mA)
1.000
1.200
1.400
1.600
1.800
2.000
2.200
2.400
2.600
2.800
3.000
0510 15 20 25 30 35 40
-40oC
25oC
125oC
LM5000
www.ti.com
SNVS176D –MAY 2004–REVISED MARCH 2007
Typical Performance Characteristics
Iq (non-switching) vs VIN @ fSW = 300kHz Iq (non-switching) vs VIN @ fSW = 700kHz
Figure 3. Figure 4.
Iq (switching) vs VIN @ fSW = 300kHz Iq (switching) vs VIN @ fSW = 700kHz
Figure 5. Figure 6.
Vfb vs Temperature RDS(ON) vs VIN @ ISW =1A
Figure 7. Figure 8.
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM5000
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (oC)
270
280
290
300
310
320
330
fSW (kHz)
fsw (kHz)
TEMPERATURE (oC)
-40 -20 020 40 60 80 100 120
630
650
670
690
710
730
750
770
VIN (V)
0510 15 20 25 30 35 40
fsw (kHz)
285
290
295
300
305
310
315
FREQUENCY (KHZ)
630
650
670
690
710
730
750
770
VIN (V)
0510 15 20 25 30 35 40
VIN (V)
0510 15 20 25 30 35 40
CURRENT LIMIT (A)
1.5
1.55
1.6
1.65
1.7
1.75
1.8
1.85
1.9
1.95
2
TEMPERATURE (oC)
CURRENT LIMIT (A)
-40 -20 020 40 60 80 100 120
1.5
1.55
1.6
1.65
1.7
1.75
1.8
1.85
1.9
1.95
2
LM5000
SNVS176D –MAY 2004–REVISED MARCH 2007
www.ti.com
Typical Performance Characteristics (continued)
Current Limit vs Temperature Current Limit vs VIN
Figure 9. Figure 10.
fSW vs. VIN @ FS = Low (-3) fSW vs. VIN @ FS = OPEN (-3)
Figure 11. Figure 12.
fSW vs. Temperature @ FS = Low (-3) fSW vs. Temperature @ FS = OPEN (-3)
Figure 13. Figure 14.
6Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Links: LM5000
VIN (V)
0510 15 20 25 30 35 40
BYP PIN VOLTAGE (V)
0
1
2
3
4
5
6
7
8125oC
25oC-40oC
Gm [Pmho]
TEMPERATURE (oC)
-40 -20 020 40 60 80 100 120
250
300
350
400
450
500
550
600
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (oC)
520
540
560
580
600
620
640
fSW (kHz)
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (oC)
1.14
1.18
1.22
1.26
1.30
1.34
1.38
fSW (kHz)
LM5000
www.ti.com
SNVS176D –MAY 2004–REVISED MARCH 2007
Typical Performance Characteristics (continued)
fSW vs. Temperature @ FS = Low (-6) fSW vs. Temperature @ FS = OPEN (-6)
Figure 15. Figure 16.
Error Amp. Transconductance vs Temp. BYP Pin Voltage vs VIN
Figure 17. Figure 18.
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LM5000
LM5000
SNVS176D –MAY 2004–REVISED MARCH 2007
www.ti.com
BOOST REGULATOR OPERATION
The LM5000 utilizes a PWM control scheme to regulate the output voltage over all load conditions. The operation
can best be understood referring to the block diagram and Figure 21. At the start of each cycle, the oscillator
sets the driver logic and turns on the NMOS power device conducting current through the inductor, cycle 1 of
Figure 21 (a). During this cycle, the voltage at the COMP pin controls the peak inductor current. The COMP
voltage will increase with larger loads and decrease with smaller. This voltage is compared with the summation
of the SW volatge and the ramp compensation.The ramp compensation is used in PWM architectures to
eliminate the sub-harmonic oscillations that occur during duty cycles greater than 50%. Once the summation of
the ramp compensation and switch voltage equals the COMP voltage, the PWM comparator resets the driver
logic turning off the NMOS power device. The inductor current then flows through the output diode to the load
and output capacitor, cycle 2 of Figure 21 (b). The NMOS power device is then set by the oscillator at the end of
the period and current flows through the inductor once again.
The LM5000 has dedicated protection circuitry running during the normal operation to protect the IC. The
Thermal Shutdown circuitry turns off the NMOS power device when the die temperature reaches excessive
levels. The UVP comparator protects the NMOS power device during supply power startup and shutdown to
prevent operation at voltages less than the minimum input voltage. The OVP comparator is used to prevent the
output voltage from rising at no loads allowing full PWM operation over all load conditions. The LM5000 also
features a shutdown mode. An external capacitor sets the softstart time by limiting the error amp output range,
as the capacitor charges up via an internal 10µA current source.
The LM5000 is available in two operating frequency ranges. The LM5000-3 is pin selectable for either 300kHz
(FS Grounded) or 700kHz (FS Open). The LM5000-6 is pin selectable for either 600kHz (FS Grounded) or
1.3MHz (FS Open)
Operation
Figure 21. Simplified Boost Converter Diagram
(a) First Cycle of Operation (b) Second Cycle Of Operation
CONTINUOUS CONDUCTION MODE
The LM5000 is a current-mode, PWM regulator. When used as a boost regulator the input voltage is stepped up
to a higher output voltage. In continuous conduction mode (when the inductor current never reaches zero at
steady state), the boost regulator operates in two cycles.
In the first cycle of operation, shown in Figure 21 (a), the transistor is closed and the diode is reverse biased.
Energy is collected in the inductor and the load current is supplied by COUT.
10 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Links: LM5000
:
RFB1 = RFB2 xVOUT - 1.259
1.259
VOUT = VIN
1-D , D' = (1-D) = VIN
VOUT
LM5000
www.ti.com
SNVS176D –MAY 2004–REVISED MARCH 2007
The second cycle is shown in Figure 21 (b). During this cycle, the transistor is open and the diode is forward
biased. The energy stored in the inductor is transferred to the load and output capacitor.
The ratio of these two cycles determines the output voltage. The output voltage is defined approximately as:
where
• D is the duty cycle of the switch
• D and D′will be required for design calculations (1)
SETTING THE OUTPUT VOLTAGE
The output voltage is set using the feedback pin and a resistor divider connected to the output as shown in
Figure 19. The feedback pin is always at 1.259V, so the ratio of the feedback resistors sets the output voltage.
(2)
INTRODUCTION TO COMPENSATION
Figure 22. (a) Inductor current. (b) Diode current.
The LM5000 is a current mode PWM regulator. The signal flow of this control scheme has two feedback loops,
one that senses switch current and one that senses output voltage.
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LM5000
'iL = (in Amps)
VIND
2Lfs
VINRDSON
0.144 fs
L > ()
D
D'
2
-1
()
D
D' +1
(in H)
Hz
1
2S(RC + RO)CC
fPC =
Hz
1
fZC =2SRCCC
LM5000
SNVS176D –MAY 2004–REVISED MARCH 2007
www.ti.com
To keep a current programmed control converter stable above duty cycles of 50%, the inductor must meet
certain criteria. The inductor, along with input and output voltage, will determine the slope of the current through
the inductor (see Figure 22 (a)). If the slope of the inductor current is too great, the circuit will be unstable above
duty cycles of 50%.
The LM5000 provides a compensation pin (COMP) to customize the voltage loop feedback. It is recommended
that a series combination of RCand CCbe used for the compensation network, as shown in Figure 19. The
series combination of RCand CCintroduces pole-zero pair according to the following equations:
(3)
where
• ROis the output impedance of the error amplifier, 850kΩ(4)
For most applications, performance can be optimized by choosing values within the range 5kΩ≤RC≤20kΩand
680pF ≤CC≤4.7nF.
COMPENSATION
This section will present a general design procedure to help insure a stable and operational circuit. The designs
in this datasheet are optimized for particular requirements. If different conversions are required, some of the
components may need to be changed to ensure stability. Below is a set of general guidelines in designing a
stable circuit for continuous conduction operation (loads greater than 100mA), in most all cases this will provide
for stability during discontinuous operation as well. The power components and their effects will be determined
first, then the compensation components will be chosen to produce stability.
INDUCTOR SELECTION
To ensure stability at duty cycles above 50%, the inductor must have some minimum value determined by the
minimum input voltage and the maximum output voltage. This equation is:
where
• fs is the switching frequency
• D is the duty cycle
• RDSON is the ON resistance of the internal switch (5)
This equation is only good for duty cycles greater than 50% (D>0.5).
(6)
The inductor ripple current is important for a few reasons. One reason is because the peak switch current will be
the average inductor current (input current) plus ΔiL. Care must be taken to make sure that the switch will not
reach its current limit during normal operation. The inductor must also be sized accordingly. It should have a
saturation current rating higher than the peak inductor current expected. The output voltage ripple is also affected
by the total ripple current.
DC GAIN AND OPEN-LOOP GAIN
Since the control stage of the converter forms a complete feedback loop with the power components, it forms a
closed-loop system that must be stabilized to avoid positive feedback and instability. A value for open-loop DC
gain will be required, from which you can calculate, or place, poles and zeros to determine the crossover
frequency and the phase margin. A high phase margin (greater than 45°) is desired for the best stability and
transient response. For the purpose of stabilizing the LM5000, choosing a crossover point well below where the
right half plane zero is located will ensure sufficient phase margin. A discussion of the right half plane zero and
checking the crossover using the DC gain will follow.
12 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Links: LM5000
fZC = 1
2SCCRC(in Hz)
fPC = 1
2S(RC + RO)CC(in Hz)
(in Hz)
RHPzero = VOUT(D')2
2S,LOADL
fZ1 = 1
2SRESRCOUT (in Hz)
fP1 = 1
2S(RESR + RL)COUT (in Hz)
LM5000
www.ti.com
SNVS176D –MAY 2004–REVISED MARCH 2007
OUTPUT CAPACITOR SELECTION
The choice of output capacitors is somewhat more arbitrary. It is recommended that low ESR (Equivalent Series
Resistance, denoted RESR) capacitors be used such as ceramic, polymer electrolytic, or low ESR tantalum.
Higher ESR capacitors may be used but will require more compensation which will be explained later on in the
section. The ESR is also important because it determines the output voltage ripple according to the approximate
equation:
ΔVOUT ≊2ΔiLRESR (in Volts) (7)
After choosing the output capacitor you can determine a pole-zero pair introduced into the control loop by the
following equations:
(8)
where
• RLis the minimum load resistance corresponding to the maximum load current (9)
The zero created by the ESR of the output capacitor is generally very high frequency if the ESR is small. If low
ESR capacitors are used it can be neglected. If higher ESR capacitors are used see the HIGH OUTPUT
CAPACITOR ESR COMPENSATION section.
RIGHT HALF PLANE ZERO
A current mode control boost regulator has an inherent right half plane zero (RHP zero). This zero has the effect
of a zero in the gain plot, causing an imposed +20dB/decade on the rolloff, but has the effect of a pole in the
phase, subtracting another 90° in the phase plot. This can cause undesirable effects if the control loop is
influenced by this zero. To ensure the RHP zero does not cause instability issues, the control loop should be
designed to have a bandwidth of ½ the frequency of the RHP zero or less. This zero occurs at a frequency of:
where
• ILOAD is the maximum load current (10)
SELECTING THE COMPENSATION COMPONENTS
The first step in selecting the compensation components RCand CCis to set a dominant low frequency pole in
the control loop. Simply choose values for RCand CCwithin the ranges given in the INTRODUCTION TO
COMPENSATION section to set this pole in the area of 10Hz to 100Hz. The frequency of the pole created is
determined by the equation:
where
• ROis the output impedance of the error amplifier, 850kΩ(11)
Since RCis generally much less than RO, it does not have much effect on the above equation and can be
neglected until a value is chosen to set the zero fZC. fZC is created to cancel out the pole created by the output
capacitor, fP1. The output capacitor pole will shift with different load currents as shown by the equation, so setting
the zero is not exact. Determine the range of fP1 over the expected loads and then set the zero fZC to a point
approximately in the middle. The frequency of this zero is determined by:
(12)
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: LM5000
m1
#
VINRDSON
L(in V/s)
n = 1+ 2mc
m1 (no unit)
Leff = L
(D')2
Zc(in rad/s)
2fs
nD'
#
ADC(DB) = 20log10 {[(ZcLeff)// RL]//RL}(in dB)
RFB1 + RFB2
RFB2
()gmROD'
RDSON
fPC2 = 1
2SCC2(RC //RO)(in Hz)
LM5000
SNVS176D –MAY 2004–REVISED MARCH 2007
www.ti.com
Now RCcan be chosen with the selected value for CC. Check to make sure that the pole fPC is still in the 10Hz to
100Hz range, change each value slightly if needed to ensure both component values are in the recommended
range. After checking the design at the end of this section, these values can be changed a little more to optimize
performance if desired. This is best done in the lab on a bench, checking the load step response with different
values until the ringing and overshoot on the output voltage at the edge of the load steps is minimal. This should
produce a stable, high performance circuit. For improved transient response, higher values of RC(within the
range of values) should be chosen. This will improve the overall bandwidth which makes the regulator respond
more quickly to transients. If more detail is required, or the most optimal performance is desired, refer to a more
in depth discussion of compensating current mode DC/DC switching regulators.
HIGH OUTPUT CAPACITOR ESR COMPENSATION
When using an output capacitor with a high ESR value, or just to improve the overall phase margin of the control
loop, another pole may be introduced to cancel the zero created by the ESR. This is accomplished by adding
another capacitor, CC2, directly from the compensation pin VCto ground, in parallel with the series combination of
RCand CC. The pole should be placed at the same frequency as fZ1, the ESR zero. The equation for this pole
follows:
(13)
To ensure this equation is valid, and that CC2 can be used without negatively impacting the effects of RCand CC,
fPC2 must be greater than 10fPC.
CHECKING THE DESIGN
The final step is to check the design. This is to ensure a bandwidth of ½ or less of the frequency of the RHP
zero. This is done by calculating the open-loop DC gain, ADC. After this value is known, you can calculate the
crossover visually by placing a −20dB/decade slope at each pole, and a +20dB/decade slope for each zero. The
point at which the gain plot crosses unity gain, or 0dB, is the crossover frequency. If the crossover frequency is
at less than ½ the RHP zero, the phase margin should be high enough for stability. The phase margin can also
be improved some by adding CC2 as discussed earlier in the section. The equation for ADC is given below with
additional equations required for the calculation:
(14)
(15)
(16)
(17)
mc ≊0.072fs (in A/s) (18)
where
• RLis the minimum load resistance
• VIN is the maximum input voltage
• RDSON is the value chosen from the graph "RDSON vs. VIN " in the Typical Performance Characteristics
section (19)
SWITCH VOLTAGE LIMITS
In a flyback regulator, the maximum steady-state voltage appearing at the switch, when it is off, is set by the
transformer turns ratio, N, the output voltage, VOUT, and the maximum input voltage, VIN (Max):
VSW(OFF) = VIN (Max) + (VOUT +VF)/N
where
• VFis the forward biased voltage of the output diode, and is typically 0.5V for Schottky diodes and 0.8V for
ultra-fast recovery diodes (20)
14 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Links: LM5000
LM5000
www.ti.com
SNVS176D –MAY 2004–REVISED MARCH 2007
In certain circuits, there exists a voltage spike, VLL, superimposed on top of the steady-state voltage . Usually,
this voltage spike is caused by the transformer leakage inductance and/or the output rectifier recovery time. To
“clamp” the voltage at the switch from exceeding its maximum value, a transient suppressor in series with a
diode is inserted across the transformer primary.
If poor circuit layout techniques are used, negative voltage transients may appear on the Switch pin. Applying a
negative voltage (with respect to the IC's ground) to any monolithic IC pin causes erratic and unpredictable
operation of that IC. This holds true for the LM5000 IC as well. When used in a flyback regulator, the voltage at
the Switch pin can go negative when the switch turns on. The “ringing” voltage at the switch pin is caused by the
output diode capacitance and the transformer leakage inductance forming a resonant circuit at the
secondary(ies). The resonant circuit generates the “ringing” voltage, which gets reflected back through the
transformer to the switch pin. There are two common methods to avoid this problem. One is to add an RC
snubber around the output rectifier(s). The values of the resistor and the capacitor must be chosen so that the
voltage at the Switch pin does not drop below −0.4V. The resistor may range in value between 10Ωand 1 kΩ,
and the capacitor will vary from 0.001 μF to 0.1 μF. Adding a snubber will (slightly) reduce the efficiency of the
overall circuit.
The other method to reduce or eliminate the “ringing” is to insert a Schottky diode clamp between the SW pin
and the PGND pin. The reverse voltage rating of the diode must be greater than the switch off voltage.
OUTPUT VOLTAGE LIMITATIONS
The maximum output voltage of a boost regulator is the maximum switch voltage minus a diode drop. In a
flyback regulator, the maximum output voltage is determined by the turns ratio, N, and the duty cycle, D, by the
equation:
VOUT ≈N × VIN × D/(1 −D) (21)
The duty cycle of a flyback regulator is determined by the following equation:
(22)
Theoretically, the maximum output voltage can be as large as desired—just keep increasing the turns ratio of the
transformer. However, there exists some physical limitations that prevent the turns ratio, and thus the output
voltage, from increasing to infinity. The physical limitations are capacitances and inductances in the LM5000
switch, the output diode(s), and the transformer—such as reverse recovery time of the output diode (mentioned
above).
INPUT LINE CONDITIONING
A small, low-pass RC filter should be used at the input pin of the LM5000 if the input voltage has an unusually
large amount of transient noise. Additionally, the RC filter can reduce the dissipation within the device when the
input voltage is high.
Flyback Regulator Operation
The LM5000 is ideally suited for use in the flyback regulator topology. The flyback regulator can produce a single
output voltage, or multiple output voltages.
The operation of a flyback regulator is as follows: When the switch is on, current flows through the primary
winding of the transformer, T1, storing energy in the magnetic field of the transformer. Note that the primary and
secondary windings are out of phase, so no current flows through the secondary when current flows through the
primary. When the switch turns off, the magnetic field collapses, reversing the voltage polarity of the primary and
secondary windings. Now rectifier D5 is forward biased and current flows through it, releasing the energy stored
in the transformer. This produces voltage at the output.
The output voltage is controlled by modulating the peak switch current. This is done by feeding back a portion of
the output voltage to the error amp, which amplifies the difference between the feedback voltage and a 1.259V
reference. The error amp output voltage is compared to a ramp voltage proportional to the switch current (i.e.,
inductor current during the switch on time). The comparator terminates the switch on time when the two voltages
are equal, thereby controlling the peak switch current to maintain a constant output voltage.
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LM5000
LM5000
www.ti.com
SNVS176D –MAY 2004–REVISED MARCH 2007
ITEM PART NUMBER DESCRIPTION VALUE
C 1 C4532X7R2A105MT Capacitor, CER, TDK 1µ, 100V
C 2 C4532X7R2A105MT Capacitor, CER, TDK 1µ, 100V
C 3 C1206C224K5RAC Capacitor, CER, KEMET 0.22µ, 50V
C 4 C1206C104K5RAC Capacitor, CER, KEMET 0.1µ, 50V
C 5 C1206C104K5RAC Capacitor, CER, KEMET 0.1µ, 50V
C 6 C1206C101K1GAC Capacitor, CER, KEMET 100p, 100V
C 7 C1206C104K5RAC Capacitor, CER, KEMET 0.1µ, 50V
C 8 C4532X7S0G686M Capacitor, CER, TDK 68µ, 4V
C 9 C4532X7S0G686M Capacitor, CER, TDK 68µ, 4V
C 10 C1206C221K1GAC Capacitor, CER, KEMET 220p, 100V
C 11 C1206C102K5RAC Capacitor, CER, KEMET 1000p, 500V
D 1 BZX84C10-NSA Central, 10V Zener, SOT-23
D 2 CMZ5930B-NSA Central, 16V Zener, SMA
D 3 CMPD914-NSA Central, Switching, SOT-23
D 4 CMPD914-NSA Central, Switching, SOT-23
D 5 CMSH3-40L-NSA Central, Schottky, SMC
T 1 A0009-A Coilcraft, Transformer
R 1 CRCW12064992F Resistor 49.9K
R 2 CRCW12061001F Resistor 1K
R 3 CRCW12061002F Resistor 10K
R 4 CRCW12066191F Resistor 6.19K
R 5 CRCW120610R0F Resistor 10
R 6 CRCW12062003F Resistor 200K
R 7 CRCW12061002F Resistor 10K
Q 1 CXT5551-NSA Central, NPN, 180V
U 1 LM5000-3 Regulator, TI
Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LM5000
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM5000-3MTC NRND TSSOP PW 16 92 Non-RoHS &
Non-Green Call TI Call TI -40 to 125 LM5000
3MTC
LM5000-3MTC/NOPB ACTIVE TSSOP PW 16 92 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM5000
3MTC
LM5000-3MTCX NRND TSSOP PW 16 2500 Non-RoHS &
Non-Green Call TI Call TI -40 to 125 LM5000
3MTC
LM5000-3MTCX/NOPB ACTIVE TSSOP PW 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM5000
3MTC
LM5000SD-3/NOPB ACTIVE WSON NHQ 16 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 5000-3
LM5000SD-6/NOPB ACTIVE WSON NHQ 16 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 5000-6
LM5000SDX-3/NOPB ACTIVE WSON NHQ 16 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 5000-3
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM5000-3MTCX TSSOP PW 16 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
LM5000-3MTCX/NOPB TSSOP PW 16 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
LM5000SD-3/NOPB WSON NHQ 16 1000 178.0 12.4 5.3 5.3 1.3 8.0 12.0 Q1
LM5000SD-6/NOPB WSON NHQ 16 1000 178.0 12.4 5.3 5.3 1.3 8.0 12.0 Q1
LM5000SDX-3/NOPB WSON NHQ 16 4500 330.0 12.4 5.3 5.3 1.3 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM5000-3MTCX TSSOP PW 16 2500 367.0 367.0 35.0
LM5000-3MTCX/NOPB TSSOP PW 16 2500 367.0 367.0 35.0
LM5000SD-3/NOPB WSON NHQ 16 1000 210.0 185.0 35.0
LM5000SD-6/NOPB WSON NHQ 16 1000 210.0 185.0 35.0
LM5000SDX-3/NOPB WSON NHQ 16 4500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
MECHANICAL DATA
NHQ0016A
www.ti.com
SDA16A (Rev A)
www.ti.com
PACKAGE OUTLINE
C
14X 0.65
2X
4.55
16X 0.30
0.19
TYP
6.6
6.2
1.2 MAX
0.15
0.05
0.25
GAGE PLANE
-80
BNOTE 4
4.5
4.3
A
NOTE 3
5.1
4.9
0.75
0.50
(0.15) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
1
89
16
0.1 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
SEATING
PLANE
A 20
DETAIL A
TYPICAL
SCALE 2.500
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
89
16
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
89
16
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated
